BTA316B-800B

BTA316B series B, C and E 16 A Three-quadrant triacs high commutation Rev. 01 — 19 April 2007 Product data sheet 1. Product profile 1.1 General description Passivated, new generation, high commutation triacs in a SOT404 plastic single-ended surface-mountable package 1.2 Features I Very high commutation performance maximized at each gate sensitivity I High immunity to dV/dt 1.3 Applications I High power motor control - e.g. washing I Refrigeration and air conditioning machines and vacuum cleaners compressors I Non-linear rectifier-fed motor loads I Electronic thermostats 1.4 Quick reference data I I I I VDRM ≤ 600 V (BTA316B-600B/C/E) VDRM ≤ 800 V (BTA316B-800B/C/E) ITSM ≤ 140 A (t = 20 ms) IT(RMS) ≤ 16 A (t = 20 ms) I IGT ≤ 50 mA (BTA316B series B) I IGT ≤ 35 mA (BTA316B series C) I IGT ≤ 10 mA (BTA316B series E) 2. Pinning information Table 1. Pin 1 2 3 mb Pinning Description main terminal 1 (T1) main terminal 2 (T2) gate (G) mounting base; main terminal 2 (T2) 2 1 3 mb T2 sym051 Simplified outline Symbol T1 G SOT404 (D2PAK) NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 3. Ordering information Table 2. Ordering information Package Name BTA316B-600B BTA316B-600C BTA316B-600E BTA316B-800B BTA316B-800C BTA316B-800E D2PAK Description Version plastic single-ended surface-mounted package (D2PAK); 3-leads (one lead SOT404 cropped) Type number 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM Parameter repetitive peak off-state voltage Conditions BTA316B-600B; BTA316B-600C; BTA316B-600E BTA316B-800B; BTA316B-800C; BTA316B-800E IT(RMS) ITSM RMS on-state current non-repetitive peak on-state current full sine wave; Tmb ≤ 101 °C; see Figure 4 and 5 full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 t = 20 ms t = 16.7 ms I2t dIT/dt IGM PGM PG(AV) Tstg Tj [1] [1] Min - Max 600 800 16 Unit V V A - 140 150 98 100 2 5 0.5 +150 125 A A A2s A/µs A W W °C °C I2t for fusing t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs rate of rise of on-state current peak gate current peak gate power average gate power storage temperature junction temperature over any 20 ms period −40 - Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 2 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 20 Ptot (W) 15 003aab689 conduction angle, (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 α = 180° 120° α 90° 60° 30° 10 5 0 0 2 4 6 8 10 12 14 IT(RMS) (A) 16 α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 003aab668 160 ITSM (A) 120 80 IT ITSM t 1/f Tj(init) = 25 °C max 40 0 1 10 102 number of cycles (n) 103 f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 3 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 103 ITSM (A) 003aab671 (1) 102 IT ITSM t tp Tj(init) = 25 °C max 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig 3. Non-repetitive peak on-state current as a function of pulse duration; maximum values 003aab685 003aab684 60 IT(RMS) (A) 50 20 IT(RMS) (A) 16 40 12 30 8 20 4 10 0 10-2 10-1 1 10 surge duration (s) 0 -50 0 50 100 150 Tmb (°C) f = 50 Hz; Tmb = 101 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature; maximum values BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 4 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 5. Thermal characteristics Table 4. Symbol Rth(j-mb) Rth(j-a) Thermal characteristics Parameter Conditions Min Typ 55 Max 1.7 1.2 Unit K/W K/W K/W thermal resistance from junction to half cycle; see Figure 6 mounting base full cycle; see Figure 6 thermal resistance from junction to mounted on a printed ambient circuit board; minimum footprint 10 Zth(j-mb) (K/W) 1 (2) 003aab776 (1) 10−1 P 10−2 tp t 10−3 10−5 10−4 10−3 10−2 10−1 1 tp (s) 10 (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 5 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 6. Static characteristics Table 5. Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions BTA316B-600B BTA316B-800B Min IGT gate trigger current VD = 12 V; IT = 0.1 A; see Figure 8 T2+ G+ T2+ G− T2− G− IL latching current VD = 12 V; IGT = 0.1 A; see Figure 10 T2+ G+ T2+ G− T2− G− IH holding current VD = 12 V; IGT = 0.1 A; see Figure 11 IT = 18 A; see Figure 9 VD = 12 V; IT = 0.1 A; see Figure 7 VD = 400 V; IT = 0.1 A; Tj = 125 °C ID off-state current VD = VDRM(max); Tj = 125 °C 60 90 60 60 50 60 50 35 25 30 30 15 mA mA mA mA 2 2 2 50 50 50 2 2 2 35 35 35 10 10 10 mA mA mA Typ Max BTA316B-600C BTA316B-800C Min Typ Max BTA316B-600E BTA316B-800E Min Typ Max Unit VT VGT on-state voltage gate trigger voltage - 1.3 0.8 1.5 1.5 - 1.3 0.8 1.5 1.5 - 1.3 0.8 1.5 1.5 V V 0.25 0.4 - 0.25 0.4 - 0.25 0.4 - V - 0.1 0.5 - 0.1 0.5 - 0.1 0.5 mA BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 6 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 7. Dynamic characteristics Table 6. Dynamic characteristics Conditions BTA316B-600B BTA316B-800B Min dVD/dt rate of rise of off-state voltage VDM = 0.67 × VDRM(max); Tj = 125 °C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 °C; IT(RMS) = 16 A; without snubber; gate open circuit VDM = 400 V; Tj = 125 °C; IT(RMS) = 16 A; dV/dt = 10 V/µs; gate open circuit VDM = 400 V; Tj = 125 °C; IT(RMS) = 16 A; dV/dt = 1 V/µs; gate open circuit tgt gate-controlled ITM = 20 A; turn-on time VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs 1000 Typ BTA316B-600C BTA316B-800C Typ 500 BTA316B-600E BTA316B-800E Typ Max V/µs 60 Unit Symbol Parameter Max Min Max Min dIcom/dt rate of change of commutating current 20 - - 15 - - 5 - - A/ms - - - - - - 8 - - A/ms - - - - - - 12 - - A/ms - 2 - - 2 - - 2 - µs BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 7 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 1.6 VGT VGT(25°C) 1.2 001aab101 3 (1) 001aac669 IGT IGT(25°C) 2 (2) (3) 0.8 1 0.4 −50 0 50 100 Tj (°C) 150 0 −50 0 50 100 Tj (°C) 150 (1) T2− G− (2) T2+ G− (3) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 8 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 50 IT (A) 40 003aab666 3 IL IL(25°C) 2 001aab100 30 (1) (2) (3) 20 1 10 0 0 0.5 1 1.5 VT (V) 2 0 −50 0 50 100 Tj (°C) 150 Vo = 1.024 V Rs = 0.021 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage 3 IH IH(25°C) 2 Fig 10. Normalized latching current as a function of junction temperature 001aab099 1 0 −50 0 50 100 Tj (°C) 150 Fig 11. Normalized holding current as a function of junction temperature BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 9 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 8. Package outline Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404 A E A1 mounting base D1 D HD 2 Lp 1 3 b c Q e e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.50 4.10 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.80 14.80 Q 2.60 2.20 OUTLINE VERSION SOT404 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-02-11 06-03-16 Fig 12. Package outline SOT404 (D2PAK) BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 10 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 9. Revision history Table 7. Revision history Release date 20070419 Data sheet status Product data sheet Change notice Supersedes Document ID BTA316B_SER_B_C_E_1 BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 11 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.3 Disclaimers Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BTA316B_SER_B_C_E_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 19 April 2007 12 of 13 NXP Semiconductors BTA316B series B, C and E 16 A Three-quadrant triacs high commutation 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 April 2007 Document identifier: BTA316B_SER_B_C_E_1