NX1117C18Z,115

23 T2 SO NX1117C; NX1117CE series Low-dropout linear regulators Rev. 2 — 11 December 2012 Product data sheet 1. General description The NX1117C/NX1117CE are two series of low-dropout positive voltage regulators with an output current capability of 1 A. The two series consist of 18 fixed output voltage versions and two adjustable output voltage versions. NX1117C series offers an output voltage accuracy of 1 % and NX1117CE series of 1.25 %. The regulators feature output current limiting, Safe Operating Area (SOA) control, and thermal shutdown. The NX1117C/NX1117CE series are housed in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Output voltage Vout (V) Output voltage accuracy of 1 % Output voltage accuracy of 1.25 % 1.25 adjustable NX1117CADJZ NX1117CEADJZ 1.2 NX1117C12Z NX1117CE12Z 1.5 NX1117C15Z NX1117CE15Z 1.8 NX1117C18Z NX1117CE18Z 1.9 NX1117C19Z NX1117CE19Z 2.0 NX1117C20Z NX1117CE20Z 2.5 NX1117C25Z NX1117CE25Z 2.85 NX1117C285Z NX1117CE285Z 3.3 NX1117C33Z NX1117CE33Z 5.0 NX1117C50Z NX1117CE50Z 2. Features and benefits  Maximum output current of 1 A  Wide operation range to 20 V input  Output voltage accuracy of 1 % or 1.25 %  Output current limiting  SOA control  Thermal shutdown  No minimum load requirements for fixed output voltage versions  Temperature range 40 C to 125 C NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 3. Applications       Post regulator for switching DC-to-DC converter High-efficiency linear regulators Battery charger USB devices Hard drive controllers Consumer and industrial equipment point of load 4. Ordering information Table 2. Ordering information Type number Package NX1117C/NX1117CE series Name Description Version - plastic surface-mounted package with increased heat sink; 4 leads SOT223 5. Marking Table 3. NX1117C_NX1117CE_SER Product data sheet Marking codes Type number Marking code Type number Marking code NX1117CADJZ NCADJZ NX1117CEADJZ 7CEADJ NX1117C12Z N7C12Z NX1117CE12Z 7CE12Z NX1117C15Z N7C15Z NX1117CE15Z 7CE15Z NX1117C18Z N7C18Z NX1117CE18Z 7CE18Z NX1117C19Z N7C19Z NX1117CE19Z 7CE19Z NX1117C20Z N7C20Z NX1117CE20Z 7CE20Z NX1117C25Z N7C25Z NX1117CE25Z 7CE25Z NX1117C285Z NC285Z NX1117CE285Z 7CE285 NX1117C33Z N7C33Z NX1117CE33Z 7CE33Z NX1117C50Z N7C50Z NX1117CE50Z 7CE50Z All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 2 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 6. Functional diagram VIN VOUT VIN Vref VOUT Vref ADJ OUTPUT CURRENT LIMITING SOA CONTROL THERMAL SHUTDOWN OUTPUT CURRENT LIMITING SOA CONTROL THERMAL SHUTDOWN GND 006aac638 Fig 1. 006aac639 Adjustable output voltage versions: functional diagram Fig 2. Fixed output voltage versions: functional diagram 7. Pinning information Table 4. Pinning Pin Symbol Description 1 ADJ or GND adjust or ground 2 VOUT output 3 VIN input 4 VOUT output [1] Simplified outline [1] 4 1 2 3 ADJ for NX1117CADJZ and NX1117CEADJZ; GND for all other devices. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Vin input voltage VESD electrostatic discharge voltage Conditions MIL-STD-883 (human body model) machine model Ptot total power dissipation Product data sheet Max Unit - 20 V 2 - kV 400 - V internally limited Tj junction temperature - 150 C Tamb ambient temperature 40 +125 C Tstg storage temperature 65 +150 C [1] NX1117C_NX1117CE_SER [1] Min T –T j amb The maximum package power dissipation is P tot = ----------------------. R th  j – a  All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 3 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac644 2.5 Ptot (W) (1) 2.0 (2) 1.5 1.0 (3) 0.5 0.0 –75 –25 25 75 125 175 Tamb (°C) (1) Ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint (2) FR4 PCB, mounting pad for output 6 cm2 (3) FR4 PCB, standard footprint Fig 3. Power derating curves 9. Recommended operating conditions Table 6. Recommended operation conditions Tamb = 25 C unless otherwise specified. Symbol Parameter Vin input voltage Conditions Min Max Unit - 20 V 10. Thermal characteristics Table 7. Symbol Rth(j-a) NX1117C_NX1117CE_SER Product data sheet Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Min Typ Max Unit [1] - - 150 K/W [2] - - 72 K/W [3] - - 45 K/W Rth(j-sp) thermal resistance from junction to solder point - - 20 K/W Tsd shutdown temperature - 135 - C [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for output 6 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 4 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac645 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.33 0.5 0.2 0.1 10 0.05 0.02 0.01 1 10–1 10–5 0 10–4 10–3 10–2 10–1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aac646 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.33 0.5 0.2 10 0.1 0.05 0.02 1 0.01 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for output 6 cm2 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 5 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac647 102 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 10 0.2 0.1 0.05 0.02 1 0.01 0 10–1 10–5 10–4 10–3 10–2 10–1 1 102 10 tp (s) 103 Ceramic PCB, Al2O3, standard footprint Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 11. Characteristics Table 8. Characteristics Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Vref reference voltage NX1117CADJZ Conditions Iout = 10 mA; Vin  Vref = 2 V; Tamb = 25 C 10 mA  Iout  800 mA; 1.5 V  Vin  Vref  15 V NX1117CEADJZ Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 Typ Max Unit 1.238 1.250 1.262 V [1] Iout = 10 mA; Vin  Vref = 2 V; Tamb = 25 C 10 mA  Iout  800 mA; 1.5 V  Vin  Vref  15 V NX1117C_NX1117CE_SER Min 1.225 - 1.275 V 1.234 1.250 1.266 V [1] 1.219 - 1.281 V © NXP B.V. 2012. All rights reserved. 6 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Table 8. Characteristics …continued Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Vout output voltage NX1117C12Z Conditions Iout = 10 mA; Vin = 3.2 V; Tamb = 25 C 0 mA  Iout  800 mA; 2.6 V  Vin  11.2 V NX1117CE12Z NX1117CE15Z NX1117C18Z NX1117CE18Z NX1117CE20Z NX1117C25Z NX1117C33Z NX1117CE33Z Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 1.538 V 1.836 V 1.845 V 1.881 1.900 1.919 V 1.938 V 1.876 1.900 1.924 V [1] 1.852 - [1] 1.960 - 1.948 V 1.980 2.000 2.020 V 2.040 V 1.975 2.000 2.025 V [1] 1.950 - [1] 2.450 - 2.050 V 2.475 2.500 2.525 V 2.550 V 2.469 2.500 2.531 V [1] 2.437 - [1] 2.790 - 2.563 V 2.820 2.850 2.880 V 2.910 V 2.814 2.850 2.886 V [1] 2.779 - [1] 3.235 - 2.921 V 3.267 3.300 3.333 V 3.365 V 3.259 3.300 3.341 V [1] 3.217 - [1] 4.900 - 3.383 V 4.950 5.000 5.050 V Iout = 10 mA; Vin = 7.0 V; Tamb = 25 C 0 mA  Iout  800 mA; 6.5 V  Vin  12 V NX1117C_NX1117CE_SER 1.862 - Iout = 10 mA; Vin = 7.0 V; Tamb = 25 C 0 mA  Iout  800 mA; 6.5 V  Vin  12 V NX1117CE50Z [1] Iout = 10 mA; Vin = 5.3 V; Tamb = 25 C 0 mA  Iout  800 mA; 4.75 V  Vin  10 V NX1117C50Z 1.755 - Iout = 10 mA; Vin = 5.3 V; Tamb = 25 C 0 mA  Iout  800 mA; 4.75 V  Vin  10 V 1.530 V 1.777 1.800 1.823 V [1] Iout = 10 mA; Vin = 4.85 V; Tamb = 25 C 0 mA  Iout  800 mA; 4.25 V  Vin  10 V 1.230 V 1.782 1.800 1.818 V Iout = 10 mA; Vin = 4.85 V; Tamb = 25 C 0 mA  Iout  800 mA; 4.25 V  Vin  10 V NX1117CE285Z 1.764 - Iout = 10 mA; Vin = 4.5 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.9 V  Vin  12 V NX1117C285Z [1] Iout = 10 mA; Vin = 4.5 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.9 V  Vin  12 V NX1117CE25Z 1.462 - Iout = 10 mA; Vin = 4.0 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.4 V  Vin  12 V 1.224 V 1.481 1.500 1.519 V [1] Iout = 10 mA; Vin = 4.0 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.4 V  Vin  12 V Unit 1.485 1.500 1.515 V Iout = 10 mA; Vin = 3.9 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.3 V  Vin  11.9 V NX1117C20Z 1.470 - Iout = 10 mA; Vin = 3.9 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.3 V  Vin  11.9 V NX1117CE19Z [1] Iout = 10 mA; Vin = 3.8 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.2 V  Vin  11.8 V NX1117C19Z 1.170 - Iout = 10 mA; Vin = 3.8 V; Tamb = 25 C 0 mA  Iout  800 mA; 3.2 V  Vin  11.8 V Max 1.185 1.200 1.215 V Iout = 10 mA; Vin = 3.5 V; Tamb = 25 C 0 mA  Iout  800 mA; 2.9 V  Vin  11.5 V 1.176 - [1] Iout = 10 mA; Vin = 3.5 V; Tamb = 25 C 0 mA  Iout  800 mA; 2.9 V  Vin  11.5 V Typ 1.188 1.200 1.212 V [1] Iout = 10 mA; Vin = 3.2 V; Tamb = 25 C 0 mA  Iout  800 mA; 2.6 V  Vin  11.2 V NX1117C15Z Min 5.100 V 4.937 5.000 5.063 V [1] 4.875 - 5.125 V © NXP B.V. 2012. All rights reserved. 7 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Table 8. Characteristics …continued Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Conditions Vdo dropout voltage measured at Vout  100 mV Max Unit Iout = 100 mA - 0.95 1.1 V - 1.01 1.15 V Iout = 800 mA - 1.07 1.2 V Vin  Vout = 5.0 V; Tamb = 25 C 1000 1200 1500 mA NX1117C12Z; NX1117CE12Z Vin = 11.2 V - 5 6 mA NX1117C15Z; NX1117CE15Z Vin = 11.5 V - 5 6 mA NX1117C18Z; NX1117CE18Z Vin = 11.8 V - 5 6 mA NX1117C19Z; NX1117CE19Z Vin = 11.9 V - 5 6 mA NX1117C20Z; NX1117CE20Z Vin = 12 V - 5 6 mA NX1117C25Z; NX1117CE25Z Vin = 10 V - 5 6 mA NX1117C285Z; NX1117CE285Z Vin = 10 V - 5 6 mA NX1117C33Z; NX1117CE33Z Vin = 15 V - 5 6 mA NX1117C50Z; NX1117CE50Z Vin = 15 V - 5 6 mA Vin = 11.25 V; Iout = 800 mA - 52 120 A 1.4 V  Vin  Vout  10 V; 10 mA  Iout  800 mA - 0.4 5 A output current limit Iq quiescent current adjust current NX1117CADJZ; NX1117CEADJZ Iadj Typ Iout = 500 mA Iout(lim) Iadj Min adjust current variation NX1117CADJZ; NX1117CEADJZ NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 8 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Table 8. Characteristics …continued Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 0.8 5 mA NX1117CADJZ; NX1117CEADJZ - 69 - dB NX1117C12Z; NX1117CE12Z - 72 - dB NX1117C15Z; NX1117CE15Z - 69 - dB NX1117C18Z; NX1117CE18Z - 68 - dB NX1117C19Z; NX1117CE19Z - 67 - dB NX1117C20Z; NX1117CE20Z - 67 - dB NX1117C25Z; NX1117CE25Z - 65 - dB NX1117C285Z; NX1117CE285Z - 63 - dB NX1117C33Z; NX1117CE33Z - 62 - dB NX1117C50Z; NX1117CE50Z - 59 - dB - 0.003 - Regulation characteristics Iout(min) minimum output current NX1117CADJZ; NX1117CEADJZ PSRR required for regulation Vin = 15 V power supply ripple rejection Vin  Vout = 2.4 V; Iout = 40 mA; 2 V(p-p) 120 Hz sine wave Vn(out)RMS RMS output noise voltage NX1117C_NX1117CE_SER Product data sheet 10 Hz  f  10 kHz All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 % © NXP B.V. 2012. All rights reserved. 9 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Table 8. Characteristics …continued Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Line regulation Vout [2] output voltage variation NX1117CADJZ; NX1117CEADJZ Iout = 10 mA; 2.75 V  Vin  16.25 V - 0.1 0.3 % NX1117C12Z; NX1117CE12Z Iout = 0 mA; 2.6 V  Vin  11.2 V - 1.2 3.0 mV NX1117C15Z; NX1117CE15Z Iout = 0 mA; 2.9 V  Vin  11.5 V - 1.5 3.5 mV NX1117C18Z; NX1117CE18Z Iout = 0 mA; 3.2 V  Vin  11.8 V - 1.8 4.0 mV NX1117C19Z; NX1117CE19Z Iout = 0 mA; 3.3 V  Vin  11.9 V - 1.9 4.0 mV NX1117C20Z; NX1117CE20Z Iout = 0 mA; 3.4 V  Vin  12 V - 2.0 4.5 mV NX1117C25Z; NX1117CE25Z Iout = 0 mA; 3.9 V  Vin  12 V - 2.5 4.5 mV NX1117C285Z; NX1117CE285Z Iout = 0 mA; 4.25 V  Vin  10 V - 2.5 4.5 mV NX1117C33Z; NX1117CE33Z Iout = 0 mA; 4.75 V  Vin  10 V - 2.5 4.5 mV NX1117C50Z; NX1117CE50Z Iout = 0 mA; 6.5 V  Vin  12 V - 6.0 10 mV Load regulation Vout [2] output voltage variation NX1117CADJZ; NX1117CEADJZ Vin  Vout = 1.4 V; 10 mA  Iout  800 mA - 0.2 0.4 % NX1117C12Z; NX1117CE12Z Vin = 2.6 V; 0 mA  Iout  800 mA - 1 4 mV NX1117C15Z; NX1117CE15Z Vin = 2.9 V; 0 mA  Iout  800 mA - 1 5 mV NX1117C18Z; NX1117CE18Z Vin = 3.2 V; 0 mA  Iout  800 mA - 1 5 mV NX1117C19Z; NX1117CE19Z Vin = 3.3 V; 0 mA  Iout  800 mA - 1 6 mV NX1117C20Z; NX1117CE20Z Vin = 3.4 V; 0 mA  Iout  800 mA - 1 6 mV NX1117C25Z; NX1117CE25Z Vin = 3.9 V; 0 mA  Iout  800 mA - 1 6 mV NX1117C285Z; NX1117CE285Z Vin = 4.25 V; 0 mA  Iout  800 mA - 1 7 mV NX1117C33Z; NX1117CE33Z Vin = 4.75 V; 0 mA  Iout  800 mA - 1 7 mV NX1117C50Z; NX1117CE50Z Vin = 6.5 V; 0 mA  Iout  800 mA - 1 10 mV NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 10 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Table 8. Characteristics …continued Cin = 680 nF in series with 1 , and Cout = 680 nF in series with 1 . For typical value Tamb = 25 C; for minimum and maximum values Tamb is the operating temperature range 40 C to 125 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 40 C  Tamb  125 C - 0.7 - % 1000 h end-point measurement; Tamb = 25 C - 0.3 - % Temperature stability Vout output voltage variation Long-term stability Vout output voltage variation [1] The SOA control limits the output current at high voltage differences Vin  Vout in order to keep the device in the safe operating area. [2] During testing low duty cycle pulse techniques are used to maintain the junction temperature as close to ambient as possible. 006aac659 2 ∆Vout (%) 006aac660 1.4 Vdo (V) 1.2 1 (1) (2) 1.0 (3) 0.8 0 0.6 0.4 –1 0.2 –2 –50 0 50 0.0 100 150 Tamb (°C) 0 200 400 600 Iout (mA) 800 Load pulsed at 1 % duty cycle Vin = Vout + 2 V (1) Tamb = 40 C Iout = 10 mA (2) Tamb = 25 C (3) Tamb = 125 C Fig 7. Output voltage variation as a function of ambient temperature; typical values NX1117C_NX1117CE_SER Product data sheet Fig 8. Dropout voltage as a function of output current; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 11 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac661 1.5 006aac662 1.5 Iout(lim) (A) Iout(lim) (A) 1.3 1.0 1.1 0.5 0.9 0.0 Fig 9. 0 4 8 12 16 20 Vin – Vout (V) 0.7 –50 0 50 Tamb = 25 C Vin = 5 V Load pulsed at 1 % duty cycle Load pulsed at 1 % duty cycle Output current limit as a function of voltage difference Vin  Vout 006aac663 100 Iadj (μA) 100 150 Tamb (°C) Fig 10. Output current limit as a function of ambient temperature 006aac664 10 ∆Iq (%) 80 0 60 40 –10 20 0 –50 0 50 100 150 Tamb (°C) –20 –50 0 50 100 150 Tamb (°C) Vin = 3.25 V Iout = 10 mA Fig 11. Adjustable output voltage versions: Adjust current as a function of ambient temperature; typical values NX1117C_NX1117CE_SER Product data sheet Fig 12. Fixed output voltage versions: Quiescent current variation as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 12 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac665 100 PSRR (dB) PSRR (dB) 80 80 60 60 40 40 20 20 0 006aac666 100 0 200 400 600 800 1000 Iout (mA) 0 10 102 Vout = 1.25 V; Vin  Vout = 2.4 V; Vin  Vout = 2.4 V; Iout = 40 mA; Cout = 680 nF; Cout = 10 F; Tamb = 25 C; Tamb = 25 C; 2 V(p-p); 120 Hz sine wave Product data sheet 104 f (Hz) 105 2 V(p-p) Fig 13. Adjustable output voltage versions: Power supply ripple rejection as a function of output current; typical values NX1117C_NX1117CE_SER 103 Fig 14. Power supply ripple rejection as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 13 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 006aac667 6.25 006aac668 8.5 Vin (V) Vin (V) 4.25 6.5 20 20 ∆Vout (mV) ∆Vout (mV) –20 –20 0 40 80 120 160 t (μs) 200 0 40 Cout = 10 F; Cout = 10 F; Iout = 100 mA; Iout = 100 mA; Tamb = 25 C Tamb = 25 C Fig 15. NX1117C285Z and NX1117CE285Z: Line transient response as a function of time; typical values 80 120 160 t (μs) 200 Fig 16. NX1117C50Z and NX1117CE50Z: Line transient response as a function of time; typical values 006aac669 006aac670 0.1 0.1 ∆Vout (V) ∆Vout (V) –0.1 –0.1 1 1 Iout (A) Iout (A) 0 0 0 40 80 120 160 t (μs) 200 Cin = 10 F; 0 40 80 Cout = 10 F; Vin = 4.5 V Vin = 6.5 V Tamb = 25 C; Tamb = 25 C; Preload = 100 mA Preload = 100 mA Fig 17. NX1117C285Z and NX1117CE285Z: Load transient response as a function of time; typical values Product data sheet 160 t (μs) 200 Cin = 10 F; Cout = 10 F; NX1117C_NX1117CE_SER 120 Fig 18. NX1117C50Z and NX1117CE50Z: Load transient response as a function of time; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 14 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 12. Application information approx. 5 V VIN VOUT NX1117C33Z NX1117CE33Z 10 μF 3.3 V 10 μF 006aac640 Fig 19. NX1117C33Z and NX1117CE33Z: Typical application for fixed output voltage versions NX1117CADJZ NX1117CEADJZ VIN VOUT R1 10 μF 10 μF R2 006aac641 V OUT = V ref   1 + R2  R1  + I adj  R2 Fig 20. NX1117CADJZ and NX1117CEADJZ: Typical application for adjustable output voltage versions NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 15 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 13. Package outline 6.7 6.3 3.1 2.9 1.8 1.5 4 1.1 0.7 7.3 6.7 3.7 3.3 1 2 3 2.3 4.6 0.8 0.6 0.32 0.22 Dimensions in mm 04-11-10 Fig 21. Package outline SOT223 (SC-73) 14. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package NX1117C/NX1117CE series [1] NX1117C_NX1117CE_SER Product data sheet SOT223 Description 8 mm pitch, 12 mm tape and reel Packing quantity 1000 4000 -115 -135 For further information and the availability of packing methods, see Section 18. All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 16 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 15. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4×) (4×) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 sot223_fr Fig 22. Reflow soldering footprint SOT223 (SC-73) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 8.7 occupied area Dimensions in mm 1 2 3 1.9 (3×) 2.7 preferred transport direction during soldering 2.7 1.1 1.9 (2×) sot223_fw Fig 23. Wave soldering footprint SOT223 (SC-73) NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 17 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 16. Revision history Table 10. Revision history Document ID Release date NX1117C_NX1117CE_SER v.2 20121211 Modifications: • • Product data sheet Change notice Supersedes Product data sheet - NX1117C_NX1117CE_SER v.1 Table 7 “Thermal characteristics”: added shutdown temperature Tsd Electrostatic discharge voltage VESD moved from Table 8 to Table 5 NX1117C_NX1117CE_SER v.1 20110718 NX1117C_NX1117CE_SER Data sheet status Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 - © NXP B.V. 2012. All rights reserved. 18 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. NX1117C_NX1117CE_SER Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 19 of 21 NX1117C; NX1117CE series NXP Semiconductors Low-dropout linear regulators Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NX1117C_NX1117CE_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 December 2012 © NXP B.V. 2012. All rights reserved. 20 of 21 NXP Semiconductors NX1117C; NX1117CE series Low-dropout linear regulators 19. Contents 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Packing information . . . . . . . . . . . . . . . . . . . . 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 December 2012 Document identifier: NX1117C_NX1117CE_SER