BZA100

DISCRETE SEMICONDUCTORS DATA SHEET M3D184 BZA100 18-fold ESD transient voltage suppressor Product data sheet Supersedes data of 1996 Mar 21 1997 Dec 02 NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor FEATURES • SO20 SMD package allows 18 separate voltage regulator diodes in a common anode configuration • Working voltage: typ. 6.8 V • Forward voltage: max. 1.3 V • Maximum reverse peak power dissipation: 27.5 W at tp = 1 ms • Maximum clamping voltage at peak pulse current: 11 V at 2.5 A • Low leakage current: max. 2 µA • ESD rating >8 kV, according IEC 801-2. APPLICATIONS • Where transient overvoltage protection in voltage and ESD sensitive equipment is required such as: – Computers – Printers – Business machines – Communication systems – Medical equipment. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL IZ IF IFSM IZSM Ptot PARAMETER working current continuous forward current non-repetitive peak forward current non-repetitive peak reverse current total power dissipation tp = 1 ms; square pulse tp = 1 ms; square pulse; see Fig.2 see Fig.3 up to Ts = 60 °C; note 2 up to Tamb = 25 °C; note 3 PZSM Tstg Tj Notes 1. DC working current limited by Ptot max. 2. One or more diodes loaded; Ts is the temperature at the soldering point. 3. One or more diodes loaded; device mounted on a printed-circuit board with Rth a-s = 43.5 K/W. 1997 Dec 02 2 non-repetitive peak reverse power dissipation storage temperature operating junction temperature tp = 1 ms; square pulse; see Fig.4 − − − −65 − 1.6 CONDITIONS − − − − MIN. DESCRIPTION 18-fold monolitic transient voltage suppressor. Its 18-fold junction common anode design protects 18 separate lines using only one package. This device is ideal for situations where board space is a premium. PINNING PIN 1 to 5 6 and 16 7 to 15 17 to 20 BZA100 DESCRIPTION cathode (k1 to k5) common anode (a1; a2) cathode (k6 to k14) cathode (k15 to k18) handbook, 4 columns k1 k2 1 2 3 4 5 20 k18 19 k17 18 k16 17 k15 16 a2 20 19 18 17 16 15 14 13 12 11 k3 k4 k5 a1 k6 k7 k8 SO20 6 7 8 9 15 k14 14 k13 13 k12 MBG396 1 2 3 4 5 6 7 8 9 10 12 k11 11 k10 k9 10 Fig.1 Pin configuration for SO20 (SOT163-1) and symbol. MAX. note 1 200 4 2.5 UNIT mA mA A A W W W °C °C 1.25 27.5 +150 150 NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor THERMAL CHARACTERISTICS SYMBOL Rth j-s Rth j-a PARAMETER thermal resistance from junction to soldering point thermal resistance from junction to ambient CONDITIONS one or more diodes loaded BZA100 VALUE 56.5 100 UNIT K/W K/W ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL Per diode VZ VF VZSM IR rdif SZ Cd working voltage forward voltage non-repetitive peak reverse voltage reverse current differential resistance temperature coefficient of working voltage diode capacitance I Z = 5 mA IF = 200 mA tp = 1 ms; IZSM = 2.5 A VR = 5.25 V I Z = 1 mA I Z = 5 mA IZ = 5mA see Fig.5 VR = 0; f = 1 MHz VR = 5.25 V; f = 1 MHz − − − − 120 60 pF pF 6.4 − − − − − − 6.8 − − − − − 3 7.2 1.3 11 2 40 8 − V V V µA Ω Ω mV/K PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 1997 Dec 02 3 NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor GRAPHICAL DATA BZA100 handbook, halfpage 10 MBG394 MBG393 handbook, halfpage 2.4 IZSM (A) Ptot (W) 1.6 1 0.8 10−1 10−1 1 10 10 2 t (ms) 103 p 0 0 50 100 Ts (oC) 150 All diodes loaded. Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Fig.3 Power derating curve. 10 2 handbook, halfpage MBG395 handbook, halfpage 100 MBG392 PZSM (W) Cd (pF) 80 10 60 1 10−1 1 10 10 2 t (ms) 103 p 40 0 2 4 VR (V) 6 PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Tj = 25 °C; f = 1 MHz. Fig.4 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.5 Diode capacitance as a function of reverse voltage; typical values. 1997 Dec 02 4 NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor PACKAGE OUTLINE BZA100 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c y HE vMA Z 20 11 Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) θ A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) θ o 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8 0o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 1997 Dec 02 5 NXP Semiconductors Product data sheet 18-fold ESD transient voltage suppressor DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes 1. Please consult the most recently issued document before initiating or completing a design. PRODUCT STATUS(2) Development Qualification Production DEFINITION BZA100 This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 1997 Dec 02 6 above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 117027/00/02/pp7 Date of release: 1997 Dec 02 Document order number: 9397 750 03107