MC68HC11D0CFBE3

MC68HC711D3 MC68HC11D3 MC68HC11D0 MC68L11D0 Data Sheet HC11 Microcontrollers MC68HC711D3 Rev. 2.1 07/2005 freescale.com MC68HC711D3 Data Sheet To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://www.freescale.com Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2005. All rights reserved. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 3 Revision History The following revision history table summarizes changes contained in this document. For your convenience, the page number designators have been linked to the appropriate location. Revision History Date Revision Level Page Number(s) Description Reformatted to current publications standards N/A Removed references to PROG mode. September, 2003 2 Corrected pin assignments for: Figure 1-2. Pin Assignments for 40-Pin Plastic DIP Figure 1-3. Pin Assignments for 44-Pin PLCC Added Figure 1-4. Pin Assignments for 44-Pin QFP 4 5 6 1.9 Interrupt Request (IRQ) — Reworked description for clarity. 7 2.4 Programmable Read-Only Memory (PROM) — Updated with additional data. 13 Section 10. Ordering Information and Mechanical Specifications — Added mechanical specifications for 44-pin plastic quad flat pack (QFP). 133 Added the following appendices: Appendix A. MC68HC11D3 and MC68HC11D0 Appendix B. MC68L11D0 July, 2005 2.1 Throughout Updated to meet Freescale identity guidelines. 137 143 Throughout MC68HC711D3 Data Sheet, Rev. 2.1 4 Freescale Semiconductor List of Chapters Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Chapter 2 Operating Modes and Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Chapter 3 Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Chapter 4 Resets, Interrupts, and Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Chapter 5 Input/Output (I/O) Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Chapter 6 Serial Communications Interface (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Chapter 7 Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Chapter 8 Programmable Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Chapter 9 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Chapter 10 Ordering Information and Mechanical Specifications . . . . . . . . . . . . . . . . . . 121 Appendix A MC68HC11D3 and MC68HC11D0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Appendix B MC68L11D0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 5 List of Chapters MC68HC711D3 Data Sheet, Rev. 2.1 6 Freescale Semiconductor Table of Contents Chapter 1 General Description 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply (VDD, VSS, and EVSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset (RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Crystal Driver and External Clock Input (XTAL and EXTAL) . . . . . . . . . . . . . . . . . . . . . . . . . . . E-Clock Output (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Request (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-Maskable Interrupt/Programming Voltage (XIRQ/VPP) . . . . . . . . . . . . . . . . . . . . . . . . . . . MODA and MODB (MODA/LIR and MODB/VSTBY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read/Write (R/W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port D Bit 6/Address Strobe (PD6/AS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input/Output Lines (PA7–PA0, PB7–PB0, PC7–PC0, and PD7–PD0) . . . . . . . . . . . . . . . . . . . 13 13 13 14 16 16 16 16 17 18 18 18 18 18 Chapter 2 Operating Modes and Memory 2.1 2.2 2.2.1 2.2.2 2.2.3 2.2.4 2.3 2.3.1 2.3.2 2.3.3 2.4 2.4.1 2.4.2 2.4.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single-Chip Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Expanded Multiplexed Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Special Bootstrap Mode (BOOT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Special Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control and Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RAM and I/O Mapping Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Configuration Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programmable Read-Only Memory (PROM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programming an Individual EPROM Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programming the EPROM with Downloaded Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROM Programming Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 21 21 21 22 23 23 23 29 30 31 31 32 32 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 7 Table of Contents Chapter 3 Central Processor Unit (CPU) 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 Accumulators A, B, and D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 Index Register X (IX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.3 Index Register Y (IY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.4 Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.5 Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6 Condition Code Register (CCR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.1 Carry/Borrow (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.2 Overflow (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.3 Zero (Z). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.4 Negative (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.5 I-Interrupt Mask (I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.6 Half Carry (H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.7 X-Interrupt Mask (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6.8 STOP Disable (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Data Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Opcodes and Operands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.1 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.2 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.3 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.4 Indexed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.5 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.6 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 33 34 34 34 34 36 36 36 36 36 37 37 37 37 37 37 38 38 38 38 39 39 39 39 39 Chapter 4 Resets, Interrupts, and Low-Power Modes 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.3 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 4.3.6 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Computer Operating Properly (COP) Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Monitor Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Configuration Options Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illegal Opcode Trap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Real-Time Interrupt (RTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Mask Bits in the CCR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Priority Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Highest Priority I Interrupt and Miscellaneous Register (HPRIO) . . . . . . . . . . . . . . . . . . . . 47 47 47 47 47 48 48 49 51 51 51 51 52 58 MC68HC711D3 Data Sheet, Rev. 2.1 8 Freescale Semiconductor 4.4 4.4.1 4.4.2 Low-Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Chapter 5 Input/Output (I/O) Ports 5.1 5.2 5.3 5.3.1 5.3.2 5.4 5.4.1 5.4.2 5.4.3 5.5 5.5.1 5.5.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port B Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port B Data Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port C Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port C Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port C Data Direction Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port D Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port D Data Direction Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 61 62 62 62 63 63 63 63 64 64 64 Chapter 6 Serial Communications Interface (SCI) 6.1 6.2 6.3 6.4 6.5 6.5.1 6.5.2 6.6 6.7 6.7.1 6.7.2 6.7.3 6.7.4 6.7.5 6.8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transmit Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Receive Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wakeup Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Idle-Line Wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address-Mark Wakeup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Control Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Control Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCI Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Baud Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Status Flags and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 65 65 65 68 68 68 69 69 69 70 70 71 72 75 Chapter 7 Serial Peripheral Interface (SPI) 7.1 7.2 7.3 7.4 7.5 7.5.1 7.5.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Transfer Formats. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Phase and Polarity Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Master In/Slave Out (MISO). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Master Out/Slave In (MOSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 77 77 79 79 79 80 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 9 Table of Contents 7.5.3 7.5.4 7.6 7.7 7.7.1 7.7.2 7.7.3 Serial Clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slave Select (SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI System Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Data I/O Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 80 80 81 81 82 83 Chapter 8 Programmable Timer 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.4 8.4.1 8.4.2 8.4.3 8.4.4 8.4.5 8.4.6 8.4.7 8.4.8 8.4.9 8.4.10 8.5 8.5.1 8.5.2 8.5.3 8.6 8.7 8.7.1 8.7.2 8.7.3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Timer Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Timer Control 2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Timer Input Capture Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Timer Input Capture 4/Output Compare 5 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Output Compare (OC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Timer Output Compare Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Timer Compare Force Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Output Compare 1 Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Output Compare 1 Data Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Timer Control 1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Timer Interrupt Mask 1 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Timer Interrupt Flag 1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Timer Interrupt Mask 2 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Timer Interrupt Flag 2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Real-Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Timer Interrupt Mask 2 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Timer Interrupt Flag 2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Pulse Accumulator Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Computer Operating Properly Watchdog Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Pulse Accumulator Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Pulse Accumulator Count Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Pulse Accumulator Status and Interrupt Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Chapter 9 Electrical Characteristics 9.1 9.2 9.3 9.4 9.5 9.6 9.7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peripheral Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 105 106 106 107 109 114 MC68HC711D3 Data Sheet, Rev. 2.1 10 Freescale Semiconductor 9.8 9.9 Expansion Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Serial Peripheral Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Chapter 10 Ordering Information and Mechanical Specifications 10.1 10.2 10.3 10.4 10.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40-Pin DIP (Case 711-03) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-Pin PLCC (Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-Pin QFP (Case 824A-01) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 121 121 122 123 Appendix A MC68HC11D3 and MC68HC11D0 A.1 A.2 A.3 A.4 A.5 A.5.1 A.5.2 A.6 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MC68HC11D3 and MC68HC11D0 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . Functional Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 126 127 128 128 128 128 129 Appendix B MC68L11D0 B.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2 MC68L11D0 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.1 Functional Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.2 DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.3 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.4 Peripheral Port Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.5 Expansion Bus Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.2.6 Serial Peripheral Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B.3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 131 131 131 133 133 134 135 136 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 11 Table of Contents MC68HC711D3 Data Sheet, Rev. 2.1 12 Freescale Semiconductor Chapter 1 General Description 1.1 Introduction This section depicts the general characteristics and features of the MC68HC711D3 high-density complementary metal-oxide semiconductor (HCMOS) microcontroller unit (MCU). The MC68HC711D3 contains highly sophisticated on-chip peripheral functions. This high-speed, low-power programmable read-only memory (PROM) MCU has a nominal bus speed of 3 MHz. The fully static design allows operations at frequencies down to dc. The MC68HC11D3 and MC68HC11D0 are read-only memory (ROM) based high-performance microcontrollers (MCU) based on the MC68HC11E9 design. The MC68L11D0 is an extended-voltage version of the MC68HC11D0 that can operate in applications that require supply voltages as low as 3.0 V. The information in this document pertains to all the devices with the exceptions noted in Appendix A MC68HC11D3 and MC68HC11D0 and Appendix B MC68L11D0. 1.2 Features Features of the MC68HC711D3 include: • Expanded 16-bit timer system with four-stage programmable prescaler • Non-return-to-zero (NRZ) serial communications interface (SCI) • Power-saving stop and wait modes • 64 Kbytes memory addressability • Multiplexed address/data bus • Serial peripheral interface (SPI) • 4 Kbytes of one-time programmable read-only memory (OTPROM) • 8-bit pulse accumulator circuit • 192 bytes of static random-access memory (RAM) (all saved during standby) • Real-time interrupt (RTI) circuit • Computer operating properly (COP) watchdog system • Available in these packages: – 40-pin plastic dual in-line package (DIP) – 44-pin plastic leaded chip carrier (PLCC) – 44-pin plastic quad flat pack (QFP) 1.3 Structure Refer to Figure 1-1, which shows the structure of the MC68HC711D3 MCU. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 13 General Description NOT BONDED IN 40-PIN PACKAGE MODA/LIR MODB/VSTBY RESET IRQ XIRQ/VPP XTAL EXTAL E OSCILLATOR MODE CONTROL PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 CLOCK LOGIC INTERRUPT CONTROL 4 KBYTES EPROM OR OTPROM COP PAI/OC1 PULSE ACCUMULATOR OC2/OC1 OC3/OC1 OC4/OC1 TIMER IC4/OC5/OC1 IC1 IC2 IC3 PERIODIC INTERRUPT PORT A 192 BYTES STATIC RAM SS MC68HC711D3 CPU CORE VSS MOSI MISO VDD SERIAL COMMUNICATIONS INTERFACE (SCI) SCK SERIAL PERIPHERAL INTERFACE (SPI) TxD RxD EVSS MULTIPLEXED ADDRESS/DATA BUS PD0 PD1 PD2 PD3 PD4 PD5 PD6/AS PD7/R/W PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PB0 PB1 PB2 PORT D PB3 PORT C PB4 PORT B PB5 DATA DIRECTION REGISTER D PB6 DATA DIRECTION REGISTER C PB7 DATA DIRECTION REGISTER B Figure 1-1. MC68HC711D3 Block Diagram 1.4 Pin Descriptions Refer to Figure 1-2, Figure 1-3, and Figure 1-4 for pin assignments. MC68HC711D3 Data Sheet, Rev. 2.1 14 Freescale Semiconductor Pin Descriptions VSS 1 40 XTAL PC0 2 39 EXTAL PC1 3 38 E PC2 4 37 MODA/LIR PC3 5 36 MODB/VSTBY PC4 6 35 PB0 PC5 7 34 PB1 PC6 8 33 PB2 PC7 9 32 PB3 XIRQ/VPP 10 31 PB4 PD7/R/W 11 30 PB5 PD6/AS 12 29 PB6 RESET 13 28 PB7 IRQ 14 27 PA0 PD0 15 26 PA1 PD1 16 25 PA2 PD2 17 24 PA3 PD3 18 23 PA5 PD4 19 22 PA7 PD5 20 21 VDD EXTAL E MODA/LIR MODB/VSTBY 42 41 40 VSS 2 XTAL PC0 3 43 PD1 4 EVSS PC2 5 44 PC3 6 Figure 1-2. Pin Assignments for 40-Pin Plastic DIP 7 39 PB0 PC5 8 38 PB1 PC6 9 37 PB2 PC7 10 36 PB3 XIRQ/VPP 11 35 PB4 PD7/R/W 12 34 PB5 PD6/AS 13 33 PB6 RESET 14 32 PB7 1 PC4 24 25 26 27 28 PA5 PA4 PA3 PA2 23 PA6 PA7 22 VDD PA1 21 29 20 17 PD5 PD1 PD4 PA0 19 NC 30 18 31 16 PD3 15 PD2 IRQ PD0 Figure 1-3. Pin Assignments for 44-Pin PLCC MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 15 38 3 31 PB2 PC7 4 30 PB3 XIRQ 5 29 PB4 PD7 6 28 PB5 PD6 7 27 PB6 RESET 8 26 PB7 IRQ 9 25 NC 10 24 PA0 15 16 17 18 19 20 21 23 PA1 PD5 VDD PA7 PA6 PA5 PA4 PA3 PA2 MODB XTAL 39 PC6 14 MODA VSS 40 PB1 PD4 34 EVSS 41 32 13 35 PC0 42 2 12 E PC1 43 PB0 PD3 36 PC2 1 PC5 PD0 PD1 37 PC3 PC4 PD2 EXTAL General Description Figure 1-4. Pin Assignments for 44-Pin QFP 1.5 Power Supply (VDD, VSS, and EVSS) Power is supplied to the MCU through VDD and VSS. VDD is the power supply (+5 V ±10%) and VSS is ground (0 V). EVSS, available on the 44-pin PLCC and QFP, is an additional ground pin. 1.6 Reset (RESET) An active low bidirectional control signal, RESET, acts as an input to initialize the MCU to a known startup state. It also acts as an open-drain output to indicate that an internal failure has been detected in either the clock monitor or computer operating properly (COP) watchdog circuit. In addition, the state of this pin is one of the factors governing the selection of BOOT mode. 1.7 Crystal Driver and External Clock Input (XTAL and EXTAL) These two pins provide the interface for either a crystal or a CMOS compatible clock to control the internal clock generator circuitry. The frequency applied to these pins is four times higher than the desired E-clock rate. Refer to Figure 1-5 for crystal and clock connections. 1.8 E-Clock Output (E) E is the output connection for the internally generated E clock. The signal from E is used as a timing reference. The frequency of the E-clock output is one fourth that of the input frequency at the XTAL and EXTAL pins. The E clock can be turned off in single-chip mode for greater noise immunity if desired. See 4.3.6 Highest Priority I Interrupt and Miscellaneous Register (HPRIO) for details. MC68HC711D3 Data Sheet, Rev. 2.1 16 Freescale Semiconductor Interrupt Request (IRQ) MCU 4xE CMOS-COMPATIBLE EXTERNAL OSCILLATOR EXTAL XTAL NC OR 10K–100K LOAD FIRST MCU SECOND MCU 25 pF * EXTAL EXTAL 10 M 4xE CRYSTAL 25 pF * XTAL NC OR 10K–100K LOAD XTAL MCU 25 pF * EXTAL 10 M 4xE CRYSTAL 25 pF * XTAL * Values includes all stray capacitances. Figure 1-5. Oscillator Connections 1.9 Interrupt Request (IRQ) The IRQ input provides a means of applying asynchronous interrupt requests to the microcontroller unit (MCU). Either negative edge-sensitive triggering or level-sensitive triggering is program selectable by using the IRQE bit of the OPTION register. IRQ is always configured to level-sensitive triggering at reset. While the programmable read-only memory (PROM) is being programmed, this pin provides the chip enable (CE) signal. To prevent accidental programming of the PROM during reset, an external resistor is required on IRQ to pull the pin to VDD. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 17 General Description 1.10 Non-Maskable Interrupt/Programming Voltage (XIRQ/VPP) The XIRQ input provides the capability for asynchronously applying non-maskable interrupts to the MCU after a power-on reset (POR). During reset, the X bit in the condition code register (CCR) is set masking any interrupt until enabled by software. This level-sensitive input requires an external pullup resistor to VDD. In the programming configuration of the bootstrap mode, this pin is used to supply one-time programmable read-only memory (OTPROM) programming voltage, VPP, to the MCU. To avoid programming accidents during reset, this pin should be equal to VDD during normal operation unless XIRQ is active. 1.11 MODA and MODB (MODA/LIR and MODB/VSTBY) As reset transitions, these pins are used to latch the part into one of the four central processor unit (CPU) controlled modes of operation. The LIR output can be used as an aid to debugging once reset is completed. The open-drain LIR pin goes to an active low during the first E-clock cycle of each instruction and remains low for the duration of that cycle. The VSTBY input is used to retain random-access memory (RAM) contents during power down. 1.12 Read/Write (R/W) This pin performs either of two separate functions, depending on the operating mode. • In single-chip and bootstrap modes, R/W functions as input/output port D bit 7. Refer to Chapter 5 Input/Output (I/O) Ports for further information. • In expanded multiplexed and test modes, R/W performs a read/write function. R/W controls the direction of transfers on the external data bus. 1.13 Port D Bit 6/Address Strobe (PD6/AS) This pin performs either of two separate functions, depending on the operating mode. • In single-chip and bootstrap modes, the pin functions as input/output port D bit 6. • In the expanded multiplexed and test modes, it provides an address strobe (AS) function. AS is used to demultiplex the address and data signals at port C. Refer to Chapter 2 Operating Modes and Memory for further information. 1.14 Input/Output Lines (PA7–PA0, PB7–PB0, PC7–PC0, and PD7–PD0) In the 44-pin PLCC package, 32 input/output lines are arranged into four 8-bit ports: A, B, C, and D. The lines of ports B, C, and D are fully bidirectional. Port A has two bidirectional, three input-only, and three output-only lines in the 44-pin PLCC packaging. In the 40-pin DIP, two of the output-only lines are not bonded. Each of these four ports serves a purpose other than input/output (I/O), depending on the operating mode or peripheral functions selected. NOTE Ports B, C, and two bits of port D are available for I/O functions only in single-chip and bootstrap modes. MC68HC711D3 Data Sheet, Rev. 2.1 18 Freescale Semiconductor Input/Output Lines (PA7–PA0, PB7–PB0, PC7–PC0, and PD7–PD0) Refer to Table 1-1 for details about the functions of the 32 port signals within different operating modes. Table 1-1. Port Signal Functions Port/Bit Single-Chip and Bootstrap Mode Expanded Multiplexed and Special Test Mode PA0 PA0/IC3 PA1 PA1/IC2 PA2 PA2/IC1 PA3 PA3/OC5/IC4/and-or OC1 (1) PA4/OC4/and-or OC1 PA4 PA5 PA5/OC3/and-or OC1 (1) PA6/OC2/and-or OC1 PA6 PA7 PB0 PA7/PAI/and-or OC1 PB0 A8 PB1 PB1 A9 PB2 PB2 A10 PB3 PB3 A11 PB4 PB4 A12 PB5 PB5 A13 PB6 PB6 A14 PB7 PB7 A15 PC0 PC0 A0/D0 PC1 PC1 A1/D1 PC2 PC2 A2/D2 PC3 PC3 A3/D3 PC4 PC4 A4/D4 PC5 PC5 A5/D5 PC6 PC6 A6/D6 PC7 PC7 A7/D7 PD0 PD0/RxD PD1 PD1/TxD PD2 PD2/MISO PD3 PD3/MOSI PD4 PD4/SCK PD5 PD5/SS PD6 PD6 AS PD7 PD7 R/W 1. In the 40-pin package, pins PA4 and PA6 are not bonded. Their associated I/O and output compare functions are not available externally. They can still be used as internal software timers, however. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 19 General Description MC68HC711D3 Data Sheet, Rev. 2.1 20 Freescale Semiconductor Chapter 2 Operating Modes and Memory 2.1 Introduction This section contains information about: • The modes that define MC68HC711D3 operating conditions • The on-chip memory that allows the microcontroller unit (MCU) to be configured for various applications • The 4-Kbytes of programmable read-only memory (PROM) 2.2 Operating Modes The MC68HC711D3 uses two dedicated pins, MODA and MODB, to select one of two normal operating modes or one of two special operating modes. A value reflecting the microcontroller unit (MCU) status or mode selected is latched on bits SMOD and MDA of the highest priority I-bit interrupt and miscellaneous register (HPRIO) on the rising edge of reset. The normal operating modes are the single-chip and expanded-multiplexed modes. The special operating modes are the bootstrap and test modes. Table 2-1 shows mode selection according to the values encoded on the MODA and MODB pins, and the value latched in the SMOD and MDA bits. Table 2-1. Mode Selection RESET MODA MODB 1 0 1 1 1 1 Mode Selected SMOD MDA Normal — single chip 0 0 1 Normal — expanded multiplexed 0 1 0 0 Special — bootstrap (BOOT) 1 0 1 1 0 Special — test 1 1 0 0 0 Reserved X X 2.2.1 Single-Chip Mode In single-chip mode, the MCU functions as a self-contained microcontroller and has no external address or data bus. The 4-Kbyte erasable programmable read-only memory (EPROM) would contain all program code and is located at $F000–$FFFF. This mode provides maximum use of the pins for on-chip peripheral functions, and all the address and data activity occurs within the MCU. 2.2.2 Expanded Multiplexed Mode In the expanded-multiplexed mode, the MCU can address up to 64 Kbytes of address space. High-order address bits are output on the port B pins. Low-order address bits and the bidirectional data bus are multiplexed on port C. The AS pin provides the control output used in demultiplexing the low-order address. The R/W pin is used to control the direction of data transfer on the port C bus. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 21 Operating Modes and Memory If this mode is entered out of reset, the EPROM is located at $7000–$7FFF and vector accesses are from external memory. To be in expanded-multiplexed mode with EPROM located at $F000–$FFFF, it is necessary to start in single-chip mode, executing out of EPROM, and then set the MDA bit of the HPRIO register to switch mode. NOTE R/W, AS, and the high-order address bus (port B) are inputs in single-chip mode. These inputs may need to be pulled up so that off-chip accesses cannot occur while the MCU is in single-chip mode. 2.2.3 Special Bootstrap Mode (BOOT) This special mode is similar to single-chip mode. The resident bootloader program contains a 256-byte program in a special on-chip read-only memory (ROM). The user downloads a small program into on-board RAM using the SCI port. Program control is passed to RAM when an idle line of at least four characters occurs. In this mode, all interrupt vectors are mapped to RAM (see Table 2-2), so that the user can set up a jump table, if desired. Bootstrap mode (BOOT) is entered out of reset if the voltage level on both MODA and MODB is low. The programming aspect of bootstrap mode, used to program the one-time programmable ROM (OTPROM) through the MCU, is entered automatically if IRQ is low and programming voltage is available on the VPP pin. IRQ should be pulled up while in reset with MODA and MODB configured for bootstrap mode to prevent unintentional programming of the EPROM. This versatile mode (BOOT) can be used for test and diagnostic functions on completed modules and for programming the on-board PROM. The serial receive logic is initialized by software in the bootloader ROM, which provides program control for the SCI baud rate and word format. Mode switching to other modes can occur under program control by writing to the SMOD and MDA bits of the HPRIO register. Two special bootloader functions allow either an immediate jump-to-RAM at memory address $0000 or an immediate jump-to-EPROM at $F000. Table 2-2. Bootstrap Mode Jump Vectors Address Vector 00C4 SCI 00C7 SPI 00CA Pulse accumulator input edge 00CD Pulse accumulator overflow 00D0 Timer overflow 00D3 Timer output compare 5/input capture 4 00D6 Timer output compare 4 00D9 Timer output compare 3 00DC Timer output compare 2 00DF Timer output compare 1 00E3 Timer input capture 3 00E5 Timer input capture 2 00E8 Timer input capture 1 MC68HC711D3 Data Sheet, Rev. 2.1 22 Freescale Semiconductor Memory Map Table 2-2. Bootstrap Mode Jump Vectors (Continued) Address Vector 00EB Real-time interrupt 00EE IRQ 00F1 XIRQ 00F4 SWI 00F7 Illegal opcode 00FA COP fail 00FD Clock monitor BF00 (Boot) Reset 2.2.4 Special Test Mode This special expanded mode is primarily intended or production testing. The user can access a number of special test control bits in this mode. Reset and interrupt vectors are fetched externally from locations $BFC0–$BFFF. A switch can be made from this mode to other modes under program control. 2.3 Memory Map Figure 2-1 illustrates the memory map for both normal modes of operation (single-chip and expanded-multiplexed), as well as for both special modes of operation (bootstrap and test). • In the single-chip mode, the MCU does not generate external addresses. The internal memory locations are shown in the shaded areas, and the contents of these shaded areas are explained on the right side of the diagram. • In expanded-multiplexed mode, the memory locations are basically the same as in the single-chip mode except that the memory locations between shaded areas are for externally addressed memory and I/O. • The special bootstrap mode is similar to the single-chip mode, except that the bootstrap program ROM is located at memory locations $BF00–$BFFF, vectors included. • The special test mode is similar to the expanded-multiplexed mode except the interrupt vectors are at external memory locations. 2.3.1 Control and Status Registers Figure 2-2 is a representation of all 64 bytes of control and status registers, I/O and data registers, and reserved locations that make up the internal register block. This block may be mapped to any 4-K boundary in memory, but reset locates it at $0000–$003F. This mappability factor and the default starting addresses are indicated by the use of a bold 0 as the starting character of a register’s address. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 23 Operating Modes and Memory $0000 $0000 INTERNAL REGISTERS AND I/O (MAY BE MAPPED TO ANY 4-K BOUNDARY $003F USING INIT REGISTER) $1000 $2000 $0040 192 BYTES STATIC RAM (MAY BE MAPPED TO ANY 4-K BOUNDARY $00FF USING THE INIT REGISTER) $3000 $4000 $5000 $7000 4 KBYTES PROM (ROM) PRESENT AT RESET AND MAY BE DISABLED BY $7FFF EPON (ROM ON) BIT IN CONFIG REGISTER. INTERRUPT VECTORS ARE EXTERNAL. $6000 $7000 $8000 EXTERNAL $9000 EXTERNAL $A000 $B000 $C000 $BF00 $D000 256-BYTES BOOT ROM $BFC0 4-KBYTES PROM (ROM) $BFC0 $BFFF $E000 $F000 $BF00 $FFFF SINGLE CHIP EXPANDED SPECIAL MULTIPLEXED BOOTSTRAP MODB MODA 1 1 0 0 0 1 0 1 SPECIAL TEST $BFFF SPECIAL MODES INTERRUPT $BFFF VECTORS NORMAL MODES INTERRUPT $BFFF VECTORS Mode Selected Single-chip (mode 0) Expanded multiplexed (mode 1) Special bootstrap Special test Figure 2-1. MC68HC711D3 Memory Map MC68HC711D3 Data Sheet, Rev. 2.1 24 Freescale Semiconductor Memory Map Addr. $0000 Register Name Port A Data Register Read: (PORTA) Write: See page 61. Reset: $0001 Reserved $0002 Port C Control Register Read: (PIOC) Write: See page 63. Reset: $0003 Port C Data Register Read: (PORTC) Write: See page 63. Reset: $0004 Port B Data Register Read: (PORTB) Write: See page 62. Reset: $0005 $0006 $0007 $0008 $0009 Reserved Data Direction Register Read: for Port B (DDRB) Write: See page 62. Reset: Data Direction Register Read: for Port C (DDRC) Write: See page 63. Reset: Port D Data Register Read: (PORTD) Write: See page 64. Reset: Data Direction Register Read: for Port D (DDRD) Write: See page 64. Reset: $000A Reserved $000B Timer Compare Force Register Read: (CFORC) Write: See page 93. Reset: $000C Output Compare 1 Mask Register Read: (OC1M) Write: See page 93. Reset: $000D Output Compare 1 Data Register Read: (OC1D) Write: See page 94. Reset: Bit 7 6 5 4 3 2 1 Bit 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Hi-Z 0 0 0 Hi-Z Hi-Z Hi-Z Hi-Z R R R R R R R R 0 0 CWOM 0 0 0 0 0 0 0 0 0 0 0 0 0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 BP1 PB0 Reset configures pins as Hi-Z inputs PB7 PB6 PB5 PB4 PB3 BP2 Reset configures pins as Hi-Z inputs R R R R R R R R DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 0 0 0 0 0 0 0 0 DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 0 0 0 0 0 0 0 0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 0 0 0 0 0 0 0 0 DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 0 0 0 0 0 0 0 0 R R R R R R R R FOC1 FOC2 FOC3 FOC4 FOC5 0 0 0 0 0 0 0 0 0 0 0 OC1M7 OC1M6 OC1M5 OC1M4 OC1M3 0 0 0 0 0 0 0 0 0 0 0 OC1D7 OC1D6 OC1D5 OC1D4 OC1D3 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented R = Reserved U = Unaffected Figure 2-2. Register and Control Bit Assignments (Sheet 1 of 5) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 25 Operating Modes and Memory Addr. Bit 7 6 5 4 3 2 1 Bit 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Timer Input Capture Register 1 Read: High (TIC1) Write: See page 89. Reset: Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 2 Bit 1 Bit 0 $0011 Timer Input Capture Register 1 Read: Low (TIC1) Write: See page 89. Reset: Bit 15 Bit 14 Bit 13 Bit 10 Bit 9 Bit 8 $0012 Timer Input Capture Register 2 Read: High (TIC2) Write: See page 89. Reset: Timer Input Capture Register 2 Read: Low (TIC2) Write: See page 89. Reset: Bit 7 Bit 2 Bit 1 Bit 0 Timer Input Capture Register 3 Read: High (TIC3) Write: See page 89. Reset: Bit 15 Bit 10 Bit 9 Bit 8 Bit 7 Bit 2 Bit 1 Bit 0 $0015 Timer Input Capture Register 3 Read: Low (TIC3) Write: See page 89. Reset: $0016 Timer Output Compare Register 1 Read: High (TOC1) Write: See page 92. Reset: $000E $000F $0010 $0013 $0014 $0017 $0018 $0019 Register Name Timer Counter Register High Read: (TCNT) Write: See page 94. Reset: Timer Counter Register Low Read: (TCNT) Write: See page 94. Reset: Timer Output Compare Register 1 Read: Low (TOC1) Write: See page 92. Reset: Timer Output Compare Register 2 Read: High (TOC2) Write: See page 92. Reset: Timer Output Compare Register 2 Read: Low (TOC2) Write: See page 92. Reset: Unaffected by reset Bit 4 Bit 3 Unaffected by reset Bit 12 Bit 11 Unaffected by reset Bit 6 Bit 5 Bit 4 Bit 3 Unaffected by reset Bit 14 Bit 13 Bit 12 Bit 11 Unaffected by reset Bit 6 Bit 5 Bit 4 Bit 3 Unaffected by reset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 15 1 1 1 1 1 1 1 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 1 1 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 1 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 1 1 = Unimplemented R = Reserved U = Unaffected Figure 2-2. Register and Control Bit Assignments (Sheet 2 of 5) MC68HC711D3 Data Sheet, Rev. 2.1 26 Freescale Semiconductor Memory Map Addr. $001A $001B $001C $001D $001E $001F $0020 $0021 $0022 Register Name Bit 7 6 5 4 3 2 1 Bit 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 1 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 1 1 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 1 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 1 1 Timer Input Capture 4/ Read: Output Compare 5 Register High Write: (TI4/O5) See page 90. Reset: Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 1 1 Timer Input Capture 4/ Read: Output Compare 5 Register Low Write: (TI4/O5) See page 90. Reset: Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 1 1 OM2 OL2 OM3 OL3 OM4 OL4 OM5 OL5 0 0 0 0 0 0 0 0 EDG4B EDG4A EDG1B EDG1A EDG2B EDG2A EDG3B EDG3A 0 0 0 0 0 0 0 0 OC1I OC2I OC3I OC4I I4/O5I IC1I IC2I IC3I 0 0 0 0 0 0 0 0 OC1F OC2F OC3F OC4F I4/O5F IC1F IC2F IC3F 0 0 0 0 0 0 0 0 TOI RTII PAOVI PAII 0 0 PR1 PR0 0 0 0 0 0 0 0 0 TOF RTIF PAOVF PAIF 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented R Timer Output Compare Register 3 Read: High (TOC3) Write: See page 92. Reset: Timer Output Compare Register 3 Read: Low (TOC3) Write: See page 92. Reset: Timer Output Compare Register 4 Read: High (TOC4) Write: See page 92. Reset: Timer Output Compare Register 4 Read: Low (TOC4) Write: See page 92. Reset: Timer Control 1 Register Read: (TCTL1) Write: See page 95. Reset: Timer Control Register 2 Read: (TCTL2) Write: See page 89. Reset: Timer Interrupt Mask 1 Register Read: (TMSK1) Write: See page 95. Reset: $0023 Timer Interrupt Flag 1 Register Read: (TFLG1) Write: See page 96. Reset: $0024 Timer Interrupt Mask 2 Register Read: (TMSK2) Write: See page 96. Reset: $0025 Timer Interrupt Flag 2 Register Read: (TFLG2) Write: See page 97. Reset: = Reserved U = Unaffected Figure 2-2. Register and Control Bit Assignments (Sheet 3 of 5) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 27 Operating Modes and Memory Addr. $0026 $0027 $0028 Register Name Pulse Accumulator Control Read: Register (PACTL) Write: See pages 99 and 102. Reset: Pulse Accumulator Count Register Read: (PACNT) Write: See page 103. Reset: SPI Control Register Read: (SPCR) Write: See page 81. Reset: $0029 SPI Status Register Read: (SPSR) Write: See page 82. Reset: $002A SPI Data I/O Register Read: (SPDR) Write: See page 83. Reset: $002B $002C Baud Rate Register Read: (BAUD) Write: See page 72. Reset: SCI Control Register 1 Read: (SCCR1) Write: See page 70. Reset: $002D SCI Control Register 2 Read: (SCCR2) Write: See page 70. Reset: $002E SCI Status Register Read: (SCSR) Write: See page 71. Reset: $002F $0030 ↓ $0038 $0039 SCI Data Register Read: (SCDR) Write: See page 69. Reset: Reserved System Configuration Options Read: Register (OPTION) Write: See page 49. Reset: Bit 7 6 5 4 3 2 1 Bit 0 DDRA7 PAEN PAMOD PEDGE DDRA3 I4/O5 RTR1 RTR0 0 0 0 0 0 0 0 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Unaffected by reset SPIE SPE DWOM MSTR CPOL CPHA SPR1 SPR0 0 0 0 0 0 1 U U SPIF WCOL 0 MODF 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Unaffected by reset TCLR 0 SCP1 SCP0 RCKB SCR2 SCR1 SCR0 0 0 0 0 0 U U U R8 T8 0 M WAKE 0 0 0 U U 0 0 0 0 0 0 TIE TCIE RIE ILIE TE RE RWU SBK 0 0 0 0 0 0 0 0 TDRE TC RDRF IDLE OR NF FE 0 1 1 0 0 0 0 0 0 R7/T7 R6/T6 R5/T5 R4/T4 R3/T3 R2/T2 R1/T1 R0/T0 Unaffected by reset R R R R R R R R 0 0 IRQE DLY CME 0 CR1 CR0 0 0 0 1 0 0 0 0 = Unimplemented R = Reserved U = Unaffected Figure 2-2. Register and Control Bit Assignments (Sheet 4 of 5) MC68HC711D3 Data Sheet, Rev. 2.1 28 Freescale Semiconductor Memory Map Addr. $003A $003B $003C Register Name Arm/Reset COP Timer Circuitry Read: Register (COPRST) Write: See page 48. Reset: PROM Programming Control Read: Register (PPROG) Write: See page 32. Reset: Highest Priority I-Bit Interrupt and Read: Miscellaneous Register (HPRIO) Write: See page 58. Reset: Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 MBE 0 ELAT EXCOL EXROW 0 0 PGM 0 0 0 0 0 0 0 0 MDA IRVNE PSEL3 PSEL2 PSEL1 PSEL0 0 1 0 1 RBOOT SMOD Note 1 1. The values of the RBOOT, SMOD, IRVNE, and MDA bits at reset depend on the mode during initialization. Refer to Table 4-3. Hardware Mode Select Summary. $003D RAM and I/O Mapping Register Read: (INIT) Write: See page 29. Reset: Read: Test 1 Register Write: (TEST) Reset: $003E $003F System Configuration Register Read: (CONFIG) Write: See page 30. Reset: RAM3 RAM2 RAM1 RAM0 REG3 REG2 REG1 REG0 0 0 0 0 0 0 0 1 TILOP 0 OCC4 CBYP DISR FCM FCOP 0 0 0 0 0 0 0 0 0 0 0 0 0 0 NOCOP ROMON 0 0 0 0 0 0 U U 0 = Unimplemented R = Reserved U = Unaffected Figure 2-2. Register and Control Bit Assignments (Sheet 5 of 5) 2.3.2 RAM and I/O Mapping Register The random-access memory (RAM) and input/output (I/O) mapping register (INIT) is a special-purpose 8-bit register that is used during initialization to change the default locations of RAM and control registers within the MCU memory map. It can be written to only once within the first 64 E-clock cycles after a reset in normal modes. Thereafter, it becomes a read-only register. Address: Read: Write: Reset: $003D Bit 7 6 5 4 3 2 1 Bit 0 RAM3 RAM2 RAM1 RAM0 REG3 REG2 REG1 REG0 0 0 0 0 0 0 0 0 Figure 2-3. RAM and I/O Mapping Register (INIT) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 29 Operating Modes and Memory RAM2–RAM0 (INIT bits 7–4) specify the starting address for the 192 bytes of static RAM. REG3–REG0 (INIT bits 3–0) specify the starting address for the control and status register block. In each case, the four RAM or REG bits become the four upper bits of the 16-bit address of the RAM or register. Since the INIT register is set to $00 by reset, the internal registers begin at $0000 and RAM begins at $0040. Throughout this document, control and status register addresses are displayed with the high-order digit shown as a bold 0. This convention indicates that the register block may be relocated to any 4-K memory page, but that its default location is $0000. RAM and the control and status registers can be relocated independently. If the control and status registers are relocated in such a way as to conflict with PROM, then the register block takes priority, and the EPROM or OTPROM at those locations becomes inaccessible. No harmful conflicts result. Lower priority resources simply become inaccessible. Similarly, if an internal resource conflicts with an external device, no harmful conflict results, since data from the external device is not applied to the internal data bus. Thus, it cannot interfere with the internal read. NOTE There are unused register locations in the 64-byte control and status register block. Reads of these unused registers return data from the undriven internal data bus, not from another source that happens to be located at the same address. 2.3.3 Configuration Control Register The configuration control register (CONFIG) controls the presence of OTPROM or EPROM in the memory map and enables the computer operating properly (COP) watchdog system. This register is writable only once in expanded and single-chip modes (SMOD = 0). In these mode, the COP watchdog timer is enabled out of reset. In all modes, except normal expanded, EPROM is enabled and located at $F000–$FFFF. In normal expanded mode, EPROM is enabled and located at $7000–$7FFF. Should the user wish to be in expanded mode, but with EPROM mapped at $F000–$FFFF, he must reset in single-chip mode, and write a 1 to the MDA bit in the HPRIO register. Address: $003F Read: Write: Reset: Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 NOCOP ROMON 0 0 0 0 0 0 U U 0 U = Unaffected Figure 2-4. Configuration Control Register (CONFIG) Bits 7–3 and 0 — Not implemented Always read 0. NOCOP — Computer Operating Properly System Disable Bit This bit is cleared out of reset in normal modes (single chip and expanded), enabling the COP system. It is writable only once after reset in these modes (SMOD = 0). In the special modes (test and bootstrap) (SMOD = 1), this bit comes out of reset set, and is writable any time. 1 = COP system is disabled. 0 = COP system is enabled, reset forced on timeout. MC68HC711D3 Data Sheet, Rev. 2.1 30 Freescale Semiconductor Programmable Read-Only Memory (PROM) ROMON — PROM Enable Bit This bit is set out of reset, enabling the EPROM or OTPROM in all modes. This bit is writable once in normal modes (SMOD = 0), but is writable at any time in special modes (SMOD = 1). 1 = PROM is present in the memory map. 0 = PROM is disabled from the memory map. NOTE In expanded mode out of reset, the EPROM or OTPROM is located at $7000–$7FFF. In all other modes, the PROM resides at $F000–$FFFF. 2.4 Programmable Read-Only Memory (PROM) The MC68HC711D3 has 4-Kbytes of one-time programmable read-only memory (OTPROM). The PROM address is $F000–$FFFF in all modes except expanded multiplexed. In expanded- multiplexed mode, the PROM is located at $7000–$7FFF after reset. The on-chip read-only memory (ROM) of an MC68HC711D3 is programmed in MCU mode. In this mode, the PROM is programmed through the MCU in the bootstrap or test modes. The erased state of a PROM byte is $FF. Using the on-chip OTPROM programming feature requires an external 12-volt nominal power supply (VPP). Normal programming is accomplished using the OTPROM programming register (PPROG). As described in the following subsections, these two methods of programming and verifying EPROM are possible: 1. Programming an individual EPROM address 2. Programming the EPROM with downloaded data 2.4.1 Programming an Individual EPROM Address In this method, the MCU programs its own EPROM by controlling the PPROG register. Use these procedures to program the EPROM through the MCU with: • The ROMON bit set in the CONFIG register • The 12-volt nominal programming voltage present on the XIRQ/VPP pin • The IRQ pin must be pulled high. EPROG LDAB STAB #$20 $003B STAA LDAB STAB $0,X #$21 $003B JSR CLR DLYEP $003B Set ELAT bit (PGM = 0) to enable EPROM latches. Store data to EPROM address Set PGM bit with ELAT = 1 to enable EPROM programming voltage Delay 2–4 ms Turn off programming voltage and set to READ mode MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 31 Operating Modes and Memory 2.4.2 Programming the EPROM with Downloaded Data When using this method, the EPROM is programmed by software while in the special test or bootstrap modes. User-developed software can be uploaded through the SCI or a ROM-resident EPROM programming utility can be used. The 12-volt nominal programming voltage must be present on the XIRQ/VPP pin. To use the resident utility, bootload a 3-byte program consisting of a single jump instruction to $BF00. $BF00 is the starting address of a resident EPROM programming utility. The utility program sets the X and Y index registers to default values, then receives programming data from an external host, and puts it in EPROM. The value in IX determines programming delay time. The value in IY is a pointer to the first address in EPROM to be programmed (default = $F000). When the utility program is ready to receive programming data, it sends the host the $FF character. Then it waits. When the host sees the $FF character, the EPROM programming data is sent, starting with the first location in the EPROM array. After the last byte to be programmed is sent and the corresponding verification data is returned, the programming operation is terminated by resetting the MCU. 2.4.3 PROM Programming Control Register The PROM programming control register (PPROG) is used to control the programming of the OTPROM or EPROM. PPROG is cleared on reset so that the PROM is configured for normal read. Address: $003B Read: Write: Reset: Bit 7 6 5 4 3 2 1 Bit 0 MBE 0 ELAT EXCOL EXROW 0 0 PGM 0 0 0 0 0 0 0 0 Figure 2-5. PROM Programming Control Register (PPROG) MBE — Multiple Byte Program Enable Bit This bit is reserved for testing. Bit 6, 2, and 1 — Not implemented Always read 0. ELAT — EPROM (OTPROM) Latch Control Bit 1 = PROM address and data bus are configured for programming. Writes to PROM cause address and data to be latched. The PROM cannot be read. 0 = PROM address and data bus are configured for normal reads. PROM cannot be programmed. EXCOL — Select Extra Columns Bit This bit is reserved for testing. EXROW — Select Extra Row Bit This bit is reserved for testing. PGM — EPROM (OTPROM) Program Command Bit This bit may be written only when ELAT = 1. 1 = Programming power is switched on to PROM array. 0 = Programming power is switched off. MC68HC711D3 Data Sheet, Rev. 2.1 32 Freescale Semiconductor Chapter 3 Central Processor Unit (CPU) 3.1 Introduction This section presents information on M68HC11 central processor unit (CPU): • Architecture • Data types • Addressing modes • Instruction set • Special operations such as subroutine calls and interrupts The CPU is designed to treat all peripheral, input/output (I/O), and memory locations identically as addresses in the 64-Kbyte memory map. This is referred to as memory-mapped I/O. I/O has no instructions separate from those used by memory. This architecture also allows accessing an operand from an external memory location with no execution time penalty. 3.2 CPU Registers M68HC11 CPU registers are an integral part of the CPU and are not addressed as if they were memory locations. The seven registers, discussed in the following paragraphs, are shown in Figure 3-1. 7 15 ACCUMULATOR A 0 7 ACCUMULATOR B DOUBLE ACCUMULATOR D 0 0 A:B D 15 INDEX REGISTER X 0 IX 15 INDEX REGISTER Y 0 IY 15 STACK POINTER 0 SP 0 0 PC 15 PROGRAM COUNTER 7 CONDITION CODE REGISTER S X H I N Z V C CCR CARRY OVERFLOW ZERO NEGATIVE I INTERRUPT MASK HALF CARRY (FROM BIT 3) X INTERRUPT MASK STOP DISABLE Figure 3-1. Programming Model MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 33 Central Processor Unit (CPU) 3.2.1 Accumulators A, B, and D Accumulators A and B are general-purpose 8-bit registers that hold operands and results of arithmetic calculations or data manipulations. For some instructions, these two accumulators are treated as a single double-byte (16-bit) accumulator called accumulator D. Although most instructions can use accumulators A or B interchangeably, these exceptions apply: • The ABX and ABY instructions add the contents of 8-bit accumulator B to the contents of 16-bit register X or Y, but there are no equivalent instructions that use A instead of B. • The TAP and TPA instructions transfer data from accumulator A to the condition code register or from the condition code register to accumulator A. However, there are no equivalent instructions that use B rather than A. • The decimal adjust accumulator A (DAA) instruction is used after binary-coded decimal (BCD) arithmetic operations, but there is no equivalent BCD instruction to adjust accumulator B. • The add, subtract, and compare instructions associated with both A and B (ABA, SBA, and CBA) only operate in one direction, making it important to plan ahead to ensure that the correct operand is in the correct accumulator. 3.2.2 Index Register X (IX) The IX register provides a 16-bit indexing value that can be added to the 8-bit offset provided in an instruction to create an effective address. The IX register can also be used as a counter or as a temporary storage register. 3.2.3 Index Register Y (IY) The 16-bit IY register performs an indexed mode function similar to that of the IX register. However, most instructions using the IY register require an extra byte of machine code and an extra cycle of execution time because of the way the opcode map is implemented. Refer to 3.4 Opcodes and Operands for further information. 3.2.4 Stack Pointer (SP) The M68HC11 CPU has an automatic program stack. This stack can be located anywhere in the address space and can be any size up to the amount of memory available in the system. Normally, the SP is initialized by one of the first instructions in an application program. The stack is configured as a data structure that grows downward from high memory to low memory. Each time a new byte is pushed onto the stack, the SP is decremented. Each time a byte is pulled from the stack, the SP is incremented. At any given time, the SP holds the 16-bit address of the next free location in the stack. Figure 3-2 is a summary of SP operations. When a subroutine is called by a jump-to-subroutine (JSR) or branch-to- subroutine (BSR) instruction, the address of the instruction after the JSR or BSR is automatically pushed onto the stack, least significant byte first. When the subroutine is finished, a return-from-subroutine (RTS) instruction is executed. The RTS pulls the previously stacked return address from the stack and loads it into the program counter. Execution then continues at this recovered return address. When an interrupt is recognized, the current instruction finishes normally, the return address (the current value in the program counter) is pushed onto the stack, all of the CPU registers are pushed onto the stack, and execution continues at the address specified by the vector for the interrupt. MC68HC711D3 Data Sheet, Rev. 2.1 34 Freescale Semiconductor CPU Registers JSR, JUMP TO SUBROUTINE MAIN PROGRAM $9D = JSR PC DIRECT RTN PC RTI, RETURN FROM INTERRUPT INTERRUPT PROGRAM $3B = RTI PC dd SP+1 CONDITION CODE NEXT MAIN INSTR SP+2 ACMLTR B MAIN PROGRAM $AD = JSR SP+3 INDXD,X ACMLTR A SP+4 INDEX REGISTER (XH) SP+5 INDEX REGISTER (XL) ff RTN NEXT MAIN INSTR PC MAIN PROGRAM $18 = PRE $AD = JSR INDXD,Y STACK SP+6 INDEX REGISTER (YH) SP-2 SP-1 RTNL SP+7 INDEX REGISTER (YL) RTNL SP+8 SP RTNH SP+9 PC NEXT MAIN INSTR PC MAIN PROGRAM $BD = JSR MAIN PROGRAM $6E = JMP ff INDXD,X hh EXTEND RTNH JMP, JUMP ff RTN STACK SP ll RTN X + ff NEXT MAIN INSTR PC BSR, BRANCH TO SUBROUTINE MAIN PROGRAM PC $8D = BSR rr RTN NEXT MAIN INSTR RTS, RETURN FROM SUBROUTINE SUBROUTINE PC $39 = RTS RTNL SP RTNH PC $3F = SWI RTN $3E = WAI RTN PC NEXT INSTRUCTION MAIN PROGRAM $7E = JMP hh RTNL SP+2 RTNH ll EXTND hh ll NEXT INSTRUCTION STACK LEGEND: SP-9 SP-8 CONDITION CODE SP-7 ACMLTR B ACMLTR A SP-5 INDEX REGISTER (XH) PC X + ff STACK SP-6 WAI, WAIT FOR INTERRUPT MAIN PROGRAM ff INDXD,Y SP SP+1 SWI, SOFTWARE INTERRUPT MAIN PROGRAM MAIN PROGRAM $18 = PRE $6E = JMP STACK SP-2 SP-1 NEXT INSTRUCTION SP-4 INDEX REGISTER (XL) SP-3 INDEX REGISTER (YH) SP-2 INDEX REGISTER (YL) RTNL SP-1 SP RTNH RTN Address of next instruction in main program to be executed upon return from subroutine RTNH Most significant byte of return address RTNL Least significant byte of return address Shaded cells show stack pointer position after operation is complete. dd 8-bit direct address ($0000–$00FF) (high byte assumed to be $00). ff 8-bit positive offset $00 (0) to $FF (256) is added to index. hh High-order byte of 16-bit extended address. ll Low-order byte of 16-bit extended address. rr Signed-relative offset $80 (–128) to $7F (+127) (offset relative to the address following the machine code offset byte). Figure 3-2. Stacking Operations MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 35 Central Processor Unit (CPU) At the end of the interrupt service routine, a return-from interrupt (RTI) instruction is executed. The RTI instruction causes the saved registers to be pulled off the stack in reverse order. Program execution resumes at the return address. Certain instructions push and pull the A and B accumulators and the X and Y index registers and are often used to preserve program context. For example, pushing accumulator A onto the stack when entering a subroutine that uses accumulator A and then pulling accumulator A off the stack just before leaving the subroutine ensures that the contents of a register will be the same after returning from the subroutine as it was before starting the subroutine. 3.2.5 Program Counter (PC) The program counter, a 16-bit register, contains the address of the next instruction to be executed. After reset, the program counter is initialized from one of six possible vectors, depending on operating mode and the cause of reset. See Table 3-1. Table 3-1. Reset Vector Comparison Mode POR or RESET Pin Clock Monitor COP Watchdog Normal $FFFE, $FFFF $FFFC, $FFFD $FFFA, $FFFB Test or boot $BFFE, $BFFF $BFFC, $FFFD $BFFA, $FFFB 3.2.6 Condition Code Register (CCR) This 8-bit register contains: • Five condition code indicators (C, V, Z, N, and H) • Two interrupt masking bits (IRQ and XIRQ) • One stop disable bit (S) In the M68HC11 CPU, condition codes are updated automatically by most instructions. For example, load accumulator A (LDAA) and store accumulator A (STAA) instructions automatically set or clear the N, Z, and V condition code flags. Pushes, pulls, add B to X (ABX), add B to Y (ABY), and transfer/exchange instructions do not affect the condition codes. Refer to Table 3-2, which shows what condition codes are affected by a particular instruction. 3.2.6.1 Carry/Borrow (C) The C bit is set if the arithmetic logic unit (ALU) performs a carry or borrow during an arithmetic operation. The C bit also acts as an error flag for multiply and divide operations. Shift and rotate instructions operate with and through the carry bit to facilitate multiple-word shift operations. 3.2.6.2 Overflow (V) The overflow bit is set if an operation causes an arithmetic overflow. Otherwise, the V bit is cleared. 3.2.6.3 Zero (Z) The Z bit is set if the result of an arithmetic, logic, or data manipulation operation is 0. Otherwise, the Z bit is cleared. Compare instructions do an internal implied subtraction and the condition codes, including Z, reflect the results of that subtraction. A few operations (INX, DEX, INY, and DEY) affect the Z bit and no other condition flags. For these operations, only = and ≠ conditions can be determined. MC68HC711D3 Data Sheet, Rev. 2.1 36 Freescale Semiconductor Data Types 3.2.6.4 Negative (N) The N bit is set if the result of an arithmetic, logic, or data manipulation operation is negative (MSB = 1). Otherwise, the N bit is cleared. A result is said to be negative if its most significant bit (MSB) is a 1. A quick way to test whether the contents of a memory location has the MSB set is to load it into an accumulator and then check the status of the N bit. 3.2.6.5 I-Interrupt Mask (I) The interrupt request (IRQ) mask (I bit) is a global mask that disables all maskable interrupt sources. While the I bit is set, interrupts can become pending, but the operation of the CPU continues uninterrupted until the I bit is cleared. After any reset, the I bit is set by default and can be cleared only by a software instruction. When an interrupt is recognized, the I bit is set after the registers are stacked, but before the interrupt vector is fetched. After the interrupt has been serviced, a return-from-interrupt instruction is normally executed, restoring the registers to the values that were present before the interrupt occurred. Normally, the I bit is 0 after a return from interrupt is executed. Although the I bit can be cleared within an interrupt service routine, "nesting" interrupts in this way should be done only when there is a clear understanding of latency and of the arbitration mechanism. Refer to Chapter 4 Resets, Interrupts, and Low-Power Modes. 3.2.6.6 Half Carry (H) The H bit is set when a carry occurs between bits 3 and 4 of the arithmetic logic unit during an ADD, ABA, or ADC instruction. Otherwise, the H bit is cleared. Half carry is used during BCD operations. 3.2.6.7 X-Interrupt Mask (X) The XIRQ mask (X) bit disables interrupts from the XIRQ pin. After any reset, X is set by default and must be cleared by a software instruction. When an XIRQ interrupt is recognized, the X and I bits are set after the registers are stacked, but before the interrupt vector is fetched. After the interrupt has been serviced, an RTI instruction is normally executed, causing the registers to be restored to the values that were present before the interrupt occurred. The X interrupt mask bit is set only by hardware (RESET or XIRQ acknowledge). X is cleared only by program instruction (TAP, where the associated bit of A is 0; or RTI, where bit 6 of the value loaded into the CCR from the stack has been cleared). There is no hardware action for clearing X. 3.2.6.8 STOP Disable (S) Setting the STOP disable (S) bit prevents the STOP instruction from putting the M68HC11 into a low-power stop condition. If the STOP instruction is encountered by the CPU while the S bit is set, it is treated as a no-operation (NOP) instruction, and processing continues to the next instruction. S is set by reset; STOP is disabled by default. 3.3 Data Types The M68HC11 CPU supports four data types: 1. Bit data 2. 8-bit and 16-bit signed and unsigned integers 3. 16-bit unsigned fractions 4. 16-bit addresses MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 37 Central Processor Unit (CPU) A byte is eight bits wide and can be accessed at any byte location. A word is composed of two consecutive bytes with the most significant byte at the lower value address. Because the M68HC11 is an 8-bit CPU, there are no special requirements for alignment of instructions or operands. 3.4 Opcodes and Operands The M68HC11 Family of microcontrollers uses 8-bit opcodes. Each opcode identifies a particular instruction and associated addressing mode to the CPU. Several opcodes are required to provide each instruction with a range of addressing capabilities. Only 256 opcodes would be available if the range of values were restricted to the number able to be expressed in 8-bit binary numbers. A 4-page opcode map has been implemented to expand the number of instructions. An additional byte, called a prebyte, directs the processor from page 0 of the opcode map to one of the other three pages. As its name implies, the additional byte precedes the opcode. A complete instruction consists of a prebyte, if any, an opcode, and zero, one, two, or three operands. The operands contain information the CPU needs for executing the instruction. Complete instructions can be from one to five bytes long. 3.5 Addressing Modes Six addressing modes can be used to access memory: 1. Immediate 2. Direct 3. Extended 4. Indexed 5. Inherent 6. Relative These modes are detailed in the following paragraphs. All modes except inherent mode use an effective address. The effective address is the memory address from which the argument is fetched or stored or the address from which execution is to proceed. The effective address can be specified within an instruction, or it can be calculated. 3.5.1 Immediate In the immediate addressing mode, an argument is contained in the byte(s) immediately following the opcode. The number of bytes following the opcode matches the size of the register or memory location being operated on. There are 2-, 3-, and 4- (if prebyte is required) byte immediate instructions. The effective address is the address of the byte following the instruction. 3.5.2 Direct In the direct addressing mode, the low-order byte of the operand address is contained in a single byte following the opcode, and the high-order byte of the address is assumed to be $00. Addresses $00–$FF are thus accessed directly, using 2-byte instructions. Execution time is reduced by eliminating the additional memory access required for the high-order address byte. In most applications, this 256-byte area is reserved for frequently referenced data. In M68HC11 MCUs, the memory map can be configured for combinations of internal registers, RAM, or external memory to occupy these addresses. MC68HC711D3 Data Sheet, Rev. 2.1 38 Freescale Semiconductor Instruction Set 3.5.3 Extended In the extended addressing mode, the effective address of the argument is contained in two bytes following the opcode byte. These are 3-byte instructions (or 4-byte instructions if a prebyte is required). One or two bytes are needed for the opcode and two for the effective address. 3.5.4 Indexed In the indexed addressing mode, an 8-bit unsigned offset contained in the instruction is added to the value contained in an index register (IX or IY). The sum is the effective address. This addressing mode allows referencing any memory location in the 64-Kbyte address space. These are 2- to 5-byte instructions, depending on whether a prebyte is required. 3.5.5 Inherent In the inherent addressing mode, all the information necessary to execute the instruction is contained in the opcode. Operations that use only the index registers or accumulators, as well as control instructions with no arguments, are included in this addressing mode. These are 1- or 2-byte instructions. 3.5.6 Relative The relative addressing mode is used only for branch instructions. If the branch condition is true, an 8-bit signed offset included in the instruction is added to the contents of the program counter to form the effective branch address. Otherwise, control proceeds to the next instruction. These are usually 2-byte instructions. 3.6 Instruction Set Refer to Table 3-2, which shows all the M68HC11 instructions in all possible addressing modes. For each instruction, the table shows the operand construction, the number of machine code bytes, and execution time in CPU E-clock cycles. Table 3-2. Instruction Set (Sheet 1 of 8) Mnemonic Operation Description ABA Add Accumulators ABX ABY ADCA (opr) ADCB (opr) ADDA (opr) Addressing Instruction Mode Opcode A+B⇒A INH Add B to X IX + (00 : B) ⇒ IX INH Add B to Y IY + (00 : B) ⇒ IY INH Add with Carry to A A+M+C⇒A Add with Carry to B Add Memory to A B+M+C⇒B A+M⇒A A A A A A IMM DIR EXT IND,X IND,Y B B B B B IMM DIR EXT IND,X IND,Y A A A A A IMM DIR EXT IND,X IND,Y Condition Codes Operand Cycles S X H I N Z V C 1B — 2 — — ∆ — ∆ ∆ ∆ ∆ 3A — 3 — — — — — — — — 18 3A — 4 — — — — — — — — ii dd hh ff ff — ∆ — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 89 99 B9 A9 A9 ii dd hh ff ff — ∆ — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 C9 D9 F9 E9 E9 ii dd hh ff ff — ∆ — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 8B 9B BB AB AB MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 39 Central Processor Unit (CPU) Table 3-2. Instruction Set (Sheet 2 of 8) Mnemonic Operation Description ADDB (opr) Add Memory to B B+M⇒B ADDD (opr) ANDA (opr) ANDB (opr) ASL (opr) Add 16-Bit to D B•M⇒B AND B with Memory Arithmetic Shift Left b7 b0 b7 A A A A A IMM DIR EXT IND,X IND,Y B B B B B IMM DIR EXT IND,X IND,Y EXT IND,X IND,Y Instruction Opcode Operand 18 CB DB FB EB EB ii dd hh ff ff 18 C3 D3 F3 E3 E3 jj dd hh ff ff 18 84 94 B4 A4 A4 ii dd hh ff ff 18 C4 D4 F4 E4 E4 ii dd hh ff ff 18 78 68 68 hh ff ff Condition Codes Cycles S X H I N Z V C 2 3 4 4 5 — — ∆ — ∆ ∆ ∆ ∆ — — — — ∆ ∆ ∆ ∆ ll 4 5 6 6 7 — — — — ∆ ∆ 0 — ll 2 3 4 4 5 — — — — ∆ ∆ 0 — ll 2 3 4 4 5 6 6 7 — — — — ∆ ∆ ∆ ∆ ll kk ll A INH 48 — 2 — — — — ∆ ∆ ∆ ∆ B INH 58 — 2 — — — — ∆ ∆ ∆ ∆ INH 05 — 3 — — — — ∆ ∆ ∆ ∆ EXT IND,X IND,Y 77 67 67 6 6 7 — — — — ∆ ∆ ∆ ∆ 0 b0 Arithmetic Shift Left B b7 IMM DIR EXT IND,X IND,Y IMM DIR EXT IND,X IND,Y 0 Arithmetic Shift Left A C ASLD B B B B B A•M⇒A AND A with Memory C ASLB Mode D + (M : M + 1) ⇒ D C ASLA Addressing 0 b0 Arithmetic Shift Left D 0 C b7 A b0 b7 B b0 ASR Arithmetic Shift Right ASRA Arithmetic Shift Right A ASRB Arithmetic Shift Right B BCC (rel) Branch if Carry Clear ?C=0 BCLR (opr) (msk) Clear Bit(s) M • (mm) ⇒ M BCS (rel) Branch if Carry Set ?C=1 BEQ (rel) Branch if = Zero ?Z=1 BGE (rel) Branch if ∆ Zero ?N⊕V=0 BGT (rel) Branch if > Zero ? Z + (N ⊕ V) = 0 BHI (rel) Branch if Higher BHS (rel) BITA (opr) b7 b0 C 18 hh ff ff ll A INH 47 — 2 — — — — ∆ ∆ ∆ ∆ B INH 57 — 2 — — — — ∆ ∆ ∆ ∆ REL 24 rr 3 — — — — — — — — DIR IND,X IND,Y 15 1D 1D dd ff ff 6 7 8 — — — — ∆ ∆ 0 — 25 rr 3 — — — — — — — — REL 27 rr 3 — — — — — — — — REL 2C rr 3 — — — — — — — — REL 2E rr 3 — — — — — — — — ?C+Z=0 REL 22 rr 3 — — — — — — — — Branch if Higher or Same ?C=0 REL 24 rr 3 — — — — — — — — Bit(s) Test A with Memory A•M IMM DIR EXT IND,X IND,Y 85 95 B5 A5 A5 ii dd hh ff ff 2 3 4 4 5 — — — — ∆ ∆ 0 — b7 b7 b0 b0 C C 18 REL A A A A A 18 mm mm mm ll MC68HC711D3 Data Sheet, Rev. 2.1 40 Freescale Semiconductor Instruction Set Table 3-2. Instruction Set (Sheet 3 of 8) Mnemonic Operation Description BITB (opr) Bit(s) Test B with Memory B•M Addressing Mode B B B B B IMM DIR EXT IND,X IND,Y Instruction Opcode 18 Operand C5 D5 F5 E5 E5 ii dd hh ff ff Condition Codes Cycles S X H I N Z V C 2 3 4 4 5 — — — — ∆ ∆ 0 — ll BLE (rel) Branch if ∆ Zero ? Z + (N ⊕ V) = 1 REL 2F rr 3 — — — — — — — — BLO (rel) Branch if Lower ?C=1 REL 25 rr 3 — — — — — — — — BLS (rel) Branch if Lower or Same ?C+Z=1 REL 23 rr 3 — — — — — — — — BLT (rel) Branch if < Zero ?N⊕V=1 REL 2D rr 3 — — — — — — — — BMI (rel) Branch if Minus ?N=1 REL 2B rr 3 — — — — — — — — BNE (rel) Branch if not = Zero ?Z=0 REL 26 rr 3 — — — — — — — — BPL (rel) Branch if Plus ?N=0 REL 2A rr 3 — — — — — — — — BRA (rel) Branch Always ?1=1 REL 20 rr 3 — — — — — — — — BRCLR(opr) (msk) (rel) Branch if Bit(s) Clear ? M • mm = 0 DIR IND,X IND,Y 13 1F 1F dd rr ff rr ff rr 6 7 8 — — — — — — — — 3 — — — — — — — — 6 7 8 — — — — — — — — 6 7 8 — — — — ∆ ∆ 0 — BRN (rel) Branch Never ?1=0 BRSET(opr) (msk) (rel) Branch if Bit(s) Set ? (M) • mm = 0 18 mm mm mm REL 21 rr DIR IND,X IND,Y 12 1E 1E dd rr ff rr ff rr mm 14 1C 1C dd ff ff mm mm mm 18 mm mm BSET (opr) (msk) Set Bit(s) M + mm ⇒ M DIR IND,X IND,Y BSR (rel) Branch to Subroutine See Figure 3-2 REL 8D rr 6 — — — — — — — — BVC (rel) Branch if Overflow Clear ?V=0 REL 28 rr 3 — — — — — — — — BVS (rel) Branch if Overflow Set ?V=1 REL 29 rr 3 — — — — — — — — CBA Compare A to B A–B INH 11 — 2 — — — — ∆ ∆ ∆ ∆ CLC Clear Carry Bit 0⇒C INH 0C — 2 — — — — — — — 0 CLI Clear Interrupt Mask 0⇒I INH 0E — 2 — — — 0 — — — — CLR (opr) Clear Memory Byte 0⇒M EXT IND,X IND,Y 7F 6F 6F 6 6 7 — — — — 0 1 0 0 CLRA Clear Accumulator A 0⇒A A INH 4F — 2 — — — — 0 1 0 0 CLRB Clear Accumulator B 0⇒B B INH 5F — 2 — — — — 0 1 0 0 CLV Clear Overflow Flag 0⇒V INH 0A — 2 — — — — — — 0 — CMPA (opr) Compare A to Memory A–M A A A A A IMM DIR EXT IND,X IND,Y ii dd hh ff ff — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 81 91 B1 A1 A1 B B B B B IMM DIR EXT IND,X IND,Y ii dd hh ff ff — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 C1 D1 F1 E1 E1 hh ff ff 6 6 7 — — — — ∆ ∆ 0 1 18 73 63 63 CMPB (opr) COM (opr) Compare B to Memory Ones Complement Memory Byte B–M $FF – M ⇒ M EXT IND,X IND,Y 18 18 hh ff ff ll ll MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 41 Central Processor Unit (CPU) Table 3-2. Instruction Set (Sheet 4 of 8) Mnemonic Operation Description COMA Ones Complement A $FF – A ⇒ A COMB Ones Complement B $FF – B ⇒ B CPD (opr) Compare D to Memory 16-Bit D–M:M +1 CPX (opr) CPY (opr) Compare X to Memory 16-Bit Compare Y to Memory 16-Bit Addressing Instruction Mode Opcode A INH B INH IMM DIR EXT IND,X IND,Y IX – M : M + 1 IY – M : M + 1 Condition Codes Operand Cycles S X H I N Z V C 43 — 2 — — — — ∆ ∆ 0 1 53 — 2 — — — — ∆ ∆ 0 1 5 6 7 7 7 — — — — ∆ ∆ ∆ ∆ 4 5 6 6 7 — — — — ∆ ∆ ∆ ∆ 5 6 7 7 7 — — — — ∆ ∆ ∆ ∆ 2 — — — — ∆ ∆ ∆ ∆ 6 6 7 — — — — ∆ ∆ ∆ — 1A 1A 1A 1A CD 83 93 B3 A3 A3 jj dd hh ff ff kk IMM DIR EXT IND,X IND,Y jj dd hh ff ff kk CD 8C 9C BC AC AC IMM DIR EXT IND,X IND,Y 18 18 18 1A 18 8C 9C BC AC AC jj dd hh ff ff kk Adjust Sum to BCD DEC (opr) Decrement Memory Byte M–1⇒M DECA Decrement Accumulator A A–1⇒A A INH 4A — 2 — — — — ∆ ∆ ∆ — DECB Decrement Accumulator B B–1⇒B B INH 5A — 2 — — — — ∆ ∆ ∆ — DES Decrement Stack Pointer SP – 1 ⇒ SP INH 34 — 3 — — — — — — — — DEX Decrement Index Register X IX – 1 ⇒ IX INH 09 — 3 — — — — — ∆ — — DEY Decrement Index Register Y IY – 1 ⇒ IY INH 18 09 — 4 — — — — — ∆ — — EORA (opr) Exclusive OR A with Memory A⊕M⇒A ii dd hh ff ff — — — ∆ ∆ 0 — ll 2 3 4 4 5 — 18 88 98 B8 A8 A8 ii dd hh ff ff — — — ∆ ∆ 0 — ll 2 3 4 4 5 — 18 C8 D8 F8 E8 E8 B⊕M⇒B EXT IND,X IND,Y 7A 6A 6A ll Decimal Adjust A Exclusive OR B with Memory 19 ll DAA EORB (opr) INH ll A A A A A IMM DIR EXT IND,X IND,Y B B B B B IMM DIR EXT IND,X IND,Y 18 — hh ff ff ll FDIV Fractional Divide 16 by 16 D / IX ⇒ IX; r ⇒ D INH 03 — 41 — — — — — ∆ ∆ ∆ IDIV Integer Divide 16 by 16 D / IX ⇒ IX; r ⇒ D INH 02 — 41 — — — — — ∆ 0 ∆ INC (opr) Increment Memory Byte M+1⇒M EXT IND,X IND,Y 7C 6C 6C 6 6 7 — — — — ∆ ∆ ∆ — INCA Increment Accumulator A A+1⇒A A INH 4C — 2 — — — — ∆ ∆ ∆ — INCB Increment Accumulator B B+1⇒B B INH 5C — 2 — — — — ∆ ∆ ∆ — INS Increment Stack Pointer SP + 1 ⇒ SP INH 31 — 3 — — — — — — — — 18 hh ff ff ll MC68HC711D3 Data Sheet, Rev. 2.1 42 Freescale Semiconductor Instruction Set Table 3-2. Instruction Set (Sheet 5 of 8) Mnemonic Operation Description INX Increment Index Register X INY Addressing Instruction Mode Opcode IX + 1 ⇒ IX INH Increment Index Register Y IY + 1 ⇒ IY INH JMP (opr) Jump See Figure 3-2 EXT IND,X IND,Y JSR (opr) Jump to Subroutine See Figure 3-2 DIR EXT IND,X IND,Y Load Accumulator A M⇒A Load Accumulator B M⇒B Load Double Accumulator D M ⇒ A,M + 1 ⇒ B Load Stack Pointer M : M + 1 ⇒ SP LDAA (opr) LDAB (opr) LDD (opr) LDS (opr) LDX (opr) LDY (opr) LSL (opr) Load Index Register X M : M + 1 ⇒ IX Load Index Register Y M : M + 1 ⇒ IY Logical Shift Left C LSLA Logical Shift Left A LSLB Logical Shift Left B C C LSLD LSRA LSRB b7 b7 b0 b0 b0 Logical Shift Right Logical Shift Right A Logical Shift Right B 0 0 b7 b7 b7 B B B B B IMM DIR EXT IND,X IND,Y IMM DIR EXT IND,X IND,Y IMM DIR EXT IND,X IND,Y Cycles S X H I N Z V C 08 — 3 — — — — — ∆ — — 18 08 — 4 — — — — — ∆ — — hh ff ff 3 3 4 — — — — — — — — 18 7E 6E 6E dd hh ff ff 5 6 6 7 — — — — — — — — 18 9D BD AD AD ii dd hh ff ff — — — ∆ ∆ 0 — ll 2 3 4 4 5 — 18 86 96 B6 A6 A6 ii dd hh ff ff — — — ∆ ∆ 0 — ll 2 3 4 4 5 — 18 C6 D6 F6 E6 E6 jj dd hh ff ff kk 3 4 5 5 6 — — — — ∆ ∆ 0 — 18 CC DC FC EC EC jj dd hh ff ff kk 3 4 5 5 6 — — — — ∆ ∆ 0 — 3 4 5 5 6 — — — — ∆ ∆ 0 — 4 5 6 6 6 — — — — ∆ ∆ 0 — 6 6 7 — — — — ∆ ∆ ∆ ∆ ll ll ll 18 8E 9E BE AE AE IMM DIR EXT IND,X IND,Y jj dd hh ff ff kk CD CE DE FE EE EE IMM DIR EXT IND,X IND,Y 18 18 18 1A 18 CE DE FE EE EE jj dd hh ff ff kk hh ff ff ll 18 78 68 68 EXT IND,X IND,Y ll ll ll A INH 48 — 2 — — — — ∆ ∆ ∆ ∆ B INH 58 — 2 — — — — ∆ ∆ ∆ ∆ INH 05 — 3 — — — — ∆ ∆ ∆ ∆ EXT IND,X IND,Y 74 64 64 6 6 7 — — — — 0 ∆ ∆ ∆ 0 0 b7 A b0 b7 B b0 0 IMM DIR EXT IND,X IND,Y 0 Logical Shift Left Double C LSR (opr) b7 A A A A A Condition Codes Operand 0 b0 C 18 hh ff ff ll A INH 44 — 2 — — — — 0 ∆ ∆ ∆ B INH 54 — 2 — — — — 0 ∆ ∆ ∆ b0 C b0 C MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 43 Central Processor Unit (CPU) Table 3-2. Instruction Set (Sheet 6 of 8) Mnemonic Operation LSRD Logical Shift Right Double Addressing Description 0 Instruction Mode Opcode INH 04 Condition Codes Operand Cycles S X H I N Z V C — 3 — — — — 0 ∆ ∆ ∆ — 10 — — — — — — — ∆ 6 6 7 — — — — ∆ ∆ ∆ ∆ b7 A b0 b7 B b0 C MUL Multiply 8 by 8 A∗B⇒D INH 3D NEG (opr) Two’s Complement Memory Byte 0–M⇒M EXT IND,X IND,Y 70 60 60 NEGA Two’s Complement A 0–A⇒A A INH 40 — 2 — — — — ∆ ∆ ∆ ∆ NEGB Two’s Complement B 0–B⇒B B INH 50 — 2 — — — — ∆ ∆ ∆ ∆ NOP No operation No Operation — 2 — — — — — — — — ORAA (opr) OR Accumulator A (Inclusive) A+M⇒A — — — — ∆ ∆ 0 — ll 2 3 4 4 5 OR Accumulator B (Inclusive) B+M⇒B — — — — ∆ ∆ 0 — ll 2 3 4 4 5 ORAB (opr) 18 hh ff ff INH 01 A A A A A IMM DIR EXT IND,X IND,Y 18 8A 9A BA AA AA ii dd hh ff ff B B B B B IMM DIR EXT IND,X IND,Y 18 CA DA FA EA EA ii dd hh ff ff ll PSHA Push A onto Stack A ⇒ Stk,SP = SP – 1 A INH 36 — 3 — — — — — — — — PSHB Push B onto Stack B ⇒ Stk,SP = SP – 1 B INH 37 — 3 — — — — — — — — PSHX Push X onto Stack (Lo First) IX ⇒ Stk,SP = SP – 2 INH 3C — 4 — — — — — — — — PSHY Push Y onto Stack (Lo First) IY ⇒ Stk,SP = SP – 2 INH 3C — 5 — — — — — — — — PULA Pull A from Stack SP = SP + 1, A ⇐ Stk A INH 32 — 4 — — — — — — — — PULB Pull B from Stack SP = SP + 1, B ⇐ Stk B INH 33 — 4 — — — — — — — — PULX Pull X From Stack (Hi First) SP = SP + 2, IX ⇐ Stk INH 38 — 5 — — — — — — — — PULY Pull Y from Stack (Hi First) SP = SP + 2, IY ⇐ Stk INH 18 38 — 6 — — — — — — — — ROL (opr) Rotate Left 6 6 7 — — — — ∆ ∆ ∆ ∆ 18 79 69 69 ROLA Rotate Left A ROLB Rotate Left B ROR (opr) Rotate Right RORA Rotate Right A RORB Rotate Right B RTI Return from Interrupt C C C b7 b7 b7 b7 b7 b7 EXT IND,X IND,Y b0 18 hh ff ff ll A INH 49 — 2 — — — — ∆ ∆ ∆ ∆ B INH 59 — 2 — — — — ∆ ∆ ∆ ∆ EXT IND,X IND,Y 76 66 66 6 6 7 — — — — ∆ ∆ ∆ ∆ b0 b0 b0 C 18 hh ff ff ll A INH 46 — 2 — — — — ∆ ∆ ∆ ∆ B INH 56 — 2 — — — — ∆ ∆ ∆ ∆ INH 3B — 12 ∆ ↓ ∆ ∆ ∆ ∆ ∆ ∆ b0 C b0 C See Figure 3-2 MC68HC711D3 Data Sheet, Rev. 2.1 44 Freescale Semiconductor Instruction Set Table 3-2. Instruction Set (Sheet 7 of 8) Mnemonic Operation Description RTS Return from Subroutine SBA SBCA (opr) SBCB (opr) Addressing Instruction Mode Opcode See Figure 3-2 INH Subtract B from A A–B⇒A Subtract with Carry from A A–M–C⇒A Subtract with Carry from B B–M–C⇒B Condition Codes Operand Cycles S X H I N Z V C 39 — 5 — — — — — — — — INH 10 — 2 — — — — ∆ ∆ ∆ ∆ A A A A A IMM DIR EXT IND,X IND,Y ii dd hh ff ff — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 82 92 B2 A2 A2 B B B B B IMM DIR EXT IND,X IND,Y ii dd hh ff ff — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 — 18 C2 D2 F2 E2 E2 SEC Set Carry 1⇒C INH 0D — 2 — — — — — — — 1 SEI Set Interrupt Mask 1⇒I INH 0F — 2 — — — 1 — — — — SEV Set Overflow Flag 1⇒V INH 0B — 2 — — — — — — 1 — STAA (opr) Store Accumulator A A⇒M A A A A DIR EXT IND,X IND,Y dd hh ff ff 3 4 4 5 — — — — ∆ ∆ 0 — 18 97 B7 A7 A7 Store Accumulator B B⇒M B B B B DIR EXT IND,X IND,Y dd hh ff ff 3 4 4 5 — — — — ∆ ∆ 0 — 18 D7 F7 E7 E7 Store Accumulator D A ⇒ M, B ⇒ M + 1 dd hh ff ff 4 5 5 6 — — — — ∆ ∆ 0 — 18 DD FD ED ED STOP Stop Internal Clocks — 2 — — — — — — — — STS (opr) Store Stack Pointer SP ⇒ M : M + 1 4 5 5 6 — — — — ∆ ∆ 0 — Store Index Register X IX ⇒ M : M + 1 4 5 5 6 — — — — ∆ ∆ 0 — Store Index Register Y IY ⇒ M : M + 1 5 6 6 6 — — — — ∆ ∆ 0 — Subtract Memory from A A–M⇒A — — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 Subtract Memory from B B–M⇒B — — — — ∆ ∆ ∆ ∆ ll 2 3 4 4 5 Subtract Memory from D D–M:M+1⇒D 4 5 6 6 7 — — — — ∆ ∆ ∆ ∆ SWI Software Interrupt See Figure 3-2 14 — — — 1 — — — — TAB Transfer A to B A⇒B INH 16 — 2 — — — — ∆ ∆ 0 — TAP Transfer A to CC Register A ⇒ CCR INH 06 — 2 ∆ ↓ ∆ ∆ ∆ ∆ ∆ ∆ STAB (opr) STD (opr) STX (opr) STY (opr) SUBA (opr) SUBB (opr) SUBD (opr) DIR EXT IND,X IND,Y INH CF DIR EXT IND,X IND,Y dd hh ff ff 18 DIR EXT IND,X IND,Y CD DF FF EF EF dd hh ff ff DIR EXT IND,X IND,Y 18 18 1A 18 DF FF EF EF dd hh ff ff 18 80 90 B0 A0 A0 ii dd hh ff ff 18 C0 D0 F0 E0 E0 ii dd hh ff ff 18 83 93 B3 A3 A3 jj dd hh ff ff IMM DIR EXT IND,X IND,Y A A A A A IMM DIR EXT IND,X IND,Y IMM DIR EXT IND,X IND,Y INH 3F ll ll — 9F BF AF AF A A A A A ll ll ll ll kk ll — MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 45 Central Processor Unit (CPU) Table 3-2. Instruction Set (Sheet 8 of 8) Mnemonic Operation Description TBA Transfer B to A TEST Addressing Instruction Mode Opcode B⇒A INH TEST (Only in Test Modes) Address Bus Counts TPA Transfer CC Register to A CCR ⇒ A TST (opr) Test for Zero or Minus M–0 TSTA Test A for Zero or Minus A–0 A INH 4D TSTB Test B for Zero or Minus B–0 B INH TSX Transfer Stack Pointer to X SP + 1 ⇒ IX INH TSY Transfer Stack Pointer to Y SP + 1 ⇒ IY INH TXS Transfer X to Stack Pointer IX – 1 ⇒ SP INH TYS Transfer Y to Stack Pointer IY – 1 ⇒ SP INH WAI Wait for Interrupt Stack Regs & WAIT XGDX Exchange D with X XGDY Exchange D with Y Cycle * ** Condition Codes Operand Cycles S X H I N Z V C 17 — 2 — — — — ∆ ∆ 0 — INH 00 — * — — — — — — — — INH 07 — 2 — — — — — — — — EXT IND,X IND,Y 7D 6D 6D 6 6 7 — — — — ∆ ∆ 0 0 — 2 — — — — ∆ ∆ 0 0 5D — 2 — — — — ∆ ∆ 0 0 30 — 3 — — — — — — — — 30 — 4 — — — — — — — — 35 — 3 — — — — — — — — 35 — 4 — — — — — — — — INH 3E — ** — — — — — — — — IX ⇒ D, D ⇒ IX INH 8F — 3 — — — — — — — — IY ⇒ D, D ⇒ IY INH 8F — 4 — — — — — — — — 18 18 18 18 hh ff ff ll Infinity or until reset occurs 12 cycles are used beginning with the opcode fetch. A wait state is entered which remains in effect for an integer number of MPU E-clock cycles (n) until an interrupt is recognized. Finally, two additional cycles are used to fetch the appropriate interrupt vector (14 + n total). Operands dd = 8-bit direct address ($0000–$00FF) (high byte assumed to be $00) ff = 8-bit positive offset $00 (0) to $FF (255) (is added to index) hh = High-order byte of 16-bit extended address ii = One byte of immediate data jj = High-order byte of 16-bit immediate data kk = Low-order byte of 16-bit immediate data ll = Low-order byte of 16-bit extended address mm = 8-bit mask (set bits to be affected) rr = Signed relative offset $80 (–128) to $7F (+127) (offset relative to address following machine code offset byte) Operators () Contents of register shown inside parentheses ⇐ Is transferred to ⇑ Is pulled from stack Is pushed onto stack ⇓ • Boolean AND + Arithmetic addition symbol except where used as inclusive-OR symbol in Boolean formula ⊕ Exclusive-OR ∗ Multiply : Concatenation – Arithmetic subtraction symbol or negation symbol (two’s complement) Condition Codes — Bit not changed 0 Bit always cleared 1 Bit always set ∆ Bit cleared or set, depending on operation ↓ Bit can be cleared, cannot become set MC68HC711D3 Data Sheet, Rev. 2.1 46 Freescale Semiconductor Chapter 4 Resets, Interrupts, and Low-Power Modes 4.1 Introduction This section describes the internal and external resets and interrupts of the MC68HC711D3 and its two low power-consumption modes. 4.2 Resets The microcontroller unit (MCU) can be reset in any of these four ways: 1. An active-low input to the RESET pin 2. A power-on reset (POR) function 3. A clock monitor failure 4. A computer operating properly (COP) watchdog timer timeout The RESET input consists mainly of a Schmitt trigger that senses the RESET line logic level. 4.2.1 RESET Pin To request an external reset, the RESET pin must be held low for at least eight E-clock cycles, or for one E-clock cycle if no distinction is needed between internal and external resets. 4.2.2 Power-On Reset (POR) Power-on reset occurs when a positive transition is detected on VDD. This reset is used strictly for power turn on conditions and should not be used to detect any drop in the power supply voltage. If the external RESET pin is low at the end of the power-on delay time, the processor remains in the reset condition until RESET goes high. 4.2.3 Computer Operating Properly (COP) Reset The MCU contains a watchdog timer that automatically times out unless it is serviced within a specific time by a program reset sequence. If the COP watchdog timer is allowed to timeout, a reset is generated, which drives the RESET pin low to reset the MCU and the external system. In the MC68HC711D3, the COP reset function is enabled out of reset in normal modes. If the user does not want the COP enabled, he must write a 1 to the NOCOP bit of the configuration control register (CONFIG) after reset. This bit is writable only once after reset in normal modes (see 2.3.3 Configuration Control Register for more information). Protected control bits (CR1 and CR0) in the configuration options register (OPTION) allow the user to select one of the four COP timeout rates. Table 4-1 shows the relationship between CR1 and CR0 and the COP timeout period for various system clock frequencies. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 47 Resets, Interrupts, and Low-Power Modes The sequence for resetting the watchdog timer is: 1. Write $55 to the COP reset register (COPRST) to arm the COP timer clearing mechanism. 2. Write $AA to the COPRST register to clear the COP timer Both writes must occur in this sequence prior to the timeout, but any number of instructions can be executed between the two writes. Table 4-1. COP Time Out Periods E ÷ 215 CR0 CR1 Divided By XTAL = 223 Time Out –0/+15.6 ms XTAL = 8.0 MHz Time Out –0/+16.4 ms XTAL = 4.9152 MHz Time Out –0/+26.7 ms XTAL = 4.0 MHz Time Out –0/+32.8 ms XTAL = 3.6864 MHz Time Out –0/+35.6 ms 0 0 1 15.625 ms 16.384 ms 26.667 ms 32.768 ms 35.556 ms 0 1 4 62.5 ms 65.536 ms 106.67 ms 131.07 ms 142.22 ms 1 0 16 250 ms 262.14 ms 426.67 ms 524.29 ms 568.89 ms 1 1 64 1 sec 1.049 sec 1.707 sec 2.1 sec 2.276 ms E= 2.1 MHz 2.0 MHz 1.2288 MHz 1.0 MHz 921.6 kHz Address: Read: Write: Reset: $003A Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 4-1. Arm/Reset COP Timer Circuitry Register (COPRST) 4.2.4 Clock Monitor Reset The MCU contains a clock monitor circuit that measures the E-clock frequency. If the E-clock input rate is above approximately 200 kHz, then the clock monitor does not generate an MCU reset. If the E-clock signal is lost or its frequency falls below 10 kHz, then an MCU reset can be generated, and the RESET pin is driven low to reset the external system. 4.2.5 System Configuration Options Register The system configuration options register (OPTION) is a special-purpose register with several time-protected bits. OPTION is used during initialization to configure internal system options. Bits 5, 4, 2, 1, and 0 can be written only once during the first 64 E-clock cycles after reset in normal modes (where the HPRIO register bit (SMOD) is cleared). In special modes (where SMOD = 1), the bits can be written at any time. Bit 3 can be written at anytime. MC68HC711D3 Data Sheet, Rev. 2.1 48 Freescale Semiconductor Interrupts Address: Read: Write: Reset: $0039 Bit 7 6 5 4 3 2 1 Bit 0 0 0 IRQE DLY CME 0 CR1 CR0 0 0 0 1 0 0 0 0 Figure 4-2. System Configuration Options Register (OPTION) Bits 7, 6, and 2 — Not implemented Always read 0. IRQE — IRQ Edge/Level Sensitivity Select This bit can be written only once during the first 64 E-clock cycles after reset in normal modes. 1 = IRQ is configured to respond only to falling edges. 0 = IRQ is configured for low-level wired-OR operation. DLY — Stop Mode Exit Turnon Delay This bit is set during reset and can be written only once during the first 64 E-clock cycles after reset in normal modes. If an external clock source rather than a crystal is used, the stabilization delay can be inhibited because the clock source is assumed to be stable. 1 = A stabilization delay of 4064 E-clock cycles is imposed before processing resumes after a stop mode wakeup. 0 = No stabilization delay is imposed after story recovery. CME — Clock Monitor Enable 1 = Clock monitor circuit is enabled. 0 = Clock monitor circuit is disabled. CR1 and CR0 — COP Timer Rate Selects The COP system is driven by a constant frequency of E ÷ 215. These two bits specify an additional divide-by value to arrive at the COP timeout rate. These bits are cleared during reset and can be written only once during the first 64 E-clock cycles after reset in normal modes. The value of these bits is: CR1 CR0 E ÷ 215 Divided By 0 0 1 0 1 4 1 0 16 1 1 64 4.3 Interrupts Excluding reset-type interrupts, there are 17 hardware interrupts and one software interrupt that can be generated from all the possible sources. These interrupts can be divided into two categories: maskable and non-maskable. Fifteen of the interrupts can be masked using the I bit of the condition code register (CCR). All the on-chip (hardware) interrupts are individually maskable by local control bits. The software interrupt is non-maskable. The external input to the XIRQ pin is considered a non-maskable interrupt because it cannot be masked by software once it is enabled. However, it is masked during reset and upon receipt of an interrupt at the XIRQ pin. Illegal opcode is also a non-maskable interrupt. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 49 Resets, Interrupts, and Low-Power Modes Table 4-2 provides a list of the interrupts with a vector location in memory for each, as well as the actual condition code and control bits that mask each interrupt. Figure 4-3 shows the interrupt stacking order. Table 4-2. Interrupt and Reset Vector Assignments Vector Address Interrupt Source CCR Mask Local Mask — — $FFC0, $FFC1 ↓ $FFD4, $FFD5 Reserved $FFD6, $FFD7 SCI serial system: • SCI transmit complete • SCI transmit data register empty • SCI idle line detect • SCI receiver overrun • SCI receive data register full I bit $FFD8, $FFD9 SPI serial transfer complete I bit SPIE $FFDA, $FFDB Pulse accumulator input edge I bit PAII $FFDC, $FFDD Pulse accumulator overflow I bit PAOVI $FFDE, $FFDF Timer overflow I bit TOI $FFE0, $FFE1 Timer input capture 4/output compare 5 I bit I4/O5I $FFE2, $FFE3 Timer output compare 4 I bit OC4I $FFE4, $FFE5 Timer output compare 3 I bit OC3I $FFE6, $FFE7 Timer output compare 2 I bit OC2I $FFE8, $FFE9 Timer output compare 1 I bit OC1I $FFEA, $FFEB Timer input capture 3 I bit IC3I $FFEC, $FFED Timer input capture 2 I bit IC2I $FFEE, $FFEF Timer input capture 1 I bit IC1I $FFF0, $FFF1 Real time interrupt I bit RTII $FFF2, $FFF3 IRQ (external pin) I bit None $FFF4, $FFF5 XIRQ pin (pseudo non-maskable) X bit None $FFF6, $FFF7 Software interrupt None None $FFF8, $FFF9 Illegal opcode trap None None $FFFA, $FFFB COP failure (reset) None NOCOP $FFFC, $FFFD Clock monitor fail (reset) None CME $FFFE, $FFFF RESET None None TCIE TIE ILIE RIE RIE MC68HC711D3 Data Sheet, Rev. 2.1 50 Freescale Semiconductor Interrupts STACK SP PCL SP – 1 PCH SP – 2 IYL SP – 3 IYH SP – 4 IXL SP – 5 IXH SP – 6 ACCA SP – 7 ACCB SP – 8 CCR SP – 9 — SP BEFORE INTERRUPT — SP AFTER INTERRUPT Figure 4-3. Interrupt Stacking Order 4.3.1 Software Interrupt (SWI) The SWI is executed the same as any other instruction and takes precedence over interrupts only if the other interrupts are masked (with I and X bits in the CCR set). SWI execution is similar to that of the maskable interrupts in that it sets the I bit, stacks the central processor unit (CPU) registers, etc. NOTE The SWI instruction cannot be executed as long as another interrupt is pending. However, once the SWI instruction has begun, no other interrupt can be honored until the first instruction in the SWI service routine is completed. 4.3.2 Illegal Opcode Trap Since not all possible opcodes or opcode sequences are defined, an illegal opcode detection circuit has been included in the MCU. When an illegal opcode is detected, an interrupt is required to the illegal opcode vector. The illegal opcode vector should never be left uninitialized. 4.3.3 Real-Time Interrupt (RTI) The real-time interrupt (RTI) provides a programmable periodic interrupt. This interrupt is maskable by either the I bit in the CCR or the RTI enable (RTII) bit of the timer interrupt mask register 2 (TMSK2). The rate is based on the MCU E clock and is software selectable to the E ÷ 213, E ÷ 214, E ÷ 215, or E ÷ 216. See PACTL, TMSK2, and TFLG2 register descriptions in Chapter 8 Programmable Timer for control and status bit information. 4.3.4 Interrupt Mask Bits in the CCR Upon reset, both the X bit and I bit of the CCR are set to inhibit all maskable interrupts and XIRQ. After minimum system initialization, software may clear the X bit by a TAP instruction, thus enabling XIRQ interrupts. Thereafter software cannot set the X bit. So, an XIRQ interrupt is effectively a non-maskable interrupt. Since the operation of the I bit related interrupt structure has no effect on the X bit, the internal XIRQ pin remains effectively non-masked. In the interrupt priority logic, the XIRQ interrupt is a higher priority than any source that is maskable by the I bit. All I bit related interrupts operate normally with their own priority relationship. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 51 Resets, Interrupts, and Low-Power Modes When an I bit related interrupt occurs, the I bit is automatically set by hardware after stacking the CCR byte. The X bit is not affected. When an X bit related interrupt occurs, both the X and the I bit are automatically set by hardware after stacking the CCR. A return-from-interrupt (RTI) instruction restores the X and I bits to their preinterrupt request state. 4.3.5 Priority Structure Interrupts obey a fixed hardware priority circuit to resolve simultaneous requests. However one I bit related interrupt source may be elevated to the highest I bit priority in the resolution circuit. Six interrupt sources are not masked by the I bit in the CCR and have these fixed priority relationships: 1. Reset 2. Clock monitor failure 3. COP failure 4. Illegal opcode 5. SWI 6. XIRQ SWI is actually an instruction and has highest priority, other than resets, in that once the SWI opcode is fetched, no other interrupt can be honored until the SWI vector has been fetched. Each of the previous sources is an input to the priority resolution circuit. The highest I bit masked priority input to the resolution circuit is assigned to be connected to any one of the remaining I bit related interrupt sources. This assignment is made under the software control of the HPRIO register. To avoid timing races, the HPRIO register can be written only while the I bit related interrupts are inhibited (I bit of CCR is logic 1). An interrupt that is assigned to this higher priority position is still subject to masking by any associated control bits or by the I bit in the CCR. The interrupt vector address is not affected by assigning a source to the higher priority position. Figure 4-4, Figure 4-5, and Figure 4-6 illustrate the interrupt process as it relates to normal processing. Figure 4-4 shows how the CPU begins from a reset, and how interrupt detection relates to normal opcode fetches. Figure 4-5 is an expansion of a block in Figure 4-4 and shows how interrupt priority is resolved. Figure 4-6 is an expansion of the SCI interrupt block of Figure 4-4 and shows the resolution of interrupt sources within the SCI subsystem. MC68HC711D3 Data Sheet, Rev. 2.1 52 Freescale Semiconductor Interrupts HIGHEST PRIORITY POWER-ON RESET (POR) DELAY 4064 E CYCLES EXTERNAL RESET CLOCK MONITOR FAIL (WITH CME = 1) LOWEST PRIORITY COP WATCHDOG TIMEOUT (WITH NOCOP = 0) LOAD PROGRAM COUNTER WITH CONTENTS OF $FFFE, $FFFF (VECTOR FETCH) LOAD PROGRAM COUNTER WITH CONTENTS OF $FFFC, $FFFD (VECTOR FETCH) LOAD PROGRAM COUNTER WITH CONTENTS OF $FFFA, $FFFB (VECTOR FETCH) SET BITS S, I, AND X RESET MCU HARDWARE 1A BEGIN INSTRUCTION SEQUENCE Y BIT X IN CCR = 1? N XIRQ PIN LOW? Y N 2A STACK CPU REGISTERS SET BITS I AND X FETCH VECTOR $FFF4, $FFF5 Figure 4-4. Processing Flow Out of Reset (Sheet 1 of 2) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 53 Resets, Interrupts, and Low-Power Modes 2A Y I BIT IN CCR SET? N ANY I-BIT INTERRUPT PENDING? Y STACK CPU REGISTERS N FETCH OPCODE N STACK CPU REGISTERS ILLEGAL OPCODE? Y SET I BIT WAI Y INSTRUCTION? FETCH VECTOR $FFF8, $FFF9 STACK CPU REGISTERS N Y STACK CPU REGISTERS SWI INSTRUCTION? N Y RTI INSTRUCTION? N RESTORE CPU REGISTERS FROM STACK EXECUTE THIS INSTRUCTION 1A INTERRUPT YET? Y SET I BIT FETCH VECTOR $FFF6, $FFF7 N SET I BIT RESOLVE INTERRUPT PRIORITY AND FETCH VECTOR FOR HIGHEST PENDING SOURCE SEE Figure 4-5 START NEXT INSTRUCTION SEQUENCE Figure 4-4. Processing Flow Out of Reset (Sheet 2 of 2) MC68HC711D3 Data Sheet, Rev. 2.1 54 Freescale Semiconductor Interrupts BEGIN X BIT IN CCR SET ? Y N XIRQ PIN LOW ? Y FETCH VECTOR $FFF4, $FFF5 N HIGHEST PRIORITY INTERRUPT ? N IRQ ? SET X BIT Y FETCH VECTOR Y FETCH VECTOR $FFF2, $FFF3 N RTII = 1 ? Y N REAL-TIME INTERRUPT ? Y FETCH VECTOR $FFF0, $FFF1 Y FETCH VECTOR $FFEE, $FFEF Y FETCH VECTOR $FFEC, $FFED Y FETCH VECTOR $FFEA, $FFEB Y FETCH VECTOR $FFE8, $FFE9 N Y IC1I = 1 ? N TIMER IC1F ? N Y IC2I = 1 ? N TIMER IC2F ? N Y IC3I = 1 ? N TIMER IC3F ? N Y OC1I = 1 ? N TIMER OC1F ? N 2A 2B Figure 4-5. Interrupt Priority Resolution (Sheet 1 of 2) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 55 Resets, Interrupts, and Low-Power Modes 2A 2B Y OC2I = 1? Y FETCH VECTOR $FFE6, $FFE7 Y FETCH VECTOR $FFE4, $FFE5 Y FETCH VECTOR $FFE2, $FFE3 Y FETCH VECTOR $FFE0, $FFE1 Y FETCH VECTOR $FFDE, $FFDF Y FETCH VECTOR $FFDC, $FFDD Y FETCH VECTOR $FFDA, $FFDB Y FETCH VECTOR $FFD8, $FFD9 N N OC3I = 1? Y FLAG OC3F = 1 N N OC4I = 1? Y FLAG OC4F = 1? N N OC5I = 1? Y FLAG OC5F = 1? N N Y TOI = 1? FLAG TOF = 1? N N PAOVI = 1? Y FLAG PAOVF = 1 N N PAII = 1? Y FLAG PAIF = 1? N N SPIE = 1? Y FLAGS SPIF = 1? OR MODF = 1? N N SCI INTERRUPT? SEE Figure 4-6 N FLAG OC2F = 1? Y FETCH VECTOR $FFD6, $FFD7 FETCH VECTOR $FFF2, $FFF3 END Figure 4-5. Interrupt Priority Resolution (Sheet 2 of 2) MC68HC711D3 Data Sheet, Rev. 2.1 56 Freescale Semiconductor Interrupts BEGIN FLAG RDRF = 1? Y N OR = 1? Y Y RE = 1? TIE = 1? Y TE = 1? Y N Y TCIE = 1? Y N N IDLE = 1? Y N N N TC = 1? Y N N TDRE = 1? RIE = 1? Y Y ILIE = 1? RE = 1? N N NO VALID SCI REQUEST Y N YES VALID SCI REQUEST Figure 4-6. Interrupt Source Resolution within SCI MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 57 Resets, Interrupts, and Low-Power Modes 4.3.6 Highest Priority I Interrupt and Miscellaneous Register (HPRIO) Four bits of this register (PSEL3–PSEL0) are used to select one of the I bit related interrupt sources and to elevate it to the highest I bit masked position of the priority resolution circuit. In addition, four miscellaneous system control bits are included in this register. Address: $003C Bit 7 Read: Write: RBOOT 6 SMOD Reset: 5 4 3 2 1 Bit 0 MDA IRVNE PSEL3 PSEL2 PSEL1 PSEL0 0 1 0 1 Note 1 1. The values of the RBOOT, SMOD, IRVNE, and MDA bits at reset depend on the mode during initialization. Refer to Table 4-3. Figure 4-7. Highest Priority I-Bit Interrupt and Miscellaneous Register (HPRIO) RBOOT — Read Bootstrap ROM This bit can be read at any time. It can be written only in special modes (SMOD = 1). In special bootstrap mode, it is set during reset. Reset clears it in all other modes. 1 = Bootloader ROM is enabled in the memory map at $BF00–$BFFF. 0 = Bootloader ROM is disabled and is not in the memory map. SMOD and MDA — Special Mode Select and Mode Select A These two bits can be read at any time.These bits reflect the status of the MODA and MODB input pins at the rising edge of reset. SMOD may be written only in special modes. It cannot be written to a 1 after being cleared without an interim reset. MDA may be written at any time in special modes, but only once in normal modes. An interpretation of the values of these two bits is shown in Table 4-3. Table 4-3. Hardware Mode Select Summary Inputs Latched at Reset Mode MODB MODA SMOD MDA 1 0 Single chip 0 0 1 1 Expanded multiplexed 0 1 0 0 Special bootstrap 1 0 0 1 Special test 1 1 IRVNE — Internal Read Visibility/Not E This bit may be read at any time. It may be written once in any mode. IRVNE is set during reset in special test mode only, and cleared by reset in the other modes. 1 = Data from internal reads is driven out on the external data bus in expanded modes. 0 = Data from internal reads is not visible on the external data bus. As shown in the table, in single-chip and bootstrap modes IRVNE determines whether the E clock is driven out or forced low. 1 = E pin driven low 0 = E clock driven out of the chip MC68HC711D3 Data Sheet, Rev. 2.1 58 Freescale Semiconductor Interrupts IRVNE E Clock IRV IRVNE IRVNE Out Out Out Affects May of Reset of Reset of Reset Only be Written Mode Single chip 0 On Off E Once Expanded multiplexed 0 On Off IRV Once Bootstrap 0 On Off E Once Special test 1 On On IRV Once NOTE To prevent bus conflicts, when using internal read visibility, the user must disable all external devices from driving the data bus during any internal access. PSEL3–PSEL0 — Priority Selects These four bits are used to specify one I bit related interrupt source, which then becomes the highest priority I bit related interrupt source. These bits may be written only while the I bit in the CCR is set, inhibiting I bit related interrupts. An interpretation of the value of these bits is shown in Table 4-4. During reset, PSEL3–PSEL0 are initialized to 0101, which corresponds to reserved (default to IRQ). IRQ becomes the highest priority I bit related interrupt source. Table 4-4. Highest Priority Interrupt Selection PSEL3–PSEL0 Interrupt Source Promoted 0000 Timer overflow 0001 Pulse accumulator overflow 0010 Pulse accumulator input edge 0011 SPI serial transfer complete 0100 SCI serial system 0101 Reserved (default to IRQ) 0110 IRQ (external pin) 0111 Real-time interrupt 1000 Timer input capture 1 1001 Timer input capture 2 1010 Timer input capture 3 1011 Timer output compare 1 1100 Timer output compare 2 1101 Timer output compare 3 1110 Timer output compare 4 1111 Timer input capture 4/output compare 5 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 59 Resets, Interrupts, and Low-Power Modes 4.4 Low-Power Operation The M68HC11 Family of microcontroller units (MCU) has two programmable low power-consumption modes: stop and wait. In the wait mode, the on-chip oscillator remains active. In the stop mode, the oscillator is stopped. This subsection describes these two low power-consumption modes. 4.4.1 Stop Mode The STOP instruction places the MCU in its lowest power-consumption mode, provided the S bit in the CCR is cleared. In this mode, all clocks are stopped, thereby halting all internal processing. To exit the stop mode, a low level must be applied to either the IRQ, XIRQ, or RESET pin. An external interrupt used at IRQ is only effective if the I bit in the CCR is cleared. An external interrupt applied at the XIRQ input is effective, regardless of the setting of the X bit of the CCR. However, the actual recovery sequence differs, depending on the X bit setting. If the X bit is cleared, the MCU starts with the stacking sequence leading to the normal service of the XIRQ request. If the X bit is set, the processing always continues with the instruction immediately following the STOP instruction. A low input to the RESET pin always results in an exit from the stop mode, and the start of MCU operations is determined by the reset vector. The CPU will not exit stop mode correctly when interrupted by IRQ or XIRQ if the instruction preceding STOP is a column 4 or 5 accumulator inherent (opcodes $4X and $5X) instruction, such as NEGA, NEGB, COMA, COMB, etc. These single-byte, two-cycle instructions must be followed by an NOP, then the STOP command. If reset is used to exit stop mode, the CPU will respond properly. A restart delay is required if the internal oscillator is being used. The delay allows the oscillator to stabilize when exiting the stop mode. If a stable external oscillator is being used, the delay (DLY) bit in the OPTION register can be cleared to bypass the delay. If the DLY bit is clear, the RESET pin would not normally be used to exit the stop mode. The reset sequence sets the DLY bit, and the restart delay would be reimposed. 4.4.2 Wait Mode The wait (WAI) instruction places the MCU in a low power-consumption mode. The wait mode consumes more power than the stop mode since the oscillator is kept running. Upon execution of the WAI instruction, the machine state is stacked and program execution stops. The wait state can be exited only by an unmasked interrupt or RESET. If the I bit of the CCR is set and the COP is disabled, the timer system is turned off by WAI to further reduce power consumption. The amount of power savings is application dependent. It also depends upon the circuitry connected to the MCU pins, and upon subsystems such as the timer, serial peripheral interface (SPI), or serial communications interface (SCI) that were or were not active when the wait mode was entered. MC68HC711D3 Data Sheet, Rev. 2.1 60 Freescale Semiconductor Chapter 5 Input/Output (I/O) Ports 5.1 Introduction The MC68HC711D3 has four 8-bit input/output (I/O) ports; A, B, C, and D. In the 40-pin version, port A bits 4 and 6 are not bonded. Port functions are controlled by the particular mode of operation selected, as shown in Table 1-1. Port Signal Functions. In the single-chip and bootstrap modes, all the ports are configured as parallel input/output (I/O) data ports. In expanded multiplexed and test modes, ports B, C, and lines D6 (AS) and D7 (R/W) are configured as a memory expansion bus, with: • Port B as the high-order address bus • Port C as the multiplexed address and data bus • AS as the demultiplexing signal • R/W as data bus direction control The remaining ports are unaffected by mode changes. • Ports A and D can be used as general-purpose I/O ports, though each has an alternate function. • Port A bits handle the timer functions. • Port D handles serial peripheral interface (SPI) and serial communications interface (SCI) functions in addition to its bus direction control functions. 5.2 Port A Port A shares functions with the timer system and has: • Three input only pins • Three output only pins • Two bidirectional I/O pins Pins PA6 and PA4 are not bonded in the 40-pin dual in-line package (DIP), and their OC output functions are unavailable, but their software interrupts are available. Address: Read: Write: $0000 Bit 7 6 5 4 3 2 1 Bit 0 PA7 PA6(1) PA5 PA4(1) PA3 PA2 PA1 PA0 Reset: Hi-Z 0 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Alt. Func.: And/Or: PAI OC1 OC2 OC1 OC3 OC1 OC4 OC1 IC4/OC5 OC1 IC1 — IC2 — IC3 — 1. This pin is not bonded in the 40-pin version. Figure 5-1. Port A Data Register (PORTA) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 61 Input/Output (I/O) Ports PORTA can be read any time. Inputs return the pin level, whereas outputs return the pin driver input level. If written, PORTA stores the data in an internal latch. It drives the pins only if they are configured as outputs. Writes to PORTA do not change the pin state when the pins are configured for timer output compares. Out of reset, port A bits 7 and 3–0 are general high-impedance inputs, while bits 6–4 are outputs, driving low. On bidirectional lines PA7 and PA3, the timer forces the I/O state to be an output if the associated output compare is enabled. In this case, the data direction bits DDRA7 and DDRA3 in PACTL will not be changed or have any effect on those bits. When the output compare functions associated with these pins are disabled, the DDR bits in PACTL govern the I/O state. 5.3 Port B Port B is an 8-bit, general-purpose I/O port with a data register (PORTB) and a data direction register (DDRB). • In the single-chip mode, port B pins are general-purpose I/O pins (PB7–PB0). • In the expanded-multiplexed mode, all of the port B pins act as the high-order address bits (A15–A8) of the address bus. 5.3.1 Port B Data Register Address: Read: Write: Reset: Alt. Func.: $0004 Bit 7 6 5 4 3 2 1 Bit 0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 0 0 0 0 0 0 0 0 A15 A14 A13 A12 A11 A10 A9 A8 Figure 5-2. Port B Data Register (PORTB) PORTB can be read at any time. Inputs return the sensed levels at the pin, while outputs return the input level of the port B pin drivers. If PORTB is written, the data is stored in an internal latch and can be driven only if port B is configured for general-purpose outputs in single-chip or bootstrap mode. Port B pins are general--purpose inputs out of reset in single-chip and bootstrap modes. These pins are outputs (the high-order address bits) out of reset in expanded multiplexed and test modes. 5.3.2 Port B Data Direction Register Address: Read: Write: Reset: $0006 Bit 7 6 5 4 3 2 1 Bit 0 DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 0 0 0 0 0 0 0 0 Figure 5-3. Data Direction Register for Port B (DDRB) DDB7–DDB0 — Data Direction Bits for Port B 1 = Corresponding port B pin configured as output 0 = Corresponding port B pin configured for input only MC68HC711D3 Data Sheet, Rev. 2.1 62 Freescale Semiconductor Port C 5.4 Port C Port C is an 8-bit, general-purpose I/O port with a data register (PORTC) and a data direction register (DDRC). In the single-chip mode, port C pins are general-purpose I/O pins (PC7–PC0). In the expanded-multiplexed mode, port C pins are configured as multiplexed address/data pins. During the address cycle, bits 7–0 of the address are output on PC7–PC0. During the data cycle, bits 7–0 (PC7–PC0) are bidirectional data pins controlled by the R/W signal. 5.4.1 Port C Control Register Address: Read: Write: Reset: $0002 Bit 7 6 5 4 3 2 1 Bit 0 0 0 CWOM 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-4. Port C Control Register (PIOC) CWOM — Port C Wire-OR Mode Bit 1 = Port C outputs are open drain (to facilitate testing) 0 = Port C operates normally 5.4.2 Port C Data Register Address: Read: Write: Reset: $0003 Bit 7 6 5 4 3 2 1 Bit 0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 0 0 0 0 0 0 0 0 Figure 5-5. Port C Data Register (PORTC) PORTC can be read at any time. Inputs return the sensed levels at the pin, while outputs return the input level of the port C pin drivers. If PORTC is written, the data is stored in an internal latch and can be driven only if port C is configured for general-purpose outputs in single-chip or bootstrap mode. Port C pins are general-purpose inputs out of reset in single-chip and bootstrap modes. These pins are multiplexed low-order address and data bus lines out of reset in expanded-multiplexed and test modes. 5.4.3 Port C Data Direction Register Address: Read: Write: Reset: $0007 Bit 7 6 5 4 3 2 1 Bit 0 DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 0 0 0 0 0 0 0 0 Figure 5-6. Data Direction Register for Port C (DDRC) DDC7–DDC0 — Data Direction Bits for Port C 1 = Corresponding port C pin is configured as output 0 = Corresponding port C pin is configured for input only MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 63 Input/Output (I/O) Ports 5.5 Port D Port D is an 8-bit, general-purpose I/O port with a data register (PORTD) and a data direction register (DDRD). The eight port D bits (D7–D0) can be used for general-purpose I/O, for the serial communications interface (SCI) and serial peripheral interface (SPI) subsystems, or for bus data direction control 5.5.1 Port D Data Register Address: Read: Write: Reset: $0008 Bit 7 6 5 4 3 2 1 Bit 0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 0 0 0 0 0 0 0 0 Figure 5-7. Port D Data Register (PORTD) PORTD can be read at any time and inputs return the sensed levels at the pin; whereas, outputs return the input level of the port D pin drivers. If PORTD is written, the data is stored in an internal latch, and can be driven only if port D is configured as general-purpose output. This port shares functions with the on-chip SCI and SPI subsystems, while bits 6 and 7 control the direction of data flow on the bus in expanded and special test modes. 5.5.2 Port D Data Direction Register Address: Read: Write: Reset: $0009 Bit 7 6 5 4 3 2 1 Bit 0 DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 0 0 0 0 0 0 0 0 Figure 5-8. Data Direction Register for Port D (DDRD) DDD7–DDD0 — Data Direction for Port D When port D is a general-purpose I/O port, the DDRD register controls the direction of the I/O pins as follows: 0 = Configures the corresponding port D pin for input only 1 = Configures the corresponding port D pin for output In expanded and test modes, bits 6 and 7 are dedicated AS and R/W. When port D is functioning with the SPI system enabled, bit 5 is dedicated as the slave select (SS) input. In SPI slave mode, DDD5 has no meaning or effect. In SPI master mode, DDD5 affects port D bit 5 as follows: 0 = Port D bit 5 is an error-detect input to the SPI. 1 = Port D bit 5 is configured as a general-purpose output line. If the SPI is enabled and expects port D bits 2, 3, and 4 (MISO, MOSI, and SCK) to be inputs, then they are inputs, regardless of the state of DDRD bits 2, 3, and 4. If the SPI expects port D bits 2, 3, and 4 to be outputs, they are outputs only if DDRD bits 2, 3, and 4 are set. MC68HC711D3 Data Sheet, Rev. 2.1 64 Freescale Semiconductor Chapter 6 Serial Communications Interface (SCI) 6.1 Introduction The serial communications interface (SCI) is a universal asynchronous receiver transmitter (UART), one of two independent serial input/output (I/O) subsystems in the MC68HC711D3. It has a standard non-return to zero (NRZ) format (one start, eight or nine data, and one stop bit). Several baud rates are available. The SCI transmitter and receiver are independent, but use the same data format and bit rate. 6.2 Data Format The serial data format requires these conditions: • An idle line in the high state before transmission or reception of a message • A start bit, logic 0, transmitted or received, that indicates the start of each character • Data that is transmitted and received least significant bit (LSB) first • A stop bit, logic 1, used to indicate the end of a frame. A frame consists of a start bit, a character of eight or nine data bits, and a stop bit. • A break, defined as the transmission or reception of a logic 0 for some multiple number of frames Selection of the word length is controlled by the M bit in the SCI control register 1 (SCCR1). 6.3 Transmit Operation The SCI transmitter includes a parallel transmit data register (SCDR) and a serial shift register that puts data from the SCDR into serial form. The contents of the serial shift register can only be written through the SCDR. This double-buffered operation allows a character to be shifted out serially while another character is waiting in the SCDR to be transferred into the serial shift register. The output of the serial shift register is applied to PD1 as long as transmission is in progress or the transmit enable (TE) bit of serial communication control register 2 (SCCR2) is set. The block diagram, Figure 6-1, shows the transmit serial shift register and the buffer logic at the top of the figure. 6.4 Receive Operation During receive operations, the transmit sequence is reversed. The serial shift register receives data and transfers it to a parallel receive data register (SCDR) as a complete word. Refer to Figure 6-2. This double-buffered operation allows a character to be shifted in serially while another character is already in the SCDR. An advanced data recovery scheme distinguishes valid data from noise in the serial data stream. The data input is selectively sampled to detect receive data, and a majority voting circuit determines the value and integrity of each bit. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 65 Serial Communications Interface (SCI) TRANSMITTER BAUD RATE CLOCK (WRITE ONLY) SCDR Tx BUFFER DDD1 10 (11) - BIT Tx SHIFT REGISTER 2 1 0 PIN BUFFER AND CONTROL L PD1 TxD BREAK—JAM 0s 3 JAM ENABLE 4 PREAMBLE—JAM 1s 5 SHIFT ENABLE 6 TRANSFER Tx BUFFER SIZE 8/9 H (8) 7 FORCE PIN DIRECTION (OUT) SCCR1 SCI CONTROL 1 FE NF OR IDLE TC RDRF TDRE WAKE M T8 R8 TRANSMITTER CONTROL LOGIC SCSR INTERRUPT STATUS TDRE TIE TC SBK RWU RE TE ILIE RIE TCIE TIE TCIE SCCR2 SCI CONTROL 2 SCI Rx REQUESTS SCI INTERRUPT REQUEST INTERNAL DATA BUS Figure 6-1. SCI Transmitter Block Diagram MC68HC711D3 Data Sheet, Rev. 2.1 66 Freescale Semiconductor Receive Operation 16X BAUD RATE CLOCK PIN BUFFER AND CONTROL PD0 RxD 10 (11) - BIT Rx SHIFT REGISTER STOP ÷16 DATA RECOVERY START DDD0 (8) 7 6 5 4 3 MSB DISABLE DRIVER 2 1 0 ALL 1s RE M FE NF OR IDLE RDRF TDRE TC RWU WAKE M T8 R8 WAKEUP LOGIC SCDR Rx BUFFER SCSR SCI STATUS 1 SCCR1 SCI CONTROL 1 (READ ONLY) RDRF RIE IDLE ILIE OR SBK RWU RE TE ILIE RIE TCIE TIE RIE SCCR2 SCI CONTROL 2 SCI Tx REQUESTS SCI INTERRUPT REQUEST INTERNAL DATA BUS Figure 6-2. SCI Receiver Block Diagram MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 67 Serial Communications Interface (SCI) 6.5 Wakeup Feature The wakeup feature reduces SCI service overhead in multiple receiver systems. Software for each receiver evaluates the first character of each message. The receiver is placed in wakeup mode by writing a 1 to the RWU bit in the SCCR2 register. While RWU is 1, all of the receiver-related status flags (RDRF, IDLE, OR, NF, and FE) are inhibited (cannot become set). Although RWU can be cleared by a software write to SCCR2, to do so would be unusual. Normally, RWU is set by software and is cleared automatically with hardware. Whenever a new message begins, logic alerts the sleeping receivers to wake up and evaluate the initial character of the new message. Two methods of wakeup are available: • Idle line wakeup • Address mark wakeup During idle line wakeup, a sleeping receiver awakens as soon as the RxD line becomes idle. In the address mark wakeup, logic 1 in the most significant bit (MSB) of a character wakes up all sleeping receivers. 6.5.1 Idle-Line Wakeup To use the receiver wakeup method, establish a software addressing scheme to allow the transmitting devices to direct a message to individual receivers or to groups of receivers. This addressing scheme can take any form as long as all transmitting and receiving devices are programmed to understand the same scheme. Because the addressing information is usually the first frame(s) in a message, receivers that are not part of the current task do not become burdened with the entire set of addressing frames. All receivers are awake (RWU = 0) when each message begins. As soon as a receiver determines that the message is not intended for it, software sets the RWU bit (RWU = 1), which inhibits further flag setting until the RxD line goes idle at the end of the message. As soon as an idle line is detected by receiver logic, hardware automatically clears the RWU bit so that the first frame of the next message can be received. This type of receiver wakeup requires a minimum of one idle-line frame time between messages and no idle time between frames in a message. 6.5.2 Address-Mark Wakeup The serial characters in this type of wakeup consist of seven (eight if M = 1) information bits and an MSB, which indicates an address character (when set to 1 — mark). The first character of each message is an addressing character (MSB = 1). All receivers in the system evaluate this character to determine if the remainder of the message is directed toward this particular receiver. As soon as a receiver determines that a message is not intended for it, the receiver activates the RWU function by using a software write to set the RWU bit. Because setting RWU inhibits receiver-related flags, there is no further software overhead for the rest of this message. When the next message begins, its first character has its MSB set, which automatically clears the RWU bit and enables normal character reception. The first character whose MSB is set is also the first character to be received after wakeup because RWU gets cleared before the stop bit for that frame is serially received. This type of wakeup allows messages to include gaps of idle time, unlike the idle-line method, but there is a loss of efficiency because of the extra bit time for each character (address bit) required for all characters. MC68HC711D3 Data Sheet, Rev. 2.1 68 Freescale Semiconductor SCI Error Detection 6.6 SCI Error Detection Three error conditions can occur during generation of SCI system interrupts: • Serial communications data register (SCDR) overrun • Received bit noise • Framing Three bits (OR, NF, and FE) in the serial communications status register (SCSR) indicate if one of these error conditions exists. The overrun error (OR) bit is set when the next byte is ready to be transferred from the receive shift register to the SCDR and the SCDR is already full (RDRF bit is set). When an overrun error occurs, the data that caused the overrun is lost and the data that was already in SCDR is not disturbed. The OR is cleared when the SCSR is read (with OR set), followed by a read of the SCDR. The noise flag (NF) bit is set if there is noise on any of the received bits, including the start and stop bits. The NF bit is not set until the RDRF flag is set. The NF bit is cleared when the SCSR is read (with FE equal to 1) followed by a read of the SCDR. When no stop bit is detected in the received data character, the framing error (FE) bit is set. FE is set at the same time as the RDRF. If the byte received causes both framing and overrun errors, the processor only recognizes the overrun error. The framing error flag inhibits further transfer of data into the SCDR until it is cleared. The FE bit is cleared when the SCSR is read (with FE equal to 1) followed by a read of the SCDR. 6.7 SCI Registers This subsection describes the five addressable registers in the SCI. 6.7.1 SCI Data Register The SCI data register (SCDR) is a parallel register that performs two functions. It is the receive data register when it is read, and the transmit data register when it is written. Reads access the receive data buffer and writes access the transmit data buffer. Receive and transmit are double buffered. Address: Read: Write: Reset: $002F Bit 7 6 5 4 3 2 1 Bit 0 R7/T7 R6/T6 R5/T5 R4/T4 R3/T3 R2/T2 R1/T1 R0/T0 Unaffected by reset Figure 6-3. SCI Data Register (SCDR) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 69 Serial Communications Interface (SCI) 6.7.2 SCI Control Register 1 The SCI control register 1 (SCCR1) provides the control bits that determine word length and select the method used for the wakeup feature. Address: Read: Write: Reset: $002C Bit 7 6 5 4 3 2 1 Bit 0 R8 T8 0 M WAKE 0 0 0 U U 0 0 0 0 0 0 U = Unaffected Figure 6-4. SCI Control Register 1 (SCCR1) R8 — Receive Data Bit 8 If M bit is set, R8 stores the ninth bit in the receive data character. T8 — Transmit Data Bit 8 If M bit is set, T8 stores ninth bit in transmit data character. M — Mode Bit The mode bit selects character format 0 = Start bit, 8 data bits, 1 stop bit 1 = Start bit, 9 data bits, 1 stop bit WAKE — Wakeup by Address Mark/Idle Bit 0 = Wakeup by IDLE line recognition 1 = Wakeup by address mark (most significant data bit set) 6.7.3 SCI Control Register 2 The SCI control register 2 (SCCR2) provides the control bits that enable or disable individual SCI functions. Address: Read: Write: Reset: $002D Bit 7 6 5 4 3 2 1 Bit 0 TIE TCIE RIE ILIE TE RE RWU SBK 0 0 0 0 0 0 0 0 Figure 6-5. SCI Control Register 2 (SCCR2) TIE — Transmit Interrupt Enable Bit 1 = TDRE interrupts disabled 1 = SCI interrupt requested when TDRE status flag is set TCIE — Transmit Complete Interrupt Enable Bit 0 = TC interrupts disabled 1 = SCI interrupt requested when TC status flag is set RIE — Receiver Interrupt Enable Bit 0 = RDRF and OR interrupts disabled 1 = SCI interrupt requested when RDRF flag or the OR status flag is set MC68HC711D3 Data Sheet, Rev. 2.1 70 Freescale Semiconductor SCI Registers ILIE — Idle Line Interrupt Enable Bit 1 = IDLE interrupts disabled 1 = SCI interrupt requested when IDLE status flag is set TE — Transmitter Enable Bit When TE goes from 0 to 1, one unit of idle character time (logic 1) is queued as a preamble. 0 = Transmitter disabled 1 = Transmitter enabled RE — Receiver Enable Bit 0 = Receiver disabled 1 = Receiver enabled RWU — Receiver Wakeup Control Bit 0 = Normal SCI receiver 1 = Wakeup enabled and receiver interrupts inhibited SBK — Send Break Bit At least one character time of break is queued and sent each time SBK is written to 1. More than one break may be sent if the transmitter is idle at the time the SBK bit is toggled on and off, as the baud rate clock edge could occur between writing the 1 and writing the 0 to SBK. 0 = Break generator off 1 = Break codes generated as long as SBK = 1 6.7.4 SCI Status Register The SCI status register (SCSR) provides inputs to the interrupt logic circuits for generation of the SCI system interrupt. Address: Read: Write: Reset: $002E Bit 7 6 5 4 3 2 1 Bit 0 TDRE TC RDRF IDLE OR NF FE 0 1 1 0 0 0 0 0 0 Figure 6-6. SCI Status Register (SCSR) TDRE — Transmit Data Register Empty Flag This flag is set when SCDR is empty. Clear the TDRE flag by reading SCSR with TDRE set and then writing to SCDR. 0 = SCDR busy 1 = SCDR empty TC — Transmit Complete Flag This flag is set when the transmitter is idle (no data, preamble, or break transmission in progress). Clear the TC flag by reading SCSR with TC set and then writing to SCDR. 0 = Transmitter busy 1 = Transmitter idle RDRF — Receive Data Register Full Flag This flag is set if a received character is ready to be read from SCDR. Clear the RDRF flag by reading SCSR with RDRF set and then reading SCDR. 0 = SCDR empty 1 = SCDR full MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 71 Serial Communications Interface (SCI) IDLE — Idle Line Detected Flag This flag is set if the RxD line is idle. Once cleared, IDLE is not set again until the RxD line has been active and becomes idle again. The IDLE flag is inhibited when RWU = 1. Clear IDLE by reading SCSR with IDLE set and then reading SCDR. 0 = RxD line active 1 = RxD line idle OR — Overrun Error Flag OR is set if a new character is received before a previously received character is read from SCDR. Clear the OR flag by reading SCSR with OR set and then reading SCDR. 0 = No overrun 1 = Overrun detected NF — Noise Error Flag NF is set if majority sample logic detects anything other than a unanimous decision. Clear NF by reading SCSR with NF set and then reading SCDR. 0 = Unanimous decision 1 = Noise detected FE — Framing Error Bit FE is set when a 0 is detected where a stop bit was expected. Clear the FE flag by reading SCSR with FE set and then reading SCDR. 0 = Stop bit detected 1 = Zero detected 6.7.5 Baud Rate Register The baud rate register (BAUD) is used to select different baud rates for the SCI system. The SCP1 and SCP0 bits function as a prescaler for the SCR2–SCR0 bits. Together, these five bits provide multiple baud rate combinations for a given crystal frequency. Normally, this register is written once during initialization. The prescaler is set to its fastest rate by default out of reset and can be changed at any time. Refer to Table 6-1 and Table 6-2 for normal baud rate selections. Address: Read: Write: Reset: $002B Bit 7 6 5 4 3 2 1 Bit 0 TCLR 0 SCP1 SCP0 RCKB SCR2 SCR1 SCR0 0 0 0 0 0 U U U U = Unaffected Figure 6-7. Baud Rate Register (BAUD) TCLR — Clear Baud Rate Counters (Test) RCKB — SCI Baud Rate Clock Check (Test) MC68HC711D3 Data Sheet, Rev. 2.1 72 Freescale Semiconductor SCI Registers SCP1 and SCP0 — SCI Baud Rate Prescaler Select Bits These two bits select a prescale factor for the SCI baud rate generator that determines the highest possible baud rate. Table 6-1. Baud Rate Prescale Selects Crystal Frequency in MHz SCP1 and SCP0 Divide Internal Clock By 4.0 MHz (Baud) 8.0 MHz (Baud) 10.0 MHz (Baud) 12.0 MHz (Baud) 00 1 62.50 K 125.0 K 156.25 K 187.5 K 01 3 20.83 K 41.67 K 52.08 K 62.5 K 10 4 15.625 K 31.25 K 38.4 K 46.88 K 11 13 4800 9600 12.02 K 14.42 K SCR2–SCR0 — SCI Baud Rate Select Bits These three bits select receiver and transmitter bit rate based on output from baud rate prescaler stage. Table 6-2. Baud Rate Selects Highest Baud Rate (Prescaler Output from Table 6-1) Divide Prescaler By 4800 9600 38.4 K 000 1 4800 9600 38.4 K 001 2 2400 4800 19.2 K 010 4 1200 2400 9600 011 8 600 1200 4800 100 16 300 600 2400 101 32 150 300 1200 110 64 — 150 600 111 128 — — 300 SCR2–SCR0 The prescale bits, SCP1 and SCP0, determine the highest baud rate and the SCR2–SCR0 bits select an additional binary submultiple (÷1, ÷2, ÷4, through ÷128) of this highest baud rate. The result of these two dividers in series is the 16 X receiver baud rate clock. The SCR2–SCR0 bits are not affected by reset and can be changed at any time, although they should not be changed when any SCI transfer is in progress. Figure 6-8 illustrates the SCI baud rate timing chain. The prescale select bits determine the highest baud rate. The rate select bits determine additional divide by two stages to arrive at the receiver timing (RT) clock rate. The baud rate clock is the result of dividing the RT clock by 16. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 73 Serial Communications Interface (SCI) EXTAL XTAL INTERNAL BUS CLOCK (PH2) OSCILLATOR AND CLOCK GENERATOR ÷3 (÷ 4) ÷4 ÷ 13 SCP1 AND SCP0 0:0 E 0:1 1:0 1:1 AS SCR2–SCR0 0:0:0 ÷2 0:0:1 ÷2 0:1:0 ÷2 0:1:1 ÷ 16 ÷2 1:0:0 ÷2 1:0:1 ÷2 1:1:0 ÷2 1:1:1 SCI TRANSMIT BAUD RATE (1X) SCI RECEIVE BAUD RATE (16X) Figure 6-8. SCI Baud Rate Diagram MC68HC711D3 Data Sheet, Rev. 2.1 74 Freescale Semiconductor Status Flags and Interrupts 6.8 Status Flags and Interrupts The SCI transmitter has two status flags. These status flags can be read by software (polled) to tell when the corresponding condition exists. Alternatively, a local interrupt enable bit can be set to enable each of these status conditions to generate interrupt requests when the corresponding condition is present. Status flags are automatically set by hardware logic conditions, but must be cleared by software, which provides an interlock mechanism that enables logic to know when software has noticed the status indication. The software clearing sequence for these flags is automatic — functions that are normally performed in response to the status flags also satisfy the conditions of the clearing sequence. TDRE and TC flags are normally set when the transmitter is first enabled (TE set to 1). The TDRE flag indicates there is room in the transmit queue to store another data character in the TDR. The TIE bit is the local interrupt mask for TDRE. When TIE is 0, TDRE must be polled. When TIE and TDRE are 1, an interrupt is requested. The TC flag indicates the transmitter has completed the queue. The TCIE bit is the local interrupt mask for TC. When TCIE is 0, TC must be polled; when TCIE is 1 and TC is 1, an interrupt is requested. Writing a 0 to TE requests that the transmitter stop when it can. The transmitter completes any transmission in progress before actually shutting down. Only an MCU reset can cause the transmitter to stop and shut down immediately. If TE is written to 0 when the transmitter is already idle, the pin reverts to its general-purpose I/O function (synchronized to the bit-rate clock). If anything is being transmitted when TE is written to 0, that character is completed before the pin reverts to general-purpose I/O, but any other characters waiting in the transmit queue are lost. The TC and TDRE flags are set at the completion of this last character, even though TE has been disabled. The SCI receiver has five status flags, three of which can generate interrupt requests. The status flags are set by the SCI logic in response to specific conditions in the receiver. These flags can be read (polled) at any time by software. Refer to Figure 6-9, which shows SCI interrupt arbitration. When an overrun takes place, the new character is lost, and the character that was in its way in the parallel RDR is undisturbed. RDRF is set when a character has been received and transferred into the parallel RDR. The OR flag is set instead of RDRF if overrun occurs. A new character is ready to be transferred into RDR before a previous character is read from RDR. The NF and FE flags provide additional information about the character in the RDR, but do not generate interrupt requests. The last receiver status flag and interrupt source come from the IDLE flag. The RxD line is idle if it has constantly been at logic 1 for a full character time. The IDLE flag is set only after the RxD line has been busy and becomes idle, which prevents repeated interrupts for the whole time RxD remains idle. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 75 Serial Communications Interface (SCI) BEGIN FLAG RDRF = 1? Y N OR = 1? Y Y Y TIE = 1? TCIE = 1? Y N Y TE = 1? Y N Y N N IDLE = 1? RE = 1? N N TC = 1? Y N N TDRE = 1? RIE = 1? Y Y ILIE = 1? RE = 1? N N NO VALID SCI REQUEST Y N VALID SCI REQUEST Figure 6-9. Interrupt Source Resolution within SCI MC68HC711D3 Data Sheet, Rev. 2.1 76 Freescale Semiconductor Chapter 7 Serial Peripheral Interface (SPI) 7.1 Introduction The serial peripheral interface (SPI), an independent serial communications subsystem, allows the microcontroller unit (MCU) to communicate synchronously with peripheral devices, such as: • Transistor-transistor logic (TTL) shift registers • Liquid crystal diode (LCD) display drivers • Analog-to-digital converter (ADC) subsystems • Other microprocessors (MCUs) The SPI is also capable of inter-processor communication in a multiple master system. The SPI system can be configured as either a master or a slave device with data rates as high as one half of the E-clock rate when configured as master, and as fast as the E-clock rate when configured as slave. 7.2 Functional Description The central element in the SPI system is the block containing the shift register and the read data buffer. The system is single buffered in the transmit direction and double buffered in the receive direction. This means that new data for transmission cannot be written to the shifter until the previous transfer is complete; however, received data is transferred into a parallel read data buffer so the shifter is free to accept a second serial character. As long as the first character is read out of the read data buffer before the next serial character is ready to be transferred, no overrun condition occurs. A single MCU register address is used for reading data from the read data buffer, and for writing data to the shifter. The SPI status block represents the SPI status functions (transfer complete, write collision, and mode fault) performed by the serial peripheral status register (SPSR). The SPI control block represents those functions that control the SPI system through the serial peripheral control register (SPCR). Refer to Figure 7-1, which shows the SPI block diagram. 7.3 SPI Transfer Formats During an SPI transfer, data is simultaneously transmitted and received. A serial clock line synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows individual selection of a slave SPI device; slave devices that are not selected do not interfere with SPI bus activities. On a master SPI device, the select line can optionally be used to indicate a multiple master bus contention. Refer to Figure 7-2. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 77 Serial Peripheral Interface (SPI) PH2 (INTERNAL) MISO PD2 S M S M LSB 8-BIT SHIFT REGISTER READ DATA BUFFER CLOCK M CLOCK LOGIC SCK PD4 S SPR0 DWOM SS PD5 MSTR SPR1 SELECT SPI CLOCK (MASTER) MOSI PD3 PIN CONTROL LOGIC MSB DIVIDER ÷4 ÷16 ÷32 SPE ÷2 MSTR SPR0 SPR1 CPOL CPHA MSTR DWOM SPIE MODF WCOL SPIF SPI STATUS REGISTER SPE SPE SPI CONTROL SPI CONTROL REGISTER 8 SPI INTERRUPT REQUEST INTERNAL DATA BUS Figure 7-1. SPI Block Diagram MC68HC711D3 Data Sheet, Rev. 2.1 78 Freescale Semiconductor Clock Phase and Polarity Controls SCK CYCLE # 1 2 3 4 5 6 7 8 SCK (CPOL = 0) SCK (CPOL = 1) SAMPLE INPUT MSB (CPHA = 0) DATA OUT 6 5 4 3 2 1 LSB SAMPLE INPUT MSB (CPHA = 1) DATA OUT 6 5 4 3 2 1 LSB SS (TO SLAVE) SLAVE CPHA=1 TRANSFER IN PROGRESS 3 1. SS ASSERTED 2. MASTER WRITES TO SPDR 3. FIRST SCK EDGE 4. SPIF SET 5. SS NEGATED MASTER TRANSFER IN PROGRESS 2 4 SLAVE CPHA=0 TRANSFER IN PROGRESS 1 5 Figure 7-2. SPI Transfer Format 7.4 Clock Phase and Polarity Controls Software can select one of four combinations of serial clock phase and polarity using two bits in the SPI control register (SPCR). The clock polarity is specified by the CPOL control bit, which selects an active high or active low clock, and has no significant effect on the transfer format. The clock phase (CPHA) control bit selects one of two different transfer formats. The clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the phase and polarity are changed between transfers to allow a master device to communicate with peripheral slaves having different requirements. When CPHA equals 0, the slave select (SS) line must be negated and reasserted between each successive serial byte. Also, if the slave writes data to the SPI data register (SPDR) while SS is active low, a write collision error results. When CPHA equals 1, the SS line can remain low between successive transfers. 7.5 SPI Signals This subsection contains description of the four SPI signals: • Master in/slave out (MISO) • Master out/slave in (MOSI) • Serial clock (SCK) • Slave select (SS) 7.5.1 Master In/Slave Out (MISO) MISO is one of two unidirectional serial data signals. It is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 79 Serial Peripheral Interface (SPI) 7.5.2 Master Out/Slave In (MOSI) The MOSI line is the second of the two unidirectional serial data signals. It is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data. 7.5.3 Serial Clock (SCK) SCK, an input to a slave device, is generated by the master device and synchronizes data movement in and out of the device through the MOSI and MISO lines. Master and slave devices are capable of exchanging a byte of information during a sequence of eight clock cycles. Four possible timing relationships can be chosen by using control bits CPOL and CPHA in the serial peripheral control register (SPCR). Both master and slave devices must operate with the same timing. The SPI clock rate select bits, SPR1 and SPR0, in the SPCR of the master device, select the clock rate. In a slave device, SPR1 and SPR0 have no effect on the operation of the SPI. 7.5.4 Slave Select (SS) The SS input of a slave device must be externally asserted before a master device can exchange data with the slave device. SS must be low before data transactions and must stay low for the duration of the transaction. The SS line of the master must be held high. If it goes low, a mode fault error flag (MODF) is set in the serial peripheral status register (SPSR). To disable the mode fault circuit, write a 1 in bit 5 of the port D data direction register. This sets the SS pin to act as a general-purpose output. The other three lines are dedicated to the SPI whenever the serial peripheral interface is on. The state of the master and slave CPHA bits affects the operation of SS. CPHA settings should be identical for master and slave. When CPHA = 0, the shift clock is the OR of SS with SCK. In this clock phase mode, SS must go high between successive characters in an SPI message. When CPHA = 1, SS can be left low between successive SPI characters. In cases where there is only one SPI slave MCU, its SS line can be tied to VSS as long as only CPHA = 1 clock mode is used. 7.6 SPI System Errors Two system errors can be detected by the SPI system. The first type of error arises in a multiple-master system when more than one SPI device simultaneously tries to be a master. This error is called a mode fault. The second type of error, write collision, indicates that an attempt was made to write data to the SPDR while a transfer was in progress. When the SPI system is configured as a master and the SS input line goes to active low, a mode fault error has occurred — usually because two devices have attempted to act as master at the same time. In cases where more than one device is concurrently configured as a master, there is a chance of contention between two pin drivers. For push-pull CMOS drivers, this contention can cause permanent damage. The mode fault attempts to protect the device by disabling the drivers. The MSTR control bit in the SPCR and all four DDRD control bits associated with the SPI are cleared. An interrupt is generated subject to masking by the SPIE control bit and the I bit in the CCR. Other precautions may need to be taken to prevent driver damage. If two devices are made masters at the same time, mode fault does not help protect either one unless one of them selects the other as slave. The amount of damage possible depends on the length of time both devices attempt to act as master. MC68HC711D3 Data Sheet, Rev. 2.1 80 Freescale Semiconductor SPI Registers A write collision error occurs if the SPDR is written while a transfer is in progress. Because the SPDR is not double buffered in the transmit direction, writes to SPDR cause data to be written directly into the SPI shift register. Because this write corrupts any transfer in progress, a write collision error is generated. The transfer continues undisturbed, and the write data that caused the error is not written to the shifter. A write collision is normally a slave error because a slave has no control over when a master initiates a transfer. A master knows when a transfer is in progress, so there is no reason for a master to generate a write-collision error, although the SPI logic can detect write collisions in both master and slave devices. The SPI configuration determines the characteristics of a transfer in progress. For a master, a transfer begins when data is written to SPDR and ends when SPIF is set. For a slave with CPHA equal to zero, a transfer starts when SS goes low and ends when SS returns high. In this case, SPIF is set at the middle of the eighth SCK cycle when data is transferred from the shifter to the parallel data register, but the transfer is still in progress until SS goes high. For a slave with CPHA equal to one, transfer begins when the SCK line goes to its active level, which is the edge at the beginning of the first SCK cycle. The transfer ends in a slave in which CPHA equals one when SPIF is set. For a slave, after a byte transfer, SCK must be in inactive state for at least 2 E-clock cycles before the next byte transfer begins. 7.7 SPI Registers The three SPI registers, SPCR, SPSR, and SPDR, provide control, status, and data storage functions. This sub-section provides a description of how these registers are organized. 7.7.1 SPI Control Register Address: $0028 Read: Write: Reset: Bit 7 6 5 4 3 2 1 Bit 0 SPIE SPE DWOM MSTR CPOL CPHA SPR1 SPR0 0 0 0 0 0 1 U U U = Unaffected Figure 7-3. SPI Control Register (SPCR) SPIE — Serial Peripheral Interrupt Enable Bit 0 = SPI interrupt disabled 1 = SPI interrupt enabled SPE — Serial Peripheral System Enable Bit 0 = SPI off 1 = SPI on DWOM — Port D Wired-OR Mode Bit DWOM affects all six port D pins. 0 = Normal CMOS outputs 1 = Open-drain outputs MSTR — Master Mode Select Bit 0 = Slave mode 1 = Master mode MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 81 Serial Peripheral Interface (SPI) CPOL — Clock Polarity Bit When the clock polarity bit is cleared and data is not being transferred, the SCK pin of the master device has a steady state low value. When CPOL is set, SCK idles high. Refer to Figure 7-2 and 7.4 Clock Phase and Polarity Controls. CPHA — Clock Phase Bit The clock phase bit, in conjunction with the CPOL bit, controls the clock-data relationship between master and slave. The CPHA bit selects one of two different clocking protocols. Refer to Figure 7-2 and 7.4 Clock Phase and Polarity Controls. SPR1 and SPR0 — SPI Clock Rate Select Bits These two serial peripheral rate bits select one of four baud rates to be used as SCK if the device is a master; however, they have no effect in the slave mode. Table 7-1. SPI Clock Rates SPR1 and SPR0 E Clock Divide By Frequency at E = 2 MHz (Baud) 00 2 1.0 MHz 01 4 500 kHz 10 16 125 kHz 11 32 62.5 kHz 7.7.2 SPI Status Register Address: Read: Write: Reset: $0029 Bit 7 6 5 4 3 2 1 Bit 0 SPIF WCOL 0 MODF 0 0 0 0 0 0 0 0 0 0 0 0 Figure 7-4. SPI Status Register (SPSR) SPIF — SPI Transfer Complete Flag SPIF is set upon completion of data transfer between the processor and the external device. If SPIF goes high, and if SPIE is set, a serial peripheral interrupt is generated. To clear the SPIF bit, read the SPSR with SPIF set, then access the SPDR. Unless SPSR is read (with SPIF set) first, attempts to write SPDR are inhibited. WCOL — Write Collision Bit Clearing the WCOL bit is accomplished by reading the SPSR (with WCOL set) followed by an access of SPDR. Refer to 7.5.4 Slave Select (SS) and 7.6 SPI System Errors. 0 = No write collision 1 = Write collision Bit 5 — Not implemented Always reads 0. MODF — Mode Fault Bit To clear the MODF bit, read the SPSR (with MODF set), then write to the SPCR. Refer to 7.5.4 Slave Select (SS) and 7.6 SPI System Errors. 0 = No mode fault 1 = Mode fault MC68HC711D3 Data Sheet, Rev. 2.1 82 Freescale Semiconductor SPI Registers Bits 3–0 — Not implemented Always reads 0 7.7.3 SPI Data I/O Register The SPI data I/O register (SPDR) is used when transmitting or receiving data on the serial bus. Only a write to this register initiates transmission or reception of a byte, and this only occurs in the master device. At the completion of transferring a byte of data, the SPIF status bit is set in both the master and slave devices. A read of the SPDR is actually a read of a buffer. To prevent an overrun and the loss of the byte that caused the overrun, the first SPIF must be cleared by the time a second transfer of data from the shift register to the read buffer is initiated. Address: Read: Write: Reset: $002A Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Unaffected by reset Figure 7-5. SPI Data I/O Register (SPDR) NOTE SPI is double buffered in and single buffered out. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 83 Serial Peripheral Interface (SPI) MC68HC711D3 Data Sheet, Rev. 2.1 84 Freescale Semiconductor Chapter 8 Programmable Timer 8.1 Introduction The M68HC11 timing system is composed of five clock divider chains. The main clock divider chain includes a 16-bit free-running counter, which is driven by a programmable prescaler. The main timer's programmable prescaler provides one of the four clocking rates to drive the 16-bit counter. Two prescaler control bits select the prescale rate. The prescaler output divides the system clock by 1, 4, 8, or 16. Taps off of this main clocking chain drive circuitry that generates the slower clocks used by the pulse accumulator, the real-time interrupt (RTI), and the computer operating properly (COP) watchdog subsystems. Refer to Figure 8-1. All main timer system activities are referenced to this free-running counter. The counter begins incrementing from $0000 as the microcontroller unit (MCU) comes out of reset, and continues to the maximum count, $FFFF. At the maximum count, the counter rolls over to $0000, sets an overflow flag, and continues to increment. As long as the MCU is running in a normal operating mode, there is no way to reset, change, or interrupt the counting. The capture/compare subsystem features three input capture channels, four output compare channels, and one channel that can be selected to perform either input capture or output compare. Each of the three input capture functions has its own 16-bit input capture register (time capture latch) and each of the output compare functions has its own 16-bit compare register. All timer functions, including the timer overflow and RTI have their own interrupt controls and separate interrupt vectors. The pulse accumulator contains an 8-bit counter and edge select logic. The pulse accumulator can operate in either event counting or gated time accumulation modes. During event counting mode, the pulse accumulator's 8-bit counter increments when a specified edge is detected on an input signal. During gated time accumulation mode, an internal clock source increments the 8-bit counter while an input signal has a predetermined logic level. RTI is a programmable periodic interrupt circuit that permits pacing the execution of software routines by selecting one of four interrupt rates. The COP watchdog clock input (E÷215) is tapped off of the free-running counter chain. The COP automatically times out unless it is serviced within a specific time by a program reset sequence. If the COP is allowed to time out, a reset is generated, which drives the RESET pin low to reset the MCU and the external system. Refer to Table 8-1 for crystal related frequencies and periods. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 85 Programmable Timer OSCILLATOR AND CLOCK GENERATOR (DIVIDE BY FOUR) AS E CLOCK INTERNAL BUS CLOCK (PH2) PRESCALER (÷ 2, 4, 16, 32) SPR1 AND SPR0 SPI PRESCALER (÷ 1, 2, 4,....128) SCR2–SCR0 PRESCALER (÷ 1, 3, 4, 13) SCP1 AND SCP0 SCI RECEIVER CLOCK ÷16 6 E÷2 SCI TRANSMIT CLOCK PULSE ACCUMULATOR PRESCALER (÷ 1, 2, 4, 8) RTR1 AND RTR0 E ÷ 213 ÷4 PRESCALER (÷ 1, 4, 8, 16) PR1 AND PR0 REAL-TIME INTERRUPT E÷215 PRESCALER (÷1, 4, 16, 64) CR1 AND CR0 TOF FF1 TCNT FF2 S Q R Q S Q R Q FORCE COP RESET IC/OC CLEAR COP TIMER SYSTEM RESET Figure 8-1. Timer Clock Divider Chains MC68HC711D3 Data Sheet, Rev. 2.1 86 Freescale Semiconductor Timer Structure Table 8-1. Timer Summary Control Bits 4.0 MHz 1.0 MHz 1000 ns PR1 and PR0 XTAL Frequencies 8.0 MHz 12.0 MHz 2.0 MHz 3.0 MHz 500 ns 333 ns Main Timer Count Rates Other Rates (E) (1/E) 00 1 count — overflow — 1.0 µs 65.536 ms 500 ns 32.768 ms 333 ns 21.845 ms (E/1) (E/216) 01 1 count — overflow — 4.0 µs 262.14 ms 2.0 µs 131.07 ms 1.333 µs 87.381 ms (E/4) (E/218) 10 1 count — overflow — 8.0 µs 524.29 ms 4.0 µs 262.14 ms 2.667 µs 174.76 ms (E/8) (E/219) 11 1 count — overflow — 16.0 µs 1.049 s 8.0 µs 524.29 ms 5.333 µs 349.52 ms (E/16) (E/220) 8.2 Timer Structure Figure 8-2 shows the capture/compare system block diagram. The port A pin control block includes logic for timer functions and for general-purpose input/output (I/O). For pins PA2, PA1, and PA0, this block contains both the edge-detection logic and the control logic that enables the selection of which edge triggers an input capture. The digital level on PA2–PA0 can be read at any time (read PORTA register), even if the pin is being used for the input capture function. Pins PA6–PA4 are used for either general-purpose output or as output compare pins. Pin PA3 can be used for general-purpose I/O, input capture 4, output compare 5, or output compare 1. When one of these pins is being used for an output compare function, it cannot be written directly as if it were a general-purpose output. Each of the output compare functions (OC5–OC2) is related to one of the port A output pins. Output compare 1 (OC1) has extra control logic, allowing it optional control of any combination of the PA7–PA3 pins. The PA7 pin can be used as a general-purpose I/O pin, as an input to the pulse accumulator, or as an OC1 output pin. 8.3 Input Capture The input capture function records the time an external event occurs by latching the value of the free-running counter when a selected edge is detected at the associated timer input pin. Software can store latched values and use them to compute the periodicity and duration of events. For example, by storing the times of successive edges of an incoming signal, software can determine the period and pulse width of a signal. To measure period, two successive edges of the same polarity are captured. To measure pulse width, two alternate polarity edges are captured. In most cases, input capture edges are asynchronous to the internal timer counter, which is clocked relative to the PH2 clock. These asynchronous capture requests are synchronized to PH2 so that the latching occurs on the opposite half cycle of PH2 from when the timer counter is being incremented. This synchronization process introduces a delay from when the edge occurs to when the counter value is detected. Because these delays offset each other when the time between two edges is being measured, the delay can be ignored. When an input capture is being used with an output compare, there is a similar delay between the actual compare point and when the output pin changes state. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 87 Programmable Timer MCU E CLOCK TCNT (HI) PRESCALER — DIVIDE BY 1, 4, 8, 16 PR1 16-BIT FREE RUNNING COUNTER PR0 TOI 16-BIT COMPARATOR = OC1F TOC1 (LO) 9 TOF TAPS FOR RTL, COP WATCHDOG, AND PULSE ACCUMULATOR 16-BIT TIMER BUS TOC1 (HI) TCNT (LO) FORCE OUTPUT COMPARE INTERRUPT REQUESTS (FURTHER QUALIFIED BY I BIT IN CCR) TO PULSE ACCUMULATOR OC1I FOC1 OC2I 16-BIT COMPARATOR = TOC2 (HI) TOC2 (LO) TOC3 (LO) OC5 16-BIT COMPARATOR = TI4/O5 (LO) I4/O5F CLK IC2I CLK BIT 3 PA3/IC4/ OC5/OC1 BIT 2 PA2/IC1 BIT 1 PA1/IC2 BIT 0 PA0/IC3 3 2 IC2F TIC2 (LO) 16-BIT LATCH TIC3 (HI) CLK IC1I IC1F TIC1 (LO) 16-BIT LATCH TIC2 (HI) PA4/OC4/ OC1 4 FOC5 CFORC TIC1 (HI) BIT 4 IC4 I4/O5 CLK PA5/OC3/ OC1 5 FOC4 I4/O5I 16-BIT LATCH BIT 5 OC4F TOC4 (LO) 16-BIT LATCH PA6/OC2/ OC1 6 FOC3 16-BIT COMPARATOR = TI4/O5 (HI) BIT 6 OC3F OC4I TOC4 (HI) PA7/OC1/ PAI 7 FOC2 16-BIT COMPARATOR = PORT A PINS BIT 7 OC2F OC3I TOC3 (HI) 8 IC3I IC3F 1 TIC3 (LO) TFLG 1 STATUS FLAGS TMSK 1 INTERRUPT ENABLES PORT A PIN CONTROL Figure 8-2. Capture/Compare Block Diagram The control and status bits that implement the input capture functions are contained in the PACTL, TCTL2, TMSK1, and TFLG1 registers. To configure port A bit 3 as an input capture, clear the DDRA3 bit of the PACTL register. Note that this bit is cleared out of reset. To enable PA3 as the fourth input capture, set the I4/O5 bit in the PACTL register. Otherwise, PA3 is configured as a fifth output compare out of reset, with bit I4/O5 being cleared. If the DDRA3 bit is set (configuring PA3 as an output), and IC4 is enabled, then writes to PA3 cause edges on the pin to result in input captures. Writing to TI4/O5 has no effect when the TI4/O5 register is acting as IC4. MC68HC711D3 Data Sheet, Rev. 2.1 88 Freescale Semiconductor Input Capture 8.3.1 Timer Control 2 Register Use the control bits of timer control 2 register (TCTL2) to program input capture functions to detect a particular edge polarity on the corresponding timer input pin. Each of the input capture functions can be independently configured to detect rising edges only, falling edges only, any edge (rising or falling), or to disable the input capture function. The input capture functions operate independently of each other and can capture the same TCNT value if the input edges are detected within the same timer count cycle. Address: Read: Write: Reset: $0021 Bit 7 6 5 4 3 2 1 Bit 0 EDG4B EDG4A EDG1B EDG1A EDG2B EDG2A EDG3B EDG3A 0 0 0 0 0 0 0 0 Figure 8-3. Timer Control 2 Register (TCTL2) EDGxB and EDGxA — Input Capture Edge Control There are four pairs of these bits. Each pair is cleared to 0 by reset and must be encoded to configure the corresponding input capture edge detector circuit. IC4 functions only if the I4/O5 bit in PACTL is set. Refer to Table 8-2 for timer control configuration. Table 8-2. Timer Control Configuration EDGxB EDGxA Configuration 0 0 Capture disabled 0 1 Capture on rising edges only 1 0 Capture on falling edges only 1 1 Capture on any edge 8.3.2 Timer Input Capture Registers When an edge has been detected and synchronized, the 16-bit free-running counter value is transferred into the input capture register pair as a single 16-bit parallel transfer. Timer counter value captures and timer counter incrementing occur on opposite half-cycles of the phase two clock so that the count value is stable whenever a capture occurs. The timer input capture (TICx) registers are not affected by reset. Input capture values can be read from a pair of 8-bit read-only registers. A read of the high-order byte of an input capture register pair inhibits a new capture transfer for one bus cycle. If a double-byte read instruction, such as LDD, is used to read the captured value, coherency is assured. When a new input capture occurs immediately after a high-order byte read, transfer is delayed for an additional cycle but the value is not lost. Address: $0010 — TIC1 (High) Bit 15 14 13 Read: Bit 15 Bit 14 Bit 13 Write: Reset: = Unimplemented 12 Bit 12 11 Bit 11 10 Bit 10 9 Bit 9 Bit 8 Bit 8 Unaffected by reset Figure 8-4. Timer Input Capture Registers (TICx) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 89 Programmable Timer Address: $0011 — TIC1 (Low) Bit 7 6 5 Read: Bit 7 Bit 6 Bit 5 Write: Reset: Address: $0012 — TIC2 (High) Bit 15 14 13 Read: Bit 15 Bit 14 Bit 13 Write: Reset: Address: $0013 — TIC2 (Low) Bit 7 6 5 Read: Bit 7 Bit 6 Bit 5 Write: Reset: Address: $0014 — TIC3 (High) Bit 15 14 13 Read: Bit 15 Bit 14 Bit 13 Write: Reset: Address: $0015 — TIC3 (Low) Bit 7 6 5 Read: Bit 7 Bit 6 Bit 5 Write: Reset: = Unimplemented 4 Bit 4 3 Bit 3 2 Bit 2 1 Bit 1 Bit 0 Bit 0 10 Bit 10 9 Bit 9 Bit 8 Bit 8 2 Bit 2 1 Bit 1 Bit 0 Bit 0 10 Bit 10 9 Bit 9 Bit 8 Bit 8 2 Bit 2 1 Bit 1 Bit 0 Bit 0 Unaffected by reset 12 Bit 12 11 Bit 11 Unaffected by reset 4 Bit 4 3 Bit 3 Unaffected by reset 12 Bit 12 11 Bit 11 Unaffected by reset 4 Bit 4 3 Bit 3 Unaffected by reset Figure 8-4. Timer Input Capture Registers (TICx) (Continued) 8.3.3 Timer Input Capture 4/Output Compare 5 Register Use timer input capture 4/output compare 5 (TI4/O5) as either an input capture register or an output compare register, depending on the function chosen for the I4/O5 pin. To enable it as an input capture pin, set the I4/O5 bit in the pulse accumulator control register (PACTL) to logic level 1. To use it as an output compare register, set the I4/O5 bit to a logic level 0. Refer to 8.7 Pulse Accumulator. Address: $001E — TI4/O5 (High) Bit 15 14 13 Read: Bit 15 Bit 14 Bit 13 Write: Reset: 1 1 1 Address: $001F — TI4/O5 (Low) Bit 7 6 5 Read: Bit 7 Bit 6 Bit 5 Write: Reset: 1 1 1 = Unimplemented 12 Bit 12 11 Bit 11 10 Bit 10 9 Bit 9 Bit 8 Bit 8 1 1 1 1 1 4 Bit 4 3 Bit 3 2 Bit 2 1 Bit 1 Bit 0 Bit 0 1 1 1 1 1 Figure 8-5. Timer Input Capture 4/Output Compare 5 Register (TI4/O5) MC68HC711D3 Data Sheet, Rev. 2.1 90 Freescale Semiconductor Output Compare (OC) 8.4 Output Compare (OC) Use the output compare (OC) function to program an action to occur at a specific time — when the 16-bit counter reaches a specified value. For each of the five output compare functions, there is a separate 16-bit compare register and a dedicated 16-bit comparator. The value in the compare register is compared to the value of the free-running counter on every bus cycle. When the compare register matches the counter value, an output compare status flag is set. The flag can be used to initiate the automatic actions for that output compare function. To produce a pulse of a specific duration, write to the output compare register a value representing the time the leading edge of the pulse is to occur. The output compare circuit is configured to set the appropriate output either high or low, depending on the polarity of the pulse being produced. After a match occurs, the output compare register is reprogrammed to change the output pin back to its inactive level at the next match. A value representing the width of the pulse is added to the original value, and then is written to the output compare register. Because the pin state changes occur at specific values of the free-running counter, the pulse width can be controlled accurately at the resolution of the free-running counter, independent of software latencies. To generate an output signal of a specific frequency and duty cycle, repeat this pulse-generating procedure. There are four 16-bit read/write output compare registers: TOC1, TOC2, TOC3, and TOC4, and the TI4/O5 register, which functions under software control as either IC4 or OC5. Each of the OC registers is set to $FFFF on reset. A value written to an OC register is compared to the free-running counter value during each E-clock cycle. If a match is found, the particular output compare flag is set in timer interrupt flag register 1 (TFLG1). If that particular interrupt is enabled in the timer interrupt mask register 1 (TMSK1), an interrupt is generated. In addition to an interrupt, a specified action can be initiated at one or more timer output pins. For OC5–OC2, the pin action is controlled by pairs of bits (OMx and OLx) in the TCTL1 register. The output action is taken on each successful compare, regardless of whether the OCxF flag in the TFLG1 register was previously cleared. OC1 is different from the other output compares in that a successful OC1 compare can affect any or all five of the OC pins. The OC1 output action taken when a match is found is controlled by two 8-bit registers with three bits unimplemented: the output compare 1 mask register, OC1M, and the output compare 1 data register, OC1D. OC1M specifies which port A outputs are to be used, and OC1D specifies what data is placed on these port pins. 8.4.1 Timer Output Compare Registers All output compare registers are 16-bit read-write. Each is initialized to $FFFF at reset. If an output compare register is not used for an output compare function, it can be used as a storage location. A write to the high-order byte of an output compare register pair inhibits the output compare function for one bus cycle. This inhibition prevents inappropriate subsequent comparisons. Coherency requires a complete 16-bit read or write. However, if coherency is not needed, byte accesses can be used. For output compare functions, write a comparison value to output compare registers TOC1–TOC4 and TI4/O5. When TCNT value matches the comparison value, specified pin actions occur. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 91 Programmable Timer Address: $0016 — TOC1 (High) Bit 15 14 Read: Bit 15 Bit 14 Write: Reset: 1 1 Address: $0017 — TOC1 (Low) Bit 7 6 Read: Bit 7 Bit 6 Write: Reset: 1 1 Address: Read: Write: Reset: $0018 — TOC2 (High) Bit 15 14 13 12 11 10 9 Bit 8 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 5 4 3 2 1 Bit 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 13 12 11 10 9 Bit 8 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 1 1 5 4 3 2 1 Bit 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 13 12 11 10 9 Bit 8 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 5 4 3 2 1 Bit 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 13 12 11 10 9 Bit 8 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 1 1 1 1 1 1 5 4 3 2 1 Bit 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 1 1 1 1 Address: $0019 — TOC2 (Low) Bit 7 6 Read: Bit 7 Bit 6 Write: Reset: 1 1 Address: $001A — TOC3 (High) Bit 15 14 Read: Bit 15 Bit 14 Write: Reset: 1 1 Address: $001B — TOC3 (Low) Bit 7 6 Read: Bit 7 Bit 6 Write: Reset: 1 1 Address: $001C — TOC4 (High) Bit 15 14 Read: Bit 15 Bit 14 Write: Reset: 1 1 Address: $001D — TOC4 (Low) Bit 7 6 Read: Bit 7 Bit 6 Write: Reset: 1 1 Figure 8-6. Timer Output Capture Registers (TOCx) MC68HC711D3 Data Sheet, Rev. 2.1 92 Freescale Semiconductor Output Compare (OC) 8.4.2 Timer Compare Force Register The timer compare force register (CFORC) allows forced early compares. FOC1–FOC5 correspond to the five output compares. These bits are set for each output compare that is to be forced. The action taken as a result of a forced compare is the same as if there were a match between the OCx register and the free-running counter, except that the corresponding interrupt status flag bits are not set. The forced channels trigger their programmed pin actions to occur at the next timer count transition after the write to CFORC. The CFORC bits should not be used on an output compare function that is programmed to toggle its output on a successful compare because a normal compare that occurs immediately before or after the force can result in an undesirable operation. Address: Read: Write: Reset: $000B Bit 7 6 5 4 3 2 1 Bit 0 FOC1 FOC2 FOC3 FOC4 FOC5 0 0 0 0 0 0 0 0 0 0 0 Figure 8-7. Timer Compare Force Register (CFORC) FOC1–FOC5 — Write 1s to Force Compare Bits 0 = Not affected 1 = Output x action occurs Bits 2–0 — Not implemented, always read 0. 8.4.3 Output Compare 1 Mask Register Use OC1M with OC1 to specify the bits of port A that are affected by a successful OC1 compare. The bits of the OC1M register correspond to PA7–PA3. Address: Read: Write: Reset: $000C Bit 7 6 5 4 3 2 1 Bit 0 OC1M7 OC1M6 OC1M5 OC1M4 OC1M3 0 0 0 0 0 0 0 0 0 0 0 Figure 8-8. Output Compare 1 Mask Register (OC1M) OC1M7–OC1M3 — Output Compare Masks 0 = OC1 disabled 1 = OC1 enabled to control the corresponding pin of port A Bits 2–0 — Not implemented; always read 0. Set bit(s) to enable OC1 to control corresponding pin(s) of port A. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 93 Programmable Timer 8.4.4 Output Compare 1 Data Register Use this register with OC1 to specify the data that is to be stored on the affected pin of port A after a successful OC1 compare. When a successful OC1 compare occurs, a data bit in OC1D is stored in the corresponding bit of port A for each bit that is set in OC1M. Address: Read: Write: Reset: $000D Bit 7 6 5 4 3 2 1 Bit 0 OC1D7 OC1D6 OC1D5 OC1D4 OC1D3 0 0 0 0 0 0 0 0 0 0 0 Figure 8-9. Output Compare 1 Data Register (OC1D) If OC1Mx is set, data in OC1Dx is output to port A bit x on successful OC1 compares. Bits 2–0 — Not implemented; always read 0. 8.4.5 Timer Counter Register The 16-bit read-only timer count register (TCNT) contains the prescaled value of the 16-bit timer. A full counter read addresses the most significant byte (MSB) first. A read of this address causes the least significant byte (LSB) to be latched into a buffer for the next CPU cycle so that a double-byte read returns the full 16-bit state of the counter at the time of the MSB read cycle. Address: $000E — TCNT High Bit 15 14 Read: Bit 15 Bit 14 Write: Reset: 0 0 13 Bit 13 12 Bit 12 11 Bit 11 10 Bit 10 9 Bit 9 Bit 8 Bit 08 0 0 0 0 0 0 4 Bit 4 3 Bit 3 2 Bit 2 1 Bit 1 Bit 0 Bit 0 0 0 0 0 0 Address: $000F — TCNT Low Bit 7 6 5 Read: Bit 7 Bit 6 Bit 5 Write: Reset: 0 0 0 = Unimplemented Figure 8-10. Timer Counter Registers (TCNT) In normal modes, TCNT is read-only. MC68HC711D3 Data Sheet, Rev. 2.1 94 Freescale Semiconductor Output Compare (OC) 8.4.6 Timer Control 1 Register The bits of the timer control 1 register (TCTL1) specify the action taken as a result of a successful OCx compare. Address: Read: Write: Reset: $0020 Bit 7 6 5 4 3 2 1 Bit 0 OM2 OL2 OM3 OL3 OM4 OL4 OM5 OL5 0 0 0 0 0 0 0 0 Figure 8-11. Timer Control 1 Register (TCTL1) OM2–OM5 — Output Mode Bits OL2–OL5 — Output Level Bits These control bit pairs are encoded to specify the action taken after a successful OCx compare. OC5 functions only if the I4/O5 bit in the PACTL register is clear. Refer to Table 8-3 for the coding. Table 8-3. Timer Output Compare Actions OMx OLx Action Taken on Successful Compare 0 0 Timer disconnected from output pin logic 0 1 Toggle OCx output line 1 0 Clear OCx output line to 0 1 1 Set OCx output line to 1 8.4.7 Timer Interrupt Mask 1 Register The timer interrupt mask 1 register (TMSK1) is an 8-bit register used to enable or inhibit the timer input capture and output compare interrupts. Address: Read: Write: Reset: $0022 Bit 7 6 5 4 3 2 1 Bit 0 OC1I OC2I OC3I OC4I I4/O5I IC1I IC2I IC3I 0 0 0 0 0 0 0 0 Figure 8-12. Timer Interrupt Mask 1 Register (TMSK1) OC1I–OC4I — Output Compare x Interrupt Enable Bits If the OCxI enable bit is set when the OCxF flag bit is set, a hardware interrupt sequence is requested. I4/O5I — Input Capture 4 or Output Compare 5 Interrupt Enable Bit When I4/O5 in PACTL is one, I4/O5I is the input capture 4 interrupt enable bit. When I4/O5 in PACTL is 0, I4/O5I is the output compare 5 interrupt enable bit. IC1I–IC3I — Input Capture x Interrupt Enable Bits If the ICxI enable bit is set when the ICxF flag bit is set, a hardware interrupt sequence is requested. NOTE Bits in TMSK1 correspond bit for bit with flag bits in TFLG1. Ones in TMSK1 enable the corresponding interrupt sources. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 95 Programmable Timer 8.4.8 Timer Interrupt Flag 1 Register The timer interrupt flag 1 register (TFLG1) bits indicate when timer system events have occurred. Coupled with the bits of TMSK1, the bits of TFLG1 allow the timer subsystem to operate in either a polled or interrupt driven system. Each bit of TFLG1 corresponds to a bit in TMSK1 in the same position. Address: Read: Write: Reset: $0023 Bit 7 6 5 4 3 2 1 Bit 0 OC1F OC2F OC3F OC4F I4/O5F IC1F IC2F IC3F 0 0 0 0 0 0 0 0 Figure 8-13. Timer Interrupt Flag 1 Register (TFLG1) Clear flags by writing a 1 to the corresponding bit position(s). OC1F–OC5F — Output Compare x Flag Set each time the counter matches output compare x value I4/O5F — Input Capture 4/Output Compare 5 Flag Set by IC4 or OC5, depending on the function enabled by I4/O5 bit in PACTL IC1F–IC3F — Input Capture x Flag Set each time a selected active edge is detected on the ICx input line 8.4.9 Timer Interrupt Mask 2 Register The timer interrupt mask 1 register (TMSK2) is an 8-bit register used to enable or inhibit timer overflow and real-time interrupts. The timer prescaler control bits are included in this register. Address: Read: Write: Reset: $0024 Bit 7 6 5 4 3 2 1 Bit 0 TOI RTII PAOVI PAII 0 0 PR1 PR0 0 0 0 0 0 0 0 0 Figure 8-14. Timer Interrupt Mask 2 Register (TMSK2) TOI — Timer Overflow Interrupt Enable Bit 0 = TOF interrupts disabled 1 = Interrupt requested when TOF is set to 1 RTII — Real-Time Interrupt Enable Bit Refer to 8.5 Real-Time Interrupt. PAOVI — Pulse Accumulator Overflow Interrupt Enable Bit Refer to 8.7 Pulse Accumulator. PAII — Pulse Accumulator Input Edge Interrupt Enable Bit Refer to 8.7 Pulse Accumulator. NOTE Bits in TMSK2 correspond bit for bit with flag bits in TFLG2. Ones in TMSK2 enable the corresponding interrupt sources. MC68HC711D3 Data Sheet, Rev. 2.1 96 Freescale Semiconductor Output Compare (OC) PR1 and PR0 — Timer Prescaler Select Bits These bits are used to select the prescaler divide-by ratio. In normal modes, PR1 and PR0 can be written once only, and the write must be within 64 cycles after reset. Refer to Table 8-4 for specific timing values. Table 8-4. Timer Prescale PR1 and PR0 00 01 10 11 Prescaler 1 4 8 16 8.4.10 Timer Interrupt Flag 2 Register The timer interrupt flag 2 register (TFLG2) bits indicate when certain timer system events have occurred. Coupled with the four high-order bits of TMSK2, the bits of TFLG2 allow the timer subsystem to operate in either a polled or interrupt driven system. Each bit of TFLG2 corresponds to a bit in TMSK2 in the same position. Address: Read: Write: Reset: $0025 Bit 7 6 5 4 3 2 1 Bit 0 TOF RTIF PAOVF PAIF 0 0 0 0 0 0 0 0 0 0 0 0 Figure 8-15. Timer Interrupt Flag 2 Register (TFLG2) Clear flags by writing a 1 to the corresponding bit position(s). TOF — Timer Overflow Interrupt Flag Set when TCNT changes from $FFFF to $0000 RTIF — Real-Time (Periodic) Interrupt Flag Refer to 8.5 Real-Time Interrupt. PAOVF — Pulse Accumulator Overflow Interrupt Flag Refer to 8.7 Pulse Accumulator. PAIF — Pulse Accumulator Input Edge Interrupt Flag Refer to 8.7 Pulse Accumulator. Bits 3–0 — Not implemented Always read 0. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 97 Programmable Timer 8.5 Real-Time Interrupt The real-time interrupt feature, used to generate hardware interrupts at a fixed periodic rate, is controlled and configured by two bits (RTR1 and RTR0) in the pulse accumulator control (PACTL) register. The RTII bit in the TMSK2 register enables the interrupt capability. The four different rates available are a product of the MCU oscillator frequency and the value of bits RTR1 and RTR0. Refer to Table 8-5 for the periodic real-time interrupt rates. Table 8-5. Periodic Real-Time Interrupt Rates RTR1 and RTR0 E = 1 MHz E = 2 MHz E = 3 MHz E = X MHz 00 01 10 11 2.731 ms 5.461 ms 10.923 ms 21.845 ms 4.096 ms 8.192 ms 16.384 ms 32.768 ms 8.192 ms 16.384 ms 32.768 ms 65.536 ms (E/213) (E/214) (E/215) (E/216) The clock source for the RTI function is a free-running clock that cannot be stopped or interrupted except by reset. This clock causes the time between successive RTI timeouts to be a constant that is independent of the software latencies associated with flag clearing and service. For this reason, an RTI period starts from the previous timeout, not from when RTIF is cleared. Every timeout causes the RTIF bit in TFLG2 to be set, and if RTII is set, an interrupt request is generated. After reset, one entire real-time interrupt period elapses before the RTIF flag is set for the first time. Refer to the TMSK2, TFLG2, and PACTL registers. 8.5.1 Timer Interrupt Mask 2 Register The timer interrupt mask 2 register (TMSK2) contains the real-time interrupt enable bits. Address: Read: Write: Reset: $0024 Bit 7 6 5 4 3 2 1 Bit 0 TOI RTII PAOVI PAII 0 0 PR1 PR0 0 0 0 0 0 0 0 0 Figure 8-16. Timer Interrupt Mask 2 Register (TMSK2) TOI — Timer Overflow Interrupt Enable Bit Refer to 8.4 Output Compare (OC). RTII — Real-Time Interrupt Enable Bit 0 = RTIF interrupts disabled 1 = Interrupt requested PAOVI — Pulse Accumulator Overflow Interrupt Enable Bit Refer to 8.7 Pulse Accumulator. PAII — Pulse Accumulator Input Edge Bit Refer to 8.7 Pulse Accumulator. Bits 3–2 — Unimplemented Always read 0. MC68HC711D3 Data Sheet, Rev. 2.1 98 Freescale Semiconductor Real-Time Interrupt PR1 and PR0 — Timer Prescaler Select Bits Refer to Table 8-4. NOTE Bits in TMSK2 correspond bit for bit with flag bits in TFLG2. Ones in TMSK2 enable the corresponding interrupt sources. 8.5.2 Timer Interrupt Flag 2 Register Bits of the timer interrupt flag 2 register (TFLG2) indicate the occurrence of timer system events. Coupled with the four high-order bits of TMSK2, the bits of TFLG2 allow the timer subsystem to operate in either a polled or interrupt driven system. Each bit of TFLG2 corresponds to a bit in TMSK2 in the same position. Address: $0025 Read: Write: Reset: Bit 7 6 5 4 3 2 1 Bit 0 TOF RTIF PAOVF PAIF 0 0 0 0 0 0 0 0 0 0 0 0 Figure 8-17. Timer Interrupt Flag 2 Register (TFLG2) Clear flags by writing a 1 to the corresponding bit position(s). TOF — Timer Overflow Interrupt Flag Set when TCNT changes from $FFFF to $0000 RTIF — Real-Time Interrupt Flag The RTIF status bit is automatically set to 1 at the end of every RTI period. To clear RTIF, write a byte to TFLG2 with bit 6 set. PAOVF — Pulse Accumulator Overflow Interrupt Flag Refer to 8.7 Pulse Accumulator. PAIF — Pulse Accumulator Input Edge Interrupt Flag Refer to 8.7 Pulse Accumulator. Bits 3–0 — Not implemented Always read 0. 8.5.3 Pulse Accumulator Control Register Bits RTR1 and RTR0 of the pulse accumulator control register (PACTL) select the rate for the real-time interrupt system. Bit DDRA3 determines whether port A bit three is an input or an output when used for general-purpose I/O. The remaining bits control the pulse accumulator. Address: $0026 Read: Write: Reset: Bit 7 6 5 4 3 2 1 Bit 0 DDRA7 PAEN PAMOD PEDGE DDRA3 I4/O5 RTR1 RTR0 0 0 0 0 0 0 0 0 Figure 8-18. Pulse Accumulator Control Register (PACTL) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 99 Programmable Timer DDRA7 — Data Direction Control for Port A Bit 7 Refer to 8.7 Pulse Accumulator. PAEN — Pulse Accumulator System Enable Bit Refer to 8.7 Pulse Accumulator. PAMOD — Pulse Accumulator Mode Bit Refer to 8.7 Pulse Accumulator. PEDGE — Pulse Accumulator Edge Control Bit Refer to 8.7 Pulse Accumulator. DDRA3 — Data Direction Register for Port A Bit 3 Refer to Chapter 5 Input/Output (I/O) Ports. I4/O5 — Input Capture 4/Output Compare 5 Bit Refer to 8.3 Input Capture. RTR1 and RTR0 — RTI Interrupt Rate Select Bits These two bits determine the rate at which the RTI system requests interrupts. The RTI system is driven by an E divided by 213 rate clock that is compensated so it is independent of the timer prescaler. These two control bits select an additional division factor. See Table 8-6. Table 8-6. Real-Time Interrupt Rates RTR1 and RTR0 E = 1 MHz E = 2 MHz E = 3 MHz E = X MHz 00 01 10 11 2.731 ms 5.461 ms 10.923 ms 21.845 ms 4.096 ms 8.192 ms 16.384 ms 32.768 ms 8.192 ms 16.384 ms 32.768 ms 65.536 ms (E/213) (E/214) (E/215) (E/216) 8.6 Computer Operating Properly Watchdog Function The clocking chain for the COP function, tapped off of the main timer divider chain, is only superficially related to the main timer system. The CR1 and CR0 bits in the OPTION register and the NOCOP bit in the CONFIG register determine the status of the COP function. Refer to Chapter 4 Resets, Interrupts, and Low-Power Modes for a more detailed discussion of the COP function. 8.7 Pulse Accumulator The MC68HC711D3 has an 8-bit counter that can be configured to operate either as a simple event counter or for gated time accumulation, depending on the state of the PAMOD bit in the PACTL register. Refer to the pulse accumulator block diagram, Figure 8-19. In the event counting mode, the 8-bit counter is clocked to increasing values by an external pin. The maximum clocking rate for the external event counting mode is the E clock divided by two. In gated time accumulation mode, a free-running E-clock ÷ 64 signal drives the 8-bit counter, but only while the external PAI pin is activated. Refer to Table 8-7. The pulse accumulator counter can be read or written at any time. Pulse accumulator control bits are also located within two timer registers, TMSK2 and TFLG2, as described here. MC68HC711D3 Data Sheet, Rev. 2.1 100 Freescale Semiconductor Pulse Accumulator 1 INTERRUPT REQUESTS TMSK2 INT ENABLES PAIF PAOVF PAII PAOVI 2 TFLG2 INTERRUPT STATUS PAI EDGE DISABLE FLAG SETTING E ÷ 64 CLOCK (FROM MAIN TIMER) INPUT BUFFER AND EDGE DETECTION PA7/ PAI/OC1 PACNT 8-BIT COUNTER ENABLE OUTPUT BUFFER PEDGE PAMOD PAEN PAEN DDRA7 FROM MAIN TIMER OC1 OVERFLOW 2:1 MUX PACTL CONTROL INTERNAL DATA BUS Figure 8-19. Pulse Accumulator Table 8-7. Pulse Accumulator Timing in Gated Mode Common XTAL Frequencies Selected Crystal 4.0 MHz 8.0 MHz 12.0 MHz CPU Clock (E) 1.0 MHz 2.0 MHz 3.0 MHz Cycle Time (1/E) 1000 ns 500 ns 333 ns 1 count overflow - 64.0 µs 16.384 ms 32.0 µs 8.192 ms 21.33 µs 5.461 ms 6 (E/2 ) (E/214) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 101 Programmable Timer 8.7.1 Pulse Accumulator Control Register Four of the pulse accumulator control register (PACTL) bits control an 8-bit pulse accumulator system. Another bit enables either the OC5 function or the IC4 function, while two other bits select the rate for the real-time interrupt system. Address: Read: Write: Reset: $0026 Bit 7 6 5 4 3 2 1 Bit 0 DDRA7 PAEN PAMOD PEDGE DDRA3 I4/O5 RTR1 RTR0 0 0 0 0 0 0 0 0 Figure 8-20. Pulse Accumulator Control Register (PACTL) DDRA7 — Data Direction Control for Port A Bit 7 The pulse accumulator uses port A bit 7 as the PAI input, but the pin can also be used as general-purpose I/O or as an output compare. NOTE Even when port A bit 7 is configured as an output, the pin still drives the input to the pulse accumulator. Refer to Chapter 5 Input/Output (I/O) Ports for more information. PAEN — Pulse Accumulator System Enable Bit 0 = Pulse accumulator disabled 1 = Pulse accumulator enabled PAMOD — Pulse Accumulator Mode Bit 0 = Event counter 1 = Gated time accumulation PEDGE — Pulse Accumulator Edge Control Bit This bit has different meanings depending on the state of the PAMOD bit, as shown in Table 8-8. Table 8-8. Pulse Accumulator Edge Control PAMOD PEDGE Action on Clock 0 0 PAI falling edge increments the counter. 0 1 PAI rising edge increments the counter. 1 0 A 0 on PAI inhibits counting. 1 1 A 1 on PAI inhibits counting. DDRA3 — Data Direction Register for Port A Bit 3 Refer to Chapter 5 Input/Output (I/O) Ports. I4/O5 — Input Capture 4/Output Compare 5 Bit Refer to 8.3 Input Capture. RTR1 and RTR0 — RTI Interrupt Rate Select Bits Refer to 8.5 Real-Time Interrupt. MC68HC711D3 Data Sheet, Rev. 2.1 102 Freescale Semiconductor Pulse Accumulator 8.7.2 Pulse Accumulator Count Register The 8-bit read/write pulse accumulator count register (PACNT) contains the count of external input events at the PAI input or the accumulated count. The counter is not affected by reset and can be read or written at any time. Counting is synchronized to the internal PH2 clock so that incrementing and reading occur during opposite half cycles. Address: Read: Write: Reset: $0027 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Unaffected by reset Figure 8-21. Pulse Accumulator Count Register (PACNT) 8.7.3 Pulse Accumulator Status and Interrupt Bits The pulse accumulator control bits, PAOVI and PAII, PAOVF, and PAIF are located within timer registers TMSK2 and TFLG2. PAOVI and PAOVF — Pulse Accumulator Interrupt Enable and Overflow Flag The PAOVF status bit is set each time the pulse accumulator count rolls over from $FF to $00. To clear this status bit, write a 1 in the corresponding data bit position (bit 5) of the TFLG2 register. The PAOVI control bit allows configuring the pulse accumulator overflow for polled or interrupt-driven operation and does not affect the state of PAOVF. When PAOVI is 0, pulse accumulator overflow interrupts are inhibited, and the system operates in a polled mode, which requires PAOVF to be polled by user software to determine when an overflow has occurred. When the PAOVI control bit is set, a hardware interrupt request is generated each time PAOVF is set. Before leaving the interrupt service routine, software must clear PAOVF by writing to the TFLG2 register. PAII and PAIF — Pulse Accumulator Input Edge Interrupt Enable and Flag The PAIF status bit is automatically set each time a selected edge is detected at the PA7/PAI/OC1 pin. To clear this status bit, write to the TFLG2 register with a 1 in the corresponding data bit position (bit 4). The PAII control bit allows configuring the pulse accumulator input edge detect for polled or interrupt-driven operation but does not affect setting or clearing the PAIF bit. When PAII is 0, pulse accumulator input interrupts are inhibited, and the system operates in a polled mode. In this mode, the PAIF bit must be polled by user software to determine when an edge has occurred. When the PAII control bit is set, a hardware interrupt request is generated each time PAIF is set. Before leaving the interrupt service routine, software must clear PAIF by writing to the TFLG register. Address: Read: Write: Reset: $0024 Bit 7 6 5 4 3 2 1 Bit 0 TOI RTII PAOVI PAII 0 0 PR1 PR0 0 0 0 0 0 0 0 0 Figure 8-22. Timer Interrupt Mask 2 Register (TMSK2) Address: Read: Write: Reset: $0025 Bit 7 6 5 4 3 2 1 Bit 0 TOF RTIF PAOVF PAIF 0 0 0 0 0 0 0 0 0 0 0 0 Figure 8-23. Timer Interrupt Flag 2 Register (TFLG2) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 103 Programmable Timer MC68HC711D3 Data Sheet, Rev. 2.1 104 Freescale Semiconductor Chapter 9 Electrical Characteristics 9.1 Introduction This section contains electrical specifications. 9.2 Maximum Ratings Maximum ratings are the extreme limits to which the microcontroller unit (MCU) can be exposed without permanently damaging it. NOTE This device is not guaranteed to operate properly at the maximum ratings. Refer to 9.5 DC Electrical Characteristics for guaranteed operating conditions. Rating Symbol Value Unit Supply voltage VDD –0.3 to +7.0 V Input voltage VIn –0.3 to +7.0 V Current drain per pin(1) Excluding VDD, VSS, VRH, and VRL ID 25 mA TSTG –55 to +150 °C Storage temperature 1. One pin at a time, observing maximum power dissipation limits NOTE This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum-rated voltages to this high-impedance circuit. For proper operation, it is recommended that VIn and VOut be constrained to the range VSS ≤ (VIn or VOut) ≤ VDD. Reliability of operation is enhanced if unused inputs are connected to an appropriate logic voltage level (for example, either VSS or VDD). MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 105 Electrical Characteristics 9.3 Functional Operating Temperature Range Rating Symbol Value Unit TA TL to TH –40 to +85 –40 to +105 °C Symbol Value Unit Average junction temperature TJ TA + (PD × ΘJA) °C Ambient temperature TA User-determined °C Package thermal resistance (junction-to-ambient) 40-pin plastic dual in-line package (DIP) 44-pin plastic leaded chip carrier (PLCC) 44-pin plastic quad flat pack (QFP) ΘJA 50 50 85 °C/W Total power dissipation(1) PD PINT + PI/O K / TJ + 273°C W Device internal power dissipation PINT IDD × VDD W I/O pin power dissipation(2) PI/O User-determined W Operating temperature range MC68HC711D3 MC68HC711D3V 9.4 Thermal Characteristics Characteristic A constant(3) K PD × (TA + 273°C) + ΘJA × PD2 W/°C 1. This is an approximate value, neglecting PI/O. 2. For most applications, PI/O ≤ PINT and can be neglected. 3. K is a constant pertaining to the device. Solve for K with a known TA and a measured PD (at equilibrium). Use this value of K to solve for PD and TJ, iteratively, for any value of TA. MC68HC711D3 Data Sheet, Rev. 2.1 106 Freescale Semiconductor DC Electrical Characteristics 9.5 DC Electrical Characteristics Characteristic(1) Output voltage(2) ILoad = ± 10.0 µA All outputs All outputs except RESET and MODA Output high voltage(1) ILoad = – 0.8 mA, VDD = 4.5 V Output low voltage ILoad = 1.6 mA Input high voltage All outputs except RESET, EXTAL, and MODA All outputs except XTAL All inputs except RESET RESET Input low voltage All inputs I/O ports, three-state leakage PA7, PA3, PC7–PC0, PD7–PD0, VIn = VIH or VIL MODA/LIR, RESET Input leakage current IRQ, XIRQ VIn = VDD or VSS VIn = VDD or VSS MODB/VSTBY RAM standby voltage RAM standby current Power down Power down Symbol VOL VOH Min Max Unit — VDD – 0.1 0.1 — V VOH VDD – 0.8 — V VOL — 0.4 V VIL 0.7 x VDD 0.8 x VDD VSS – 0.3 VDD + 0.3 VDD + 0.3 0.2 x VDD V IOZ — ±10 µA IIn — — µA VSB ISB 4.0 — ±1 ±10 VDD VIH V V µA 20 (3) Total supply current RUN: Single-chip mode dc — 2 MHz dc — 3 MHz Expanded multiplexed mode dc — 2 MHz dc — 3 MHz WAIT — All peripheral functions shut down: Single-chip mode dc — 2 MHz dc — 3 MHz Expanded multiplexed mode dc — 2 MHz dc — 3 MHz STOP — No clocks, single-chip mode: dc — 2 MHz dc — 3 MHz Input capacitancePA3–PA0, IRQ, XIRQ, EXTAL PA7, PC7–PC0, PD7–PD0, MODA/LIR, RESET Power dissipation Single-chip mode dc — 2 MHz dc — 3 MHz Expanded multiplexed mode dc — 2 MHz dc — 3 MHz EPROM programming voltage EPROM programming time IDD mA — — 15 27 — — 27 35 WIDD mA — — 6 15 — — 10 20 — — 100 150 CIn — — 8 12 PD — — 85 150 mW VPP tPP — — 11.75 2 150 195 12.75 4 V ms SIDD µA pF 1. VDD = 5.0 Vdc ±10%, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted. 2. VOH specification for RESET and MODA is not applicable because they are open-drain pins. VOH specification is not applicable to ports C and D in wired-OR mode. 3. All ports configured as inputs: VIL ≤ 0.2 V, VIH ≤ VDD –0.2 V; no dc loads; EXTAL is driven with a square wave; tcyc = 476.5 ns. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 107 Electrical Characteristics VDD EQUIVALENT TEST LOAD(1) Pins R2 TEST POINT C1 R1 R1 R2 C1 PA3–PA7 PB0–PB7 PC0–PC7 PD0, PD5–PD7 E 3.26 K 2.38 K 90 pF PD1—PD4 3.26 K 2.38 K 200 pF Note: 1. Full test loads are applied during all ac electrical timing measurements. Figure 9-1. Equivalent Test Load CLOCKS, STROBES ~ VDD VDD – 0.8 V 0.4 V 0.4 V ~ V SS NOM NOM 70% of VDD INPUTS 20% of VDD NOMINAL TIMING ~ VDD VDD – 0.8 V OUTPUTS 0.4 V ~ VSS DC TESTING CLOCKS, STROBES ~ VDD 70% of VDD 20% of VDD ~ VSS 20% of VDD SPEC SPEC 70% of VDD INPUTS 20% of VDD (NOTE 1) VDD – 0.8 V 0.4 V SPEC TIMING ~ VDD OUTPUTS ~ VSS 70% of VDD 20% of VDD AC TESTING Note: 1. During ac timing measurements, inputs are driven to 0.4 volts and VDD – 0.8 volts while timing measurements are taken at the 20% and 70% of VDD points. Figure 9-2. Test Methods MC68HC711D3 Data Sheet, Rev. 2.1 108 Freescale Semiconductor Control Timing 9.6 Control Timing 1.0 MHz Characteristic(1) 2.0 MHz 3.0 MHz Symbol Unit Min Max Min Max Min Max Frequency of operation fO dc 1.0 dc 2.0 dc 3.0 MHz E-clock period tcyc 1000 — 500 — 333 — ns Crystal frequency fXTAL — 4.0 — 8.0 — 12.0 MHz External oscillator frequency 4 fO dc 4.0 dc 8.0 dc 12.0 MHz tPCSU 300 — 175 — 133 — ns PWRSTL 8 1 — — 8 1 — — 8 1 — — tcyc Mode programming setup time tMPS 2 — 2 — 2 — tcyc Mode programming hold time tMPH 10 — 10 — 10 — ns PWIRQ 1020 — 520 — 353 — ns tWRS — 4 — 4 — 4 tcyc PWTIM 1020 — 520 — 353 — ns Processor control setup timetPCSU = 1/4 tcyc + 50 ns Reset input pulse width(2) To guarantee external reset vector Minimum input time can be preempted by internal reset Interrupt pulse width, PWIRQ = tcyc + 20 ns IRQ edge-sensitive mode Wait recovery startup time Timer pulse width PWTIM = tcyc + 20 ns Input capture pulse Accumulator input 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Reset is recognized during the first clock cycle it is held low. Internal circuitry then drives the pin low for four clock cycles, releases the pin, and samples the pin level two cycles later to determine the source of the interrupt. Refer to Chapter 5 Input/Output (I/O) Ports for further details. PA0–PA3(1) PA0–PA3(2) PA7(1) (3) PWTIM PA7(2) (3) Notes: 1. Rising edge sensitive input 2. Falling edge sensitive input 3. Maximum pulse accumulator clocking rate is E-clock frequency divided by 2. Figure 9-3. Timer Inputs MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 109 Electrical Characteristics 110 VDD EXTAL MC68HC711D3 Data Sheet, Rev. 2.1 4064 tcyc E tPCSU PWRSTL RESET tMPS tMPH MODA, MODB ADDRESS FFFE FFFE FFFE FFFE FFFF NEW PC FFFE FFFE FFFE Figure 9-4. POR and External Reset Timing Diagram FFFE FFFE FFFF NEW PC Freescale Semiconductor Freescale Semiconductor RESET IRQ(1) PWIRQ IRQ(2) or XIRQ MC68HC711D3 Data Sheet, Rev. 2.1 tSTOPDELAY(3) AS E ADDRESS(4) STOP ADDR STOP ADDR + 1 OPCODE STOP ADDR + 1 Resume program with instruction which follows the STOP instruction. ADDRESS(5) STOP ADDR STOP ADDR + 1 STOP ADDR + 1 Notes: 1. Edge sensitive IRQ pin (IRQE bit = 1) 2. Edge sensitive IRQ pin (IRQE bit = 0) 3. tSTOPDELAY = 4064 tcyc if DLY bit = 1 or 4 tcyc if DLY = 0. 4. XIRQ with X bit in CCR = 1. 5. IRQ or (XIRQ with X bit in CCR = 0) STOP ADDR + 2 SP – 8 SP – 8 FFF2 (FFF4) FFF3 (FFF5) NEW PC SP…SP–7 Figure 9-5. STOP Recovery Timing Diagram Control Timing 111 Electrical Characteristics 112 MC68HC711D3 Data Sheet, Rev. 2.1 E tPCSU IRQ, XIRQ, OR INTERNAL INTERRUPTS ADDRESS tWRS WAIT ADDR WAIT ADDR + 1 SP PCL SP – 1 SP – 2…SP – 8 SP – 8 SP – 8…SP – 8 SP – 8 SP – 8 PCH, YL, YH, XL, XH, A, B, CCR STACK REGISTERS R/W Note: RESET also causes recovery from WAIT. Figure 9-6. WAIT Recovery Timing Diagram SP – 8 NEW PC VECTOR ADDR VECTOR ADDR + 1 Freescale Semiconductor Freescale Semiconductor E tPCSU IRQ(1) PWIRQ (2) MC68HC711D3 Data Sheet, Rev. 2.1 IRQ , XIRQ OR INTERNAL INTERRUPT NEXT OP + 1 ADDRESS SP SP – 1 SP – 2 SP – 3 SP – 4 SP – 5 SP – 6 SP – 7 SP – 8 NEW PC SP – 8 VECTOR ADDR NEXT OPCODE VECTOR ADDR + 1 AS ADDRESS OP CODE —— PCL PCH IYL IYH IXL IXH B A CCR —— VECT MSB VECT LSB OP CODE R/W Notes: 1. Edge sensitive IRQ pin (IRQE bit = 1) 2. Level sensitive IRQ pin (IRQE bit = 0) Figure 9-7. Interrupt Timing Diagram Control Timing 113 Electrical Characteristics 9.7 Peripheral Port Timing 1.0 MHz Characteristic(1) 2.0 MHz 3.0 MHz Symbol Unit Min Max Min Max Min Max fO 1.0 1.0 2.0 2.0 3.0 3.0 MHz E-clock period tCYC 1000 — 500 — 333 — ns Peripheral data setup time(2) MCU read of ports A, B, C, and D tPDSU 100 — 100 — 100 — ns Peripheral data hold time(2) MCU read of ports A, B, C, and D tPDH 50 — 50 — 50 — ns Delay time, peripheral data write MCU write to port A MCU writes to ports B, C, and D tPWD = 1/4 tcyc + 150 ns tPWD — 200 — 200 — 200 — 350 — 225 — 183 Frequency of operation (E-clock frequency) ns 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Port C and D timing is valid for active drive (CWOM and DWOM bits not set in PIOC and SPCR registers respectively). MCU WRITE TO PORT E t PWD PORTS B, C, D PREVIOUS PORT DATA NEW DATA VALID tPWD PORT A PREVIOUS PORT DATA NEW DATA VALID Figure 9-8. Port Write Timing Diagram MCU READ OF PORT E tPDSU tPDH PORTS A, B, C, D Figure 9-9. Port Read Timing Diagram MC68HC711D3 Data Sheet, Rev. 2.1 114 Freescale Semiconductor Expansion Bus Timing 9.8 Expansion Bus Timing Characteristic(1) Num Symbol 1.0 MHz Min Max 2.0 MHz 3.0 MHz Min Max Min Max Unit Frequency of operation (E-clock frequency) fO dc 1.0 dc 2.0 dc 3.0 MHz 1 Cycle time tcyc 1000 — 500 — 333 — ns 2 Pulse width, E low, PWEL = 1/2 tcyc — 23 ns PWEL 477 — 227 — 146 — ns 3 Pulse width, E high, PWEH = 1/2 tcyc – 28 ns PWEH 472 — 222 — 141 — ns 4A E and AS rise time tr — 20 — 20 — 20 ns 4B E and AS fall time tf — 20 — 20 — 15 ns 9 Address hold time(2)a, tAH = 1/8 tcyc – 29.5 ns tAH 95.5 — 33 — 26 — ns 12 Non-muxed address valid time to E rise tAV = PWEL – (tASD + 80 ns)(2)a tAV 281.5 — 94 — 54 — ns 17 Read data setup time tDSR 30 — 30 — 30 — ns 18 Read data hold time (max = tMAD) tDHR 0 145.5 0 83 0 51 ns tDDW — 190.5 — 128 — 71 ns ns(2)a 19 Write data delay time, tDDW = 1/8 tcyc + 65.5 21 Write data hold time, tDHW = 1/8 tcyc – 29.5 ns(2)a tDHW 95.5 — 33 — 26 — ns 22 Muxed address valid time to E rise tAVM = PWEL – (tASD + 90 ns)(2)a tAVM 271.5 — 84 — 54 — ns 24 Muxed address valid time to AS fall tASL = PWASH – 70 ns tASL 151 — 26 — 13 — ns 25 Muxed address hold time, tAHL = 1/8 tcyc – 29.5 ns(2)b tAHL 95.5 — 33 — 31 — ns 26 Delay time, E to AS rise, tASD = 1/8 tcyc – 9.5 ns(2)a tASD 115.5 — 53 — 31 — ns 27 Pulse width, AS high, PWASH = 1/4 tcyc – 29 ns PWASH 221 — 96 — 63 — ns 28 Delay time, AS to E rise, tASED = 1/8 tcyc – 9.5 ns(2)b tASED 115.5 — 53 — 31 — ns time(2)a 29 MPU address access tACCA = tcyc – (PWEL– tAVM) – tDSR – tf tACCA 744.5 — 307 — 196 — ns 35 MPU access time , tACCE = PWEH – tDSR tACCE — 442 — 192 — 111 ns 36 Muxed address delay (previous cycle MPU read) tMAD = tASD + 30 ns(2)a(3) tMAD 145.5 — 83 — 51 — ns 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Input clocks with duty cycles other than 50% affect bus performance. Timing parameters affected by input clock duty cycle are identified by (a) and (b). To recalculate the approximate bus timing values, substitute the following expressions in place of 1/8 tCYC in the above formulas, where applicable: (a) (1-dc) × 1/4 tCYC (b) dc × 1/4 tCYC Where: DC is the decimal value of duty cycle percentage (high time). 3. Formula only for dc to 2 MHz. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 115 Electrical Characteristics 1 2 3 E 4 4 12 9 R/W, ADDRESS (NON-MUX) 22 36 35 17 29 18 ADDRESS READ DATA ADDRESS/DATA (MULTIPLEXED) 19 ADDRESS WRITE 21 DATA 25 24 4 4 AS 26 27 28 Note: Measurement points shown are 20% and 70% of VDD. Figure 9-10. Multiplexed Expansion Bus Timing Diagram MC68HC711D3 Data Sheet, Rev. 2.1 116 Freescale Semiconductor Serial Peripheral Interface Timing 9.9 Serial Peripheral Interface Timing Characteristic(1) Num Symbol 2.0 MHz Min Max 3.0 MHz Min Max Unit Operating frequency Master Slave fop(m) fop(s) dc dc 0.5 2.0 dc dc 0.5 3.0 fop MHz 1 Cycle time Master Slave tcyc(m) tCYC(s) 2.0 500 — — 2.0 333 — — tcyc ns 2 Enable lead time Master(2) Slave tlead(m) tlead(s) — 250 — — — 240 — — ns 3 Enable lag time Master(2) Slave tlag(m) tlag(s) — 250 — — — 240 — — ns 4 Clock (SCK) high time Master Slave tw(SCKH)m tw(SCKH)s 340 190 — — 227 127 — — ns 5 Clock (SCK) low time Master Slave tw(SCKL)m tw(SCKL)s 340 190 — — 227 127 — — ns 6 Data setup time (inputs) Master Slave tsu(m) tsu(s) 100 100 — — 100 100 — — ns 7 Data hold time (inputs) Master Slave th(m) th(s) 100 100 — — 100 100 — — ns 8 Access time (time to data active from high-impedance state) Slave ta 0 120 0 120 ns 9 Disable time (hold time to high-impedance state) Slave tdis — 240 — 167 ns 10 Data valid (after enable edge)(3) tv(s) — 240 — 167 ns 11 Data hold time (outputs) (after enable edge) tho 0 — 0 — ns 12 Rise time (20% VDD to 70% VDD, CL = 200 pF) SPI outputs (SCK, MOSI, and MISO) SPI inputs (SCK, MOSI, MISO, and SS) trm trs — — 100 2.0 — — 100 2.0 ns µs 13 Fall time (70% VDD to 20% VDD, CL = 200 pF) SPI outputs (SCK, MOSI, and MISO) SPI inputs (SCK, MOSI, MISO, and SS) tfm tfs — — 100 2.0 — — 100 2.0 ns µs 1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Signal production depends on software. 3. Assumes 200 pF load on all SPI pins. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 117 Electrical Characteristics SS (INPUT) SS IS HELD HIGH ON MASTER 1 12 13 13 12 5 SCK (CPOL = 0) (OUTPUT) SEE NOTE SCK (CPOL = 1) (OUTPUT) SEE NOTE 4 5 4 MISO (INPUT) MSB IN BIT 6 - - - -1 LSB IN 11 10 (REF) MOSI (OUTPUT) MASTER MSB OUT 11 (REF) 10 BIT 6 - - - -1 MASTER LSB OUT 13 12 Note: This first clock edge is generated internally but is not seen at the SCK pin. Figure 9-11. SPI Master Timing (CPHA = 0) SS (INPUT) SS IS HELD HIGH ON MASTER 1 13 12 5 SEE NOTE SCK (CPOL = 0) (OUTPUT) 4 13 5 SEE NOTE SCK (CPOL = 1) (OUTPUT) 4 MISO (INPUT) MSB IN 10 (REF) MOSI (OUTPUT) 12 BIT 6 - - - -1 LSB IN 10 11 MASTER MSB OUT 7 6 BIT 6 - - - -1 13 11 (REF) MASTER LSB OUT 12 Note: This last clock edge is generated internally but is not seen at the SCK pin. Figure 9-12. SPI Master Timing (CPHA = 1) MC68HC711D3 Data Sheet, Rev. 2.1 118 Freescale Semiconductor Serial Peripheral Interface Timing SS (INPUT) 1 13 12 12 13 3 5 SCK (CPOL = 0) (INPUT) 4 2 5 SCK (CPOL = 1) (INPUT) 4 8 MISO (OUTPUT) 6 MOSI (INPUT) BIT 6 - - - -1 MSB OUT SLAVE 7 10 SEE NOTE SLAVE LSB OUT 11 11 BIT 6 - - - -1 MSB IN 9 LSB IN Note: Not defined but normally MSB of character just received Figure 9-13. SPI Slave Timing (CPHA = 0) SS (INPUT) 1 12 13 5 SCK (CPOL = 0) (INPUT) 4 2 3 5 SCK (CPOL = 1) (INPUT) 8 MISO (OUTPUT) 4 10 SEE NOTE SLAVE MSB OUT 6 MOSI (INPUT) 7 MSB IN 13 BIT 6 - - - -1 10 12 9 SLAVE LSB OUT 11 BIT 6 - - - -1 LSB IN Note: Not defined but normally LSB of character previously transmitted Figure 9-14. SPI Slave Timing (CPHA = 1) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 119 Electrical Characteristics MC68HC711D3 Data Sheet, Rev. 2.1 120 Freescale Semiconductor Chapter 10 Ordering Information and Mechanical Specifications 10.1 Introduction This section provides ordering information for the MC68HC711D3. In addition, mechanical specifications are provided for the following packaging options: • 40-pin plastic dual in-line package (DIP) • 44-pin plastic leaded chip carrier (PLCC) • 44-pin plastic quad flat pack (QFP) 10.2 Ordering Information Table 10-1. MC Order Numbers MC Order Number Package Type Temperature 2 MHz 40-pin DIP 3 MHz –40 to +85°C MC68HC711D3CP2 MC68HC711D3CP3 –40 to +85°C MC68HC711D3CFN2 MC68HC711D3CFN3 –40 to +105°C MC68HC711D3VFN2 MC68HC711D3VFN3 –40 to +85°C MC68HC711D3CFB2 MC68HC711D3CFB3 44-pin PLCC 44-pin QFP 10.3 40-Pin DIP (Case 711-03) 40 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 21 B 1 20 L A C N J H G F D K SEATING PLANE M DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0° 15° 0.51 1.02 INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0° 15° 0.020 0.040 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 121 Ordering Information and Mechanical Specifications 10.4 44-Pin PLCC (Case 777-02) -N- Y BRK 0.007(0.180) M T B D L-M S 0.007(0.180) M T U N S L-M S N S Z -M- -L- V 44 W 1 G1 X D 0.010 (0.25) S T VIEW D-D A 0.007(0.180) M T L-M S N S R 0.007(0.180) M T L-M S N S 0.007(0.180) M T H L-M S L-M S N S N S Z J K1 E C 0.004 (0.10) G -TG1 0.010 (0.25) S T L-M S N S K SEATING PLANE F VIEW S 0.007(0.180) M T L-M S N S VIEW S NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOLDERS EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSION R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF THE MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMINSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTUSION(S) SHALL NOT CAUSE THE H DIMINSION TO BE GREATER THAN 0.037 (0.940124). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMINISION TO SMALLER THAN 0.025 (0.635). INCHES DIM A B C E F G H J K R U V W X Y Z G1 K1 MIN MAX 0.685 0.695 0.685 0.695 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 0.025 0.650 0.656 0.650 0.656 0.042 0.048 0.042 0.048 0.042 0.056 0.020 2° 10° 0.610 0.630 0.040 MILLIMETERS MIN MAX 17.40 17.65 17.40 17.65 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 0.64 16.51 16.66 16.51 16.66 1.07 1.21 1.07 1.21 1.07 1.42 0.50 2° 10° 15.50 16.00 1.02 MC68HC711D3 Data Sheet, Rev. 2.1 122 Freescale Semiconductor 44-Pin QFP (Case 824A-01) 10.5 44-Pin QFP (Case 824A-01) B L B 33 23 22 S D V S 0.20 (0.008) DETAIL A DETAIL A F BASE METAL M H A-B S S C A-B 0.20 (0.008) B L -B- M -A- D -A-, -B-, -D- 0.05 (0.002) A-B 34 J N D 44 0.20 (0.008) 12 1 11 A M C A-B S D S S D S 0.05 (0.002) A-B S 0.20 (0.008) M H A-B M DETAIL C C E -H- -CSEATING PLANE DATUM PLANE 0.01 (0.004) H G M M T DATUM PLANE -H- R K W C A-B S D S SECTION B-B -D0.20 (0.008) M Q X DETAIL C NOTES: 1. 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MILLIMETERS DIM MIN MAX A 9.90 10.10 B 9.90 10.10 C 2.10 2.45 D 0.30 0.45 E 2.00 2.10 F 0.30 0.40 G 0.80 BSC H --0.25 J 0.13 0.23 K 0.65 0.95 L 8.00 REF M 5° 10 ° N 0.13 0.17 Q 0° 7° R 0.13 0.30 S 12.95 13.45 T 0.13 --U 0° --V 12.95 13.45 W 0.40 --X 1.6 REF INCHES MIN MAX 0.390 0.398 0.390 0.398 0.083 0.096 0.012 0.018 0.079 0.083 0.012 0.016 0.031 BSC --- 0.010 0.005 0.009 0.026 0.037 0.315 REF 5° 10 ° 0.005 0.007 0° 7° 0.005 0.012 0.510 0.530 0.005 --0° --0.510 0.530 0.016 --0.063 REF MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 123 Ordering Information and Mechanical Specifications MC68HC711D3 Data Sheet, Rev. 2.1 124 Freescale Semiconductor Appendix A MC68HC11D3 and MC68HC11D0 A.1 Introduction The MC68HC11D3 and MC68HC11D0 are read-only memory (ROM) based high-performance microcontrollers (MCU) based on the MC68HC11E9 design. Members of the Dx series are derived from the same mask and feature a high-speed multiplexed bus capable of running at up to 3 MHz and a fully static design that allows operations at frequencies to dc. The only difference between the MCUs in the Dx series is whether the ROM has been tested and guaranteed. The information contained in this document applies to both the MC68HC11D3 and MC68HC11D0 with the differences given in this appendix. Features of the MC68HC11D3 and MC68HC11D0 include: • 4 Kbytes of on-chip ROM (MC68HC11D3) • 0 bytes of on-chip ROM (MC68HC11D0) • 192 bytes of on-chip random-access memory (RAM) all saved during standby • 16-bit timer system: – Three input capture (IC) channels – Four output compare (OC) channels – One IC or OC software-selectable channel • 32 input/output (I/O) pins: – 26 bidirectional I/O pins – 3 input-only pins – 3 output-only pins • Available in these packages: – 44-pin plastic leaded chip carrier (PLCC) – 44-pin quad flat pack (QFP) MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 125 MC68HC11D3 and MC68HC11D0 A.2 Block Diagram MODA/LIR MODB/VSTBY RESET IRQ XIRQ XTAL EXTAL E OSCILLATOR MODE CONTROL COP PAI/OC1 PULSE ACCUMULATOR OC2/OC1 OC3/OC1 OC4/OC1 TIMER IC4/OC5/OC1 IC1 IC2 IC3 PERIODIC INTERRUPT PORT A MC68HC11D3 — 4 KBYTES ROM MC68HC11D0 — 0 BYTES ROM 192 BYTES RAM SERIAL PERIPHERAL INTERFACE (SPI) EVSS MOSI MISO MC68HC11D3 CPU CORE VSS SERIAL COMMUNICATIONS INTERFACE (SCI) SCK VDD SS PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 CLOCK LOGIC INTERRUPT CONTROL TxD RxD A0/D0 A1/D1 A2/D2 A3/D3 A4/D4 A5/D5 A6/D6 A7/D7 A8 A9 A10 A11 A12 A13 A14 A15 MULTIPLEXED ADDRESS/DATA BUS PD0 PD1 PD2 PORT D PD3 PORT C PD4 PORT B PD5 DATA DIRECTION REGISTER D PD6/AS DATA DIRECTION REGISTER C PD7/R/W DATA DIRECTION REGISTER B Figure A-1. MC68HC11D3 Block Diagram MC68HC711D3 Data Sheet, Rev. 2.1 126 Freescale Semiconductor Pin Assignments EXTAL E MODA/LIR MODB/VSTBY 42 41 40 VSS 2 43 PC0 3 XTAL PC1 4 EVSS PC2 5 44 PC3 6 A.3 Pin Assignments 39 PB0/A8 7 PC5/A5/D5 8 38 PB1/A9 PC6/A6/D6 9 37 PB2/A10 PC7/A7/D7 10 36 PB3/A11 1 PC4/A4/D4 26 27 28 PA4/OC4 PA3/IC4/OC5/OC1 PA2/IC1 PA1/IC2 25 PA0/IC3 29 PA5/OC3 30 17 24 16 PD1/TxD PA6/OC2 PD0/RxD 23 NC 22 IRQ 31 VDD PB7 15 PA7/PAI PB6/A14 32 21 33 14 PD5/SS 13 RESET 20 PD6/AS 19 PB5/A13 PD4/SCK PB4/A12 34 PD3/MOSI 35 12 18 11 PD2/MISO XIRQ PD7/R/W MODB 38 34 XTAL 39 MODA VSS 40 35 EVSS 41 E PC0 42 36 PC1 1 PC5 2 PC6 3 31 PB2 37 PC2 PB1 PC4 43 PB0 32 PC3 EXTAL Figure A-2. Pin Assignments for 44-Pin PLCC PD6 7 27 PB6 RESET 8 26 PB7 IRQ 9 25 NC PD0 10 24 PA0 15 16 17 18 19 20 21 23 PA1 VDD PA7 PA6 PA5 PA4 PA3 PA2 PB5 PD5 28 14 PD7 PD4 PB4 6 13 PB3 29 PD3 30 5 12 4 PD2 PC7 XIRQ PD1 Figure A-3. Pin Assignments for 44-Pin QFP MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 127 MC68HC11D3 and MC68HC11D0 A.4 Memory Map $0000 $0000 INTERNAL REGISTERS AND I/O (CAN BE MAPPED TO ANY 4-K BOUNDARY $003F USING INIT REGISTER) $0040 192 BYTES STATIC RAM (CAN BE MAPPED TO ANY 4-K BOUNDARY $00FF USING THE INIT REGISTER) $7000 4 KBYTES ROM (MC68HC11D3) PRESENT AT RESET AND CAN BE DISABLED BY $7FFF ROM ON BIT IN CONFIG REGISTER. INTERRUPT VECTORS ARE EXTERNAL. $7000 $8000 EXTERNAL EXTERNAL $B000 $BF00 BOOT ROM $BFFF $FF00 4-KBYTES ROM $FFFF SINGLE CHIP EXPANDED SPECIAL MULTIPLEXED BOOTSTRAP SPECIAL TEST $FFFF $BFC0 SPECIAL MODES INTERRUPT $BFFF VECTORS $FFC0 NORMAL MODES INTERRUPT $FFFF VECTORS Figure A-4. MC68HC11Dx(1) Memory Map A.5 MC68HC11D3 and MC68HC11D0 Electrical Characteristics The parameters given in Chapter 9 Electrical Characteristics apply to the MC68HC11D3 and MC68HC11D0 with the exceptions given here. A.5.1 Functional Operating Temperature Range Rating Operating temperature range MC68HC11D0C Symbol Value Unit TA TL to TH –40 to +85 °C Symbol Value Unit ΘJA 50 85 °C/W A.5.2 Thermal Characteristics Characteristic Package thermal resistance (junction-to-ambient) 44-pin plastic leaded chip carrier (PLCC) 44-pin plastic quad flat pack (QFP 1. MC68HC11D0 only operates in expanded multiplexed mode and bootstrap mode. MC68HC711D3 Data Sheet, Rev. 2.1 128 Freescale Semiconductor Ordering Information A.6 Ordering Information MC Order Number MCU MC68HC11D3 (Custom ROM) MC68HC11D0 (No ROM) Package Temperature 2 MHz 3 MHz 44-pin PLCC –40 to +85°C MC68HC11D3CFN2 MC68HC11D3CFN3 44-pin PLCC –40 to +85°C MC68HC11D0CFN2 MC68HC11D0CFN3 44-pin QFP –40 to +85°C MC68HC11D0CFB2 MC68HC11D0CFB3 MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 129 MC68HC11D3 and MC68HC11D0 MC68HC711D3 Data Sheet, Rev. 2.1 130 Freescale Semiconductor Appendix B MC68L11D0 B.1 Introduction The MC68L11D0 is an extended-voltage version of the MC68HC11D0 microcontroller that can operate in applications that require supply voltages as low as 3.0 volts. Operation is identical to that of the MC68HC11D0 (see Appendix A MC68HC11D3 and MC68HC11D0) in all aspects other than electrical parameters, as shown in this appendix. Features of the MC68HC11D0 include: • Suitable for battery-powered portable and hand-held applications • Excellent for use in devices such as remote sensors and actuators • Operating performance is same at 5 V and 3 V B.2 MC68L11D0 Electrical Characteristics The parameters given in Chapter 9 Electrical Characteristics apply to the MC68L11D0 with the exceptions given here. B.2.1 Functional Operating Temperature Range Rating Operating temperature range Symbol Value Unit TA TL to TH –20 to +70 °C B.2.2 DC Electrical Characteristics Characteristic(1) Symbol Min Max Unit Output voltage(2) All outputs except XTAL ILoad = ± 10.0 µAAll outputs except XTAL, RESET, and MODA VOL VOH — VDD – 0.1 0.1 — V Output high voltage(1) All outputs except XTAL, RESET, and MODA ILoad = – 0.5 mA, VDD = 3.0 V ILoad = – 0.8 mA, VDD = 4.5 V VOH VDD – 0.8 — V Output low voltage All outputs except XTAL ILoad = 1.6 mA, VDD = 5.0 V ILoad = 1.0 mA, VDD = 3.0 V VOL — 0.4 V The dc electrical table continues on next page. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 131 MC68L11D0 Characteristic(1) Symbol Min Max Unit Input high voltage All inputs except RESET RESET VIH 0.7 x VDD 0.8 x VDD VDD + 0.3 VDD + 0.3 V Input low voltage All inputs VIL VSS – 0.3 0.2 x VDD V I/O ports, three-state leakage PA7, PA3, PC7–PC0, VIn = VIH or VIL PD7–PD0, MODA/LIR, RESET IOZ — ±10 µA Input leakage current VIn = VDD or VSS PA2–PA0, IRQ, XIRQ VIn = VDD or VSS MODB/VSTBY IIn — — ±1 ±10 µA RAM standby voltagePower down VSB 2.0 VDD V RAM standby currentPower down ISB — 10 µA Input capacitancePA2–PA0, IRQ, XIRQ, EXTAL PA3, PA7, PC7–PC0, PD7–PD0, MODA/LIR, RESET CIn — — 8 12 pF Output load capacitanceAll outputs except PD4–PD1 PD4–PD1 CL — — 90 100 pF Total supply current(3) RUN: Single-chip mode VDD = 5.5 V VDD = 3.0 V Expanded multiplexed mode VDD = 5.5 V VDD = 3.0 V WAIT — All peripheral functions shut down: Single-chip mode VDD = 5.5 V VDD = 3.0 V Expanded multiplexed mode VDD = 5.5 V VDD = 3.0 V STOP — No clocks, single-chip mode: VDD = 5.5 V VDD = 3.0 V Power dissipation Single-chip mode VDD = 5.5 V VDD = 3.0 V Expanded multiplexed mode VDD = 5.5 V VDD = 3.0 V IDD mA 8 4 15 8 14 7 27 14 WIDD SIDD PD mA 3 1.5 6 3 5 2.5 10 5 50 25 50 25 44 12 85 24 77 21 150 42 µA mW 1. VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted. 2. VOH specification for RESET and MODA is not applicable because they are open-drain pins. VOH specification is not applicable to ports C and D in wired-OR mode. 3. EXTAL is driven with a square wave, and tcyc = 1000 ns for 1 MHz rating; tcyc = 500 ns for 2 MHz rating; VIL ≤ 0.2 V; VIH ≥ VDD – 0.2 V; No dc loads MC68HC711D3 Data Sheet, Rev. 2.1 132 Freescale Semiconductor MC68L11D0 Electrical Characteristics B.2.3 Control Timing Characteristic(1) 1.0 MHz Symbol 2.0 MHz Min Max Min Max Unit Frequency of operation fO dc 1.0 dc 2.0 MHz E-clock period tcyc 1000 — 500 — ns Crystal frequency fXTAL — 4.0 — 8.0 MHz External oscillator frequency 4 fO dc 4.0 dc 8.0 MHz Processor control setup time tPCSU = 1/4 tcyc + 50 ns tPCSU 325 — 200 — ns PWRSTL 8 1 — — 8 1 — — tcyc PWIRQ 1020 — 520 — ns tWRS — 4 — 4 tcyc PWTIM 1020 — 520 — ns Reset input pulse width(2) To guarantee external reset vector Minimum input time can be preempted by internal reset Interrupt pulse width, PWIRQ = tcyc + 20 ns IRQ edge-sensitive mode Wait recovery startup time Timer pulse width PWTIM = tcyc + 20 ns Input capture pulse accumulator input 1. VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Reset is recognized during the first clock cycle it is held low. Internal circuitry then drives the pin low for four clock cycles, releases the pin, and samples the pin level two cycles later to determine the source of the interrupt. Refer to Chapter 4 Resets, Interrupts, and Low-Power Modes for further details. B.2.4 Peripheral Port Timing Characteristic(1) Symbol 1.0 MHz 2.0 MHz Min Max Min Max Unit Frequency of operation (E-clock frequency) fO dc 1.0 dc 2.0 MHz E-clock period tcyc 1000 — 500 — ns Peripheral data setup time(2) MCU read of ports A, B, C, and D tPDSU 100 — 100 — ns Peripheral data hold time(2) MCU read of ports A, B, C, and D tPDH 50 — 50 — ns Delay time, peripheral data write MCU write to port A MCU writes to ports B, C, and D tPWD = 1/4 tcyc + 150 ns tPWD — 200 — 200 — 350 — 225 ns 1. VDD = 3.0 Vd to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Port C and D timing is valid for active drive (CWOM and DWOM bits not set in PIOC and SPCR registers respectively). MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 133 MC68L11D0 B.2.5 Expansion Bus Timing Characteristic(1) Num Symbol Frequency of operation (E-clock frequency) 1.0 MHz 2.0 MHz Unit Min Max Min Max fO dc 1.0 dc 2.0 MHz tcyc 1000 — 500 — ns 1 Cycle time 2 Pulse width, E low, PWEL = 1/2 tcyc — 23 ns PWEL 475 — 225 — ns 3 Pulse width, E high, PWEH = 1/2 tcyc – 28 ns PWEH 470 — 220 — ns 4A E and AS rise time tr — 25 — 25 ns 4B E and AS fall time tf — 25 — 25 ns 9 Address hold time(2)a, tAH = 1/8 tcyc – 29.5 ns tAH 95 — 33 — ns 12 Non-muxed address valid time to E rise tAV = PWEL – (tASD + 80 ns)(2)a tAV 275 — 88 — ns 17 Read data setup time tDSR 30 — 30 — ns 18 Read data hold time (max = tMAD) tDHR 0 150 0 88 ns tDDW — 195 — 133 ns ns(2)a 19 Write data delay time, tDDW = 1/8 tcyc + 65.5 21 Write data hold time, tDHW = 1/8 tcyc – 29.5 ns(2)a tDHW 95 — 33 — ns 22 Muxed address valid time to E rise tAVM = PWEL – (tASD + 90 ns)(2)a tAVM 265 — 78 — ns 24 Muxed address valid time to AS fall tASL = PWASH – 70 ns tASL 150 — 25 — ns 25 Muxed address hold time, tAHL = 1/8 tcyc – 29.5 ns(2)b tAHL 95 — 33 — ns 26 Delay time, E to AS rise, tASD = 1/8 tcyc – 9.5 ns(2)a tASD 120 — 58 — ns 27 Pulse width, AS high, PWASH = 1/4 tcyc – 29 ns PWASH 220 — 95 — ns 28 Delay time, AS to E rise, tASED = 1/8 tcyc – 9.5 ns(2)b tASED 120 — 58 — ns 29 MPU address access time(2)a tACCA = tcyc – (PWEL– tAVM) – tDSR – tf tACCA 735 — 298 — ns 35 MPU access time , tACCE = PWEH – tDSR tACCE — 440 — 190 ns 36 Muxed address delay (previous cycle MPU read) tMAD = tASD + 30 ns(2)a tMAD 150 — 88 — ns 1. VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Input clocks with duty cycles other than 50% affect bus performance. Timing parameters affected by input clock duty cycle are identified by (a) and (b). To recalculate the approximate bus timing values, substitute the following expressions in place of 1/8 tCYC in the above formulas, where applicable: (a) (1-dc) × 1/4 tCYC (b) dc × 1/4 tCYC Where: DC is the decimal value of duty cycle percentage (high time). MC68HC711D3 Data Sheet, Rev. 2.1 134 Freescale Semiconductor MC68L11D0 Electrical Characteristics B.2.6 Serial Peripheral Interface Timing Characteristic(1) Num Symbol 1.0 MHz Min Max 2.0 MHz Min Max Unit Operating frequency Master Slave fop(m) fop(s) dc dc 0.5 1.0 dc dc 0.5 2.0 fop MHz 1 Cycle time Master Slave tcyc(m) tCYC(s) 2.0 1000 — — 2.0 500 — — tcyc ns 2 Enable lead time Master(2) Slave tlead(m) tlead(s) — 500 — — — 250 — — ns 3 Enable lag time Master(2) Slave tlag(m) tlag(s) — 500 — — — 250 — — ns 4 Clock (SCK) high time Master Slave tw(SCKH)m tw(SCKH)s 680 380 — — 340 190 — — ns 5 Clock (SCK) low time Master Slave tw(SCKL)m tw(SCKL)s 680 380 — — 340 190 — — ns 6 Data setup time (inputs) Master Slave tsu(m) tsu(s) 100 100 — — 100 100 — — ns 7 Data hold time (inputs) Master Slave th(m) th(s) 100 100 — — 100 100 — — ns 8 Access time (time to data active from high-impedance state) Slave ta 0 120 0 120 ns 9 Disable time (hold time to high-impedance state) Slave tdis — 240 — 240 ns 10 Data valid (after enable edge)(3) tv(s) — 240 — 240 ns 11 Data hold time (outputs) (after enable edge) tho 0 — 0 — ns 12 Rise time (20% VDD to 70% VDD, CL = 200 pF) SPI outputs (SCK, MOSI, and MISO) SPI inputs (SCK, MOSI, MISO, and SS) trm trs — — 100 2.0 — — 100 2.0 ns µs 13 Fall time (70% VDD to 20% VDD, CL = 200 pF) SPI outputs (SCK, MOSI, and MISO) SPI inputs (SCK, MOSI, MISO, and SS) tfm tfs — — 100 2.0 — — 100 2.0 ns µs 1. VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted. 2. Signal production depends on software. 3. Assumes 100 pF load on all SPI pins. MC68HC711D3 Data Sheet, Rev. 2.1 Freescale Semiconductor 135 MC68L11D0 B.3 Ordering Information Package Frequency Features MC Order Number 44-pin PLCC 2 MHz No ROM MC68L11D0FN2 44-pin QFP 2 MHz No ROM MC68L11D0FB2 MC68HC711D3 Data Sheet, Rev. 2.1 136 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. 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