PCA9500D

PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM Rev. 04 — 15 April 2009 Product data sheet 1. General description The PCA9500 is an 8-bit I/O expander with an on-board 2-kbit EEPROM. The I/O expander's eight quasi-bidirectional data pins can be independently assigned as inputs or outputs to monitor board level status or activate indicator devices such as LEDs. The system master writes to the I/O configuration bits in the same way as for the PCF8574. The data for each input or output is kept in the corresponding Input or Output register. The system master can read all registers. The EEPROM can be used to store error codes or board manufacturing data for read-back by application software for diagnostic purposes and is included in the I/O expander package. The PCA9500 has 3 address pins with internal pull-up resistors allowing up to 8 devices to share the common two-wire I2C software protocol serial data bus. The fixed GPIO I2C-bus address is the same as the PCF8574 and the fixed EEPROM I2C-bus address is the same as the PCF8582C-2, so the PCA9500 appears as two separate devices to the bus master. The PCA9500 supports hot insertion to facilitate usage in removable cards on backplane systems. The PCA9501 is an alternative to the functionally similar PCA9500 for systems where a higher number of devices are required to share the same I2C-bus or an interrupt output is required. 2. Features I I I I I I I I I I I I I I 8 general purpose input/output expander/collector Drop-in replacement for PCF8574 with integrated 2-kbit EEPROM Internal 256 × 8 EEPROM Self timed write cycle 4 byte page write operation I2C-bus and SMBus interface logic Internal power-on reset Noise filter on SCL/SDA inputs 3 address pins allowing up to 8 devices on the I2C-bus/SMBus No glitch on power-up Supports hot insertion Power-up with all channels configured as inputs Low standby current Operating power supply voltage range of 2.5 V to 3.6 V NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM I 5 V tolerant inputs/outputs I 0 Hz to 400 kHz clock frequency I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Packages offered: SO16, TSSOP16, HVQFN16 3. Applications I Board version tracking and configuration I Board health monitoring and status reporting I Multi-card systems in telecommunications, networking, and base station infrastructure equipment I Field recall and troubleshooting functions for installed boards I General-purpose integrated I/O with memory I Drop-in replacement for PCF8574 with integrated 2-kbit EEPROM I Bus master sees GPIO and EEPROM as two separate devices I Three hardware address pins allow up to 8 PCA9500s to be located in the same I2C-bus/SMBus 4. Ordering information Table 1. Ordering information Package Name PCA9500D PCA9500PW PCA9500BS SO16 TSSOP16 HVQFN16 Description plastic small outline package; 16 leads; body width 7.5 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT162-1 SOT403-1 Type number plastic thermal enhanced very thin quad flat package; SOT629-1 no leads; 16 terminals; body 4 × 4 × 0.85 mm 4.1 Ordering options Table 2. PCA9500D PCA9500PW PCA9500BS Ordering options Topside mark PCA9500D PCA9500 9500 Temperature range −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C Type number PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 2 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 5. Block diagram PCA9500 300 kΩ A0 A1 A2 SCL SDA INPUT FILTER I2C-BUS/SMBus CONTROL 8-bit INPUT/ OUTPUT PORTS write pulse read pulse IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 VDD VSS POWER-ON RESET WC EEPROM 256 × 8 002aae585 Fig 1. Block diagram of PCA9500 6. Pinning information 6.1 Pinning A0 A1 A2 IO0 IO1 IO2 IO3 VSS 1 2 3 4 5 6 7 8 002aae582 16 VDD 15 SDA 14 SCL 13 WC 12 IO7 11 IO6 10 IO5 9 IO4 A0 A1 A2 IO0 IO1 IO2 IO3 VSS 1 2 3 4 5 6 7 8 002aae583 16 VDD 15 SDA 14 SCL 13 WC 12 IO7 11 IO6 10 IO5 9 IO4 PCA9500D PCA9500PW Fig 2. Pin configuration for SO16 Fig 3. Pin configuration for TSSOP16 PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 3 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 16 A1 A2 IO0 IO1 IO2 1 2 15 A2 terminal 1 index area 13 SDA 12 SCL 11 WC 10 IO7 9 IO6 IO5 8 PCA9500BS 3 4 5 6 VSS 7 IO4 IO3 14 VDD 002aae584 Transparent top view Fig 4. Pin configuration for HVQFN16 6.2 Pin description Table 3. Symbol A0 A1 A2 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 VSS WC SCL SDA VDD [1] Pin description Pin SO16, TSSOP16 1 2 3 4 5 6 7 9 10 11 12 8 13 14 15 16 HVQFN16 15 16 1 2 3 4 5 7 8 9 10 6[1] 11 12 13 14 supply ground active LOW write control pin I2C-bus serial clock I2C-bus serial data supply voltage quasi-bidirectional I/O pins address lines (internal pull-up) Description HVQFN16 package supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the printed-circuit board in the thermal pad region. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 4 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 7. Functional description Refer also to Figure 1 “Block diagram of PCA9500”. write pulse 100 µA VDD data from shift register D FF CI S Q IO0 to IO7 power-on reset D FF read pulse CI S Q VSS data to shift register 002aae588 to interrupt logic Fig 5. Simplified schematic diagram of each I/O 7.1 Device addressing Following a START condition, the bus master must output the address of the slave it is accessing. The address of the PCA9500 is shown in Figure 6. Internal pull-up resistors are incorporated on the hardware selectable address pins. The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. slave address 0 1 0 0 A2 A1 A0 R/W 1 0 slave address 1 0 A2 A1 A0 R/W fixed hardware programmable 002aae589 fixed hardware programmable 002aae590 a. I/O expander Fig 6. PCA9500 slave addresses b. Memory 7.2 Control register The PCA9500 contains a single 8-bit register called the Control register, which can be written and read via the I2C-bus. This register is sent after a successful acknowledgment of the slave address. It contains the I/O operation information. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 5 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 7.3 I/O operations (Refer also to Figure 5.) Each of the PCA9500's eight I/Os can be independently used as an input or output. Output data is transmitted to the port by the I/O Write mode (see Figure 7). Input I/O data is transferred from the port to the microcontroller by the Read mode (see Figure 8). SCL 1 2 3 4 5 6 7 8 9 data to port A acknowledge from slave DATA 1 A acknowledge from slave data to port DATA 2 A acknowledge from slave slave address (I/O expander) SDA S 0 1 0 0 A2 A1 A0 0 R/W START condition write to port tv(Q) data out from port tv(Q) DATA 1 VALID DATA 2 VALID 002aae591 Fig 7. I/O Write mode (output) SCL 1 2 3 4 5 6 7 8 9 data from port A acknowledge from slave DATA 1 A acknowledge from master data from port DATA 4 no acknowledge from master slave address (I/O expander) SDA S 0 1 0 0 A2 A1 A0 1 R/W 1 P STOP condition START condition read from port DATA 2 data into port DATA 1 th(D) DATA 3 tsu(D) 002aae592 DATA 4 Fig 8. I/O Read mode (input) PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 6 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 7.3.1 Quasi-bidirectional I/Os A quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH. In this mode, only a current source to VDD is active. An additional strong pull-up to VDD allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. See Figure 9. SCL 1 2 3 4 5 6 7 8 9 data to port A acknowledge from slave 1 IO3 A acknowledge from slave data to port 0 IO3 A STOP condition P slave address (I/O expander) SDA S 0 1 0 0 A2 A1 A0 0 R/W START condition IO3 output voltage acknowledge from slave IO3 pull-up output current IOHt IOH 002aae593 Fig 9. Transient pull-up current (IOHt) while IO3 changes from LOW to HIGH and back to LOW 7.4 Memory operations 7.4.1 Write operations Write operations require an additional address field to indicate the memory address location to be written. The address field is eight bits long, providing access to any one of the 256 words of memory. There are two types of write operations, ‘byte write’ and ‘page write’. Write operation is possible when the Write Control pin (WC) is put at a LOW logic level (0). When this control signal is set at 1, write operation is not possible and data in the memory is protected. ‘Byte write’ and ‘page write’ explained below assume that WC is set to 0. 7.4.1.1 Byte write To perform a byte write the START condition is followed by the memory slave address and the R/W bit set to 0. The PCA9500 will respond with an acknowledge and then consider the next eight bits sent as the word address and the eight bits after the word address as the data. The PCA9500 will issue an acknowledge after the receipt of both the word address and the data. To terminate the data transfer the master issues the STOP condition, initiating the internal write cycle to the non-volatile memory. Only write and read operations to the quasi-bidirectional I/Os are allowed during the internal write cycle. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 7 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM slave address (memory) SDA S 1 0 1 0 A2 A1 A0 0 R/W A word address A data A acknowledge from slave P STOP condition. Write to the memory is performed. 002aae594 START condition acknowledge from slave acknowledge from slave Fig 10. Byte write 7.4.1.2 Page write A page write is initiated in the same way as the byte write. If after sending the first word of data, the STOP condition is not received, the PCA9500 considers subsequent words as data. After each data word the PCA9500 responds with an acknowledge and the two least significant bits of the memory address field are incremented. Should the master not send a STOP condition after four data words, the address counter will return to its initial value and overwrite the data previously written. After the receipt of the STOP condition the inputs will behave as with the byte write during the internal write cycle. slave address (memory) SDA S 1 0 1 0 A2 A1 A0 0 R/W A word address A data to memory DATA n A data to memory DATA n + 3 A P START condition acknowledge from slave acknowledge from slave acknowledge from slave acknowledge from slave STOP condition. Write to the memory is performed. 002aae595 Fig 11. Page write 7.4.2 Read operations PCA9500 read operations are initiated in an identical manner to write operations with the exception that the memory slave address R/W bit is set to ‘1’. There are three types of read operations: current address read, random read and sequential read. 7.4.2.1 Current address read The PCA9500 contains an internal address counter that increments after each read or write access and as a result, if the last word accessed was at address ‘n’, then the address counter contains the address ‘n + 1’. When the PCA9500 receives its memory slave address with the R/W bit set to one it issues an acknowledge and uses the next eight clocks to transmit the data contained at the address stored in the address counter. The master ceases the transmission by issuing the STOP condition after the eighth bit. There is no ninth clock cycle for the acknowledge. See Figure 12. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 8 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM slave address (memory) SDA S 1 0 1 0 A2 A1 A0 1 R/W A data from memory P STOP condition 002aae596 START condition acknowledge from slave Fig 12. Current address read 7.4.2.2 Random read The PCA9500's random read mode allows the address to be read from to be specified by the master. This is done by performing a dummy write to set the address counter to the location to be read. The master must perform a byte write to the address location to be read, but instead of transmitting the data after receiving the acknowledge from the PCA9500, the master re-issues the START condition and memory slave address with the R/W bit set to one. The PCA9500 will then transmit an acknowledge and use the next eight clock cycles to transmit the data contained in the addressed location. The master ceases the transmission by issuing the STOP condition after the eighth bit, omitting the ninth clock cycle acknowledge. slave address (memory) SDA S 1 0 1 0 A2 A1 A0 0 R/W A word address A acknowledge from slave S slave address (memory) 1 0 1 0 A2 A1 A0 1 R/W acknowledge from slave A data from memory P STOP condition 002aae597 START condition acknowledge from slave START condition Fig 13. Random read 7.4.2.3 Sequential read The PCA9500 sequential read is an extension of either the current address read or random read. If the master does not issue a STOP condition after it has received the eighth data bit, but instead issues an acknowledge, the PCA9500 will increment the address counter and use the next eight cycles to transmit the data from that location. The master can continue this process to read the contents of the entire memory. Upon reaching address 255 the counter will return to address 0 and continue transmitting data until a STOP condition is received. The master ceases the transmission by issuing the STOP condition after the eighth bit, omitting the ninth clock cycle acknowledge. slave address (memory) SDA S 1 0 1 0 A2 A1 A0 1 R/W A data from memory DATA n A data from memory DATA n + 1 A data from memory DATA n + X P STOP condition 002aae598 START condition acknowledge from slave acknowledge from master acknowledge from master Fig 14. Sequential read PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 9 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 8. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 15). SDA SCL data line stable; data valid change of data allowed mba607 Fig 15. Bit transfer 8.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 16). SDA SCL S START condition P STOP condition mba608 Fig 16. Definition of START and STOP conditions PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 10 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 8.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 17). SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER 002aaa381 Fig 17. System configuration 8.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement 002aaa987 9 Fig 18. Acknowledgement on the I2C-bus PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 11 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 9. Application design-in information A central processor/controller typically located on the system main board can use the 400 kHz I2C-bus/SMBus to poll the PCA9500 devices located on the system cards for status or version control type of information. The PCA9500 may be programmed at manufacturing to store information regarding board build, firmware version, manufacturer identification, configuration option data, and so on. Alternately, these devices can be used as convenient interface for board configuration, thereby utilizing the I2C-bus/SMBus as an intra-system communication bus. up to 8 cards I2C-bus CPU OR µC I2C-bus I2C-bus BACKPLANE I2C-bus configuration control ASIC PCA9500 I2C-bus I2C-bus CONTROL GPIO EEPROM monitoring and control INPUTS ALARM LEDs card ID, subroutines, configuration data, or revision history 002aae586 Fig 19. PCA9500 used as interface for board configuration PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 12 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM VDD 10 kΩ 10 kΩ VDD MASTER CONTROLLER SCL SDA 10 kΩ (optional) 2 kΩ SUB-SYSTEM 1 (e.g., temp sensor) INT VDD PCA9500 SCL SDA IO0 IO1 IO2 IO3 SUB-SYSTEM 2 (e.g., counter) RESET A enable controlled switch (e.g., CBT device) B SUB-SYSTEM 3 (e.g., alarm system) ALARM VSS IO4 IO5 A2 A1 A0 VSS IO6 IO7 VDD 002aae599 GPIO device address configured as 0100 100x for this example. EEPROM device address configured as 1010 100x for this example. IO0, IO2, IO3 configured as outputs. IO1, IO4, IO5 configured as inputs. IO6, IO7 are not used and must be configured as outputs. Fig 20. Typical application 10. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI II IO IDD ISS Ptot P/out Tstg Tamb Parameter supply voltage input voltage input current output current supply current ground supply current total power dissipation power dissipation per output storage temperature ambient temperature operating Conditions Min −0.5 VSS − 0.5 −20 −25 −100 −100 −65 −40 Max +4.0 5.5 +20 +25 +100 +100 400 100 +150 +85 Unit V V mA mA mA mA mW mW °C °C PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 13 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 11. Static characteristics Table 5. Symbol Supply VDD IDDQ IDD1 IDD2 VPOR VIL VIH IOL ILI Ci VIL VIH IIHL(max) IOL IOH IOHt Ci Co VIL VIH ILI supply voltage standby current supply current read supply current write power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current input leakage current input capacitance LOW-level input voltage HIGH-level input voltage input current through protection diodes LOW-level output current HIGH-level output current transient pull-up current input capacitance output capacitance LOW-level input voltage HIGH-level input voltage input leakage current VI = VDD pull-up; VI = VSS [1] Static characteristics Parameter Conditions Min 2.5 A0, A1, A2, WC = HIGH −0.5 0.7VDD VOL = 0.4 V VI = VDD or VSS VI = VSS 3 −1 −0.5 0.7VDD −400 VOL = 1 V VOH = VSS [1] Typ 3.3 25 100 2 25 Max 3.6 60 1 2 2.4 +0.3VDD 5.5 +1 7 +0.3VDD 5.5 +400 300 10 10 +0.3VDD 5.5 +1 100 Unit V µA mA mA V V V mA µA pF V V µA mA µA mA pF pF V V µA µA Input SCL; input/output SDA I/O expander port 10 30 −0.5 0.7VDD −1 10 Address inputs A0, A1, A2; WC input Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 14 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 20 IOH (µA) −40 002aad307 VDD = 2.5 V 2.7 V 3.0 V 3.3 V 3.6 V 20 IOH (µA) −20 002aad308 VDD = 2.5 V 2.7 V 3.0 V 3.3 V 3.6 V −60 −100 −100 −160 0 1.2 2.4 VOH (V) 3.6 −140 0 1.2 2.4 VOH (V) 3.6 a. Tamb = −40 °C 20 IOH (µA) −20 b. Tamb = 25 °C 002aad309 VDD = 2.5 V 2.7 V 3.0 V 3.3 V 3.6 V −60 −100 −140 0 1.2 2.4 VOH (V) 3.6 c. Tamb = 85 °C Fig 21. VOH versus IOH Remark: Rapid fall-off in VOH at current inception is due to a diode that provides 5 V overvoltage protection for the GPIO I/O pins. When the GPIO I/O are being used as inputs, the internal current source VOH should be evaluated to determine if external pull-up resistors are required to provide sufficient VIH threshold noise margin. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 15 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 12. Dynamic characteristics Table 6. Symbol I2C-bus fSCL tSP tBUF tSU;STA tHD;STA tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Port timing tv(Q) tsu(D) th(D) tpu(R) tpu(W) Tcy(W) [1] [2] [3] Dynamic characteristics Parameter timing[1] (see Figure 22) 1.3 0.6 0.6 250 0 SCL LOW to data output 0.6 CL ≤ 100 pF CL ≤ 100 pF CL ≤ 100 pF [2] [2] Conditions Min Typ 5 Max 400 50 0.3 0.3 1.0 4 1 5 10 Unit kHz ns µs µs µs µs µs ns ns µs µs µs µs µs ms ms ms SCL clock frequency pulse width of spikes that must be suppressed by the input filter bus free time between a STOP and START condition set-up time for a repeated START condition hold time (repeated) START condition rise time of both SDA and SCL signals fall time of both SDA and SCL signals data set-up time data hold time data valid time set-up time for STOP condition data output valid time data input set-up time data input hold time read power-up time write power-up time write cycle time 0 4 - Power-up timing Write cycle limits (see Figure 23) [3] All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD. tpu(R) and tpu(W) are the delays required from the time VDD is stable until the specified operation can be initiated. These parameters are guaranteed by design. Tcy(W) is the maximum time that the device requires to perform the internal write operation. Table 7. Parameter Non-volatile storage specifications Specification 10 years minimum 100,000 cycles minimum memory cell data retention number of memory cell write cycles PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 16 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM protocol START condition (S) tSU;STA bit 7 MSB (A7) tLOW tHIGH bit 6 (A6) bit 0 (R/W) acknowledge (A) STOP condition (P) 1/f SCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tVD;DAT tVD;ACK tSU;STO 002aab175 Fig 22. I2C-bus timing SCL SDA 8th bit word n ACK Tcy(W) STOP condition START condition memory address 002aad310 Fig 23. Write cycle timing PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 17 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 13. Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) θ A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 JEITA EUROPEAN PROJECTION A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) θ 0.9 0.4 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 0.035 0.004 0.016 8o o 0 ISSUE DATE 99-12-27 03-02-19 Fig 24. Package outline SOT162-1 (SO16) PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 18 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index A1 θ Lp L (A 3) A 1 e bp 8 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 θ 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 25. Package outline SOT403-1 (TSSOP16) PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 19 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm SOT629-1 D B A terminal 1 index area E AA 1 c detail X e1 1/2 e C b 8 vMCAB wMC y1 C y e 5 L 4 9 e Eh 1/2 e e2 1 12 terminal 1 index area 16 Dh 0 13 X 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.38 0.23 c 0.2 D (1) 4.1 3.9 Dh 2.25 1.95 E (1) 4.1 3.9 Eh 2.25 1.95 e 0.65 e1 1.95 e2 1.95 L 0.75 0.50 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT629-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22 Fig 26. Package outline SOT629-1 (HVQFN16) PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 20 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 21 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 27) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 27. PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 22 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 27. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 15. Abbreviations Table 10. Acronym ASIC CBT CDM CPU EEPROM ESD FF GPIO I2C-bus I/O HBM LED MM SMBus Abbreviations Description Application Specific Integrated Circuit Cross-Bar Technology Charged-Device Model Central Processing Unit Electrically Erasable Programmable Read-Only Memory ElectroStatic Discharge Flip-Flop General Purpose Input/Output Inter-Integrated Circuit bus Input/Output Human Body Model Light-Emitting Diode Machine Model System Management Bus PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 23 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 16. Revision history Table 11. Revision history Release date 20090415 Data sheet status Product data sheet Change notice Supersedes PCA9500_3 Document ID PCA9500_4 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 3 “Pin description”: – added Table note [1] and its reference at HVQFN16 pin 6 – changed naming convention for pins I/On to “IOn” • • Figure 7 “I/O Write mode (output)”: changed symbol “tpv” to “tv(Q)” Figure 8 “I/O Read mode (input)”: – changed symbol “tph” to “th(D)” – changed symbol “tps” to “tsu(D)” • Table 4 “Limiting values”: – changed symbol “VCC” to “VDD” – changed parameter for ISS from “supply current” to “ground supply current” – changed symbol “PO” to “P/out” – changed parameter for Tamb from “operating temperature” to “ambient temperature”; placed “operating” in Conditions column • • Table 5 “Static characteristics”: – added reference to Table note [1] at IOL in sub-section “I/O expander port” Table 6 “Dynamic characteristics”: – sub-section “I2C-bus timing”: changed symbol/parameter from “tSW, tolerable spike width on bus” to “tSP, pulse width of spikes that must be suppressed by the input filter” – sub-section “Port timing”: changed symbol “tpv” to “tv(Q)” – sub-section “Port timing”: changed symbol “tps” to “tsu(D)” – sub-section “Port timing”: changed symbol “tph” to “th(D)” – sub-section “Power-up timing”: changed symbol “tPUR” to “tpu(R)” – sub-section “Power-up timing”: changed symbol “tPUW” to “tpu(W)” – sub-section “Write cycle limits”: changed symbol “tWR” to “Tcy(W)” • • • PCA9500_3 (9397 750 14134) PCA9500_2 PCA9500_1 Figure 23 “Write cycle timing”: changed symbol “tWR” to “Tcy(W)” added Section 15 “Abbreviations” updated soldering information Product data sheet Product data Product data 853-2369 30018 of 2003 Jun 11 853-2369 28875 of 2002 Sep 27 PCA9500_2 PCA9500_1 - 20040930 20030627 20020927 PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 24 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 17. Legal information 17.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9500_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 15 April 2009 25 of 26 NXP Semiconductors PCA9500 8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM 19. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.3.1 7.4 7.4.1 7.4.1.1 7.4.1.2 7.4.2 7.4.2.1 7.4.2.2 7.4.2.3 8 8.1 8.1.1 8.2 8.3 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 17 17.1 17.2 17.3 17.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device addressing . . . . . . . . . . . . . . . . . . . . . . 5 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 5 I/O operations . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quasi-bidirectional I/Os . . . . . . . . . . . . . . . . . . 7 Memory operations . . . . . . . . . . . . . . . . . . . . . . 7 Write operations . . . . . . . . . . . . . . . . . . . . . . . . 7 Byte write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Page write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Read operations . . . . . . . . . . . . . . . . . . . . . . . . 8 Current address read . . . . . . . . . . . . . . . . . . . . 8 Random read . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Sequential read. . . . . . . . . . . . . . . . . . . . . . . . . 9 Characteristics of the I2C-bus. . . . . . . . . . . . . 10 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 START and STOP conditions . . . . . . . . . . . . . 10 System configuration . . . . . . . . . . . . . . . . . . . 11 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application design-in information . . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 18 19 Contact information . . . . . . . . . . . . . . . . . . . . 25 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 April 2009 Document identifier: PCA9500_4