MPXH6300A6T1

Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXH6300A Rev. 6.0, 09/2015 MPXH6300A, 20 to 300 kPa, Absolute, Integrated, Pressure Sensor MPXH6300A Freescale's MPXH6300A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features • Improved accuracy at high temperature • Available in super small outline package • 1.5% maximum error over 0 °C to 85 °C • Fully calibrated and compensated • Ideally suited for microprocessor or microcontroller-based systems • Temperature compensated from -40 °C to +125 °C • Durable thermoplastic surface mount package • Package porting and mounting options enable tube attachment for liquefied natural gas (LPG) or remote sensing applications Super small outline package MPXH6300A6U/6T1 MPXH6300AC6U/6T1 Case 98ARH99066A Case 98ARH99089A Top view DNC 5 4 VOUT DNC 6 3 GND DNC 7 DNC 8 2 VS 1 DNC Typical applications Pin 1 identification, chamfered corner. • Fuel injected car engines • Vehicles powered by green gases (for example LPG and CNG) • Small engines • Industrial controls Pinout Ordering information # of Ports Part number Pressure type Absolute Device marking • MPXH6300A Shipping Package MPXH6300A6U Rail 98ARH99066A • MPXH6300A6T1 Tape and Reel 98ARH99066A • • MPXH6300A MPXH6300AC6U Rail 98ARH99089A • • MPXH6300A MPXH6300AC6T1 Tape and Reel 98ARH99089A • • MPXH6300A None Single Dual Gauge Differential Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved. Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Pressure (P1)/Vacuum (P2) Side Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Related Documentation The MPXH6300A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXH6300A. In the Refine Your Result pane on the left, click on the Documentation link. MPXH6300A 2 Sensors Freescale Semiconductor, Inc. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 DNC 8 2 VS 1 DNC Pin 1 identification, chamfered corner. Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner. 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Voltage supply MPXH6300A Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Parametrics Symbol Value Units Maximum pressure (P1 > P2) Pmax 1200 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C Io+ 0.5 mAdc Io - -0.5 mAdc Output source current @ full-scale output(2) Output sink current @ minimum pressure offset (2) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.1 VDC, TA = 25 °C unless otherwise noted, P1 > P2.) Characteristic Pressure range (1) Supply voltage Symbol Min Typ Max Unit POP 20 — 304 kPa VS 4.74 5.1 5.46 VDC IO — 6.0 10 mAdc VOFF 0.241 0.306 0.371 VDC Full-scale output(3) (0 to 85 °C) @ VS = 5.1 Volts VFSO 4.847 4.912 4.977 VDC Full-scale span(4) (0 to 85 °C) @ VS = 5.1 Volts VFSS 4.476 4.606 4.736 VDC — — — ±1.5 %VFSS V/P — 16.2 — mV/kPa Response time(6) tR — 1.0 — ms Warm-up time(7) — — 20 — ms Offset stability(8) — — ±0.25 — %VFSS Supply current Minimum pressure offset (2) (0 to 85 °C) @ VS = 5.1 Volts Accuracy(5) (0 to 85 °C) Sensitivity 1.Device is ratiometric within this specified excitation range. 2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressures 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 °C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C. 6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MPXH6300A 4 Sensors Freescale Semiconductor, Inc. 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6300A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Die P1 Stainless Steel Cap Thermoplastic Case Wire Bond Lead frame Absolute Element Die Bond Sealed Vacuum Reference Figure 3. Cross-sectional diagram (not-to-scale) +5.1 V VS VOUT 100 nF To ADC 1 μF GND 47 pF 51 K Figure 4. Recommended power supply decoupling and output filtering MPXH6300A Sensors Freescale Semiconductor, Inc. 5 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: VOUT = VS*(.00318*P-.00353) ± Error VS = 5.1 Vdc Temperature = 0 to 85 °C 3.0 2.5 MAX TYP 2.0 1.5 1.0 MIN 0.5 20 35 50 65 80 95 110 125 140 155 170 185 200 215 230 245 260 275 290 304 0 Pressure (Reference to Sealed Vacuum) in kPa Figure 5. Output vs. absolute pressure Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353) ± (Pressure Error x Temp Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Figure 6. Transfer function Temperature Error Factor 4.0 Break Points 3.0 2.0 Temp Multiplier -40 0 to 85 125 3 1 3 1.0 0.0 -40 -20 0 20 40 80 60 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C. Figure 7. Temperature error band Error Limits for Pressure 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 60 100 140 180 220 260 300 Pressure (in kPa) -2.0 -3.0 Pressure Error (Max) -4.0 20 to 304 (kPa) ±4.0 (kPa) Figure 8. Pressure error band MPXH6300A 6 Sensors Freescale Semiconductor, Inc. 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 9. SSOP footprint MPXH6300A Sensors Freescale Semiconductor, Inc. 7 4.2 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, super small outline package, surface mount MPXH6300A 8 Sensors Freescale Semiconductor, Inc. Case 98ARH99066A, super small outline package, surface mount MPXH6300A Sensors Freescale Semiconductor, Inc. 9 Case 98ARH99066A, super small outline package, surface mount MPXH6300A 10 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf. Case 98ARH99089A, super small outline package, surface mount MPXH6300A Sensors Freescale Semiconductor, Inc. 11 Case 98ARH99089A, super small outline package, surface mount MPXH6300A 12 Sensors Freescale Semiconductor, Inc. 5 Revision History Table 4. Revision history Revision number Revision date 5.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. 6.0 09/2015 • Corrected figure 4. • Updated format. Description MPXH6300A Sensors Freescale Semiconductor, Inc. 13 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc. Document Number: MPXH6300A Rev. 6.0 09/2015