LPC54616J256ET180E

LPC546xx 32-bit ARM Cortex-M4 microcontroller; up to 512 KB flash and 200 kB SRAM; High-speed USB device/host + PHY; Full-speed USB device/host; Ethernet AVB; LCD; EMC; SPIFI; CAN FD, SDIO; SHA; 12-bit 5 Msamples/s ADC; DMIC subsystem Rev. 2.8 — 8 September 2020 Product data sheet 1. General description The LPC546xx is a family of ARM Cortex-M4 based microcontrollers for embedded applications featuring a rich peripheral set with very low power consumption and enhanced debug features. The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated into the core. The LPC546xx family includes up to 512 KB of flash, 200 KB of on-chip SRAM, up to 16 kB of EEPROM memory, a quad SPI Flash Interface (SPIFI) for expanding program memory, one high-speed and one full-speed USB host and device controller, Ethernet AVB, LCD controller, Smart Card Interfaces, SD/MMC, CAN FD, an External Memory Controller (EMC), a DMIC subsystem with PDM microphone interface and I2S, five general-purpose timers, SCTimer/PWM, RTC/alarm timer, Multi-Rate Timer (MRT), a Windowed Watchdog Timer (WWDT), ten flexible serial communication peripherals (USART, SPI, I2S, I2C interface), Secure Hash Algorithm (SHA), 12-bit 5.0 Msamples/sec ADC, and a temperature sensor. 2. Features and benefits  ARM Cortex-M4 core (version r0p1):  ARM Cortex-M4 processor, running at a frequency of up to 220 MHz.  The LPC5460x/61x devices operate at CPU frequencies of up to 180 MHz. The LPC54628 device operates at CPU frequencies of up to 220 MHz.  Floating Point Unit (FPU) and Memory Protection Unit (MPU).  ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC).  Non-maskable Interrupt (NMI) input with a selection of sources.  Serial Wire Debug (SWD) with six instruction breakpoints, two literal comparators, and four watch points. Includes Serial Wire Output and ETM Trace for enhanced debug capabilities, and a debug timestamp counter.  System tick timer. LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller  On-chip memory:  Up to 512 KB on-chip flash program memory with flash accelerator and 256 byte page erase and write.  Up to 200 KB total SRAM consisting of 160 KB contiguous main SRAM and an additional 32 KB SRAM on the I&D buses. 8 KB of SRAM bank intended for USB traffic.  16 KB of EEPROM.  ROM API support:  Flash In-Application Programming (IAP) and In-System Programming (ISP).  ROM-based USB drivers (HID, CDC, MSC, and DFU). Flash updates via USB.  Booting from valid user code in flash, USART, SPI, and I2C.  Legacy, Single, and Dual image boot.  OTP API for programming OTP memory.  Random Number Generator (RNG) API.  Serial interfaces:  Flexcomm Interface contains up to ten serial peripherals. Each Flexcomm Interface can be selected by software to be a USART, SPI, or I2C interface. Two Flexcomm Interfaces also include an I2S interface. Each Flexcomm Interface includes a FIFO that supports USART, SPI, and I2S if supported by that Flexcomm Interface. A variety of clocking options are available to each Flexcomm Interface and include a shared fractional baud-rate generator.  I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates of up to 1Mbit/s and with multiple address recognition and monitor mode. Two sets of true I2C pads also support High Speed Mode (3.4 Mbit/s) as a slave.  Two ISO 7816 Smart Card Interfaces with DMA support.  USB 2.0 high-speed host/device controller with on-chip high-speed PHY.  USB 2.0 full-speed host/device controller with on-chip PHY and dedicated DMA controller supporting crystal-less operation in device mode using software library. See Technical note TN00032 for more details.  SPIFI with XIP feature uses up to four data lines to access off-chip SPI/DSPI/QSPI flash memory at a much higher rate than standard SPI or SSP interfaces.  Ethernet MAC with MII/RMII interface with Audio Video Bridging (AVB) support and dedicated DMA controller.  Two CAN FD modules with dedicated DMA controller.  Digital peripherals:  DMA controller with 30 channels and up to 24 programmable triggers, able to access all memories and DMA-capable peripherals.  LCD Controller supporting both Super-Twisted Nematic (STN) and Thin-Film Transistor (TFT) displays. It has a dedicated DMA controller, selectable display resolution (up to 1024 x 768 pixels), and supports up to 24-bit true-color mode.  External Memory Controller (EMC) provides support for asynchronous static memory devices such as RAM, ROM and flash, in addition to dynamic memories such as single data rate SDRAM with an SDRAM clock of up to 100 MHz. EMC bus width (bit) on TFBGA180, TFBGA100, and LQFP100 and packages supports up to 8/16 data line wide static memory, in addition to dynamic memories, such as, SDRAM (2 banks only) with an SDRAM clock of up to 100 MHz.  Secured digital input/output (SD/MMC and SDIO) card interface with DMA support. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 2 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller      LPC546xx Product data sheet  CRC engine block can calculate a CRC on supplied data using one of three standard polynomials with DMA support.  Up to 171 General-Purpose Input/Output (GPIO) pins.  GPIO registers are located on the AHB for fast access. The DMA supports GPIO ports.  Up to eight GPIOs can be selected as Pin Interrupts (PINT), triggered by rising, falling or both input edges.  Two GPIO Grouped Interrupts (GINT) enable an interrupt based on a logical (AND/OR) combination of input states.  CRC engine. Analog peripherals:  12-bit ADC with 12 input channels and with multiple internal and external trigger inputs and sample rates of up to 5.0 MSamples/sec. The ADC supports two independent conversion sequences.  Integrated temperature sensor connected to the ADC. DMIC subsystem including a dual-channel PDM microphone interface, flexible decimators, 16 entry FIFOs, optional DC locking, hardware voice activity detection, and the option to stream the processed output data to I2S. Timers:  Five 32-bit general purpose timers/counters, four of which support up to four capture inputs and four compare outputs, PWM mode, and external count input. Specific timer events can be selected to generate DMA requests. The fifth timer does not have external pin connections and may be used for internal timing operations.  SCTimer/PWM with 8 input and 10 output functions (including capture and match). Inputs and outputs can be routed to/from external pins and internally to or from selected peripherals. Internally, the SCTimer/PWM supports 10 match/captures, 10 events, and 10 states.  32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power domain. A timer in the RTC can be used for wake-up from all low power modes including deep power-down, with 1 ms resolution.  Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at up to four programmable, fixed rates.  Windowed Watchdog Timer (WWDT).  Repetitive Interrupt Timer (RIT) for debug time stamping and for general purpose use. Security features:  enhanced Code Read Protection (eCRP) to protect user code.  OTP memory for ECRP settings, and user application specific data.  Secure Hash Algorithm (SHA1/SHA2) module with dedicated DMA controller. Clock generation:  12 MHz internal Free Running Oscillator (FRO). This oscillator provides a selectable 48 MHz or 96 MHz output, and a 12 MHz output (divided down from the selected higher frequency) that can be used as a system clock. The FRO is trimmed to 1 % accuracy over the entire voltage and temperature range.  External clock input for clock frequencies of up to 25 MHz.  Crystal oscillator with an operating range of 1 MHz to 25 MHz. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 3 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller         LPC546xx Product data sheet  Watchdog Oscillator (WDTOSC) with a frequency range of 6 kHz to 1.5 MHz.  32.768 kHz low-power RTC oscillator.  System PLL allows CPU operation up to the maximum CPU rate and can run from the main oscillator, the internal FRO, the watchdog oscillator or the 32.768 KHz RTC oscillator.  Two additional PLLs for USB clock and audio subsystem.  Independent clocks for the SPIFI interface, ADC, USBs, and the audio subsystem.  Clock output function with divider.  Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal. Power control:  Programmable PMU (Power Management Unit) to minimize power consumption and to match requirements at different performance levels.  Reduced power modes: sleep, deep-sleep, and deep power-down.  Wake-up from deep-sleep modes due to activity on the USART, SPI, and I2C peripherals when operating as slaves.  Ultra-low power Micro-tick Timer, running from the Watchdog oscillator that can be used to wake up the device from low power modes.  Power-On Reset (POR).  Brown-Out Detect (BOD) with separate thresholds for interrupt and forced reset. Single power supply 1.71 V to 3.6 V. Power-On Reset (POR). Brown-Out Detect (BOD) with separate thresholds for interrupt and forced reset. JTAG boundary scan supported. 128 bit unique device serial number for identification. Operating temperature range 40 °C to +105 °C. Available in TFBGA180, TFBGA100, LQFP208, and LQFP100 packages. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 4 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 3. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC54605J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54605J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54605J256BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC54605J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC54605J256ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC54605J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC54606J256ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC54606J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54606J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC54606J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC54606J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC54607J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54607J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC54608J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC54616J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54616J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC54616J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC54616J512BD208 LQFP208 LPC54606J256BD100 LQFP100 LPC54607J256BD208 LQFP208 LPC54608J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC54618J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC54628J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54618J512BD208 LQFP208 LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 5 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 3.1 Ordering options CAN FD LCD Flexcomm Interface EMC data bus width (bit) GPIO SHA yes yes yes 10 8/16 145 yes Classic CAN Ethernet AVB HS USB FS USB SRAM/kB Flash/kB Frequency/MHz Package Name Ordering options Type number Table 2. LPC54628 devices (HS/FS USB, Ethernet, CAN FD, CAN 2.0, LCD, SHA) LPC54628J512ET180 TFBGA180 220 512 200 yes yes yes LPC54618 devices (HS/FS USB, Ethernet, CAN FD, CAN 2.0, LCD) LPC54618J512ET180 TFBGA180 180 512 200 yes yes yes yes yes yes 10 8/16 145 no LPC54618J512BD208 LQFP208 yes yes yes yes yes yes 10 8/16/32 171 no 180 512 200 LPC54616 devices (HS/FS USB, Ethernet, CAN FD, CAN 2.0) LPC54616J256ET180 TFBGA180 180 256 136 yes yes yes yes yes no 10 8/16 145 no LPC54616J512BD208 LQFP208 yes yes yes yes yes no 10 8/16/32 171 no 180 512 200 LPC54616J512ET100 TFBGA100 180 512 200 yes yes yes yes yes no 9 8/16 64 no LPC54616J512BD100 LQFP100 yes yes yes yes yes no 9 8/16 64 no 180 512 200 LPC54608 devices (HS/FS USB, Ethernet, CAN 2.0, LCD) LPC54608J512ET180 TFBGA180 180 512 200 yes yes yes yes no yes 10 8/16 145 no LPC54608J512BD208 LQFP208 yes yes yes yes no yes 10 8/16/32 171 no LPC54607J256ET180 TFBGA180 180 256 136 yes yes no no no yes 10 8/16 145 no LPC54607J512ET180 TFBGA180 180 512 200 yes yes no no no yes 10 8/16 145 no LPC54607J256BD208 LQFP208 yes yes no no no yes 10 8/16/32 171 no LPC54606J256ET180 TFBGA180 180 256 136 yes yes yes yes no no 10 8/16 145 no LPC54606J512BD208 LQFP208 180 512 200 yes yes yes yes no no 10 8/16/32 171 no LPC54606J256ET100 TFBGA100 180 256 136 yes yes yes yes no no 9 8/16 64 no LPC54606J512ET100 TFBGA100 180 512 200 yes yes yes yes no no 9 8/16 64 no LPC54606J256BD100 LQFP100 180 256 136 yes yes yes yes no no 9 8/16 64 no LPC54606J512BD100 LQFP100 180 512 200 yes yes yes yes no no 9 8/16 64 no LPC54605J256ET180 TFBGA180 180 256 136 yes yes no no no no 10 8/16 145 no LPC54605J512ET180 TFBGA180 180 512 200 yes yes no no no no 10 8/16 145 no LPC54605J256BD100 LQFP100 180 256 136 yes yes no no no no 9 8/16 64 no LPC54605J512BD100 LQFP100 180 512 200 LPC54607 devices (HS/FS USB, LCD) 180 256 136 LPC54606 devices (HS/FS USB, Ethernet, CAN 2.0) LPC54605 devices (HS/FS USB) 180 512 200 yes yes no no no no 9 8/16 64 no LPC54605J256ET100 TFBGA100 180 256 136 yes yes no no no no 9 8/16 64 no LPC54605J512ET100 TFBGA100 180 512 200 yes yes no no no no 9 8/16 64 no LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 6 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 4. Marking Terminal 1 index area n Terminal 1 index area 1 aaa-025721 Fig 1. TFBGA180 and TFBGA100 package markings aaa-011231 Fig 2. LQFP208 package marking n Terminal 1 index area 1 aaa-029374 Fig 3. LQFP100 package marking The LPC546xx TFBGA180 and TFBGA100 packages have the following top-side marking: • First line: LPC546xxJyyy – yyy: flash size • Second line: ET180 or ET100 • Third line: xxxxxxxxxxxx • Fourth line: xxxyywwx[R]x – yyww: Date code with yy = year and ww = week. – xR = boot code version and device revision. The LPC546xx LQFP208 and LQFP100 packages have the following top-side marking: • First line: LPC546xxJyyy – yyy: flash size • Second line: BD208 or BD100 • Third line: xxxxxxxxxxxx • Fourth line: xxxyywwx[R]x LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 7 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller – yyww: Date code with yy = year and ww = week. – xR = Boot code version and device revision. Table 3. Device revision table Revision identifier (R) Revision description 1A Initial device revision with Boot ROM version 19.1 LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 8 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 5. Block diagram Figure 4 shows the LPC546xx block diagram. In this figure, orange shaded blocks support general purpose DMA and yellow shaded blocks include dedicated DMA control. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 9 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller JTAG test and ISP access boundary scan interface port DEBUG INTERFACE ARM CORTEX-M4 WITH FPU/MPU I-code bus ethernet PHY interface LCD panel ETHERNET 10/100 MAC +AVB LCD PANEL INTERFACE GENERAL PURPOSE DMA CONTROLLER FS USB bus or transceiver SDIO interface USB 2.0 HOST/ DEVICE H D SDIO CAN interface CAN FD Xtalin Xtalout CAN FD SHA D-code system bus bus RST clocks and controls CLOCK GENERATION, POWER CONTROL, AND OTHER SYSTEM FUNCTIONS CLK OUT internal power VOLTAGE REGULATOR Vdd BOOT ROM 64 kB FLASH INTERFACE AND ACCELERATOR HS USB PHY HS USB bus FLASH 512 MB SRAM 32 kB SPI FLASH INTERFACE SPIFI SRAM 64 kB SRAM 32 kB MULTILAYER AHB MATRIX SRAM 32 kB SRAM 32 kB FS USB HOST REGISTERS SHA SLAVE INTERFACE EEPROM UP TO 16 kB HS USB HOST REGISTERS 12b ADC 12-CH POLYFUSE OTP 256 b USB RAM INTERFACE TEMP SENSOR SRAM 8 kB STATIC/DYNAMIC EXT MEMORY CONTROLLER HS GPIO 0-5 SPIFI REGISTERS EMC REGISTERS DMA REGISTERS LCD REGISTERS FS USB DEVICE REGISTERS CAN 0 REGISTERS CAN 1 REGISTERS ETHERNET REGISTERS HS USB DEVICE REGISTERS CRC ENGINE APB slave group 0 SYSTEM CONTROL AHB TO APB BRIDGE AHB TO APB BRIDGE FlexComms 0-4 -UARTs 0-4 - I2Cs 0-4 -SPI0s 0-4 FlexComms 5-9 -UARTs 5-9 -SPI0s 5-9 -I2Cs 5-9 - I2Ss 0,1 SYSTEM CONTROL (async regs) 2 x 32-BIT TIMERS (T3, 4) APB slave group 1 GPIO INTERRUPT CONTROL PMU REGS (+BB, PVT) 32-BIT TIMERS (T2) 2 x 32-BIT TIMERS (T0, 1) RIT MULTI-RATE TIMER FLASH 0 REGISTERS EEPROM REGISTERS 2 x SMARTCARDS OTP CONTROLLER RANDOM NUMBER GEN WINDOWED WDT RTC ALARM MICRO TICK TIMER REAL TIME CLOCK Note: - Orange shaded blocks support Gen. Purpose DMA. - Yellow shaded blocks include dedicated DMA Ctrl. Fig 4. D[31:0] A[25:0] control GPIO APB slave group 2 ASYNC AHB TO APB BRIDGE PERIPH INPUT MUX SELECTS WATCHDOG OSC SDIO REGISTERS AUDIO SUBSYS D-MIC, DECIMATOR, ETC I/O CONFIGURATION GPIO GLOBAL INTRPTS (0, 1) SCTimer/ PWM ADC inputs RTC POWER DOMAIN DIVIDER 32 kHz Osc aaa-029364 LPC546xx Block diagram LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 10 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 6. Pinning information 6.1 Pinning ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H J K L M N P aaa-026026 Transparent top view Fig 5. TFBGA 180 Pin configuration ball A1 index area 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K 002aaf723-m-lpc5460x Transparent top view Fig 6. LPC546xx Product data sheet TFBGA 100 Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 11 of 171 LPC546xx NXP Semiconductors 157 208 32-bit ARM Cortex-M4 microcontroller 156 52 105 53 104 1 aaa-026027 Fig 7. LQFP 208 Pin configuration 75 25 51 LPC546xx Product data sheet 50 26 Fig 8. 76 100 1 002aad945--lpc5460x LQFP 100 Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 12 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 6.2 Pin description On the LPC546xx, digital pins are grouped into several ports. Each digital pin can support several different digital functions (including General Purpose I/O (GPIO)) and an additional analog function. C4 D6 196 93 Reset state [1] [2] Type 208-pin, LQFP PIO0_0 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description 100-pin, TFBGA Table 4. PU I/O PIO0_0 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 3 SPI SCK function. I CAN1_RD — Receiver input for CAN 1. I/O FC3_SCK — Flexcomm 3: USART or SPI clock. PIO0_1 A1 A1 207 100 [2] O CTimer_MAT0 — Match output 0 from Timer 0. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. O PDM0_CLK — Clock for PDM interface 0, for digital microphone. PU I/O PIO0_1 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 3 SPI SSEL0 function. O CAN1_TD — Transmitter output for CAN 1. I/O FC3_CTS_SDA_SSEL0 — Flexcomm 3: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO0_2/ TRST A7 E9 174 83 [2] I CT0_CAP0 — Capture input 0 to Timer 0. I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. I PDM0_DATA — Data for PDM interface 0 (digital microphone). PU I/O PIO0_2 — General-purpose digital input/output pin. In boundary scan mode: TRST (Test Reset). Remark: In ISP mode, this pin is set to the Flexcomm 3 SPI MISO function. I/O FC3_TXD_SCL_MISO — Flexcomm 3: USART transmitter, I2C clock, SPI master-in/slave-out data. I CT0_CAP1 — Capture input 1 to Timer 0. O SCT0_OUT0 — SCTimer/PWM output 0. I SCT0_GPI[2] — Pin input 2 to SCTimer/PWM. I/O EMC_D[0] — External Memory interface data [0]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 13 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller A10 178 85 Reset state [1] [2] Type A6 Description 100-pin, LQFP PIO0_3/ TCK 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO0_3 — General-purpose digital input/output pin. In boundary scan mode: TCK (Test Clock In). Remark: In ISP mode, this pin is set to the Flexcomm 3 SPI MOSI function. I/O FC3_RXD_SDA_MOSI — Flexcomm 3: USART receiver, I2C data I/O, SPI master-out/slave-in data. O CT0_MAT1 — Match output 1 from Timer 0. O SCT0_OUT1 — SCTimer/PWM output 1. I SCT0_GPI3 — Pin input 3 to SCTimer/PWM. R — Reserved. I/O EMC_D[1] — External Memory interface data [1]. PIO0_4/ TMS B6 C8 185 87 [2] PU I/O PIO0_4 — General-purpose digital input/output pin. In boundary scan mode: TMS (Test Mode Select). Remark: The state of this pin at Reset in conjunction with PIO0_5 and PIO0_6 will determine the boot source for the part or if ISP handler is invoked. See the Boot Process chapter in UM10912 for more details. I CAN0_RD — Receiver input for CAN 0. I/O FC4_SCK — Flexcomm 4: USART or SPI clock. I CT3_CAP0 — Capture input 0 to Timer 3. I SCT0_GPI4 — Pin input 4 to SCTimer/PWM. R — Reserved. I/O EMC_D[2] — External Memory interface data [2]. O PIO0_5/ TDI A5 E7 189 89 [2] ENET_MDC — Ethernet management data clock. PU I/O PIO0_5 — General-purpose digital input/output pin. In boundary scan mode: TDI (Test Data In). Remark: The state of this pin at Reset in conjunction with PIO0_4 and PIO0_6 will determine the boot source for the part or if ISP handler is invoked. See the Boot Process chapter in UM10912 for more details. O CAN0_TD — Transmitter output for CAN 0. I/O FC4_RXD_SDA_MOSI — Flexcomm 4: USART receiver, I2C data I/O, SPI master-out/slave-in data. O CT3_MAT0 — Match output 0 from Timer 3. I SCT0_GPI5 — Pin input 5 to SCTimer/PWM. R — Reserved. I/O EMC_D[3] — External Memory interface data [3]. I/O ENET_MDIO — Ethernet management data I/O. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 14 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller A4 A5 191 90 Reset state [1] [2] Type 208-pin, LQFP PIO0_6/ TDO Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO0_6 — General-purpose digital input/output pin. In boundary scan mode: TDO (Test Data Out). Remark: The state of this pin at Reset in conjunction with PIO0_4 and PIO0_5 will determine the boot source for the part or if ISP handler is invoked. See the Boot Process chapter in UM10912 for more details. I/O FC3_SCK — Flexcomm 3: USART or SPI clock. I CT3_CAP1 — Capture input 1 to Timer 3. O CT4_MAT0 — Match output 0 from Timer 4. I SCT0_GPI6 — Pin input 6 to SCTimer/PWM. R — Reserved. I/O EMC_D[4] — External Memory interface data [4]. I PIO0_7 F9 H12 125 61 [2] ENET_RX_DV — Ethernet receive data valid. PU I/O PIO0_7 — General-purpose digital input/output pin. I/O FC3_RTS_SCL_SSEL1 — Flexcomm 3: USART request-to-send, I2C clock, SPI slave select 1. O SD_CLK — SD/MMC clock. I/O FC5_SCK — Flexcomm 5: USART or SPI clock. I/O FC1_SCK — Flexcomm 1: USART or SPI clock. O PDM1_CLK — Clock for PDM interface 1, for digital microphone. I/O EMC_D[5] — External Memory interface data [5]. I PIO0_8 E9 H10 133 64 [2] ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). PU I/O PIO0_8 — General-purpose digital input/output pin. I/O FC3_SSEL3 — Flexcomm 3: SPI slave select 3. I/O SD_CMD — SD/MMC card command I/O. I/O FC5_RXD_SDA_MOSI — Flexcomm 5: USART receiver, I2C data I/O, SPI master-out/slave-in data. O SWO — Serial Wire Debug trace output. I PDM1_DATA — Data for PDM interface 1 (digital microphone). I/O EMC_D[6] — External Memory interface data [6]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 15 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Pin description …continued Reset state [1] [2] Type Description 100-pin, LQFP E10 G12 136 65 208-pin, LQFP PIO0_9 180-pin, TFBGA Symbol 100-pin, TFBGA Table 4. PU I/O PIO0_9 — General-purpose digital input/output pin. I/O FC3_SSEL2 — Flexcomm 3: SPI slave select 2. O SD_POW_EN — SD/MMC card power enable. I/O FC5_TXD_SCL_MISO — Flexcomm 5: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. I/O SCI1_IO — SmartCard Interface 1 data I/O. I/O EMC_D[7] — External Memory interface data [7]. PIO0_10/ ADC0_0 J1 P2 50 23 [4] PU I/O; PIO0_10/ADC0_0 — General-purpose digital input/output pin. AI ADC input channel 0 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC6_SCK — Flexcomm 6: USART, SPI, or I2S clock. I CT2_CAP2 — Capture input 2 to Timer 2. O CT2_MAT0 — Match output 0 from Timer 2. I/O FC1_TXD_SCL_MISO — Flexcomm 1: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. O PIO0_11/ ADC0_1 K1 L3 51 24 [4] SWO — Serial Wire Debug trace output. PU I/O; PIO0_11/ADC0_1 — General-purpose digital input/output pin. AI ADC input channel 1 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC6_RXD_SDA_MOSI_DATA — Flexcomm 6: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. O CT2_MAT2 — Match output 2 from Timer 2. I FREQME_GPIO_CLK_A — Frequency Measure pin clock input A. R — Reserved. R — Reserved. I LPC546xx Product data sheet SWCLK — Serial Wire Debug clock. This is the default function after booting. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 16 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP J2 M3 52 25 [4] Type 208-pin, LQFP PIO0_12/ ADC0_2 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O; PIO0_12/ADC0_2 — General-purpose digital input/output pin. AI ADC input channel 2 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC3_TXD_SCL_MISO — Flexcomm 3: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. I FREQME_GPIO_CLK_B — Frequency Measure pin clock input B. I SCT0_GPI7 — Pin input 7 to SCTimer/PWM. R — Reserved. I/O SWDIO — Serial Wire Debug I/O. This is the default function after booting. PIO0_13 C10 F11 141 67 [3] Z I/O PIO0_13 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 1 I2C SDA function. I/O FC1_CTS_SDA_SSEL0 — Flexcomm 1: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I UTICK_CAP0 — Micro-tick timer capture input 0. I CT0_CAP0 — Capture input 0 to Timer 0. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. R — Reserved. R — Reserved. I PIO0_14 D9 E13 144 69 [3] Z ENET_RXD0 — Ethernet receive data 0. I/O PIO0_14 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 1 I2C SCL function. I/O FC1_RTS_SCL_SSEL1 — Flexcomm 1: USART request-to-send, I2C clock, SPI slave select 1. I UTICK_CAP1 — Micro-tick timer capture input 1. I CT0_CAP1 — Capture input 1 to Timer 0. I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. R — Reserved. R — Reserved. I LPC546xx Product data sheet ENET_RXD1 — Ethernet receive data 1. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 17 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP K2 L4 53 26 [4] Type 208-pin, LQFP PIO0_15/ ADC0_3 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O; PIO0_15/ADC0_3 — General-purpose digital input/output pin. AI ADC input channel 3 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC6_CTS_SDA_SSEL0 — Flexcomm 6: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I UTICK_CAP2 — Micro-tick timer capture input 2. I CT4_CAP0 — Capture input 4 to Timer 0. O SCT0_OUT2 — SCTimer/PWM output 2. R — Reserved. PIO0_16/ ADC0_4 H3 M4 54 27 [4] O EMC_WEN — External memory interface Write Enable (active low). O ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). PU I/O; PIO0_16/ADC0_4 — General-purpose digital input/output pin. AI ADC input channel 4 if the DIGIMODE bit is set to 0 in the IOCON register for this pin.ws I/O FC4_TXD_SCL_MISO — Flexcomm 4: USART transmitter, I2C clock, SPI master-in/slave-out data. O CLKOUT — Output of the CLKOUT function. I CT1_CAP0 — Capture input 0 to Timer 1. R — Reserved. R — Reserved. PIO0_17 B10 E14 146 70 [2] O EMC_CSN[0] — External memory interface static chip select 0 (active low). O ENET_TXD0 — Ethernet transmit data 0. PU I/O PIO0_17 — General-purpose digital input/output pin. I/O FC4_SSEL2 — Flexcomm 4: SPI slave select 2. I SD_CARD_DET_N — SD/MMC card detect (active low). I SCT0_GPI7 — Pin input 7 to SCTimer/PWM. O SCT0_OUT0 — SCTimer/PWM output 0. R — Reserved. LPC546xx Product data sheet O EMC_OEN — External memory interface output enable (active low) O ENET_TXD1 — Ethernet transmit data 1. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 18 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller C14 150 72 Reset state [1] [2] Type C9 Description 100-pin, LQFP PIO0_18 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO0_18 — General-purpose digital input/output pin. I/O FC4_CTS_SDA_SSEL0 — Flexcomm 4: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO0_19 C5 C6 193 91 [2] I SD_WR_PRT — SD/MMC write protect. O CT1_MAT0 — Match output 0 from Timer 1. O SCT0_OUT1 — SCTimer/PWM output 1. O SCI1_SCLK — SmartCard Interface 1 clock. O EMC_A[0] — External memory interface address 0. PU I/O PIO0_19 — General-purpose digital input/output pin. I/O FC4_RTS_SCL_SSEL1 — Flexcomm 4: USART request-to-send, I2C clock, SPI slave select 1. I UTICK_CAP0 — Micro-tick timer capture input 0. O CT0_MAT2 — Match output 2 from Timer 0. O SCT0_OUT2 — SCTimer/PWM output 2. R — Reserved. O EMC_A[1] — External memory interface address 1. I/O FC7_TXD_SCL_MISO_WS — Flexcomm 7: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. PIO0_20 C8 D13 153 74 [2] PU I/O PIO0_20 — General-purpose digital input/output pin. I/O FC3_CTS_SDA_SSEL0 — Flexcomm 3: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O CT1_MAT1 — Match output 1 from Timer 1. I CT3_CAP3 — Capture input 3 to Timer 3. I SCT0_GPI2 — Pin input 2 to SCTimer/PWM. I/O SCI0_IO — SmartCard Interface 0 data I/O. O EMC_A[2] — External memory interface address 2. I/O FC7_RXD_SDA_MOSI_DATA — Flexcomm 7: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. PIO0_21 B9 C13 158 77 [2] PU I/O PIO0_21 — General-purpose digital input/output pin. I/O FC3_RTS_SCL_SSEL1 — Flexcomm 3: USART request-to-send, I2C clock, SPI slave select 1. I UTICK_CAP3 — Micro-tick timer capture input 3. O CT3_MAT3 — Match output 3 from Timer 3. I SCT0_GPI3 — Pin input 3 to SCTimer/PWM. O SCI0_SCLK — SmartCard Interface 0 clock. O EMC_A[3] — External memory interface address 3. I/O FC7_SCK — Flexcomm 7: USART, SPI, or I2S clock. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 19 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller B12 163 80 Reset state [1] [2][8] Type B8 Description 100-pin, LQFP PIO0_22 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO0_22 — General-purpose digital input/output pin. I/O FC6_TXD_SCL_MISO_WS — Flexcomm 6: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. I UTICK_CAP1 — Micro-tick timer capture input 1. I CT3_CAP3 — Capture input 3 to Timer 3. O SCT0_OUT3 — SCTimer/PWM output 3. R — Reserved. R — Reserved. I PIO0_23/ ADC0_11 K5 N7 71 35 [4] USB0_VBUS — Monitors the presence of USB0 bus power. PU I/O; PIO0_23/ADC0_11 — General-purpose digital input/output AI pin. ADC input channel 11 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O MCLK — MCLK input or output for I2S and/or digital microphone. O CT1_MAT2 — Match output 2 from Timer 1. O CT3_MAT3 — Match output 3 from Timer 3. O SCT0_OUT4 — SCTimer/PWM output 4. R — Reserved. I/O SPIFI_CSN — SPI Flash Interface chip select (active low). PIO0_24 J5 M7 76 38 [2] PU I/O PIO0_24 — General-purpose digital input/output pin. I/O FC0_RXD_SDA_MOSI — Flexcomm 0: USART receiver, I2C data I/O, SPI master-out/slave-in data. I/O SD_D[0] — SD/MMC data 0. I CT2_CAP0 — Capture input 0 to Timer 2. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. R — Reserved. I/O SPIFI_IO0 — Data bit 0 for the SPI Flash Interface. PIO0_25 J6 K8 83 40 [2] PU I/O PIO0_25 — General-purpose digital input/output pin. I/O FC0_TXD_SCL_MISO — Flexcomm 0: USART transmitter, I2C clock, SPI master-in/slave-out data. I/O SD_D[1] — SD/MMC data 1. I CT2_CAP1 — Capture input 1 to Timer 2. I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. R — Reserved. I/O SPIFI_IO1 — Data bit 1 for the SPI Flash Interface. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 20 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Pin description …continued 56 Reset state [1] [2] Type Description 100-pin, LQFP H10 M13 110 208-pin, LQFP PIO0_26 180-pin, TFBGA Symbol 100-pin, TFBGA Table 4. PU I/O PIO0_26 — General-purpose digital input/output pin. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO0_27 H7 L9 87 42 [2] O CLKOUT — Output of the CLKOUT function. I CT3_CAP2 — Capture input 2 to Timer 3. O SCT0_OUT5 — SCTimer/PWM output 5. O PDM0_CLK — Clock for PDM interface 0, for digital microphone. O SPIFI_CLK — Clock output for the SPI Flash Interface. I USB0_IDVALUE — Indicates to the transceiver whether connected as an A-device (USB0_ID LOW) or B-device (USB0_ID HIGH). PU I/O PIO0_27 — General-purpose digital input/output pin. I/O FC2_TXD_SCL_MISO — Flexcomm 2: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. O CT3_MAT2 — Match output 2 from Timer 3. O SCT0_OUT6 — SCTimer/PWM output 6. I PDM0_DATA — Data for PDM interface 0 (digital microphone). I/O SPIFI_IO3 — Data bit 3 for the SPI Flash Interface. PIO0_28 J7 M9 91 44 [2] PU I/O PIO0_28 — General-purpose digital input/output pin. I/O FC0_SCK — Flexcomm 0: USART or SPI clock. R — Reserved. I CT2_CAP3 — Capture 3 input to Timer 2. O SCT0_OUT7 — SCTimer/PWM output 7. O TRACEDATA[3] — Trace data bit 3. I/O SPIFI_IO2 — Data bit 2 for the SPI Flash Interface. I PIO0_29 B7 B13 167 82 [2] USB0_OVERCURRENTN — USB0 bus overcurrent indicator (active low). PU I/O PIO0_29 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 0 USART RXD function. I/O FC0_RXD_SDA_MOSI — Flexcomm 0: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. O LPC546xx Product data sheet CT2_MAT3 — Match output 3 from Timer 2. O SCT0_OUT8 — SCTimer/PWM output 8. O TRACEDATA[2] — Trace data bit 2. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 21 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller A2 A2 200 95 Reset state [1] [2] Type 208-pin, LQFP PIO0_30 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO0_30 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 0 USART TXD function. I/O FC0_TXD_SCL_MISO — Flexcomm 0: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. PIO0_31/ ADC0_5 K3 M5 55 28 [4] O CT0_MAT0 — Match output 0 from Timer 0. O SCT0_OUT9 — SCTimer/PWM output 9. O TRACEDATA[1] — Trace data bit 1. PU I/O; PIO0_31/ADC0_5 — General-purpose digital input/output pin. AI ADC input channel 5 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC0_CTS_SDA_SSEL0 — Flexcomm 0: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O SD_D[2] — SD/MMC data 2. PIO1_0/ ADC0_6 J3 N3 56 29 [4] O CT0_MAT1 — Match output 1 from Timer 0. O SCT0_OUT3 — SCTimer/PWM output 3. O TRACEDATA[0] — Trace data bit 0. PU I/O; PIO1_0/ADC0_6 — General-purpose digital input/output pin. AI ADC input channel 6 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC0_RTS_SCL_SSEL1 — Flexcomm 0: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_D[3] — SD/MMC data 3. PIO1_1 J10 K12 109 55 [2] I CT0_CAP2 — Capture 2 input to Timer 0. I SCT0_GPI4 — Pin input 4 to SCTimer/PWM. O TRACECLK — Trace clock. PU I/O PIO1_1/ — General-purpose digital input/output pin. I/O FC3_RXD_SDA_MOSI — Flexcomm 3: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. I CT0_CAP3 — Capture 3 input to Timer 0. I SCT0_GPI5 — Pin input 5 to SCTimer/PWM. R — Reserved. R — Reserved. I LPC546xx Product data sheet USB1_OVERCURRENTN — USB1 bus overcurrent indicator (active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 22 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 58 [2] Type L14 117 Reset state [1] G9 Description 100-pin, LQFP PIO1_2 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_2 — General-purpose digital input/output pin. O CAN0_TD — Transmitter output for CAN0. R — Reserved. O CT0_MAT3 — Match output 3 from Timer0. I SCT0_GPI6 — Pin input 6 to SCTimer/PWM. O PDM1_CLK — Clock for PDM interface 1, for digital microphone. R — Reserved. O PIO1_3 F10 J13 120 60 [2] USB1_PORTPWRN — USB1 VBUS drive indicator (Indicates VBUS must be driven). PU I/O PIO1_3 — General-purpose digital input/output pin. I CAN0_RD — Receiver input for CAN0. R — Reserved. R — Reserved. PIO1_4 C3 D4 3 3 [2] O SCT0_OUT4 — SCTimer/PWM output 4. I PDM1_DATA — Data for PDM interface 1 (digital microphone). O USB0_PORTPWRN — USB0 VBUS drive indicator (Indicates VBUS must be driven). PU I/O PIO1_4 — General-purpose digital input/output pin. I/O FC0_SCK — Flexcomm 0: USART or SPI clock. I/O SD_D[0] — SD/MMC data 0. O CT2_MAT1 — Match output 1 from Timer 2. O SCT0_OUT0 — SCTimer/PWM output 0. I FREQME_GPIO_CLK_A — Frequency Measure pin clock input A. I/O EMC_D[11]) — External Memory interface data [11]. PIO1_5 C2 E4 5 4 [2] PU I/O PIO1_5 — General-purpose digital input/output pin. I/O FC0_RXD_SDA_MOSI — Flexcomm 0: USART receiver, I2C data I/O, SPI master-out/slave-in data. I/O SD_D[2] — SD/MMC data 2. O CT2_MAT0 — Match output 0 from Timer 2. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. R — Reserved. O LPC546xx Product data sheet EMC_A[4] — External memory interface address 4. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 23 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP F1 G4 30 15 [2] Type 208-pin, LQFP PIO1_6 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_6 — General-purpose digital input/output pin. I/O FC0_TXD_SCL_MISO — Flexcomm 0: USART transmitter, I2C clock, SPI master-in/slave-out data. I/O SD_D[3] — SD/MMC data 3. O CT2_MAT1 — Match output 1 from Timer 2. I SCT0_GPI3 — Pin input 3 to SCTimer/PWM. R — Reserved. O PIO1_7 H1 N1 38 18 [2] EMC_A[5] — External memory interface address 5. PU I/O PIO1_7 — General-purpose digital input/output pin. I/O FC0_RTS_SCL_SSEL1 — Flexcomm 0: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_D[1] — SD/MMC data 1. O CT2_MAT2 — Match output 2 from Timer 2. I SCT0_GPI4 — Pin input 4 to SCTimer/PWM. R — Reserved. O PIO1_8 H5 P8 72 36 [2] EMC_A[6] — External memory interface address 6. PU I/O PIO1_8 — General-purpose digital input/output pin. I/O FC0_CTS_SDA_SSEL0 — Flexcomm 0: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O SD_CLK — SD/MMC clock. R — Reserved. O SCT0_OUT1 — SCTimer/PWM output 1. I/O FC4_SSEL2 — Flexcomm 4: SPI slave select 2. O PIO1_9 K7 K6 78 39 [2] EMC_A[7] — External memory interface address 7. PU I/O PIO1_9 — General-purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0. I/O FC1_SCK — Flexcomm 1: USART or SPI clock. I CT1_CAP0 — Capture 0 input to Timer 1. O SCT0_OUT2 — SCTimer/PWM output 2. I/O FC4_CTS_SDA_SSEL0 — Flexcomm 4: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O LPC546xx Product data sheet EMC_CASN — External memory interface column access strobe (active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 24 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP H6 N9 84 41 [2] Type 208-pin, LQFP PIO1_10 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_10 — General-purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1. I/O FC1_RXD_SDA_MOSI — Flexcomm 1: USART receiver, I2C data I/O, SPI master-out/slave-in data. O CT1_MAT0 — Match output 0 from Timer 1. O SCT0_OUT3 — SCTimer/PWM output 3. R — Reserved. O PIO1_11 B4 B4 198 94 [2][8] EMC_RASN — External memory interface row address strobe (active low). PU I/O PIO1_11 — General-purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). I/O FC1_TXD_SCL_MISO — Flexcomm 1: USART transmitter, I2C clock, SPI master-in/slave-out data. I CT1_CAP1 — Capture 1 input to Timer 1. I USB0_VBUS — Monitors the presence of USB0 bus power. R — Reserved. O PIO1_12 F8 K9 128 62 [2] EMC_CLK[0] — External memory interface clock 0. PU I/O PIO1_12 — General-purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0. I/O FC6_SCK — Flexcomm 6: USART, SPI, or I2S clock. PIO1_13 D10 G10 139 66 [2] O CT1_MAT1 — Match output 1 from Timer 1. O USB0_PORTPWRN — USB0 VBUS drive indicator (Indicates VBUS must be driven). O EMC_DYCSN[0] — External Memory interface SDRAM chip select 0 (active low). PU I/O PIO1_13 — General-purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data 1. I/O FC6_RXD_SDA_MOSI_DATA — Flexcomm 6: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. LPC546xx Product data sheet I CT1_CAP2 — Capture 2 input to Timer 1. I USB0_OVERCURRENTN — USB0 bus overcurrent indicator (active low). O USB0_FRAME — USB0 frame toggle signal. O EMC_DQM[0] — External memory interface data mask 0. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 25 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller C12 160 78 Reset state [1] [2] Type A9 Description 100-pin, LQFP PIO1_14 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_14 — General-purpose digital input/output pin. I ENET_RX_DV — Ethernet receive data valid. I UTICK_CAP2 — Micro-tick timer capture input 2. O CT1_MAT2 — Match output 2 from Timer 1. I/O FC5_CTS_SDA_SSEL0 — Flexcomm 5: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO1_15 C7 A11 176 84 [2] O USB0_LEDN — USB0-configured LED indicator (active low). O EMC_DQM[1] — External memory interface data mask 0. PU I/O PIO1_15 — General-purpose digital input/output pin. I ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). I UTICK_CAP3 — Micro-tick timer capture input 3. I CT1_CAP3 — Capture 3 input to Timer 1. I/O FC5_RTS_SCL_SSEL1 — Flexcomm 5: USART request-to-send, I2C clock, SPI slave select 1. I/O FC4_RTS_SCL_SSEL1 — Flexcomm 4: USART request-to-send, I2C clock, SPI slave select 1. O PIO1_16 B5 B7 187 88 [2] EMC_CKE[0] — External memory interface SDRAM clock enable 0. PU I/O PIO1_16 — General-purpose digital input/output pin. O ENET_MDC — Ethernet management data clock. I/O FC6_TXD_SCL_MISO_WS — Flexcomm 6: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. O CT1_MAT3 — Match output 3 from Timer 1. I/O SD_CMD — SD/MMC card command I/O. R — Reserved. O PIO1_17 H8 N12 98 47 [2] EMC_A[10] — External memory interface address 10. PU I/O PIO1_17 — General-purpose digital input/output pin. I/O ENET_MDIO — Ethernet management data I/O. I/O FC8_RXD_SDA_MOSI — Flexcomm 8: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. LPC546xx Product data sheet O SCT0_OUT4 — SCTimer/PWM output 4. O CAN1_TD — Transmitter output for CAN 1. O EMC_BLSN[0] — External memory interface byte lane select 0 (active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 26 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP D2 D1 15 5 [2] Type 208-pin, LQFP PIO1_18 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_18 — General-purpose digital input/output pin. R — Reserved. I/O FC8_TXD_SCL_MISO — Flexcomm 8: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. PIO1_19 F3 L1 33 16 [2] O SCT0_OUT5 — SCTimer/PWM output 5. I CAN1_RD — Receiver input for CAN 1. O EMC_BLSN[1] — External memory interface byte lane select 1 (active low). PU I/O PIO1_19 — General-purpose digital input/output pin. I/O FC8_SCK — Flexcomm 8: USART or SPI clock. O SCT0_OUT7 — SCTimer/PWM output 7. O CT3_MAT1 — Match output 1 from Timer 3. I SCT0_GPI7 — Pin input 7 to SCTimer/PWM. I/O FC4_SCK — Flexcomm 4: USART or SPI clock. I/O EMC_D[8] — External Memory interface data [8]. PIO1_20 G2 M1 35 17 [2] PU I/O PIO1_20 — General-purpose digital input/output pin. I/O FC7_RTS_SCL_SSEL1 — Flexcomm 7: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. I CT3_CAP2 — Capture 2 input to Timer 3. R — Reserved. I/O FC4_TXD_SCL_MISO — Flexcomm 4: USART transmitter, I2C clock, SPI master-in/slave-out data. I/O EMC_D[9] — External Memory interface data [9]. PIO1_21 K6 N8 74 37 [2] PU I/O PIO1_21 — General-purpose digital input/output pin. I/O FC7_CTS_SDA_SSEL0 — Flexcomm 7: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. O CT3_MAT2 — Match output 2 from Timer 3. R — Reserved. I/O FC4_RXD_SDA_MOSI — Flexcomm 4: USART receiver, I2C data I/O, SPI master-out/slave-in data. I/O EMC_D[10] — External Memory interface data [10]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 27 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP K8 P11 89 43 [2] Type 208-pin, LQFP PIO1_22 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_22 — General-purpose digital input/output pin. I/O FC8_RTS_SCL_SSEL1 — Flexcomm 8: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_CMD — SD/MMC card command I/O. O CT2_MAT3 — Match output 3 from Timer 2. I SCT0_GPI5 — Pin input 5 to SCTimer/PWM. I/O FC4_SSEL3 — Flexcomm 4: SPI slave select 3. O PIO1_23 K10 M10 97 46 [2] EMC_CKE[1] — External memory interface SDRAM clock enable 1. PU I/O PIO1_23 — General-purpose digital input/output pin. I/O FC2_SCK — Flexcomm 2: USART or SPI clock. O SCT0_OUT0 — SCTimer/PWM output 0. R — Reserved. I/O ENET_MDIO — Ethernet management data I/O. I/O FC3_SSEL2 — Flexcomm 3: SPI slave select 2. O PIO1_24 G8 N14 111 57 [2] EMC_A[11] — External memory interface address 11. PU I/O PIO1_24 — General-purpose digital input/output pin. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. O SCT0_OUT1 — SCTimer/PWM output 1. R — Reserved. R — Reserved. I/O FC3_SSEL3 — Flexcomm 3: SPI slave select 3. O PIO1_25 G10 M12 119 59 [2] EMC_A[12] — External memory interface address 12. PU I/O PIO1_25 — General-purpose digital input/output pin. I/O FC2_TXD_SCL_MISO — Flexcomm 2: USART transmitter, I2C clock, SPI master-in/slave-out data. O SCT0_OUT2 — SCTimer/PWM output 2. R — Reserved. I UTICK_CAP0 — Micro-tick timer capture input 0. R — Reserved. O LPC546xx Product data sheet EMC_A[13] — External memory interface address 13. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 28 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller E8 J10 131 63 Reset state [1] [2] Type 208-pin, LQFP PIO1_26 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_26 — General-purpose digital input/output pin. I/O FC2_CTS_SDA_SSEL0 — Flexcomm 2: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O SCT0_OUT3 — SCTimer/PWM output 3. I CT0_CAP3 — Capture 3 input to Timer 0. I UTICK_CAP1 — Micro-tick timer capture input 1. R — Reserved. O PIO1_27 D8 F10 142 68 [2] EMC_A[8] — External memory interface address 8. PU I/O PIO1_27 — General-purpose digital input/output pin. I/O FC2_RTS_SCL_SSEL1 — Flexcomm 2: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_D[4] — SD/MMC data 4. O CT0_MAT3 — Match output 3 from Timer 0. O CLKOUT — Output of the CLKOUT function. R — Reserved. O PIO1_28 A10 E12 151 73 [2] EMC_A[9] — External memory interface address 9. PU I/O PIO1_28 — General-purpose digital input/output pin. I/O FC7_SCK — Flexcomm 7: USART, SPI, or I2S clock. I/O SD_D[5] — SD/MMC data 5. I CT0_CAP2 — Capture 2 input to Timer 0. R — Reserved. R — Reserved. I/O EMC_D[12] — External Memory interface data [12]. PIO1_29 A8 C11 165 81 [2][8] PU I/O PIO1_29 — General-purpose digital input/output pin. I/O FC7_RXD_SDA_MOSI_DATA — Flexcomm 7: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. I/O SD_D[6] — SD/MMC data 6. I SCT0_GPI6 — Pin input 6 to SCTimer/PWM. O USB1_PORTPWRN — USB1 VBUS drive indicator (Indicates VBUS must be driven). O USB1_FRAME — USB1 frame toggle signal. I/O EMC_D[13] — External Memory interface data [13]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 29 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller C6 A8 182 86 Reset state [1] [2] Type 208-pin, LQFP PIO1_30 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO1_30 — General-purpose digital input/output pin. I/O FC7_TXD_SCL_MISO_WS — Flexcomm 7: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. I/O SD_D[7] — SD/MMC data 7. I SCT0_GPI7 — Pin input 7 to SCTimer/PWM. I USB1_OVERCURRENTN — USB1 bus overcurrent indicator (active low). O USB1_LEDN — USB1-configured LED indicator (active low). I/O EMC_D[14] — External Memory interface data [14]. PIO1_31 A3 C5 195 92 [2] PU I/O PIO1_31 — General-purpose digital input/output pin. I/O MCLK — MCLK input or output for I2S and/or digital microphone. R — Reserved. O CT0_MAT2 — Match output 2 from Timer 0. O SCT0_OUT6 — SCTimer/PWM output 6. I/O FC8_CTS_SDA_SSEL0 — Flexcomm 8: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O EMC_D[15] — External Memory interface data [15]. PIO2_0/ ADC0_7 - P3 57 - [4] PU I/O; PIO2_0/ADC0_7 — General-purpose digital input/output pin. AI ADC input channel 7 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. R — Reserved. I/O FC0_RXD_SDA_MOSI — Flexcomm 0: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. O PIO2_1/ ADC0_8 - P4 58 - [4] CT1_CAP0 — Capture input 0 to Timer 1. PU I/O; PIO2_1/ADC0_8 — General-purpose digital input/output pin. AI ADC input channel 8 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. R — Reserved. I/O FC0_TXD_SCL_MISO — Flexcomm 0: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. O LPC546xx Product data sheet CT1_MAT0 — Match output 0 from Timer 1. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 30 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - C3 4 - [2] Type 208-pin, LQFP PIO2_2 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO2_2 — General-purpose digital input/output pin. I ENET_CRS — Ethernet Carrier Sense (MII interface) or Ethernet Carrier Sense/Data Valid (RMII interface). I/O FC3_SSEL3 — Flexcomm 3: SPI slave select 3. PIO2_3 - B1 7 - [2] O SCT0_OUT6 — SCTimer/PWM output 6. O CT1_MAT1 — Match output 1 from Timer 1. PU I/O PIO2_3 — General-purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). O SD_CLK — SD/MMC clock. I/O FC1_RXD_SDA_MOSI — Flexcomm 1: USART receiver, I2C data I/O, SPI master-out/slave-in data. O PIO2_4 - D3 9 - [2] CT2_MAT0 — Match output 0 from Timer 2. PU I/O PIO2_4 — General-purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O SD_CMD — SD/MMC card command I/O. I/O FC1_TXD_SCL_MISO — Flexcomm 1: USART transmitter, I2C clock, SPI master-in/slave-out data. O PIO2_5 - C1 12 - [2] CT2_MAT1 — Match output 1 from Timer 2. PU I/O PIO2_5 — General-purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). O SD_POW_EN — SD/MMC card power enable I/O FC1_CTS_SDA_SSEL0 — Flexcomm 1: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O PIO2_6 - F3 17 - [2] CT1_MAT2 — Match output 2 from Timer 1. PU I/O PIO2_6 — General-purpose digital input/output pin. I ENET_TX_CLK — Ethernet Transmit Clock (MII interface). I/O SD_D[0] — SD/MMC data 0. I/O FC1_RTS_SCL_SSEL1 — Flexcomm 1: USART request-to-send, I2C clock, SPI slave select 1. I PIO2_7 - J2 29 - [2] CT0_CAP0 — Capture input 0 to Timer 0. PU I/O PIO2_7 — General-purpose digital input/output pin. I ENET_COL — Ethernet Collision detect (MII interface). I/O SD_D(1) — SD/MMC data 1. LPC546xx Product data sheet I FREQME_GPIO_CLK_B — Frequency Measure pin clock input B. I CT0_CAP1 — Capture input 1 to Timer 0. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 31 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - F4 32 - [2] Type 208-pin, LQFP PIO2_8 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO2_8 — General-purpose digital input/output pin. I ENET_RXD2 — Ethernet Receive Data 2 (MII interface). I/O SD_D[2] — SD/MMC data 2. R — Reserved. O PIO2_9 - K2 36 - [2] CT0_MAT0 — Match output 0 from Timer 0. PU I/O PIO2_9 — General-purpose digital input/output pin. I ENET_RXD3 — Ethernet Receive Data 3 (MII interface). I/O SD_D[3] — SD/MMC data 3. R — Reserved. O PIO2_10 PIO2_11 - - P1 K3 39 43 - - [2] [2] CT0_MAT1 — Match output 0 from Timer 1. PU I/O PIO2_10 — General-purpose digital input/output pin. I ENET_RX_ER — Ethernet receive error (RMII/MII interface). I SD_CARD_DET_N — SD/MMC card detect (active low). PU I/O PIO2_11 — General-purpose digital input/output pin. O LCD_PWR — LCD panel power enable. O SD_VOLT[0] — SD/MMC card regulator voltage control [0]. R — Reserved. R — Reserved. I/O FC5_SCK — Flexcomm 5: USART or SPI clock. PIO2_12 - M2 45 - [2] PU I/O PIO2_12 — General-purpose digital input/output pin. O LCD_LE — LCD line end signal. O SD_VOLT[1] — SD/MMC card regulator voltage control [1]. I USB0_IDVALUE — Indicates to the transceiver whether connected as an A-device (USB0_ID LOW) or B-device (USB0_ID HIGH). R — Reserved. I/O FC5_RXD_SDA_MOSI — Flexcomm 5: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO2_13 - P7 70 - [2] PU I/O PIO2_13 — General-purpose digital input/output pin. O LCD_DCLK — LCD panel clock. O SD_VOLT[2] — SD/MMC card regulator voltage control [2]. R — Reserved. R — Reserved. I/O FC5_TXD_SCL_MISO — Flexcomm 5: USART transmitter, I2C clock, SPI master-in/slave-out data. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 32 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - L7 77 - [2][8] Type 208-pin, LQFP PIO2_14 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO2_14 — General-purpose digital input/output pin. O LCD_FP — LCD frame pulse (STN). Vertical synchronization pulse (TFT). O USB0_FRAME — USB0 frame toggle signal. O USB0_PORTPWRN — USB0 VBUS drive indicator (Indicates VBUS must be driven). O CT0_MAT2 — Match output 2 from Timer 0. I/O FC5_CTS_SDA_SSEL0 — Flexcomm 5: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO2_15 - M8 79 - [2] PU I/O PIO2_15 — General-purpose digital input/output pin. O LCD_AC — LCD STN AC bias drive or TFT data enable output. O USB0_LEDN — USB0-configured LED indicator (active low). I USB0_OVERCURRENTN — USB0 bus overcurrent indicator (active low). O CT0_MAT3 — Match output 3 from Timer 0. I/O FC5_RTS_SCL_SSEL1 — Flexcomm 5: USART request-to-send, I2C clock, SPI slave select 1. PIO2_16 - L8 81 - [2][8] PU I/O PIO2_16 — General-purpose digital input/output pin. O LCD_LP — LCD line synchronization pulse (STN). Horizontal synchronization pulse (TFT). O USB1_FRAME — USB1 frame toggle signal. O USB1_PORTPWRN — USB1 VBUS drive indicator (Indicates VBUS must be driven). O CT1_MAT3 — Match output 3 from Timer 1. I/O FC8_SCK — Flexcomm 8: USART or SPI clock. PIO2_17 - P10 86 - [2] PU I/O PIO2_17 — General-purpose digital input/output pin. I LCD_CLKIN — LCD clock input. O USB1_LEDN — USB1-configured LED indicator (active low). I USB1_OVERCURRENTN — USB1 bus overcurrent indicator (active low). I CT1_CAP1 — Capture 1 input to Timer 1. I/O FC8_RXD_SDA_MOSI — Flexcomm 8: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO2_18 - N10 90 - [2] PU I/O PIO2_18 — General-purpose digital input/output pin. O LCD_VD[0] — LCD Data [0]. I/O FC3_RXD_SDA_MOSI — Flexcomm 3: USART receiver, I2C data I/O, SPI master-out/slave-in data. I/O FC7_SCK — Flexcomm 7: USART, SPI, or I2S clock. O LPC546xx Product data sheet CT3_MAT0 — Match output 0 from Timer 3. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 33 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Type P12 93 Reset state [1] - Description 100-pin, LQFP PIO2_19 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO2_19 — General-purpose digital input/output pin. O LCD_VD[1] — LCD Data [1]. I/O FC3_TXD_SCL_MISO — Flexcomm 3: USART transmitter, I2C clock, SPI master-in/slave-out data. I/O FC7_RXD_SDA_MOSI_DATA — Flexcomm 7: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. O PIO2_20 - P13 95 - [2] CT3_MAT1 — Match output 1 from Timer 3. PU I/O PIO2_20 — General-purpose digital input/output pin. O LCD_VD[2] — LCD Data [2]. I/O FC3_RTS_SCL_SSEL1 — Flexcomm 3: USART request-to-send, I2C clock, SPI slave select 1. I/O FC7_TXD_SCL_MISO_WS — Flexcomm 7: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. PIO2_21 - L10 99 - [2] O CT3_MAT2 — Match output 2 from Timer 3. I CT4_CAP0 — Capture input 4 to Timer 0. PU I/O PIO2_21 — General-purpose digital input/output pin. O LCD_VD[3] — LCD Data [3]. I/O FC3_CTS_SDA_SSEL0 — Flexcomm 3: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O MCLK — MCLK input or output for I2S and/or digital microphone. O PIO2_22 - K10 113 - [2] CT3_MAT3 — Match output 3 from Timer 3. PU I/O PIO2_22 — General-purpose digital input/output pin. O LCD_VD[4] — LCD Data [4]. O SCT0_OUT7 — SCTimer/PWM output 7. R — Reserved. I PIO2_23 PIO2_24 PIO2_25 LPC546xx Product data sheet - - - M14 115 K14 118 J11 - - 121 - [2] CT2_CAP0 — Capture input 0 to Timer 2. PU I/O PIO2_23 — General-purpose digital input/output pin. [2] O LCD_VD[5] — LCD Data [5]. O SCT0_OUT8 — SCTimer/PWM output 8. PU I/O PIO2_24 — General-purpose digital input/output pin. [2][8] O LCD_VD[6] — LCD Data [6]. O SCT0_OUT9 — SCTimer/PWM output 9. PU I/O PIO2_25 — General-purpose digital input/output pin. O LCD_VD[7] — LCD Data [7]. I USB0_VBUS — Monitors the presence of USB0 bus power. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 34 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller H11 124 - Reset state [1] [2] Type - Description 100-pin, LQFP PIO2_26 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO2_26 — General-purpose digital input/output pin. O LCD_VD[8] — LCD Data [8]. R — Reserved. I/O FC3_SCK — Flexcomm 3: USART or SPI clock. I PIO2_27 - H14 130 - [2] CT2_CAP1 — Capture input 1 to Timer 2. PU I/O PIO2_27 — General-purpose digital input/output pin. O LCD_VD[9] — LCD Data [9]. I/O FC9_SCK — Flexcomm 9: USART or SPI clock. I/O FC3_SSEL2 — Flexcomm 3: SPI slave select 2. PIO2_28 - G13 134 - [2] PU I/O PIO2_28 — General-purpose digital input/output pin. O LCD_VD[10]) — LCD Data [10]. I/O FC7_CTS_SDA_SSEL0 — Flexcomm 7: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved I PIO2_29 - G11 137 - [2] CT2_CAP2 — Capture input 2 to Timer 2. PU I/O PIO2_29 — General-purpose digital input/output pin. O LCD_VD[11] — LCD Data [11]. I/O FC7_RTS_SCL_SSEL1 — Flexcomm 7: USART request-to-send, I2C clock, SPI slave select 1. I/O FC8_TXD_SCL_MISO — Flexcomm 8: USART transmitter, I2C clock, SPI master-in/slave-out data. PIO2_30 - F12 143 - [2] I CT2_CAP3 — Capture 3 input to Timer 2. O CLKOUT — Output of the CLKOUT function. PU I/O PIO2_30 — General-purpose digital input/output pin. O LCD_VD[12] — LCD Data [12]. R — Reserved. R — Reserved. O PIO2_31 - D14 149 - [2] D12 155 - [2] PU I/O PIO2_31 — General-purpose digital input/output pin. O PIO3_0 - CT2_MAT2 — Match output 2 from Timer 2. LCD_VD[13] — LCD Data [13]. PU I/O PIO3_0 — General-purpose digital input/output pin. O LCD_VD[14] — LCD Data [14]. O PDM0_CLK — Clock for PDM interface 0, for digital microphone. R — Reserved. O LPC546xx Product data sheet CT1_MAT0 — Match output 0 from Timer 1. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 35 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller D11 159 - Reset state [1] [2] Type - Description 100-pin, LQFP PIO3_1 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_1 — General-purpose digital input/output pin. O LCD_VD[15] — LCD Data [15]. I PDM0_DATA — Data for PDM interface 0 (digital microphone). R — Reserved. O PIO3_2 - C10 164 - [2] CT1_MAT1 — Match output 1 from Timer 1. PU I/O PIO3_2 — General-purpose digital input/output pin. O LCD_VD[16] — LCD Data [16]. I/O FC9_RXD_SDA_MOSI — Flexcomm 9: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. O PIO3_3 - A13 169 - [2] CT1_MAT2 — Match output 2 from Timer 1. PU I/O PIO3_3 — General-purpose digital input/output pin. O LCD_VD[17] — LCD Data [17]. I/O FC9_TXD_SCL_MISO — Flexcomm 9: USART transmitter, I2C clock, SPI master-in/slave-out data. PIO3_4 - B11 172 - [2] PU I/O PIO3_4 — General-purpose digital input/output pin. O LCD_VD[18] — LCD Data [18]. R — Reserved. I/O FC8_CTS_SDA_SSEL0 — Flexcomm 8: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I PIO3_5 - B10 177 - [2] CT4_CAP1 — Capture input 4 to Timer 1. PU I/O PIO3_5 — General-purpose digital input/output pin. O LCD_VD[19] — LCD Data [19]. R — Reserved. I/O FC8_RTS_SCL_SSEL1 — Flexcomm 8: USART request-to-send, I2C clock, SPI slave select 1. O PIO3_6 - C9 180 - [2] CT4_MAT1 — Match output 1 from Timer 4. PU I/O PIO3_6 — General-purpose digital input/output pin. O LCD_VD[20] — LCD Data [20]. O LCD_VD[0] — LCD Data [0]. R — Reserved. O PIO3_7 - B8 184 - [2] CT4_MAT2 — Match output 2 from Timer 4. PU I/O PIO3_7 — General-purpose digital input/output pin. O LCD_VD[21] — LCD Data [21]. O LCD_VD[1] — LCD Data [1]. R — Reserved. I LPC546xx Product data sheet CT4_CAP2 — Capture input 2 to Timer 4. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 36 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - A7 186 - Reset state [1] [2] Type 208-pin, LQFP PIO3_8 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_8 — General-purpose digital input/output pin. O LCD_VD[22] — LCD Data [22]. O LCD_VD[2] — LCD Data [2]. R — Reserved. I PIO3_9 - C7 192 - [2] CT4_CAP3 — Capture input 3 to Timer 4. PU I/O PIO3_9 — General-purpose digital input/output pin. O LCD_VD[23] — LCD Data [23]. O LCD_VD[3] — LCD Data [3]. R — Reserved. I PIO3_10 - A3 199 - [2] CT0_CAP2 — Capture input 2 to Timer 0. I/O PIO3_10 — General-purpose digital input/output pin. O SCT0_OUT3 — SCTimer/PWM output 3. R — Reserved. O CT3_MAT0 — Match output 0 from Timer 3. R — Reserved. R — Reserved. PIO3_11 - B2 208 - [2] O EMC_DYCSN[1] — External Memory interface SDRAM chip select 1(active low). O TRACEDATA[0] — Trace data bit 0. PU I/O PIO3_11 — General-purpose digital input/output pin. I/O MCLK — MCLK input or output for I2S and/or digital microphone. I/O FC0_SCK — Flexcomm 0: USART or SPI clock. I/O FC1_SCK — Flexcomm 1: USART or SPI clock. R — Reserved. R — Reserved. R — Reserved. O PIO3_12 - L2 37 - [2] TRACEDATA[3] — Trace data bit 3. PU I/O PIO3_12 — General-purpose digital input/output pin. O SCT0_OUT8 — SCTimer/PWM output 8. R — Reserved. I CT3_CAP0 — Capture input 0 to Timer 3. R — Reserved. LPC546xx Product data sheet O CLKOUT — Output of the CLKOUT function. O EMC_CLK[1] — External memory interface clock 1. O TRACECLK — Trace clock. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 37 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - H4 75 - [2] Type 208-pin, LQFP PIO3_13 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_13 — General-purpose digital input/output pin. O SCT0_OUT9 — SCTimer/PWM output 9. I/O FC9_CTS_SDA_SSEL0 — Flexcomm 9: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I CT3_CAP1 — Capture input 1 to Timer 3. R — Reserved. R — Reserved. PIO3_14 - E3 13 - [2] I EMC_FBCK — External memory interface feedback clock. O TRACEDATA[1] — Trace data bit 1. PU I/O PIO3_14 — General-purpose digital input/output pin. O SCT0_OUT4 — SCTimer/PWM output 4. I/O FC9_RTS_SCL_SSEL1 — Flexcomm 9: USART request-to-send, I2C clock, SPI slave select 1. O CT3_MAT1 — Match output 1 from Timer 3. R — Reserved. R — Reserved. R — Reserved. O PIO3_15 - D2 11 - [2] TRACEDATA[2] — Trace data bit 2. PU I/O PIO3_15 — General-purpose digital input/output pin. I/O FC8_SCK — Flexcomm 8: USART or SPI clock. I PIO3_16 - E1 19 - [2] SD_WR_PRT — SD/MMC write protect. PU I/O PIO3_16 — General-purpose digital input/output pin. I/O FC8_RXD_SDA_MOSI — Flexcomm 8: USART receiver, I2C data I/O, SPI master-out/slave-in data. I/O SD_D[4] — SD/MMC data 4. PIO3_17 - K1 31 - [2] PU I/O PIO3_17 — General-purpose digital input/output pin. I/O FC8_TXD_SCL_MISO — Flexcomm 8: USART transmitter, I2C clock, SPI master-in/slave-out data. I/O SD_D[5] — SD/MMC data 5. PIO3_18 - M6 68 - [2] PU I/O PIO3_18 — General-purpose digital input/output pin. I/O FC8_CTS_SDA_SSEL0 — Flexcomm 8: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O SD_D[6] — SD/MMC data 6. LPC546xx Product data sheet O CT4_MAT0 — Match output 0 from Timer 4. O CAN0_TD — Transmitter output for CAN 0. O SCT0_OUT5 — SCTimer/PWM output 5. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 38 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - J3 44 - [2] Type 208-pin, LQFP PIO3_19 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_19 — General-purpose digital input/output pin. I/O FC8_RTS_SCL_SSEL1 — Flexcomm 8: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_D[7] — SD/MMC data 7. PIO3_20 - N2 46 - [2] O CT4_MAT1 — Match output 1 from Timer 4. I CAN0_RD — Receiver input for CAN 0. O SCT0_OUT6 — SCTimer/PWM output 6. PU I/O PIO3_20 — General-purpose digital input/output pin. I/O FC9_SCK — Flexcomm 9: USART or SPI clock. I SD_CARD_INT_N — Card interrupt line. O CLKOUT — Output of the CLKOUT function. R — Reserved. O PIO3_21/ ADC0_9 - P5 61 - [4] SCT0_OUT7 — SCTimer/PWM output 7. PU I/O; PIO3_21/ADC0_9 — General-purpose digital input/output pin. AI ADC input channel 9 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC9_RXD_SDA_MOSI — Flexcomm 9: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO3_22/ ADC0_10 - N5 62 - [4] O SD_BACKEND_PWR — SD/MMC back-end power supply for embedded device. O CT4_MAT3 — Match output 3 from Timer 4. I UTICK_CAP2 — Micro-tick timer capture input 2. PU I/O; PIO3_22/ADC0_10 — General-purpose digital input/output AI pin. ADC input channel 10 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC9_TXD_SCL_MISO — Flexcomm 9: USART transmitter, I2C clock, SPI master-in/slave-out data. PIO3_23 - C2 8 - [3] Z I/O PIO3_23 — General-purpose digital input/output pin. I/O FC2_CTS_SDA_SSEL0 — Flexcomm 2: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. I PIO3_24 - E2 16 - [3] Z UTICK_CAP3 — Micro-tick timer capture input 3. I/O PIO3_24 — General-purpose digital input/output pin. I/O FC2_RTS_SCL_SSEL1 — Flexcomm 2: USART request-to-send, I2C clock, SPI slave select 1. LPC546xx Product data sheet I CT4_CAP0 — Capture input 4 to Timer 0. I USB0_VBUS — Monitors the presence of USB0 bus power. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 39 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - P9 82 - [2] Type 208-pin, LQFP PIO3_25 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_25 — General-purpose digital input/output pin. R — Reserved. I CT4_CAP2 — Capture input 2 to Timer 4. I/O FC4_SCK — Flexcomm 4: USART or SPI clock. R — Reserved. R — Reserved. O PIO3_26 - K5 88 - [2] EMC_A[14] — External memory interface address 14. PU I/O PIO3_26 — General-purpose digital input/output pin. R — Reserved. O SCT0_OUT0 — SCTimer/PWM output 0. I/O FC4_RXD_SDA_MOSI — Flexcomm 4: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. R — Reserved. O PIO3_27 - P14 96 - [2] EMC_A[15] — External memory interface address 15. PU I/O PIO3_27 — General-purpose digital input/output pin. R — Reserved. O SCT0_OUT1 — SCTimer/PWM output 1. I/O FC4_TXD_SCL_MISO — Flexcomm 4: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. R — Reserved. O PIO3_28 - M11 100 - [2] EMC_A[16] — External memory interface address 16. PU I/O PIO3_28 — General-purpose digital input/output pin. R — Reserved. O SCT0_OUT2 — SCTimer/PWM output 2. I/O FC4_CTS_SDA_SSEL0 — Flexcomm 4: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. R — Reserved. O LPC546xx Product data sheet EMC_A[17] — External memory interface address 17. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 40 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Type L13 112 Reset state [1] - Description 100-pin, LQFP PIO3_29 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO3_29 — General-purpose digital input/output pin. R — Reserved. O SCT0_OUT3 — SCTimer/PWM output 3. I/O FC4_RTS_SCL_SSEL1 — Flexcomm 4: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. R — Reserved. O PIO3_30 - K13 116 - [2] EMC_A[18] — External memory interface address 18. PU I/O PIO3_30 — General-purpose digital input/output pin. I/O FC9_CTS_SDA_SSEL0 — Flexcomm 9: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O SCT0_OUT4 — SCTimer/PWM output 4. I/O FC4_SSEL2 — Flexcomm 4: SPI slave select 2. R — Reserved. R — Reserved. O PIO3_31 - J14 123 - [2] EMC_A[19] — External memory interface address 19. PU I/O PIO3_31 — General-purpose digital input/output pin. I/O FC9_RTS_SCL_SSEL1 — Flexcomm 9: USART request-to-send, I2C clock, SPI slave select 1. O SCT0_OUT5 — SCTimer/PWM output 5. O CT4_MAT2 — Match output 2 from Timer 4. R — Reserved. PIO4_0 - H13 127 - [2] I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. O EMC_A[20] — External memory interface address 20. PU I/O PIO4_0 — General-purpose digital input/output pin. R — Reserved. I/O FC6_CTS_SDA_SSEL0 — Flexcomm 6: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I CT4_CAP1 — Capture input 4 to Timer 1. R — Reserved. LPC546xx Product data sheet I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. O EMC_CSN[1] — External memory interface static chip select 1(active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 41 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller G14 132 - Reset state [1] [2] Type - Description 100-pin, LQFP PIO4_1 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_1 — General-purpose digital input/output pin. R — Reserved. I/O FC6_SCK — Flexcomm 6: USART, SPI, or I2S clock. R — Reserved. R — Reserved. PIO4_2 - F14 138 - [2] I SCT0_GPI2 — Pin input 2 to SCTimer/PWM. O EMC_CSN[2] — External memory interface static chip select 2 (active low). PU I/O PIO4_2 — General-purpose digital input/output pin. R — Reserved. I/O FC6_RXD_SDA_MOSI_DATA — Flexcomm 6: USART receiver, I2C data I/O, SPI master-out/slave-in data, I2S data I/O. R — Reserved. R — Reserved. PIO4_3 - F13 140 - [2] I SCT0_GPI3 — Pin input 3 to SCTimer/PWM. O EMC_CSN[3] — External memory interface static chip select 3 (active low). PU I/O PIO4_3 — General-purpose digital input/output pin. R — Reserved. I/O FC6_TXD_SCL_MISO_WS — Flexcomm 6: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. I CT0_CAP3 — Capture 3 input to Timer 0. R — Reserved. PIO4_4 - D9 147 - [2] I SCT0_GPI4 — Pin input 4 to SCTimer/PWM. O EMC_DYCSN[2] — External Memory interface SDRAM chip select 2 (active low). PU I/O PIO4_4 — General-purpose digital input/output pin. R — Reserved. I/O FC4_SSEL3 — Flexcomm 4: SPI slave select 3. I/O FC0_RTS_SCL_SSEL1 — Flexcomm 0: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. LPC546xx Product data sheet I SCT0_GPI5 — Pin input 5 to SCTimer/PWM. O EMC_DYCSN[3] — External Memory interface SDRAM chip select 3 (active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 42 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller E10 154 - Reset state [1] [2] Type - Description 100-pin, LQFP PIO4_5 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_5 — General-purpose digital input/output pin. R — Reserved. I/O FC9_CTS_SDA_SSEL0 — Flexcomm 9: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O FC0_CTS_SDA_SSEL0 — Flexcomm 0: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO4_6 - D10 161 - [2] O CT4_MAT3 — Match output 3 from Timer 4. I SCT0_GPI6 — Pin input 6 to SCTimer/PWM. O EMC_CKE[2] — External memory interface SDRAM clock enable 2. PU I/O PIO4_6 — General-purpose digital input/output pin. R — Reserved. I/O FC9_RTS_SCL_SSEL1 — Flexcomm 9: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. R — Reserved. PIO4_7 - A14 166 - [2][8] I SCT0_GPI7 — Pin input 7 to SCTimer/PWM. O EMC_CKE[3] — External memory interface SDRAM clock enable 3. PU I/O PIO4_7 — General-purpose digital input/output pin. R — Reserved. PIO4_8 - B14 170 - [2] I CT4_CAP3 — Capture input 3 to Timer 4. O USB0_PORTPWRN — USB0 VBUS drive indicator (Indicates VBUS must be driven). O USB0_FRAME — USB0 frame toggle signal. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. PU I/O PIO4_8 — General-purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0. I/O FC2_SCK — Flexcomm 2: USART or SPI clock. LPC546xx Product data sheet I USB0_OVERCURRENTN — USB0 bus overcurrent indicator (active low). O USB0_LEDN — USB0-configured LED indicator (active low). I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 43 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller A12 173 - Reset state [1] [2][8] Type - Description 100-pin, LQFP PIO4_9 208-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_9 — General-purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. O PIO4_10 - B9 181 - [2] USB1_PORTPWRN — USB1 VBUS drive indicator (Indicates VBUS must be driven). O USB1_FRAME — USB1 frame toggle signal. I SCT0_GPI2 — Pin input 2 to SCTimer/PWM. PU I/O PIO4_10 — General-purpose digital input/output pin. I ENET_RX_DV — Ethernet receive data valid. I/O FC2_TXD_SCL_MISO — Flexcomm 2: USART transmitter, I2C clock, SPI master-in/slave-out data. I USB1_OVERCURRENTN — USB1 bus overcurrent indicator (active low). O USB1_LEDN — USB1-configured LED indicator (active low). SCT0_GPI3 — Pin input 3 to SCTimer/PWM. PIO4_11 - A9 183 - [2] PU I/O PIO4_11 — General-purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0. I/O FC2_CTS_SDA_SSEL0 — Flexcomm 2: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I USB0_IDVALUE — Indicates to the transceiver whether connected as an A-device (USB0_ID LOW) or B-device (USB0_ID HIGH). R — Reserved. I PIO4_12 - A6 188 - [2] SCT0_GPI4 — Pin input 4 to SCTimer/PWM. PU I/O PIO4_12 — General-purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data 1. I/O FC2_RTS_SCL_SSEL1 — Flexcomm 2: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. I PIO4_13 - B6 190 - [2] SCT0_GPI5 — Pin input 5 to SCTimer/PWM. PU I/O PIO4_13 — General-purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). O CT4_MAT0 — Match output 0 from Timer 4. R — Reserved. I LPC546xx Product data sheet SCT0_GPI6 — Pin input 6 to SCTimer/PWM. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 44 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - B5 194 - Reset state [1] [2] Type 208-pin, LQFP PIO4_14 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_14 — General-purpose digital input/output pin. I ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). O CT4_MAT1 — Match output 1 from Timer 4. I/O FC9_SCK — Flexcomm 9: USART or SPI clock. R — Reserved. I PIO4_15 - A4 197 - [2] SCT0_GPI7 — Pin input 7 to SCTimer/PWM. PU I/O PIO4_15 — General-purpose digital input/output pin. O ENET_MDC — Ethernet management data clock. O CT4_MAT2 — Match output 2 from Timer 4. I/O FC9_RXD_SDA_MOSI — Flexcomm 9: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO4_16 - C4 203 - [2] PU I/O PIO4_16 — General-purpose digital input/output pin. I/O ENET_MDIO — Ethernet management data I/O. O CT4_MAT3 — Match output 3 from Timer 4. I/O FC9_TXD_SCL_MISO — Flexcomm 9: USART transmitter, I2C clock, SPI master-in/slave-out data. PIO4_17 - - 6 - [2] PU I/O PIO4_17 — General-purpose digital input/output pin. R — Reserved. O CAN1_TD — Transmitter output for CAN 1. I CT1_CAP2 — Capture 2 input to Timer 1. I UTICK_CAP0 — Micro-tick timer capture input 0. R — Reserved. O PIO4_18 - - 10 - [2] EMC_BLSN[2] — External memory interface byte lane select 2 (active low). PU I/O PIO4_18 — General-purpose digital input/output pin. R — Reserved. I CAN1_RD — Receiver input for CAN 1. I CT1_CAP3 — Capture 3 input to Timer 1. I UTICK_CAP1 — Micro-tick timer capture input 1. R — Reserved. O LPC546xx Product data sheet EMC_BLSN[3] — External memory interface byte lane select 3 (active low). All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 45 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 14 - [2] Type 208-pin, LQFP PIO4_19 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_19 — General-purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0. O SD_CLK — SD/MMC clock. I/O FC2_SCK — Flexcomm 2: USART or SPI clock. I CT4_CAP2 — Capture input 2 to Timer 4. R — Reserved. O PIO4_20 - - 18 - [2] EMC_DQM[2] — External memory interface data mask 2. PU I/O PIO4_20 — General-purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1. I/O SD_CMD — SD/MMC card command I/O. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. I CT4_CAP3 — Capture input 3 to Timer 4. R — Reserved. O PIO4_21 - - 34 - [2] EMC_DQM[3] — External memory interface data mask 3. PU I/O PIO4_21 — General-purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). O SD_POW_EN — SD/MMC card power enable. I/O FC2_TXD_SCL_MISO — Flexcomm 2: USART transmitter, I2C clock, SPI master-in/slave-out data. O CT2_MAT3 — Match output 3 from Timer 2. R — Reserved. I/O EMC_D[16] — External Memory interface data [16]. PIO4_22 - - 47 - [2] PU I/O PIO4_22 — General-purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I SD_CARD_DET_N — SD/MMC card detect (active low). I/O FC2_RTS_SCL_SSEL1 — Flexcomm 2: USART request-to-send, I2C clock, SPI slave select 1. O CT1_MAT3 — Match output 3 from Timer 1. R — Reserved. I/O EMC_D[17] — External Memory interface data [17]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 46 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 42 - [2] Type 208-pin, LQFP PIO4_23 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_23 — General-purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0. I SD_WR_PRT — SD/MMC write protect. I/O FC2_CTS_SDA_SSEL0 — Flexcomm 2: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. O CT1_MAT0 — Match output 0 from Timer 1. I/O EMC_D[18] — External Memory interface data [18]. PIO4_24 - - 67 - [2] PU I/O PIO4_24 — General-purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data 1. I SD_CARD_INT_N — Card interrupt line. I/O FC7_RTS_SCL_SSEL1 — Flexcomm 7: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. O CT1_MAT1 — Match output 1 from Timer 1. I/O EMC_D[19] — External Memory interface data [19]. PIO4_25 - - 69 - [2] PU I/O PIO4_25 — General-purpose digital input/output pin. I ENET_RXD2 — Ethernet Receive Data 2 (MII interface). I/O SD_D[0] — SD/MMC data 0. I/O FC7_CTS_SDA_SSEL0 — Flexcomm 7: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. O CT1_MAT2 — Match output 2 from Timer 1. I/O EMC_D[20] — External Memory interface data [20]. PIO4_26 - - 73 - [2] PU I/O PIO4_26 — General-purpose digital input/output pin. I ENET_RXD3 — Ethernet Receive Data 3 (MII interface). I/O SD_D[1] — SD/MMC data 1. R — Reserved. I UTICK_CAP2 — Micro-tick timer capture input 2. O CT1_MAT3 — Match output 3 from Timer 1. I/O EMC_D[21] — External Memory interface data [21]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 47 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 85 - [2] Type 208-pin, LQFP PIO4_27 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_27 — General-purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). I/O SD_D[2] — SD/MMC data 2. R — Reserved. I/O FC1_SCK — Flexcomm 1: USART or SPI clock. I CT1_CAP0 — Capture input 0 to Timer 1. I/O EMC_D[22] — External Memory interface data [22]. PIO4_28 - - 92 - [2] PU I/O PIO4_28 — General-purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). I/O SD_D[3] — SD/MMC data 3. R — Reserved. I/O FC1_RXD_SDA_MOSI — Flexcomm 1: USART receiver, I2C data I/O, SPI master-out/slave-in data. I CT1_CAP1 — Capture 1 input to Timer 1. I/O EMC_D[23] — External Memory interface data [23]. PIO4_29 - - 102 - [2] PU I/O PIO4_29 — General-purpose digital input/output pin. I ENET_RX_ER — Ethernet receive error (RMII/MII interface). I/O SD_D[4] — SD/MMC data 4. R — Reserved. I/O FC1_TXD_SCL_MISO — Flexcomm 1: USART transmitter, I2C clock, SPI master-in/slave-out data. I CT1_CAP2 — Capture 2 input to Timer 1. I/O EMC_D[24] — External Memory interface data [24]. PIO4_30 - - 80 - [2] PU I/O PIO4_30 — General-purpose digital input/output pin. I ENET_TX_CLK — Ethernet Transmit Clock (MII interface). I/O SD_D[5] — SD/MMC data 5. O CT3_MAT0 — Match output 0 from Timer 3. I/O FC1_RTS_SCL_SSEL1 — Flexcomm 1: USART request-to-send, I2C clock, SPI slave select 1. I CT1_CAP3 — Capture 3 input to Timer 1. I/O EMC_D[25] — External Memory interface data [25]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 48 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 114 - [2] Type 208-pin, LQFP PIO4_31 Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO4_31 — General-purpose digital input/output pin. I ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). I/O SD_D[6] — SD/MMC data 6. O CT3_MAT1 — Match output 1 from Timer 3. I/O FC4_SCK — Flexcomm 4: USART or SPI clock. R — Reserved. I/O EMC_D[26] — External Memory interface data [26]. PIO5_0 - - 122 - [2] PU I/O PIO5_0 — General-purpose digital input/output pin. I ENET_RX_DV — Ethernet receive data valid. I/O SD_D[7] — SD/MMC data 7. O CT3_MAT2 — Match output 2 from Timer 3. I/O FC4_RXD_SDA_MOSI — Flexcomm 4: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. I/O EMC_D[27] — External Memory interface data [27]. PIO5_1 - - 126 - [2] PU I/O PIO5_1 — General-purpose digital input/output pin. I ENET_CRS — Ethernet Carrier Sense (MII interface) or Ethernet Carrier Sense/Data Valid (RMII interface). O SD_VOLT[0] — SD/MMC card regulator voltage control [0]. O CT3_MAT3 — Match output 3 from Timer 3. I/O FC4_TXD_SCL_MISO — Flexcomm 4: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved. I/O EMC_D[28] — External Memory interface data [28]. PIO5_2 - - 202 - [2] PU I/O PIO5_2 — General-purpose digital input/output pin. I ENET_COL — Ethernet Collision detect (MII interface). O SD_VOLT[1] — SD/MMC card regulator voltage control [1]. I CT3_CAP0 — Capture input 0 to Timer 3. I/O FC4_CTS_SDA_SSEL0 — Flexcomm 4: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved. I/O EMC_D[29] — External Memory interface data [29]. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 49 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - - 129 - Reset state [1] [2] Type 208-pin, LQFP PIO5_3 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO5_3 — General-purpose digital input/output pin. O ENET_MDC — Ethernet management data clock. O SD_VOLT[2] — SD/MMC card regulator voltage control [2]. I CT3_CAP1 — Capture input 1 to Timer 3. I/O FC4_RTS_SCL_SSEL1 — Flexcomm 4: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. I/O EMC_D[30] — External Memory interface data [30]. PIO5_4 - - 135 - [2] PU I/O PIO5_4 — General-purpose digital input/output pin. I/O ENET_MDIO — Ethernet management data I/O. O SD_BACKEND_PWR — SD/MMC back-end power supply for embedded device. I CT3_CAP2 — Capture input 2 to Timer 3. I/O FC4_SSEL2 — Flexcomm 4: SPI slave select 2. R — Reserved. I/O EMC_D[31] — External Memory interface data [31]. PIO5_5 - - 145 - [2] PU I/O PIO5_5 — General-purpose digital input/output pin. I SCT0_GPI0 — Pin input 0 to SCTimer/PWM. O PDM1_CLK — Clock for PDM interface 1, for digital microphone. I CT3_CAP3 — Capture input 3 to Timer 3. I/O FC4_SSEL3 — Flexcomm 4: SPI slave select 3. PIO5_6 - - 152 - [2] O TRACECLK — Trace clock. O EMC_A[21] — External memory interface address 21. PU I/O PIO5_6 — General-purpose digital input/output pin. I SCT0_GPI1 — Pin input 1 to SCTimer/PWM. I PDM1_DATA — Data for PDM interface 1 (digital microphone). I/O FC5_SCK — Flexcomm 5: USART or SPI clock. LPC546xx Product data sheet O SCT0_OUT5 — SCTimer/PWM output 5. O TRACEDATA[0] — Trace data bit 0. O EMC_A[22] — External memory interface address 22. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 50 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - - 171 - Reset state [1] [2] Type 208-pin, LQFP PIO5_7 Description 100-pin, LQFP Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. PU I/O PIO5_7 — General-purpose digital input/output pin. I SCT0_GPI2 — Pin input 2 to SCTimer/PWM. I/O MCLK — MCLK input or output for I2S and/or digital microphone. I/O FC5_RXD_SDA_MOSI — Flexcomm 5: USART receiver, I2C data I/O, SPI master-out/slave-in data. PIO5_8 - - 175 - [2] O SCT0_OUT6 — SCTimer/PWM output 6. O TRACEDATA[1] — Trace data bit 1. O EMC_A[23] — External memory interface address 23. PU I/O PIO5_8 — General-purpose digital input/output pin. I SCT0_GPI3 — Pin input 3 to SCTimer/PWM. O PDM0_CLK — Clock for PDM interface 0, for digital microphone. I/O FC5_TXD_SCL_MISO — Flexcomm 5: USART transmitter, I2C clock, SPI master-in/slave-out data. PIO5_9 - - 179 - [2] O SCT0_OUT7 — SCTimer/PWM output 7. O TRACEDATA[2] — Trace data bit 2. O EMC_A[24] — External memory interface address 24. PU I/O PIO5_9 — General-purpose digital input/output pin. I SCT0_GPI4 — Pin input 4 to SCTimer/PWM. I PDM0_DATA — Data for PDM interface 0 (digital microphone). I/O FC5_CTS_SDA_SSEL0 — Flexcomm 5: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO5_10 - - 168 - [2] O SCT0_OUT8 — SCTimer/PWM output 8. O TRACEDATA[3] — Trace data bit 3. O EMC_A[25] — External memory interface address 25. PU I/O PIO5_10 — General-purpose digital input/output pin. I SCT0_GPI5 — Pin input 5 to SCTimer/PWM. R — Reserved. I/O FC5_RTS_SCL_SSEL1 — Flexcomm 5: USART request-to-send, I2C clock, SPI slave select 1. O SCT0_OUT9 — SCTimer/PWM output 9. I UTICK_CAP3 — Micro-tick timer capture input 3. USB1_AVSSC D1 F2 20 6 USB1 analog 3.3 V ground. USB1_REXT B1 F1 21 7 USB1 analog signal for reference resistor, 12.4 k +/-1% USB1_ID C1 G1 22 8 Indicates to the transceiver whether connected as an A-device (USB1_ID LOW) or B-device (USB1_ID HIGH). LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 51 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP D3 G2 23 9 USB1_AVDDC3V3 [6][8] Type 208-pin, LQFP USB1_VBUS Description Reset state [1] Symbol 180-pin, TFBGA Pin description …continued 100-pin, TFBGA Table 4. I/O VBUS pin (power on USB cable). 5 V tolerant when USB1_AVDD3V3 and USB1_AVDDTX3V3 = 0 V. E1 G3 24 10 USB1 analog 3.3 V supply. USB1_AVDDTX3V3 E2 H1 25 11 USB1 analog 3.3 V supply for line drivers. USB1_DP H3 27 13 [6] I/O USB1 bidirectional D+ line. 26 12 [6] I/O USB1 bidirectional D- line. 14 USB1_DM F2 E3 H2 USB1_AVSSTX3V3 G1 J1 28 USB0_DP B3 E5 204 97 [6] I/O USB0 bidirectional D+ line. USB1 analog ground for line drivers. USB0_DM B2 D5 205 98 [6] I/O USB0 bidirectional D- line. [5] External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and the boot code to execute. Wakes up the part from deep power-down mode. RESETN J8 N13 101 48 VDD D5; D7; E4; E6; F5; F7; G4; G6 E6; E8; F5; G5; J12; L6; L11 1; 48; 65; 104; 108; 156; 157; 206 1; 21; 33; 50; 54; 75; 76; 99 - - Single 1.71 V to 3.6 V power supply powers internal digital functions and I/Os. VSS D4; D6; E5; E7; F4; F6; G5; G7 B3; D7; D8; E11; H5; J5; K7 2; 49; 66; 103; 107; 148; 162; 201 2; 22; 34; 49; 53; 71; 79; 96 - - Ground. VDDA J4 N6 64 32 - - Analog supply voltage. VREFN - N4 59 - - - ADC negative reference voltage. On TFBGA100 and LQFP100 packages, the ADC negative reference voltage is internally tied to the VSSA pin. VREFP K4 P6 63 31 - - ADC positive reference voltage. VSSA H4 L5 60 30 - - Analog ground. On TFBGA100 and LQFP100 packages, the ADC negative reference voltage is internally tied to the VSSA pin. XTALIN H2 K4 41 20 [7] - - Main oscillator input. [7] XTALOUT G3 J4 40 19 - - Main oscillator output. VBAT K9 N11 94 45 - - Battery supply voltage. If no battery is used, tie VBAT to VDD or to ground. RTCXIN J9 L12 105 51 - - RTC oscillator input. RTCXOUT H9 K11 106 52 - - RTC oscillator output. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 52 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [1] PU = input mode, pull-up enabled (pull-up resistor pulls up pin to VDD). Z = high impedance; pull-up or pull-down disabled, AI = analog input, I = input, O = output, F = floating. Reset state reflects the pin state at reset without boot code operation. For pin states in the different power modes, see Section 6.2.2 “Pin states in different power modes”. For termination on unused pins, see Section 6.2.1 “Termination of unused pins”. [2] 5 V tolerant pad with programmable glitch filter (5 V tolerant if VDD present; if VDD not present, do not exceed 3.6 V); provides digital I/O functions with TTL levels and hysteresis; normal drive strength. See Figure 44. Pulse width of spikes or glitches suppressed by input filter is from 3 ns to 16 ns (simulated value). [3] True open-drain pin. I2C-bus pins compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus. The pin requires an external pull-up to provide output functionality. When power is switched off, this pin is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [4] 5 V tolerant pin providing standard digital I/O functions with configurable modes, configurable hysteresis, and analog input. When configured as an analog input, the digital section of the pin is disabled, and the pin is not 5 V tolerant. [5] Reset pad.5 V tolerant pad with glitch filter with hysteresis. Pulse width of spikes or glitches suppressed by input filter is from 3 ns to 20 ns (simulated value) [6] 5 V tolerant transparent analog pad. [7] The oscillator input pin (XTALIN) cannot be driven by an external clock. Must connect a crystal between XTALIN and XTALOUT. [8] VBUS must be connected to supply voltage when using the USB peripheral. 6.2.1 Termination of unused pins Table 5 shows how to terminate pins that are not used in the application. In many cases, unused pins should be connected externally or configured correctly by software to minimize the overall power consumption of the part. Unused pins with GPIO function should be configured as outputs set to LOW with their internal pull-up disabled. To configure a GPIO pin as output and drive it LOW, select the GPIO function in the IOCON register, select output in the GPIO DIR register, and write a 0 to the GPIO PORT register for that pin. Disable the pull-up in the pin’s IOCON register. In addition, it is recommended to configure all GPIO pins that are not bonded out on smaller packages as outputs driven LOW with their internal pull-up disabled. Table 5. Termination of unused pins Pin Default state[1] RESET I; PU Recommended termination of unused pins The RESET pin can be left unconnected if the application does not use it. all PIOn_m (not open-drain) I; PU Can be left unconnected if driven LOW and configured as GPIO output with pull-up disabled by software. PIOn_m (I2C open-drain) IA Can be left unconnected if driven LOW and configured as GPIO output by software. RTCXIN - Connect to ground. When grounded, the RTC oscillator is disabled. RTCXOUT - Can be left unconnected. XTALIN - Connect to ground. When grounded, the RTC oscillator is disabled. XTALOUT - Can be left unconnected. VREFP - Tie to VDD. VREFN - Tie to VSS. VDDA - Tie to VDD. VSSA - Tie to VSS. VBAT - Tie to VDD. USBn_DP F Can be left unconnected. If USB interface is not used, pin can be left unconnected except in deep power-down mode where it must be externally pulled low. When the USB PHY is disabled, the pins are floating. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 53 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 5. Termination of unused pins Pin Default state[1] Recommended termination of unused pins USBn_DM F Can be left unconnected. If USB interface is not used, pin can be left unconnected except in deep power-down mode where it must be externally pulled low. When the USB PHY is disabled, the pins are floating. USB1_AVSCC F Tie to VSS. USB1_VBUS F Tie to VDD. USB1_AVDDC3V3 F Tie to VDD. USB1_AVDDTX3V3 F Tie to VDD. USB1_AVSSTX3V3 F Tie to VSS. USB1_ID F Can be left unconnected. If USB interface is not used, pin can be left unconnected. [1] I = Input, IA = Inactive (no pull-up/pull-down enabled), PU = Pull-Up enabled, F = Floating 6.2.2 Pin states in different power modes Table 6. Pin states in different power modes Pin Active Sleep Deep-sleep Deep power-down[2] PIOn_m pins (not I2C) As configured in the IOCON[1]. Default: internal pull-up enabled. Floating PIO0_13 to PIO0_14 (open-drain I2C-bus pins) As configured in the IOCON[1]. Floating PIO3_23 to PIO3_24 (open-drain I2C-bus pins) As configured in the IOCON[1]. Floating RESET Reset function enabled. Default: input, internal pull-up enabled. Reset function disabled. [1] Default and programmed pin states are retained in sleep and deep-sleep. [2] If VBAT> VDD, the external reset pin must be floating to prevent high VBAT leakage. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 54 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus. The I-code and D-code core buses allow for concurrent code and data accesses from different slave ports. The LPC546xx uses a multi-layer AHB matrix to connect the ARM Cortex-M4 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slave ports of the matrix to be accessed simultaneously by different bus masters. 7.2 ARM Cortex-M4 processor The ARM Cortex-M4 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. The ARM Cortex-M4 offers many new features, including a Thumb-2 instruction set, low interrupt latency, hardware multiply and divide, interruptable/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt controller, and multiple core buses capable of simultaneous accesses. A 3-stage pipeline is employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. 7.3 ARM Cortex-M4 integrated Floating Point Unit (FPU) The FPU fully supports single-precision add, subtract, multiply, divide, multiply and accumulate, and square root operations. It also provides conversions between fixed-point and floating-point data formats, and floating-point constant instructions. The FPU provides floating-point computation functionality that is compliant with the ANSI/IEEE Std 754-2008, IEEE Standard for Binary Floating-Point Arithmetic, referred to as the IEEE 754 standard. 7.4 Memory Protection Unit (MPU) The Cortex-M4 includes a Memory Protection Unit (MPU) which can be used to improve the reliability of an embedded system by protecting critical data within the user application. The MPU allows separating processing tasks by disallowing access to each other's data, disabling access to memory regions, allowing memory regions to be defined as read-only and detecting unexpected memory accesses that could potentially break the system. The MPU separates the memory into distinct regions and implements protection by preventing disallowed accesses. The MPU supports up to eight regions each of which can be divided into eight subregions. Accesses to memory locations that are not defined in the MPU regions, or not permitted by the region setting, will cause the Memory Management Fault exception to take place. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 55 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.5 Nested Vectored Interrupt Controller (NVIC) for Cortex-M4 The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.5.1 Features • • • • • • Controls system exceptions and peripheral interrupts. Supports up to 54 vectored interrupts. Eight programmable interrupt priority levels, with hardware priority level masking. Relocatable vector table. Non-Maskable Interrupt (NMI). Software interrupt generation. 7.5.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. 7.6 System Tick timer (SysTick) The ARM Cortex-M4 includes a system tick timer (SysTick) that is intended to generate a dedicated SYSTICK exception. The clock source for the SysTick can be the FRO or the Cortex-M4 core clock. 7.7 On-chip static RAM The LPC546xx support 200 kB SRAM with separate bus master access for higher throughput and individual power control for low-power operation. 7.8 On-chip flash The LPC546xx supports up to 512 kB of on-chip flash memory. 7.9 On-chip ROM The 64 kB on-chip ROM contains the boot loader and the following Application Programming Interfaces (API): • Flash In-Application Programming (IAP) and In-System Programming (ISP). • ROM-based USB drivers (HID, CDC, MSC, and DFU). Supports flash updates via USB. • • • • LPC546xx Product data sheet Supports booting from valid user code in flash, USART, SPI, and I2C. Legacy, Single, and Dual image boot. OTP API for programming OTP memory. Random Number Generator (RNG) API. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 56 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.10 EEPROM The LPC546xx contains up to 16 kB byte of on-chip word-erasable and word-programmable EEPROM data memory. EEPROM is not accessible in deep-sleep and deep-power-down modes. 7.11 Memory mapping The LPC546xx incorporates several distinct memory regions. The APB peripheral area is 512 kB in size and is divided to allow for up to 32 peripherals.Each peripheral is allocated 4 kB of space simplifying the address decoding. The registers incorporated into the CPU, such as NVIC, SysTick, and sleep mode control, are located on the private peripheral bus. The ARM Cortex-M4 processor has a single 4 GB address space. The following table shows how this space is used on the LPC546xx. Table 7. Memory usage and details Address range General Use Address range details and description 0x0000 0000 to 0x1FFF FFFF On-chip non-volatile memory 0x0000 0000 - 0x0007 FFFF Flash memory (512 kB). Boot ROM 0x0300 0000 - 0x0300 FFFF Boot ROM with flash services in a 64 kB space. SRAMX 0x0400 0000 - 0x0400 7FFF I&D SRAM bank (32 kB). 0x2000 0000 to 0x3FFF FFFF 0x4000 0000 to 0x7FFF FFFF LPC546xx Product data sheet SPI Flash 0x1000 0000 - 0x17FF FFFF Interface (SPIFI) SPIFI memory mapped access space (128 MB). SRAM Banks SRAM banks (160 kB). 0x2000 0000 - 0x2002 7FFF SRAM bit band 0x2200 0000 - 0x23FF FFFF alias addressing SRAM bit band alias addressing (32 MB) APB peripherals 0x4000 0000 - 0x4001 FFFF APB slave group 0 up to 32 peripheral blocks of 4 kB each (128 kB). 0x4002 0000 - 0x4003 FFFF APB slave group 1 up to 32 peripheral blocks of 4 kB each (128 kB). 0x4004 0000 - 0x4005 FFFF APB asynchronous slave group 2 up to 32 peripheral blocks of 4 kB each (128 kB). AHB peripherals 0x4008 0000 - 0x400B FFFF AHB peripherals (256 kB). Peripheral bit band alias addressing Peripheral bit band alias addressing (32 MB) 0x4200 0000 - 0x43FF FFFF All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 57 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 7. Memory usage and details …continued Address range General Use Address range details and description 0x8000 0000 to 0xDFFF FFFF Off-chip Memory Four static memory chip selects: via the External 0x8000 0000 - 0x83FF FFFF Static memory chip select 0 (up to 64 Memory MB)[1] Controller 0x8800 0000 - 0x8BFF FFFF Static memory chip select 1 (up to 64 MB)[2] 0x9000 0000 – 0x93FF FFFF Static memory chip select 2 (up to 64 MB) 0x9800 0000 - 0x9BFF FFFF Static memory chip select 3 (up to 64 MB) Four dynamic memory chip selects: 0xA000 0000 - 0xA7FF FFFF Dynamic memory chip select 0 (up to 256MB) 0xA800 0000 - 0xAFFF FFFF Dynamic memory chip select 1 (up to 256MB) 0xB000 0000 - 0xB7FF FFFF Dynamic memory chip select 2 (up to 256MB) 0xB800 0000 - 0xBFFF FFFF Dynamic memory chip select 3 (up to 256MB) 0xE000 0000 to 0xE00F FFFF Cortex-M4 Private Peripheral Bus 0xE000 0000 - 0xE00F FFFF Cortex-M4 related functions, includes the NVIC and System Tick Timer. [1] Can be up to 256 MB, upper address 0x8FFF FFFF, if the address shift mode is enabled. See the EMCSYSCTRL register bit 0 in the UM10912 LPC546xx user manual. [2] Can be up to 128 MB, upper address 0x97FF FFFF, if the address shift mode is enabled. See the EMCSYSCTRL register bit 0 in the UM10912 LPC546xx user manual. Figure 9 shows the overall map of the entire address space from the user program viewpoint following reset. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 58 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller AHB peripherals Memory space 0xFFFF FFFF (reserved) private peripheral bus 0x4010 BFFF 0xE010 0000 EPROM (16 kB) 0xE000 0000 (EMC) (reserved) 0x8000 0000 (reserved) USB SRAM (8 kB) 0x4400 0000 (reserved) peripheral bit-band addressing (reserved) (reserved) 0x4200 0000 HS USB host registers 0x400C 0000 FS USB host registers AHB peripheral SHA registers (reserved) Asynchronous APB peripherals 0x4008 0000 ADC 0x4006 0000 CAN 1 CAN 0 0x4004 0000 APB peripherals on APB bridge 1 0x4002 0000 see APB memory map figure SDIO Flexcomm 9 APB peripherals on APB bridge 0 Flexcomm 8 0x4000 0000 (reserved) ISP-AP interface Flexcomm 7 0x2400 0000 Flexcomm 6 SRAM bit-band addressing Flexcomm 5 0x2200 0000 (reserved) CRC engine 0x2002 0000 HS USB device SRAM2 (up to 32 kB) Ethernet 0x2002 0000 (reserved) SRAM1 (up to 64 kB) D-Mic interface 0x2001 0000 SRAM0 (up to 64 kB) (reserved) High Speed GPIO 0x2000 0000 (reserved) 0x1800 0000 Flexcomm 4 SPIFI Flash Interface memory mapped space (reserved) Flexcomm 3 0x1000 0000 Flexcomm 2 0x0401 0000 Flexcomm 1 SRAMX (32 kB) Flexcomm 0 SC Timer / PWM 0x0400 0000 (reserved) FS USB device registers 0x0300 0000 Boot ROM LCD registers 0x0300 0000 (reserved) DMA registers 0x0008 0000 EMC registers Flash memory (up to 512 kB) SPIFI registers 0x0000 0000 active interrupt vectors 0x0000 00C0 0x0000 0000 0x4010 8000 0x4010 2000 0x4010 0000 0x400A 5000 0x400A 4000 0x400A 3000 0x400A 2000 0x400A 1000 0x400A 0000 0x4009 E000 0x4009 D000 0x4009 C000 0x4009 B000 0x4009 A000 0x4009 9000 0x4009 8000 0x4009 7000 0x4009 6000 0x4009 5000 0x4009 4000 0x4009 2000 0x4009 1000 0x4009 0000 0x4008 C000 0x4008 B000 0x4008 A000 0x4008 9000 0x4008 8000 0x4008 7000 0x4008 6000 0x4008 5000 0x4008 4000 0x4008 3000 0x4008 2000 0x4008 1000 0x4008 0000 aaa-029365 The private peripheral bus includes CPU peripherals such as the NVIC, SysTick, and the core control registers. Fig 9. LPC546xx Memory mapping LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 59 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller APB bridge 1 APB bridge 0 31-22 21 (reserved) OTP controller 20 EEPROM controller (reserved) 19-15 14 Micro-Tick 13 MRT 12 WDT 11-10 (reserved) 9 CTIMER1 8 CTIMER0 7-6 (reserved) 5 Input muxes 4 Pin Interrupts (PINT) 3 GINT1 2 GINT0 1 IOCON 2 Syscon 0x4001 FFFF 0x4001 6000 0x4001 5000 0x4001 4000 31-27 (reserved) 26 RNG (reserved) 25-24 0x4003 FFFF 0x4003 B000 0x4003 A000 0x4003 8000 0x4001 F000 23 22 0x4000 E000 21 Smart card 1 Smart card 0 (reserved) 0x4000 D000 0x4000 C000 20 19-14 Flash controller (reserved) 0x4000 A000 13 RIT 0x4002 D000 0x4000 9000 12 RTC 0x4002 C000 0x4000 8000 11-9 (reserved) 0x4002 9000 0x4000 6000 8 7-0 CTIMER2 (reserved) 0x4002 8000 0x4002 0000 0x4000 5000 0x4000 4000 0x4003 7000 0x4003 6000 0x4003 5000 0x4003 4000 0x4002 E000 Asynchronous APB bridge 0x4000 3000 0x4005 FFFF 0x4000 2000 31-10 (reserved) 0x4000 1000 9 CTIMER4 0x4000 0000 8 CTIMER3 7-1 (reserved) 0 Asynch. Syscon 0x4004 A000 0x4004 9000 0x4004 8000 0x4004 1000 0x4004 0000 aaa-023944 Fig 10. LPC546xx APB Memory map 7.12 System control 7.12.1 Clock sources The LPC546xx supports one external and two internal clock sources: • Free Running Oscillator (FRO). • Watchdog oscillator (WDOSC). • Crystal oscillator. 7.12.1.1 Free Running Oscillator (FRO) The FRO 12 MHz oscillator provides the default clock at reset and provides a clean system clock shortly after the supply pins reach operating voltage. • 12 MHz internal FRO oscillator, factory trimmed for accuracy, that can optionally be used as a system clock as well as other purposes. • Selectable 48 MHz or 96 MHz FRO oscillator, factory trimmed for accuracy, that can optionally be used as a system clock as well as other purposes. 7.12.1.2 Watchdog oscillator (WDOSC) The watchdog oscillator is a low-power internal oscillator. The WDOSC can be used to provide a clock to the WWDT and to the entire chip. The low-power watchdog oscillator provides a selectable frequency in the range of 6 kHz to 1.5 MHz. The accuracy of this clock is limited to  40% over temperature, voltage, and silicon processing variations. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 60 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.12.1.3 Crystal oscillator The LPC546xx include four independent oscillators. These are the main oscillator, the FRO, the watchdog oscillator, and the RTC oscillator. Following reset, the LPC546xx will operate from the Internal FRO until switched by software. This allows systems to operate without any external crystal and the boot loader code to operate at a known frequency. See Figure 11 and Figure 12 for an overview of the LPC546xx clock generation. 7.12.2 System PLL (PLL0) The system PLL accepts an input clock frequency in the range of 32.768 kHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The PLL can be enabled or disabled by software. 7.12.3 USB PLL (PLL1) The USB PLL accepts an input clock frequency in the range of 1 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The PLL can be enabled or disabled by software. 7.12.4 Audio PLL (PLL2) The audio PLL accepts an input clock frequency in the range of 1 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The PLL can be enabled or disabled by software. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 61 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.12.5 Clock Generation fro_12m clk_in wdt_clk fro_hf 00 pll_clk 10 32k_clk 11 00 01 32k_clk “none” (1) MAINCLKSELB[1:0] 000 001 fro_hf 000 pll_clk 001 usb_pll_clk 010 audio_pll_clk 011 “none” 111 to EMC (function clock) EMCCLKDIV ADC CLOCK DIVIDER to ADC pll_clk SYSTEM PLL 011 ADC clock select ADCCLKSEL[2:0] 111 fro_hf pll_clk System PLL settings usb_pll_clk “none” 000 001 010 USB0 CLOCK DIVIDER to USB0 (FS USB) 111 USB0CLKDIV clk_in Crystal oscillator USB0 clock select USB0CLKSEL[2:0] Range select SYSOSCCTRL[1:0] fro_hf EMC ClOCK DIVIDER ADCCLKDIV PLL clock select SYSPLLCLKSEL[2:0] xtalin xtalout to CPU, AHB bus, Sync APB Main clock select B Main clock select A MAINCLKSELA[1:0] fro_12m clk_in main_clk AHBCLKDIV 10 11 (1) CPU CLOCK DIVIDER main_clk pll_clk fro_hf_div FRO Clock Divider 000 001 usb_pll_clk 010 “none” USB1 CLOCK DIVIDER to USB1 PHY 111 USB1CLKDIV USB1 clock select USB1CLKSEL[2:0] FROHFCLKDIV usb_pll_clk clk_in fro_12 USB PLL 000 001 fro_hf_div audio_pll_clk USB PLL settings 010 011 111 mclk_in “none” DMIC CLOCK DIVIDER to DMIC subsystem DMICCLKDIV fro_12m 000 clk_in 001 “none” 111 Audio PLL audio_pll_clk DMIC clock select DMICCLKSEL[2:0] fro_hf_div Audio clock select AUDIO PLL Settings AUDPLLCKSEL[2:0] main_clk fro_12m audio_pll_clk fc6_fclk “none” 000 001 MCLK DIVIDER to MCLK pin (output) 111 MCLK clock select MCLKCLKSEL[1:0] 00 01 10 11 audio_pll_clk MCLKDIV to Async APB (1) main_clk pll_clk usb_pll_clk APB clock select B ASYNCAPBCLKSELA[1:0] fro_hf audio_pll_clk “none” (1): synchronized multiplexer, see register descriptions for details. 000 001 010 011 100 111 SDIO clock select SDIOCLKSEL[2:0] SDIO CLOCK DIVIDER to SDIO (function clock) SDIOCLKDIV aaa-023922 Fig 11. LPC546xx clock generation LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 62 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller (1 per Flexcomm) main_clk pll_clk fro_12m fro_hf “none” fro_12m 000 001 fro_hf_div audio_pll_clk 010 011 FRG CLOCK DIVIDER 111 mclk_in frg_clk “none” FRG clock select FRGCTRL[15:0] FRGCLKSEL[2:0] main_clk 000 001 fcn_fclk (function clock 010 of Flexcomm[n]) main_clk FCLKSEL[n] pll_clk fro_hf audio_pll_clk “none” 000 001 SCTimer/PWM Clock Divider 010 011 111 MCAN0 clock divider to MCAN0 function clock CAN0CLKDIV main_clk main_clk to systick function clock SYSTICKCLKDIV 011 (up to 10 Flexcomm 100 Interfaces on these devices) 111 to CLK32K of all Flexcomms 32k_clk Systick clock divider to SCTimer/PWM input clock 7 MCAN1 clock divider to MCAN1 function clock CAN1CLKDIV SCTCLKDIV main_clk SCT clock select SCTCLKSEL[2:0] Smartcard0 clock divider to Smartcard0 function clock SC0CLKDIV main_clk lcdclkin fro_hf “none” 00 01 to LCD LCD CLOCK (function clock) DIVIDER 10 main_clk 11 Smartcard1 clock divider to Smartcard1 function clock SC1CLKDIV LCDCLKDIV LCD clock select LCDCLKSEL[1:0] main_clk clk_in wdt_clk fro_hf pll_clk usb_pll_clk audio_pll_clk 32k_clk main_clk ARM Trace clock divider to ARM Trace function clock ARMTRACECLKDIV 000 001 main_clk 010 pll_clk 011 100 CLKOUT DIVIDER CLKOUT fro_hf audio_pll_clk 101 CLKOUTDIV 110 111 usb_pll_clk “none” 000 001 010 011 100 SPIFI CLOCK DIVIDER 111 SPIFI CLKDIV SPIFI clock select SPIFICLKSEL[2:0] CLKOUT select CLKOUTSEL[2:0] to SPIFI (function clock) aaa-023923 Fig 12. LPC546xx clock generation (continued) 7.12.6 Brownout detection The LPC546xx includes a monitor for the voltage level on the VDD pin. If this voltage falls below a fixed level, the BOD sets a flag that can be polled or cause an interrupt. In addition, a separate threshold level can be selected to cause chip reset. 7.12.7 Safety The LPC546xx includes a Windowed WatchDog Timer (WWDT), which can be enabled by software after reset. Once enabled, the WWDT remains locked and cannot be modified in any way until a reset occurs. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 63 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.13 Code security (enhanced Code Read Protection - eCRP) eCRP is a mechanism that allows the user to enable different features in the security system. The features are specified using a combination of OTP and flash values. Some levels are only controlled by either flash or OTP, but the majority have dual control. The overlap allows higher security by specifying access using OTP bits, which cannot be changed (except to increase security) while allowing customers who are less concerned about security the ability to change levels in the flash image. eCRP is calculated by reading the ECRP from the flash boot sector (offset 0x0000 0020) and then masking it with the value read from OTP. The OTP bits are more restrictive (that is, disable access) than equivalent values in flash. Certain aspects of eCRP are only specified in the OTP (that is, Mass Erase disable), while others are only specified in flash (that is, Sector Protection count). For Dual Enhanced images, eCRP is calculated by reading the eCRP from the bootable image sector. The bootable image is defined as the highest revision image that passes the required validation methods. Remark: If the ECRP is set to the most restrictive combination of OTP and the ECRP of the images, no future factory testing can be performed on the device. 7.14 Power control The LPC546xx support a variety of power control features. In Active mode, when the chip is running, power and clocks to selected peripherals can be adjusted for power consumption. In addition, there are three special modes of processor power reduction with different peripherals running: sleep mode, deep-sleep mode, and deep power-down mode that can be activated using the power API library from the LPCOpen software package. 7.14.1 Sleep mode In sleep mode, the system clock to the CPU is stopped and execution of instructions is suspended until either a reset or an interrupt occurs. Peripheral functions, if selected to be clocked can continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, internal buses, and unused peripherals. The processor state and registers, peripheral registers, and internal SRAM values are maintained, and the logic levels of the pins remain static. 7.14.2 Deep-sleep mode In deep-sleep mode, the system clock to the processor is disabled as in sleep mode. All analog blocks are powered down by default but can be selected to keep running through the power API if needed as wake-up sources. The main clock and all peripheral clocks are disabled by default. The flash memory is put in standby mode. Deep-sleep mode eliminates all power used by analog peripherals and all dynamic power used by the processor itself, memory systems and related controllers, and internal buses. The processor state and registers, peripheral registers, and internal SRAM values are maintained, and the logic levels of the pins remain static. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 64 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller GPIO Pin Interrupts, GPIO Group Interrupts, and selected peripherals such as USB0, USB1, DMIC, SPI, I2C, USART, WWDT, RTC, Micro-tick Timer, and BOD can be left running in deep sleep mode The FRO, RTC oscillator, and the watchdog oscillator can be left running.In some cases, DMA can operate in deep-sleep mode. For more details, see UM10912, LPC546xx. user manual. 7.14.3 Deep power-down mode In deep power-down mode, power is shut off to the entire chip except for the RTC power domain and the RESET pin. The LPC546xx can wake up from deep power-down mode via the RESET pin and the RTC alarm. The ALARM1HZ flag in RTC control register generates an RTC wake-up interrupt request, which can wake up the part. During deep power-down mode, the contents of the SRAM and registers are not retained. All functional pins are tri-stated in deep power-down mode. Table 8 shows the peripheral configuration in reduced power modes. Table 8. Peripheral configuration in reduced power modes Peripheral Reduced power mode Sleep Deep-sleep Deep power-down FRO Software configured Software configured Off Flash Software configured Standby Off BOD Software configured Software configured Off PLL Software configured Off Off Watchdog osc and WWDT Software configured Software configured Off Micro-tick Timer Software configured Software configured Off DMA Active Off USART Software configured Off; but can create a wake-up interrupt in synchronous Off slave mode or 32 kHz clock mode Configurable some for operations. For more details, see UM10912, LPC546xx. user manual. SPI Software configured Off; but can create a wake-up interrupt in slave mode Off I2C Software configured Off; but can create a wake-up interrupt in slave mode Off USB0 Software configured Software configured Off USB1 Software configured Software configured Off Ethernet Software configured Off Off DMIC Software configured Software configured Off Other digital peripherals Software configured Off Off RTC oscillator Software configured LPC546xx Product data sheet Software configured Software configured All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 65 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 9 shows wake-up sources for reduced power modes. Table 9. Wake-up sources for reduced power modes Power mode Wake-up source Conditions Sleep Any interrupt Enable interrupt in NVIC. HWWAKE Certain Flexcomm Interface and DMIC subsystem activity. Pin interrupts Enable pin interrupts in NVIC and STARTER0 and/or STARTER1 registers. Deep-sleep BOD interrupt BOD reset Watchdog interrupt Watchdog reset Reset pin RTC 1 Hz alarm timer RTC 1 kHz timer time-out and alarm Micro-tick timer (intended for ultra-low power wake-up from deep-sleep mode • • • Enable interrupt in NVIC and STARTER0 registers. Enable interrupt in BODCTRL register. Configure the BOD to keep running in this mode with the power API. Enable reset in BODCTRL register. • • • • • • • Enable the watchdog oscillator in the PDRUNCFG0 register. Enable the watchdog interrupt in NVIC and STARTER0 registers. Enable the watchdog in the WWDT MOD register and feed. Enable interrupt in WWDT MOD register. Configure the WDTOSC to keep running in this mode with the power API. Enable the watchdog oscillator in the PDRUNCFG0 register. Enable the watchdog and watchdog reset in the WWDT MOD register and feed. Always available. • • • • • Enable the RTC 1 Hz oscillator in the RTCOSCCTRL register. • • • • • • Start RTC 1 kHz timer by writing a value to the WAKE register of the RTC. Enable the RTC bus clock in the AHBCLKCTRL0 register. Start RTC alarm timer by writing a time-out value to the RTC COUNT register. Enable the RTCALARM interrupt in the STARTER0 register. Enable the RTC 1 Hz oscillator and the RTC 1 kHz oscillator in the RTC CTRL register. Enable the RTC wake-up interrupt in the STARTER0 register. Enable the watchdog oscillator in the PDRUNCFG0 register. Enable the Micro-tick timer clock by writing to the AHBCLKCTRL1 register. Start the Micro-tick timer by writing UTICK CTRL register. Enable the Micro-tick timer interrupt in the STARTER0 register. I2C interrupt Interrupt from I2C in slave mode. SPI interrupt Interrupt from SPI in slave mode. USART interrupt Interrupt from USART in slave or 32 kHz mode. USB0 need clock interrupt Interrupt from USB0 when activity is detected that requires a clock. USB1 need clock interrupt Interrupt from USB1 when activity is detected that requires a clock. Ethernet interrupt Interrupt from ethernet. DMA interrupt Interrupt from DMA. HWWAKE Certain Flexcomm Interface and DMIC subsystem activity. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 66 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 9. Wake-up sources for reduced power modes Power mode Wake-up source Deep power-down RTC 1 Hz alarm timer RTC 1 kHz timer time-out and alarm Reset pin Conditions • • • Enable the RTC 1 Hz oscillator in the RTC CTRL register. • • Enable the RTC bus clock in the AHBCLKCTRL0 register. Start RTC alarm timer by writing a time-out value to the RTC COUNT register. Enable the RTC 1 Hz oscillator and the RTC 1 kHz oscillator in the RTCOSCCTRL register. Start RTC 1 kHz timer by writing a value to the WAKE register of the RTC. Always available. 7.15 General Purpose I/O (GPIO) The LPC546xx provides six GPIO ports with a total of up to 171 GPIO pins. Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The current level of a port pin can be read back no matter what peripheral is selected for that pin. 7.15.1 Features • Accelerated GPIO functions: – GPIO registers are located on the AHB so that the fastest possible I/O timing can be achieved. – Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. – All GPIO registers are byte and half-word addressable. – Entire port value can be written in one instruction. • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • All GPIO pins can be selected to create an edge or level-sensitive GPIO interrupt request. • One GPIO group interrupt can be triggered by a combination of any pin or pins. 7.16 Pin interrupt/pattern engine The pin interrupt block configures up to eight pins from all digital pins for providing eight external interrupts connected to the NVIC. The pattern match engine can be used in conjunction with software to create complex state machines based on pin inputs. Any digital pin, independent of the function selected through the switch matrix can be configured through the SYSCON block as an input to the pin interrupt or pattern match engine. The registers that control the pin interrupt or pattern match engine are located on the I/O+ bus for fast single-cycle access. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 67 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.16.1 Features • Pin interrupts: – Up to eight pins can be selected from all GPIO pins on ports 0 and 1 as edge-sensitive or level-sensitive interrupt requests. Each request creates a separate interrupt in the NVIC. – Edge-sensitive interrupt pins can interrupt on rising or falling edges or both. – Level-sensitive interrupt pins can be HIGH-active or LOW-active. – Level-sensitive interrupt pins can be HIGH-active or LOW-active. – Pin interrupts can wake up the device from sleep mode and deep-sleep mode. • Pattern match engine: – Up to eight pins can be selected from all digital pins on ports 0 and 1 to contribute to a boolean expression. The boolean expression consists of specified levels and/or transitions on various combinations of these pins. – Each bit slice minterm (product term) comprising of the specified boolean expression can generate its own, dedicated interrupt request. – Any occurrence of a pattern match can also be programmed to generate an RXEV notification to the CPU. The RXEV signal can be connected to a pin. – Pattern match can be used in conjunction with software to create complex state machines based on pin inputs. – Pattern match engine facilities wake-up only from active and sleep modes. 7.17 Serial peripherals 7.17.1 Full-speed USB Host/Device interface (USB0) The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. 7.17.1.1 USB0 device controller The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. Features • • • • • • LPC546xx Product data sheet Supports 10 physical (5 logical) endpoints including two control endpoints. Single and double-buffering supported. Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types. Supports wake-up from reduced power mode on USB activity and remote wake-up. Supports SoftConnect. Link Power Management (LPM) supported. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 68 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.17.1.2 USB0 host controller The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies with the Open Host Controller Interface (OHCI) specification. Features • OHCI compliant. • Two downstream ports. 7.17.2 High-speed USB Host/Device interface (USB1) The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. 7.17.2.1 USB1 device controller The device controller enables 480 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. Features • • • • • Fully compliant with USB 2.0 Specification (high speed). Supports 8 physical (16 logical) endpoints with up to 8 kB endpoint buffer RAM. Supports Control, Bulk, Interrupt and Isochronous endpoints. Scalable realization of endpoints at run time. Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • While USB is in the Suspend mode, the LPC546xx can enter one of the reduced power modes and wake up on USB activity. • Double buffer implementation for Bulk and Isochronous endpoints. 7.17.2.2 USB1 host controller The host controller enables high speed data exchange with USB devices attached to the bus. It consists of register interface and serial interface engine. The register interface complies with the Enhanced Host Controller Interface (EHCI) specification. Features • EHCI compliant. • Two downstream ports. • Supports per-port power switching. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 69 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.17.3 Ethernet AVB The Ethernet block enables a host to transmit and receive data over Ethernet in compliance with the IEEE 802.3-2008 standard. The Ethernet interface contains a full featured 10 Mbps or 100 Mbps Ethernet MAC (Media Access Controller) designed to provide optimized performance through the use of DMA hardware acceleration. 7.17.3.1 Features • • • • 10/100 Mbit/s DMA support Power management remote wake-up frame and magic packet detection Supports both full-duplex and half-duplex operation – Supports CSMA/CD Protocol for half-duplex operation. – Supports IEEE 802.3x flow control for full-duplex operation. – Optional forwarding of received pause control frames to the user application in full-duplex operation. – Supports IEEE 802.1AS-2011 and 802.1-Qav-2009 for Audio Video (AV) traffic. – Software support for AVB feature is available from NXP Professional Services. See nxp.com for more details. – Back-pressure support for half-duplex operation. – Automatic transmission of zero-quanta pause frame on deassertion of flow control input in full-duplex operation. • Supports IEEE1588 time stamping and IEEE 1588 advanced time stamping (IEEE 1588-2008 v2). 7.17.4 SPI Flash Interface (SPIFI) The SPI Flash Interface allows low-cost serial flash memories to be connected to the LPC546xx microcontroller with little performance penalty compared to parallel flash devices with higher pin count. After a few commands configure the interface at startup, the entire flash content is accessible as normal memory using byte, halfword, and word accesses by the processor and/or DMA channels. Simple sequences of commands handle erasure and programming. Many serial flash devices use a half-duplex command-driven SPI protocol for device setup and initialization and then move to a half-duplex, command-driven 4-bit protocol for normal operation. Different serial flash vendors and devices accept or require different commands and command formats. SPIFI provides sufficient flexibility to be compatible with common flash devices and includes extensions to help insure compatibility with future devices. 7.17.4.1 Features • • • • LPC546xx Product data sheet Interfaces to serial flash memory in the main memory map. Supports classic and 4-bit bidirectional serial protocols. Half-duplex protocol compatible with various vendors and devices. Quad SPI Flash Interface with 1-, 2-, or 4-bit data at rates of up to 52 MB per second. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 70 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller • Supports DMA access. • Provides XIP (execute in place) feature to execute code directly from serial flash. 7.17.5 CAN Flexible Data (CAN FD) interface The LPC546xx contains two CAN FD interfaces, CAN FD 1 and CAN FD 2. 7.17.5.1 Features • • • • • • Conforms with CAN protocol version 2.0 part A, B and ISO 11898-1. CAN FD with up to 64 data bytes supported. CAN Error Logging. AUTOSAR support. SAE J1939 support. Improved acceptance filtering. 7.17.6 DMIC subsystem 7.17.6.1 Features • Pulse-Density Modulation (PDM) data input for left and/or right channels on 1 or 2 buses. • • • • Flexible decimation. 16 entry FIFO for each channel. DC blocking or unaltered DC bias can be selected. Data can be transferred using DMA from deep-sleep mode without waking up the CPU, then automatically returning to deep-sleep mode. • Data can be streamed directly to I2S on Flexcomm Interface 7. 7.17.7 Smart card interface 7.17.7.1 Features • Two DMA supported ISO 7816 Smart Card Interfaces. • Both asynchronous protocols, T = 0 and T = 1 are supported. 7.17.8 Flexcomm Interface serial communication 7.17.8.1 Features • • • • • LPC546xx Product data sheet USART with asynchronous operation or synchronous master or slave operation. SPI master or slave, with up to 4 slave selects. I2C, including separate master, slave, and monitor functions. Two I2S functions using Flexcomm Interface 6 and Flexcomm Interface 7. Data for USART, SPI, and I2S traffic uses the Flexcomm Interface FIFO. The I2C function does not use the FIFO. All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 71 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.17.8.2 SPI serial I/O controller Features • Maximum data rates of 48 Mbit/s in master mode and 14 Mbit/s in slave mode for SPI functions. • Data frames of 1 to 16 bits supported directly. Larger frames supported by software or DMA set-up. • Master and slave operation. • Data can be transmitted to a slave without the need to read incoming data. This can be useful while setting up an SPI memory. • Control information can optionally be written along with data. This allows very versatile operation, including “any length” frames. • Four Slave Select input/outputs with selectable polarity and flexible usage. • Activity on the SPI in slave mode allows wake-up from deep-sleep mode on any enabled interrupt. Remark: Texas Instruments SSI and National Microwire modes are not supported. 7.17.8.3 I2C-bus interface The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line (SCL) and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (for example, an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. Features • All I2Cs support standard, Fast-mode, and Fast-mode Plus with data rates of up to 1 Mbit/s. • • • • • All I2Cs support high-speed slave mode with data rates of up to 3.4 Mbit/s. Independent Master, Slave, and Monitor functions. Supports both Multi-master and Multi-master with Slave functions. Multiple I2C slave addresses supported in hardware. One slave address can be selectively qualified with a bit mask or an address range in order to respond to multiple I2C-bus addresses. • 10-bit addressing supported with software assist. • Supports SMBus. • Activity on the I2C in slave mode allows wake-up from deep-sleep mode on any enabled interrupt. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 72 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.17.8.4 USART Features • Maximum bit rates of 6.25 Mbit/s in asynchronous mode. • The maximum supported bit rate for USART master synchronous mode is 24 Mbit/s, and the maximum supported bit rate for USART slave synchronous mode is 12.5 Mbit/s. • 7, 8, or 9 data bits and 1 or 2 stop bits. • Synchronous mode with master or slave operation. Includes data phase selection and continuous clock option. • • • • • • • Multiprocessor/multidrop (9-bit) mode with software address compare. • • • • • • Received data and status can optionally be read from a single register RS-485 transceiver output enable. Autobaud mode for automatic baud rate detection Parity generation and checking: odd, even, or none. Software selectable oversampling from 5 to 16 clocks in asynchronous mode. One transmit and one receive data buffer. RTS/CTS for hardware signaling for automatic flow control. Software flow control can be performed using Delta CTS detect, Transmit Disable control, and any GPIO as an RTS output. Break generation and detection. Receive data is 2 of 3 sample "voting". Status flag set when one sample differs. Built-in Baud Rate Generator with auto-baud function. A fractional rate divider is shared among all USARTs. Interrupts available for Receiver Ready, Transmitter Ready, Receiver Idle, change in receiver break detect, Framing error, Parity error, Overrun, Underrun, Delta CTS detect, and receiver sample noise detected. • Loopback mode for testing of data and flow control. • In synchronous slave mode, wakes up the part from deep-sleep mode. • Special operating mode allows operation at up to 9600 baud using the 32.768 kHz RTC oscillator as the UART clock. This mode can be used while the device is in deep-sleep mode and can wake-up the device when a character is received. • USART transmit and receive functions work with the system DMA controller. 7.17.8.5 I2S-bus interface The I2S bus provides a standard communication interface for streaming data transfer applications such as digital audio or data collection. The I2S bus specification defines a 3-wire serial bus, having one data, one clock, and one word select/frame trigger signal, providing single or dual (mono or stereo) audio data transfer as well as other configurations. In the LPC546xx, the I2S function is included in Flexcomm Interface 6 and Flexcomm Interface 7. Each of the Flexcomm Interface implements four I2S channel pairs. The I2S interface within one Flexcomm Interface provides at least one channel pair that can be configured as a master or a slave. Other channel pairs, if present, always operate as slaves. All of the channel pairs within one Flexcomm Interface share one set of I2S LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 73 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller signals, and are configured together for either transmit or receive operation, using the same mode, same data configuration and frame configuration. All such channel pairs can participate in a time division multiplexing (TDM) arrangement. For cases requiring an MCLK input and/or output, this is handled outside of the I2S block in the system level clocking scheme. Features • A Flexcomm Interface may implement one or more I2S channel pairs, the first of which could be a master or a slave, and the rest of which would be slaves. All channel pairs are configured together for either transmit or receive and other shared attributes. The number of channel pairs is defined for each Flexcomm Interface, and may be from 0 to 4. • Configurable data size for all channels within one Flexcomm Interface, from 4 bits to 32 bits. Each channel pair can also be configured independently to act as a single channel (mono as opposed to stereo operation). • All channel pairs within one Flexcomm Interface share a single bit clock (SCK) and word select/frame trigger (WS), and data line (SDA). • Data for all I2S traffic within one Flexcomm Interface uses the Flexcomm Interface FIFO. The FIFO depth is 8 entries. • Left justified and right justified data modes. • DMA support using FIFO level triggering. • TDM (Time Division Multiplexing) with a several stereo slots and/or mono slots is supported. Each channel pair can act as any data slot. Multiple channel pairs can participate as different slots on one TDM data line. • The bit clock and WS can be selectively inverted. • Sampling frequencies supported depends on the specific device configuration and applications constraints (for example, system clock frequency and PLL availability.) but generally supports standard audio data rates. See the data rates section in I2S chapter in the LPC546xx. user manual to calculate clock and sample rates. Remark: The Flexcomm Interface function clock frequency should not be above 48 MHz. 7.18 Digital peripheral 7.18.1 LCD controller The LCD controller provides all of the necessary control signals to interface directly to various color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024  768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512 byte color palette allows reducing bus utilization (that is, memory size of the displayed data) while still supporting many colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time required to operate the display. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 74 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.18.1.1 Features • • • • AHB master interface to access frame buffer. Setup and control via a separate AHB slave interface. Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320  200, 320  240, 640  200, 640  240, 640  480, 800  600, and 1024  768. • • • • • • • • • • • • Hardware cursor support for single-panel displays. 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. 16 bpp true-color non-palettized for color STN and TFT. 24 bpp true-color non-palettized for color TFT. Programmable timing for different display panels. 256 entry, 16-bit palette RAM, arranged as a 128  32-bit RAM. Frame, line, and pixel clock signals. AC bias signal for STN, data enable signal for TFT panels. Supports little and big-endian, and Windows CE data formats. LCD panel clock may be generated from the peripheral clock, or from a clock input pin. 7.18.2 SD/MMC card interface The SD/MMC card interface supports the following modes to control: 7.18.2.1 Features • • • • • Secure Digital memory (SD version 1.1). Secure Digital I/O (SDIO version 2.0). Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1). MultiMedia Cards (MMC version 4.1). Supports up to a maximum of 50 MHz of interface frequency. 7.18.3 External memory controller The LPC546xx EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant peripheral. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 75 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.18.3.1 Features • Read and write buffers to reduce latency and to improve performance. • Low transaction latency. • Asynchronous static memory device support including RAM, ROM, and flash, with or without asynchronous page mode. • 8/16/32 data and 16/20/26 address lines wide static memory support. • Static memory features include: – Asynchronous page mode read. – Programmable Wait States. – Bus turnaround delay. – Output enable and write enable delays. – Extended wait. • Dynamic memory interface support including single data rate SDRAM. • 16 bit and 32 bit wide chip select SDRAM memory support. • EMC bus width (bit) on LQFP100 and TFBGA100 packages supports up to 8/16 data line wide static memory, in addition to dynamic memories, such as, SDRAM (2 banks only) with an SDRAM clock of up to 100 MHz. • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control EMC_CKE and EMC_CLK outputs to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device. • Separate reset domains allow the for auto-refresh through a chip reset if desired. Note: Synchronous static memory devices (synchronous burst mode) are not supported. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 76 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.18.4 DMA controller The DMA controller allows peripheral-to memory, memory-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional DMA transfers for a single source and destination. 7.18.4.1 Features • One channel per on-chip peripheral direction: typically one for input and one for output for most peripherals. • • • • • • • DMA operations can optionally be triggered by on- or off-chip events. Priority is user selectable for each channel. Continuous priority arbitration. Address cache. Efficient use of data bus. Supports single transfers up to 1,024 words. Address increment options allow packing and/or unpacking data. 7.19 Counter/timers 7.19.1 General-purpose 32-bit timers/external event counter The LPC546xx includes five general-purpose 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.19.1.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Up to four 32-bit captures can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. The number of capture inputs for each timer that are actually available on device pins may vary by device. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. – Shadow registers are added for glitch-free PWM output. • For each timer, up to four external outputs corresponding to match registers with the following capabilities (the number of match outputs for each timer that are actually available on device pins may vary by device): – Set LOW on match. – Set HIGH on match. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 77 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. • The timer and prescaler may be configured to be cleared on a designated capture event. This feature permits easy pulse width measurement by clearing the timer on the leading edge of an input pulse and capturing the timer value on the trailing edge. • Up to four match registers can be configured for PWM operation, allowing up to three single edged controlled PWM outputs. (The number of match outputs for each timer that are actually available on device pins may vary by device.) 7.19.2 SCTimer/PWM The SCTimer/PWM allows a wide variety of timing, counting, output modulation, and input capture operations. The inputs and outputs of the SCTimer/PWM are shared with the capture and match inputs/outputs of the 32-bit general-purpose counter/timers. The SCTimer/PWM can be configured as two 16-bit counters or a unified 32-bit counter. In the two-counter case, in addition to the counter value the following operational elements are independent for each half: • State variable. • Limit, halt, stop, and start conditions. • Values of Match/Capture registers, plus reload or capture control values. In the two-counter case, the following operational elements are global to the SCTimer/PWM, but the last three can use match conditions from either counter: • • • • • Clock selection Inputs Events Outputs Interrupts 7.19.2.1 Features • • • • • • Two 16-bit counters or one 32-bit counter. Counter(s) clocked by bus clock or selected input. Up counter(s) or up-down counter(s). State variable allows sequencing across multiple counter cycles. Event combines input or output condition and/or counter match in a specified state. Events control outputs, interrupts, and the SCTimer/PWM states. – Match register 0 can be used as an automatic limit. – In bi-directional mode, events can be enabled based on the count direction. – Match events can be held until another qualifying event occurs. • Selected event(s) can limit, halt, start, or stop a counter. • Supports: LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 78 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller – 8 inputs – 10 outputs – 10 match/capture registers – 10 events – 10 states • PWM capabilities including dead time and emergency abort functions 7.19.3 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.19.3.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect feed sequence causes reset or interrupt if enabled. Flag to indicate watchdog reset. Programmable 24-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in multiples of Tcy(WDCLK)  4. • The Watchdog Clock (WDCLK) uses the WDOSC as the clock source. 7.19.4 Real Time Clock (RTC) timer The RTC timer is a 32-bit timer which counts down from a preset value to zero. At zero, the preset value is reloaded and the counter continues. The RTC timer uses the 32.768 kHz clock input to create a 1 Hz or 1 kHz clock. 7.19.5 Multi-Rate Timer (MRT) The Multi-Rate Timer (MRT) provides a repetitive interrupt timer with four channels. Each channel can be programmed with an independent time interval, and each channel operates independently from the other channels. 7.19.5.1 Features • 24-bit interrupt timer. • Four channels independently counting down from individually set values. • Repeat and one-shot interrupt modes. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 79 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.19.6 Repetitive Interrupt Timer (RIT) The repetitive interrupt timer provides a free-running 48-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. Any bits of the timer/compare can be masked such that they do not contribute to the match detection. The repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 7.19.6.1 Features • 48-bit counter running from the main clock. Counter can be free-running or can be reset when an RIT interrupt is generated. • 48-bit compare value. • 48-bit compare mask. An interrupt is generated when the counter value equals the compare value, after masking. This allows for combinations not possible with a simple compare. • Can be used for ETM debug time stamping. 7.20 12-bit Analog-to-Digital Converter (ADC) The ADC supports a resolution of 12-bit and fast conversion rates of up to 5 Msamples/s. Sequences of analog-to-digital conversions can be triggered by multiple sources. Possible trigger sources are the SCTimer/PWM, external pins, and the ARM TXEV interrupt. The ADC supports a variable clocking scheme with clocking synchronous to the system clock or independent, asynchronous clocking for high-speed conversions The ADC includes a hardware threshold compare function with zero-crossing detection. The threshold crossing interrupt is connected internally to the SCTimer/PWM inputs for tight timing control between the ADC and the SCTimer/PWM. 7.20.1 Features • • • • • 12-bit successive approximation analog to digital converter. Input multiplexing among up to 12 pins. Two configurable conversion sequences with independent triggers. Optional automatic high/low threshold comparison and “zero crossing” detection. Measurement range VREFN to VREFP (typically 3 V; not to exceed VDDA voltage level). • 12-bit conversion rate of 5.0 Msamples/s. Options for reduced resolution at higher conversion rates. • Burst conversion mode for single or multiple inputs. • Synchronous or asynchronous operation. Asynchronous operation maximizes flexibility in choosing the ADC clock frequency, Synchronous mode minimizes trigger latency and can eliminate uncertainty and jitter in response to a trigger. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 80 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.21 CRC engine The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings supports several CRC standards commonly used. To save system power and bus bandwidth, the CRC engine supports DMA transfers. 7.21.1 Features • Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32. – CRC-CCITT: x16 + x12 + x5 + 1 – CRC-16: x16 + x15 + x2 + 1 – CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1 • Bit order reverse and 1’s complement programmable setting for input data and CRC sum. • Programmable seed number setting. • Supports CPU PIO or DMA back-to-back transfer. • Accept any size of data width per write: 8, 16 or 32-bit. – 8-bit write: 1-cycle operation. – 16-bit write: 2-cycle operation (8-bit x 2-cycle). – 32-bit write: 4-cycle operation (8-bit x 4-cycle). 7.22 Temperature sensor The temperature sensor transducer uses an intrinsic pn-junction diode reference and outputs a CTAT voltage (Complement To Absolute Temperature). The output voltage varies inversely with device temperature with an absolute accuracy of better than ±5 C over the full temperature range (40 C to +105 C). The temperature sensor is only approximately linear with a slight curvature. The output voltage is measured over different ranges of temperatures and fit with linear-least-square lines. After power-up, the temperature sensor output must be allowed to settle to its stable value before it can be used as an accurate ADC input. For an accurate measurement of the temperature sensor by the ADC, the ADC must be configured in single-channel burst mode. The last value of a nine-conversion (or more) burst provides an accurate result. 7.23 Security features The OTP memory contains a memory bank of 128 bits each. OTP bank contains 4 words: word 0 for ECRP, word 1 is reserved, words 2 and 3 can be used by user application for storing application specific options. 7.23.1 Features • OTP memory. • Random number generator (RNG). LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 81 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.23.2 SHA-1 and SHA-2 The Hash peripheral is used to perform SHA-1 and SHA-2 (256) based hashing. A hash takes an arbitrarily large message or image and forms a relatively small fixed size “unique” number called a digest. The data is fed by words from the processor, DMA, or hosted access; the words are converted from little-endian (ARM standard) to big-endian (SHA standard) by the block. 7.23.2.1 Features • Used with an HMAC to support a challenge/response or to validate a message. • Can be used to verify external memory that has not been compromised. 7.24 Code security (enhanced Code Read Protection - eCRP) eCRP is a mechanism that allows the user to enable different features in the security system. The features are specified using a combination of OTP and flash values. Some levels are only controlled by either flash or OTP, but the majority have dual control. The overlap allows higher security by specifying access using OTP bits, which cannot be changed (except to increase security) while allowing customers who are less concerned about security the ability to change levels in the flash image. eCRP is calculated by reading the ECRP from the flash boot sector (offset 0x0000 0020) and then masking it with the value read from OTP. The OTP bits are more restrictive (that is, disable access) than equivalent values in flash. Certain aspects of eCRP are only specified in the OTP (that is, Mass Erase disable), while others are only specified in flash (that is, Sector Protection count). For Dual Enhanced images, eCRP is calculated by reading the eCRP from the bootable image sector. The bootable image is defined as the highest revision image that passes the required validation methods. 7.25 Emulation and debugging Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and trace functions are supported. The ARM Cortex-M4 is configured to support up to eight breakpoints and four watch points. The ARM SYSREQ reset is supported and causes the processor to reset the peripherals, execute the boot code, restart from address 0x0000 0000, and break at the user entry point. The SWD pins are multiplexed with other digital I/O pins. On reset, the pins assume the SWD functions by default. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 82 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 8. Limiting values Table 10. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions [2] Min Max Unit -0.5 +4.6 V VDD supply voltage (core and on pin VDD external rail) VDDA analog supply voltage on pin VDDA -0.5 +4.6 V VBAT battery supply voltage on pin VBAT -0.5 +4.6 V Vref reference voltage on pin VREFP VI input voltage - only valid when the VDD > 1.8 V; -0.5 +4.6 V [6][7] -0.5 +5.0 V [5] -0.5 +5.0 V -0.5 +5.0 V -0.5 VDD V [3] - 200 mA [3] - 300 mA [3] - 200 mA [3] - 300 mA - 100 mA -65 +150 C - +150 C 5 V tolerant I/O pins on I2C open-drain pins USB_DM, USB_DP pins VIA analog input voltage on digital pins configured for an analog function IDD supply current per supply pin, supply current per supply pin, [8][9] 1.71 V  VDD < 2.7 V 2.7 V  VDD < 3.6 V ISS ground current per ground pin, 1.71 V  VDD < 2.7 V ground current per ground pin, I/O latch-up current (0.5VDD) < VI < (1.5VDD); 2.7 V  VDD < 3.6 V Ilatch Tj < 125 C Tstg storage temperature Tj(max) maximum junction temperature LPC546xx Product data sheet [10] All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 83 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 10. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Ptot(pack) VESD Parameter total power dissipation (per package) electrostatic discharge voltage Conditions Min Max Unit LQFP208, based on package heat transfer, not device power consumption [11] - 1.2 W LQFP208, based on package heat transfer, not device power consumption [12] - 0.95 W LQFP100, based on package heat transfer, not device power consumption [11] - 0.82 W LQFP100, based on package heat transfer, not device power consumption [12] - 0.60 W TFBGA180, based on package heat transfer, not device power consumption [11] - 0.95 W TFBGA180, based on package heat transfer, not device power consumption [13] - 1.2 W TFBGA100, based on package heat transfer, not device power consumption [11] - 0.57 W TFBGA100, based on package heat transfer, not device power consumption [13] - 0.65 W [4] - 2000 V human body model; all pins [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. c) The limiting values are stress ratings only and operating the part at these values is not recommended and proper operation is not guaranteed. The conditions for functional operation are specified in Table 21. [2] Maximum/minimum voltage above the maximum operating voltage (see Table 21) and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device. [3] The peak current is limited to 25 times the corresponding maximum current. [4] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. [5] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down. [6] Applies to all 5 V tolerant I/O pins except true open-drain pins. [7] Including the voltage on outputs in 3-state mode. [8] An ADC input voltage above 3.6 V can be applied for a short time without leading to immediate, unrecoverable failure. Accumulated exposure to elevated voltages at 4.6 V must be less than 106 s total over the lifetime of the device. Applying an elevated voltage to the ADC inputs for a long time affects the reliability of the device and reduces its lifetime. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 84 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [9] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin. [10] Dependent on package type. [11] JEDEC (4.5 in  4 in); still air. [12] Single layer (4.5 in  3 in); still air. [13] 8-layer (4.5 in  3 in); still air. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 85 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb +  P D  R th  j – a   (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 11. Thermal resistance Symbol Parameter Conditions Max/Min Unit JEDEC (4.5 in  4 in); still air LQFP208 Package Rth(j-a) Rth(j-c) thermal resistance from junction to ambient 33 15 % C/W Single-layer (4.5 in  3 in); still air 41 15 % C/W 16 15 % C/W 48 15 % C/W Single-layer (4.5 in  3 in); still air 65 15 % C/W 19 15 % C/W JEDEC (4.5 in  4 in); still air 41 15 % C/W 8-layer (4.5 in  3 in); still air 33 15 % C/W 14 15 % C/W JEDEC (4.5 in  4 in); still air 69 15 % C/W 8-layer (4.5 in  3 in); still air 60 15 % C/W 10 15 % C/W thermal resistance from junction to case LQFP100 Package Rth(j-a) Rth(j-c) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air thermal resistance from junction to case TFBGA180 Package Rth(j-a) Rth(j-c) thermal resistance from junction to ambient thermal resistance from junction to case TFBGA100 Package LPC546xx Product data sheet Rth(j-a) thermal resistance from junction to ambient Rth(j-c) thermal resistance from junction to case All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 86 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 10. Static characteristics 10.1 General operating conditions Table 12. General operating conditions Tamb = −40 °C to +105 °C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1 Max Unit ] fclk CPU clock frequency [3] - - 220 MHz CPU clock frequency For USB high-speed device and host operations [3] 90 - 220 MHz CPU clock frequency For USB full-speed device and host operations [3] 12 - 220 MHz - - 12 MHz 1.71 - 3.6 V For OTP programming only supply voltage (core and external rail) VDD VDDA analog supply voltage VBAT battery supply voltage Vrefp ADC positive reference voltage [2] 2.7 - 3.6 V For USB full-speed operation only 3.0 - 3.6 V For USB high-speed operation only 1.71 - 3.6 V 1.71 - 3.6 V For OTP programming only 1.71 - 3.6 V VDDA 2 V 2.0 - VDDA V VDDA < 2 V VDDA - VDDA V 3.0 3.6 V USB1_AVDD3V3, USB1 analog supply USB1_AVDDTX3V3 3.3 Temperature For EEPROM operation 40.0 - +85 C Vi(rtcx) 32.768 kHz oscillator input voltage on pin RTCXIN -0.5 - +3.6 V Vo(rtcx) 32.768 kHz oscillator output voltage on pin RTCXOUT -0.5 - +3.6 V Vi(xtal) crystal input voltage on pin XTALIN 0.5 - 1.95 V Vo(xtal) crystal output voltage on pin XTALOUT 0.5 - 1.95 V Tamb RTC oscillator pins [1] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply voltages. [2] Attempting to program below 2.7 V will result in unpredictable results and the part might enter an unrecoverable state. [3] The LPC5460x/61x operates at CPU frequencies of up to 180 MHz. The LPC54628 operates at CPU frequencies of up to 220 MHz. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 87 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 10.2 Power-up ramp conditions Table 13. Power-up characteristics[1] Tamb = 40 C to +105 C. Symbol Parameter Min Typ Max Unit twd Window duration - - 170 s (time where V1 VDD, the external reset pin must be floating to prevent high VBAT leakage. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 92 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller aaa-025694 500 IDD (μA) 400 300 3.6 V 3.3 V 1.8 V 1.71 V 200 100 0 -40 -10 20 50 80 Temperature (°C) 110 Conditions: BOD disabled; all oscillators and analog blocks disabled; all SRAM disabled except 32 KB SRAMX. Remark: At hot temperature and below 2.0 V, the supply current could increase slightly because of reduction of available RBB (reverse body bias) voltage. Fig 16. Deep-sleep mode: Typical supply current IDD versus temperature for different supply voltages VDD aaa-025695 35 IDD (μA) 28 21 14 3.6 V 3.3 V 1.8 V 1.71 V 7 0 -40 -10 20 50 80 Temperature (°C) 110 RTC disabled (RTC oscillator input grounded). Fig 17. Deep power-down mode: Typical supply current IDD versus temperature for different supply voltages VDD Table 19 shows the typical peripheral power consumption measured on a typical sample at Tamb = 25 °C and VDD = 3.3 V. The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled using ASYNCAPBCLKCTRL, AHBCLKCTRL0/1/2, and PDRUNCFG0/1 LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 93 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller registers. All other blocks are disabled and no code accessing the peripheral is executed. The supply currents are shown for system clock frequencies of 12 MHz, 48 MHz, 96 MHz and 180MHz. Table 19. Typical peripheral power consumption[1][2] VDD = 3.3 V; Tamb = 25 °C Peripheral IDD in uA FRO 100 WDT OSC 2.0 Flash 200 BOD 2.0 SYSOSC 247 [1] The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled using PDRUNCFG0/1 registers. All other blocks are disabled and no code accessing the peripheral is executed. [2] Typical ratings are not guaranteed. Characterized through bench measurements using typical samples. Table 20. Typical AHB/APB peripheral power consumption [3][4][5] Tamb = 25 °C, VDD = 3.3 V; Peripheral IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz AHB peripheral CPU: 12 MHz, sync APB bus: 12 MHz CPU: 48 MHz, sync APB bus: 48 MHz CPU: 96 MHz, sync APB bus: 96 MHz CPU: 180 MHz, sync APB bus: 180 MHz CPU: 220 MHz, sync APB bus: 220 MHz USB0 device 0.3 0.3 0.3 0.4 0.5 USB1 device 4.4 4.4 4.4 5.0 6.5 DMIC 0.2 0.2 0.2 0.2 0.3 GPIO0 [1] 0.9 0.9 0.9 1.0 1.4 GPIO1 [1] 0.8 0.8 0.8 1.0 1.4 GPIO2 [1] 1.0 1.0 1.0 1.1 1.4 GPIO3 [1] 1.1 1.1 1.1 1.3 1.7 GPIO4 [1] 1.0 1.0 1.0 1.2 1.6 GPIO5 [1] 0.7 0.7 0.7 0.8 1.1 DMA 0.7 0.7 0.7 0.8 1.1 CRC 1.0 1.0 1.0 1.0 1.4 ADC0 1.6 1.6 1.6 1.9 2.6 SCTimer/PWM 4.5 4.5 4.5 5.3 7.0 Ethernet AVB 24.0 24.0 24.0 28.0 38.0 LCD 13.0 13.0 13.0 15.0 19.0 EEPROM 1.1 1.1 1.1 1.2 1.6 EMC 39.0 39.0 39.0 45.4 60.1 CAN0 10.8 10.8 10.8 12.6 16.5 CAN1 10.7 10.7 10.7 12.4 16.4 SD/MMC 7.9 7.9 7.9 9.3 12.3 Flexcomm Interface 0 (USART, SPI, I2C) 1.6 1.6 1.6 1.9 2.5 LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 94 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 20. Typical AHB/APB peripheral power consumption [3][4][5] Tamb = 25 °C, VDD = 3.3 V; Peripheral IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz Flexcomm Interface1 (USART, SPI, I2C) 1.6 1.6 1.6 1.8 2.4 Flexcomm Interface 2 (USART, SPI, I2C) 1.7 1.7 1.7 1.9 2.6 Flexcomm Interface 3 (USART, SPI, I2C) 1.4 1.4 1.4 1.6 2.2 Flexcomm Interface 4 (USART, SPI, I2C) 1.4 1.5 1.5 1.7 2.3 Flexcomm Interface 5 (USART, SPI, I2C) 1.7 1.7 1.7 1.9 2.5 Flexcomm Interface 6 (USART, SPI, I2C, I2S) 2.0 2.0 2.0 2.3 3.0 Flexcomm Interface 7 (USART, SPI, I2C, I2S) 1.6 1.6 1.6 1.9 2.5 Flexcomm Interface 8 (USART, SPI, I2C) 1.5 1.5 1.5 1.8 2.3 Flexcomm Interface 9 (USART, SPI, I2C) 1.5 1.5 1.5 1.8 2.3 Sync APB peripheral CPU: 12 MHz, sync APB bus: 12 MHz CPU: 48 MHz, sync APB bus: 48 MHz CPU: 96 MHz, sync APB bus: 96 MHz CPU: 180 MHz, sync APB bus: 180 MHz CPU: 220 MHz, sync APB bus: 220 MHz INPUTMUX [1] 0.83 0.85 0.86 1.0 1.3 IOCON [1] 2.67 2.65 2.65 3.13 4.2 PINT 1.1 1.1 1.1 1.3 1.8 GINT0 and GINT1 1.33 1.35 1.34 1.52 2.0 WWDT 0.42 0.42 0.42 0.46 0.6 RTC 0.3 0.3 0.3 0.3 0.4 MRT 0.3 0.3 0.3 0.3 0.4 RIT 0.1 0.1 0.1 0.1 0.1 UTICK 0.2 0.2 0.2 0.2 0.3 CTimer0 0.8 0.8 0.8 0.9 1.3 CTimer1 0.8 0.9 0.9 1.0 1.4 CTimer2 0.83 0.85 0.88 0.99 1.3 Smart card0 2.5 2.5 2.5 2.8 3.7 Smart card1 2.5 2.5 2.5 2.8 3.7 RNG 1.4 1.4 1.4 1.5 2.0 OTP controller 4.0 4.0 4.0 4.5 6.0 SHA 1.2 1.2 1.2 1.3 1.7 LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 95 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 20. Typical AHB/APB peripheral power consumption [3][4][5] Tamb = 25 °C, VDD = 3.3 V; Peripheral IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz Async APB peripheral CPU: 12 MHz, Async APB bus: 12 MHz CPU: 48 MHz, sync APB bus: 12 MHz[2] CPU: 96 MHz, Async APB bus: 12 MHz[2] CPU: 180 MHz, CPU: 220 MHz, Async APB bus: Async APB bus: 12 MHz[2] 12 MHz[2] Timer3 0.9 0.9 0.9 0.9 1.2 Timer4 0.9 0.9 0.9 0.9 1.2 [1] Turn off the peripheral when the configuration is done. [2] For optimal system power consumption, use fixed low frequency Async APB bus when the CPU is at a higher frequency. [3] The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled using ASYNCAPBCLKCTRL, AHBCLKCTRL0/1, and PDRUNCFG0/1 registers. All other blocks are disabled and no code accessing the peripheral is executed. [4] The supply currents are shown for system clock frequencies of 12 MHz, 48 MHz, 96 MHz, 180 MHz, and 220 MHz. [5] Typical ratings are not guaranteed. Characterized through bench measurements using typical samples. 10.5 Pin characteristics Table 21. Static characteristics: pin characteristics Tamb = −40 °C to +105 °C, unless otherwise specified. 1.71 V ≤ VDD ≤ 3.6 V unless otherwise specified. Values tested in production unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit 0.8  VDD - 5.0 V 0.5 - 0.3  VDD V RESET pin VIH HIGH-level input voltage VIL LOW-level input voltage Vhys 0.05  VDD - - V - 3.0 180 nA 3.0 180 nA - 3.0 180 nA 0 - 5.0 V 0 - 3.6 V 1.71 V  VDD < 2.7 V 1.5 - 5.0 V 2.7 V  VDD  3.6 V 2.0 - 5.0 V 1.71 V  VDD < 2.7 V 0.5 - +0.4 V 0.5 - +0.8 V 0.1  VDD - - V [14] hysteresis voltage Standard I/O pins Input characteristics IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled. IIH HIGH-level input current VI = VDD; VDD = 3.6 V; for RESETN pin. IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled VI input voltage pin configured to provide a digital function; [3] VDD  1.8 V VDD = 0 V VIH VIL HIGH-level input voltage LOW-level input voltage 2.7 V  VDD  3.6 V Vhys [14] hysteresis voltage Output characteristics LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 96 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 21. Static characteristics: pin characteristics …continued Tamb = −40 °C to +105 °C, unless otherwise specified. 1.71 V ≤ VDD ≤ 3.6 V unless otherwise specified. Values tested in production unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VO output voltage output active 0 - VDD V IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/pull-down resistors disabled - 3 180 nA VOH HIGH-level output voltage IOH = 4 mA; 1.71 V  VDD < 2.7 V VDD  0.4 - - V IOH = 6 mA; 2.7 V  VDD  3.6 V VOL VDD  0.4 LOW-level output voltage IOL = 4 mA; 1.71 V  VDD < 2.7 V IOL = 6 mA; 2.7 V  VDD 3.6 V IOH HIGH-level output current VOH = VDD  0.4 V; 1.71 V  VDD < 2.7 V VOH = VDD  0.4 V; 2.7 V  VDD  3.6 V IOL LOW-level output current VOL = 0.4 V; 1.71 V  VDD < 2.7 V VOL = 0.4 V; 2.7 V  VDD  3.6 V IOHS IOLS HIGH-level short-circuit output current 1.71 V  VDD < 2.7 V drive HIGH; connected to ground; 2.7 V  VDD  3.6 V LOW-level short-circuit output current 1.71 V  VDD < 2.7 V drive LOW; connected to VDD 2.7 V  VDD  3.6 V [2][4] [2][4] - - 0.4 V - - 0.4 V 4.0 - - mA 6.0 - - mA 4.0 - - mA 6.0 - - mA - - 35 mA - - 87 mA - - 30 mA - - 77 mA 25 80 A 80 100 A 25 80 A 6 30 A Weak input pull-up/pull-down characteristics Ipd pull-down current VI = VDD [2] VI = 5 V Ipu pull-up current VI = 0 V VDD < VI < 5 V [2][7] Open-drain I2C pins VIH VIL Vhys HIGH-level input voltage LOW-level input voltage 1.71 V  VDD < 2.7 V 0.7  VDD - - V 2.7 V  VDD  3.6 V 0.7  VDD - - V 1.71 V  VDD < 2.7 V 0 - 0.3  VDD V 2.7 V  VDD  3.6 V 0 - 0.3  VDD V 0.1  VDD - - V - 2.5 3.5 A hysteresis voltage [5] ILI input leakage current VI = VDD VI = 5 V - 5.5 10 A IOL LOW-level output VOL = 0.4 V; pin configured for standard mode or fast mode 4.0 - - mA VOL = 0.4V; pin configured for Fast-mode Plus 20 - - mA current LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 97 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 21. Static characteristics: pin characteristics …continued Tamb = −40 °C to +105 °C, unless otherwise specified. 1.71 V ≤ VDD ≤ 3.6 V unless otherwise specified. Values tested in production unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit USB0_DM and USB0_DP pins VI input voltage 0 - VDD V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V Vhys hysteresis voltage V 0.4 - - Zout output impedance [11] 33.0 - 44 Ω VOH HIGH-level output voltage [12] 2.8 - - V VOL LOW-level output voltage [13] IOH IOL - - 0.3 V HIGH-level output current VOH = VDD  0.3 V [9][10] 38 - 74 mA VOH = VDD  0.3 V [10][11] 6.0 9.0 mA LOW-level output current VOL = 0.3 V [9][10] 38 - 74 mA VOL = 0.3 V [10][11] 6.0 9.0 mA IOLS LOW-level short-circuit output current drive LOW; pad connected to ground [10] IOHS HIGH-level short-circuit output current drive HIGH; pad connected to ground [10] - - 100 mA I2C-bus pins [8] - - 6.0 pF pins with digital functions only [6] - - 2.0 pF Pins with digital and analog functions [6] - - 7.0 pF - - 100 mA Pin capacitance Cio input/output capacitance [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltage. [2] Based on characterization. Not tested in production. [3] With respect to ground. [4] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [5] To VSS. [6] The values specified are simulated and absolute values, including package/bondwire capacitance. [7] The weak pull-up resistor is connected to the VDD rail and pulls up the I/O pin to the VDD level. [8] The value specified is a simulated value, excluding package/bondwire capacitance. [9] Without 33 Ω  2 % series external resistor. [10] The parameter values specified are simulated and absolute values. [11] With 33 Ω  2 % series external resistor. [12] With 15 KΩ  5 % resistor to VSS. [13] With 1.5 KΩ  5% resistor to 3.6 V external pull-up. [14] Guaranteed by design, not tested in production. LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 98 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller VDD IOL Ipd + - pin PIO0_n A IOH Ipu - + pin PIO0_n A aaa-010819 Fig 18. Pin input/output current measurement 10.5.1 Electrical pin characteristics aaa-017309 60 -40C 25C 90C 105C IOL (mA) 50 aaa-017310 60 IOL (mA) -40C 25C 90C 105C 45 40 30 30 20 15 10 0 0 0 0.1 0.2 0.3 0.4 0.5 VOL (V) 0.6 Conditions: VDD = 1.8 V; on pins PIO0_13 to PIO0_14. 0 0.1 0.2 0.3 0.4 0.5 VOL (V) 0.6 Conditions: VDD = 3.3 V; on pins PIO0_13 to PIO0_16. Fig 19. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus LOW-level output voltage VOL LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 99 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller aaa-017311 12 IOL (mA) aaa-017312 15 -40C 25C 90C 105C IOL (mA) 10 12 -40C 90C 25C 105C 8 9 6 6 4 3 2 0 0 0 0.1 0.2 0.3 0.4 0.5 VOL (V) 0.6 0 Conditions: VDD = 1.8 V; on standard port pins. 0.1 0.2 0.3 0.4 0.5 VOL (V) 0.6 Conditions: VDD = 3.3 V; on standard port pins. Fig 20. Typical LOW-level output current IOL versus LOW-level output voltage VOL aaa-017313 1.8 VOH (V) 1.7 aaa-017314 3.5 VOH (V) 3.2 1.6 2.9 -40C 25C 90C 105C 1.5 -40C 25C 90C 105C 2.6 1.4 2.3 1.3 1.2 2 0 2.4 4.8 7.2 9.6 IOH (mA) 12 Conditions: VDD = 1.8 V; on standard port pins. 0 7 14 21 28 IOH (mA) 35 Conditions: VDD = 3.3 V; on standard port pins. Fig 21. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 100 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller aaa-017315 40 Ipu (μA) aaa-017316 50 Ipu (μA) 30 20 10 0 -10 -40C 25C 90C 105C -20 -40C 25C 90C 105C -30 -50 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VI (V) -70 0.0 3.5 Conditions: VDD = 1.8 V; on standard port pins. 1.0 2.0 3.0 4.0 VI (V) 5.0 Conditions: VDD = 3.3 V; on standard port pins. Fig 22. Typical pull-up current IPU versus input voltage VI aaa-017317 70 Ipd (μA) 56 80 42 60 28 40 25C -40C 90C 105C 14 0 0.0 aaa-017318 100 Ipd (μA) 105C 90C 25C -40C 20 0 0.7 1.4 2.1 2.8 VI (V) 3.5 Conditions: VDD = 1.8V; on standard port pins. 0 1 2 3 4 VI (V) 5 Conditions: VDD = 3.3 V; on standard port pins. Fig 23. Typical pull-down current IPD versus input voltage VI LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 101 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11. Dynamic characteristics 11.1 Flash memory Table 22. Flash characteristics Tamb = −40 °C to +105 °C, unless otherwise specified. VDD = 1.71 V to 3.6 V Symbol Nendu Parameter Conditions endurance [1] sector erase/program Min Typ Max Unit 10000 - - cycles page erase/program; page in a sector 1000 - - cycles tret retention time powered 10 - - years unpowered 10 - - years ter erase time page, sector, or multiple consecutive sectors - 100 - ms tprog programming time - 1 - ms [2] [1] Number of erase/program cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. 11.2 EEPROM Table 23. EEPROM characteristics Tamb = −40 °C to +85 °C; VDD = 1.71 V to 3.6 V. Symbol Parameter fclk Min Typ Max Unit clock frequency 800 1500 1600 kHz Nendu endurance 100000 - - cycles tret retention time Tamb = 40 C to +85 C 20 - - years ta access time read - 100 - ns erase/program; fclk = 1500 kHz - 1.99 - ms erase/program; fclk = 1600 kHz - 1.87 - ms twait wait time [1] Conditions read; RPHASE1 [1] 70 - - ns read; RPHASE2 [1] 35 - - ns write; PHASE1 [1] 20 - - ns write; PHASE2 [1] 40 - - ns write; PHASE3 [1] 10 - - ns See the LPC546xx. user manual, UM10912 on how to program the wait states for the different read (RPHASEx) and erase/program phases (PHASEx). Remark: EEPROM is not accessible in deep-sleep and deep power-down modes LPC546xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.8 — 8 September 2020 © NXP Semiconductors N.V. 2020. All rights reserved. 102 of 171 LPC546xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.3 I/O pins Table 24. Dynamic characteristic: I/O pins[1] Tamb = −40 °C to +105 °C; 1.71 V ≤ VDD ≤ 3.6 V Symbol Parameter Conditions Min Typ Max Unit 1.0 - 2.5 ns 1.6 - 3.8 ns 2.7 V  VDD