MWPR1516CALR

Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: WPR1516 Rev 2, 1/2015 MWPR1516 16 KB Flash MWPR1516CFM(R) MWPR1516CALR 24 MHz Cortex-M0+ Based Microcontroller Higher integration receiver controller MCU for wireless power transfer application. Targeting battery powered products are smart phone, tablet, portable medical devices, power tools etc. This product offers: • AC/DC conversion and modulation/demodulation circuit for bi-directional communication to support industrial standards with foreign object detection (FOD) • USB/adapter power switcher to charge products with wire and wireless with priority. • Up to 15 W with proper external transistors • QFN package for industrial application and WLCSP package for space constrained consumer applications 32-pin QFN (FM) 36-pin WLCSP (AL) 5 x 5 x 0.58 Pitch 0.5 3.1 x 3.0 x 0.6 Pitch 0.4 mm mm Performance • 24 MHz ARM® Cortex®-M0+ core • Single cycle 32-bit x 32-bit multiplier Human-machine interface • One interrupt module (IRQ) • Up to 13 general-purpose input/output (GPIO) Memories and memory interfaces • 16 KB program flash memory • 4 KB SRAM Communication interfaces • One UART module • One I2C module System peripherals • LDO provides 5 V and 3 A output to down system • CNC controls the communication and provides AC protection • High voltage input PMC module with three power modes: Run, Wait, Stop • LVR with reset or interrupt, selectable trip points • WDOG with independent clock source • Serial wire debug interface Analog Modules Clocks • 32.768 kHz or 4 MHz to 24 MHz crystal oscillator • Internal 20 kHz low-power oscillator (LPO) • Internal clock source (ICS) • Internal FLL with internal or external reference, precision trimming Operating Characteristics • Input from rectifier voltage range: 3.5 to 20 V • Temperature range (ambient): -40 to 85°C • One 12-bit analog-to-digital converters (ADC) with up to 4 external channels • One programmable gain amplifier (PGA) with differential input and output • One analog comparator (ACMP) containing a 6-bit DAC and programmable reference input Timers • Two 2-channel FTMs with basic TPM function • One periodic interrupt timers (PIT) • One FSK demodulation timer (FSKDT) • System tick timer (SysTick) • One real time clock (RTC) Security and integrity modules • 80-bit unique identification number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2014–2015 Freescale Semiconductor, Inc. All rights reserved. Ordering Information Part Number1 Memory Maximum number of I\O's Flash (KB) SRAM (KB) MWPR1516CFM(R) 16 4 13 MWPR1516CALR 16 4 13 1. To confirm current availability of ordererable part numbers, go to http://www.freescale.com and perform a part number search. Related Resources Type Description Resource Selector Guide The Freescale Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector. Solution Advisor Product Brief The Product Brief contains concise overview/summary information to WPR1516PB1 enable quick evaluation of a device for design suitability. Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. WPR1516RM1 Chip Errata The chip mask set Errata provides additional or corrective information for a particular device mask set. WPR1516_0N49M1 Package drawing Package dimensions are provided in package drawings. QFN 32-pin: 98ASA00615D1 WLCSP 36-pin: 98ASA00789D1 1. To find the associated resource, go to http://www.freescale.com and perform a search using this term. Figure 1 shows the functional modules in the chip. 2 Freescale Semiconductor, Inc. MWPR1516 16 KB Flash, Rev2, 1/2015. WPR1516 Family ARM ® Cortex™-M0+ Core System Internal watchdogs Memories and Memory Interfaces Program flash Debug interfaces Interrupt controller PMC Security Analog Timers UHV Watchdog 12-bit ADC x1 FSKDT x1 CNC x1 Analog comparator x1 FTM x2 and Integrity 6-bit DAC RAM Clocks External clock ICS Communication Human-Machine Interface (HMI) Interfaces LDO x1 UART x1 NMI I2C x1 GPIO PIT x1 Figure 1. Functional block diagram MWPR1516 16 KB Flash, Rev2, 1/2015. 3 Freescale Semiconductor, Inc. Table of Contents 1 Ratings................................................................................................5 1.1 Thermal handling ratings........................................................... 5 1.2 Moisture handling ratings.......................................................... 5 1.3 ESD handling ratings................................................................. 5 1.4 Voltage and current operating ratings........................................6 2 General............................................................................................... 7 2.1 Nonswitching electrical specifications...................................... 7 2.1.1 DC electrical characteristics.........................................7 2.1.2 Supply current characteristics...................................... 11 2.1.3 EMC performance........................................................ 12 2.2 Switching specifications............................................................ 13 2.2.1 Control timing.............................................................. 13 2.2.2 FTM module timing..................................................... 14 2.3 Thermal specifications...............................................................14 2.3.1 Thermal operating requirements.................................. 14 2.3.2 Thermal characteristics.................................................15 3 Peripheral operating requirements and behaviors.............................. 16 3.1 UHV modules............................................................................ 16 3.1.1 LDO electrical characteristics...................................... 16 3.1.2 Programmable gain amplifier (PGA) electronic characterizations...........................................................17 3.1.3 Communication and clamp controller (CNC) electronic characterizations.......................................... 18 3.2 Core modules............................................................................. 19 3.2.1 SWD electricals ...........................................................19 3.3 Clock modules........................................................................... 20 3.3.1 External oscillator (OSC) and ICS characteristics....... 20 3.4 Memories and memory interfaces..............................................22 3.4.1 NVM specifications......................................................22 4 Freescale Semiconductor, Inc. 4 5 6 7 8 9 3.5 Analog........................................................................................23 3.5.1 IFR measurement conditions........................................23 3.5.2 ADC characteristics......................................................24 3.5.3 Analog comparator (ACMP) electricals.......................26 3.6 Communication interfaces......................................................... 26 3.6.1 Inter-Integrated Circuit Interface (I2C) timing............ 27 Dimensions.........................................................................................28 4.1 Obtaining package dimensions.................................................. 28 Pinout................................................................................................. 28 5.1 Signal multiplexing and pin assignments.................................. 28 5.2 Device pin assignment............................................................... 30 Ordering Parts.................................................................................... 31 6.1 Determining valid orderable parts............................................. 31 Part Identification...............................................................................31 7.1 Description.................................................................................31 7.2 Format........................................................................................31 7.3 Fields..........................................................................................32 7.4 Example..................................................................................... 32 Terminology and guidelines...............................................................32 8.1 Definition: Operating requirement.............................................32 8.2 Definition: Operating behavior..................................................33 8.3 Definition: Attribute.................................................................. 33 8.4 Definition: Rating...................................................................... 34 8.5 Result of exceeding a rating.......................................................34 8.6 Relationship between ratings and operating requirements........ 35 8.7 Guidelines for ratings and operating requirements....................35 8.8 Definition: Typical value........................................................... 35 8.9 Typical value conditions............................................................36 Revision history................................................................................. 37 MWPR1516 16 KB Flash, Rev2, 1/2015. Ratings 1 Ratings 1.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.3 ESD handling ratings Symbol Description1 Min Typ. Max Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 — +2000 V 2 VCDM Electrostatic discharge voltage, charged-device model -500 — +500 V 3 Latch-up current at ambient temperature of 85 °C -100 — +100 mA 4 ILAT 1. Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions, unless otherwise noted. 2. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 3. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. MWPR1516 16 KB Flash, Rev2, 1/2015. 5 Freescale Semiconductor, Inc. Ratings 1.4 Voltage and current operating ratings Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the limits specified in the following table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this document. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor associated with the pin is enabled. Table 1. Voltage and current operating ratings Symbol VREC VAC1/AC2 Description Supply voltage from wireless receiver rectifier AC voltage input from wireless receiver coil IVREC Maximum current into VREC VDIO Digital input voltage (except RESET_b, EXTAL, and XTAL) VAD_IN VAIO ID Wired power input voltage • Analog1, RESET, VOUT_FB, EXTAL, and XTAL input voltage • VOUT and ISENS input voltage Instantaneous maximum current single pin limit • for GPIO pins • for other pins except power pins Min. Max. Unit 0 20 V -0.3 21 V 0 120 mA -0.3 VDD+0.3 0 12 -0.3 VDD+0.3 -0.3 5.5 -25 25 -10 10 V mA 1. Analog pins are defined as pins that do not have an associated general-purpose I/O port function. 6 Freescale Semiconductor, Inc. MWPR1516 16 KB Flash, Rev2, 1/2015. General 2 General 2.1 Nonswitching electrical specifications 2.1.1 DC electrical characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 2. DC characteristics Symbol — Descriptions Operating voltage — Min. Typical1 Max. Unit 3.13 — 5.5 V VDD – 0.8 — — V — — -100 mA — — 0.8 V 5V — — 100 mA All digital inputs VDD > 4.5 V 0.70 × VDD — — V Input high voltage All digital inputs 3.13 V VDD -0.2 — 2 mA -5 — 25 Total MCU limit, includes sum of all stressed pins CIn Input capacitance, all pins — — — 7 pF VRAM RAM retention voltage — 2.0 — — V 1. Typical values are measured at 25 °C. Characterized, not tested. 2. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured externally on the pin. 3. This item applies to the GPIO share pads only. 4. All functional non-supply pins, except for PTA6 and PTA7, are internally clamped to VDD. 5. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the large one. 6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is very low (which would reduce overall power consumption). Table 3. Power supply electrical characteristics Symbol Description VDD1.8 Output voltage core Full performance mode VDD3 Output Voltage Flash Output voltage VDD Load current VDD Output voltage VREFH Unit 1.83 1.98 V — 1.6 — V Full performance mode 2.6 2.81 2.9 V mode2 — 1.69 — V Reduced power Full performance mode 3.5 V≤VREC