PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Rev. 05 — 28 July 2008 Product data sheet
1. General description
The PCA9539; PCA9539R is a 24-pin CMOS device that provides 16 bits of General Purpose parallel Input/Output (GPIO) expansion with interrupt and reset for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc. The PCA9539; PCA9539R consists of two 8-bit configuration (input or output selection), input, output and polarity inversion (active HIGH or active LOW operation) registers. The system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each input or output is kept in the corresponding Input or Output register. The polarity of the read register can be inverted with the Polarity inversion register. All registers can be read by the system master. The PCA9539; PCA9539R is identical to the PCA9555 except for the removal of the internal I/O pull-up resistor which greatly reduces power consumption when the I/Os are held LOW, replacement of A2 with RESET and a different address range. The PCA9539; PCA9539R open-drain interrupt output is activated when any input state differs from its corresponding input port register state and is used to indicate to the system master that an input state has changed. The power-on reset sets the registers to their default values and initializes the device state machine. In the PCA9539, the RESET pin causes the same reset/default I/O input configuration to occur without de-powering the device, holding the registers and I2C-bus state machine in their default state until the RESET input is once again HIGH. This input requires a pull-up to VDD. In the PCA9539R however, only the device state machine is initialized by the RESET pin and the internal general-purpose registers remain unchanged. Using the PCA9539R RESET pin will only reset the I2C-bus interface should it be stuck LOW to regain access to the I2C-bus. This allows the I/O pins to retain their last configured state so that they can keep any lines in their previously defined state and not cause system errors while the I2C-bus is being restored. Two hardware pins (A0, A1) vary the fixed I2C-bus address and allow up to four devices to share the same I2C-bus/SMBus.
2. Features
I I I I 16-bit I2C-bus GPIO with interrupt and reset Operating power supply voltage range of 2.3 V to 5.5 V 5 V tolerant I/Os Polarity inversion register
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
I I I I I I I I I
Active LOW interrupt output Active LOW reset input Low standby current Noise filter on SCL/SDA inputs No glitch on power-up Internal power-on reset 16 I/O pins which default to 16 inputs 0 Hz to 400 kHz clock frequency ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Offered in three different packages: SO24, TSSOP24, and HVQFN24
3. Ordering information
Table 1. Ordering information Package Name PCA9539D PCA9539PW PCA9539RPW PCA9539BS PCA9539RBS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 × 4 × 0.85 mm SOT616-1 SO24 TSSOP24 Description plastic small outline package; 24 leads; body width 7.5 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm Version SOT137-1 SOT355-1 Type number
3.1 Ordering options
Table 2. PCA9539D PCA9539PW PCA9539RPW PCA9539BS PCA9539RBS Ordering options Topside mark PCA9539D PCA9539PW PA9539RPW 9539 539R Temperature range −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C Type number
PCA9539_PCA9539R_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
2 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
4. Block diagram
PCA9539 PCA9539R
A0 A1 write pulse read pulse I2C-BUS/SMBus CONTROL SCL SDA INPUT FILTER 8-bit INPUT/ OUTPUT PORTS 8-bit INPUT/ OUTPUT PORTS
IO1_0 IO1_1 IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7
IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VDD
write pulse read pulse POWER-ON RESET
VDD RESET
VSS
LP FILTER
INT
002aad722
Remark: All I/Os are set to inputs at reset.
Fig 1.
Block diagram of PCA9539; PCA9539R
PCA9539_PCA9539R_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
3 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
5. Pinning information
5.1 Pinning
INT A1 RESET IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 A0 20 IO1_7 19 IO1_6 18 IO1_5 17 IO1_4 16 IO1_3 15 IO1_2 14 IO1_1 13 IO1_0
002aad719
INT A1 RESET IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 A0 20 IO1_7 19 IO1_6 18 IO1_5 17 IO1_4 16 IO1_3 15 IO1_2 14 IO1_1 13 IO1_0
002aad720
PCA9539D
PCA9539PW PCA9539RPW
IO0_6 10 IO0_7 11 VSS 12
IO0_6 10 IO0_7 11 VSS 12
Fig 2.
Pin configuration for SO24
Fig 3.
PCA9539BS PCA9539RBS
24 RESET 20 SDA 23 A1
Pin configuration for TSSOP24
terminal 1 index area IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 1 2 3 4 5 6
19 SCL 18 A0 17 IO1_7 16 IO1_6 15 IO1_5 14 IO1_4 13 IO1_3 IO1_2 12
002aad721
IO1_0 10
21 VDD
22 INT VSS 9
Transparent top view
Fig 4.
Pin configuration for HVQFN24
PCA9539_PCA9539R_5
IO1_1 11
7 IO0_6
IO0_7
8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
4 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
5.2 Pin description
Table 3. Symbol INT A1 RESET Pin description Pin SO24, TSSOP24 1 2 3 HVQFN24 22 23 24 interrupt output (open-drain) address input 1 active LOW reset input. Driving this pin LOW causes: Description
• •
IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS IO1_0 IO1_1 IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 A0 SCL SDA VDD
[1]
PCA9539 to reset its state machine and registers PCA9539R to reset its state machine, but has no effect on its registers
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
1 2 3 4 5 6 7 8 9[1] 10 11 12 13 14 15 16 17 18 19 20 21
port 0 input/output 0 port 0 input/output 1 port 0 input/output 2 port 0 input/output 3 port 0 input/output 4 port 0 input/output 5 port 0 input/output 6 port 0 input/output 7 supply ground port 1 input/output 0 port 1 input/output 1 port 1 input/output 2 port 1 input/output 3 port 1 input/output 4 port 1 input/output 5 port 1 input/output 6 port 1 input/output 7 address input 0 serial clock line input serial data line open-drain input/output supply voltage
HVQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region.
PCA9539_PCA9539R_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
5 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6. Functional description
Refer to Figure 1 “Block diagram of PCA9539; PCA9539R”.
6.1 Device address
slave address 1 1 1 0 1 A1 A0 R/W
fixed
programmable
002aad724
Fig 5. PCA9539; PCA9539R device address
6.2 Registers
6.2.1 Command byte
The command byte is the first byte to follow the address byte during a write transmission. It is used as a pointer to determine which of the following registers will be written or read.
Table 4. Command 0 1 2 3 4 5 6 7 Command byte Register Input port 0 Input port 1 Output port 0 Output port 1 Polarity inversion port 0 Polarity inversion port 1 Configuration port 0 Configuration port 1
PCA9539_PCA9539R_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
6 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.2.2 Registers 0 and 1: Input port registers
This register is an input-only port. It reflects the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by Register 3. Writes to this register have no effect. The default value ‘X’ is determined by the externally applied logic level.
Table 5. Bit Symbol Default Table 6. Bit Symbol Default Input port 0 register 7 I0.7 X 6 I0.6 X 5 I0.5 X 4 I0.4 X 3 I0.3 X 2 I0.2 X 1 I0.1 X 0 I0.0 X
Input port 1 register 7 I1.7 X 6 I1.6 X 5 I1.5 X 4 I1.4 X 3 I1.3 X 2 I1.2 X 1 I1.1 X 0 I1.0 X
6.2.3 Registers 2 and 3: Output port registers
This register is an output-only port. It reflects the outgoing logic levels of the pins defined as outputs by Registers 6 and 7. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value.
Table 7. Bit Symbol Default Table 8. Bit Symbol Default Output port 0 register 7 O0.7 1 6 O0.6 1 5 O0.5 1 4 O0.4 1 3 O0.3 1 2 O0.2 1 1 O0.1 1 0 O0.0 1
Output port 1 register 7 O1.7 1 6 O1.6 1 5 O1.5 1 4 O1.4 1 3 O1.3 1 2 O1.2 1 1 O1.1 1 0 O1.0 1
6.2.4 Registers 4 and 5: Polarity inversion registers
This register allows the user to invert the polarity of the Input port register data. If a bit in this register is set (written with ‘1’), the Input port data polarity is inverted. If a bit in this register is cleared (written with a ‘0’), the Input port data polarity is retained.
Table 9. Bit Symbol Default Table 10. Bit Symbol Default
PCA9539_PCA9539R_5
Polarity inversion port 0 register 7 N0.7 0 6 N0.6 0 5 N0.5 0 4 N0.4 0 3 N0.3 0 2 N0.2 0 1 N0.1 0 0 N0.0 0
Polarity inversion port 1 register 7 N1.7 0 6 N1.6 0 5 N1.5 0 4 N1.4 0 3 N1.3 0 2 N1.2 0 1 N1.1 0 0 N1.0 0
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
7 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.2.5 Registers 6 and 7: Configuration registers
This register configures the directions of the I/O pins. If a bit in this register is set (written with ‘1’), the corresponding port pin is enabled as an input with high-impedance output driver. If a bit in this register is cleared (written with ‘0’), the corresponding port pin is enabled as an output. At reset, the device's ports are inputs.
Table 11. Bit Symbol Default Table 12. Bit Symbol Default Configuration port 0 register 7 C0.7 1 6 C0.6 1 5 C0.5 1 4 C0.4 1 3 C0.3 1 2 C0.2 1 1 C0.1 1 0 C0.0 1
Configuration port 1 register 7 C1.7 1 6 C1.6 1 5 C1.5 1 4 C1.4 1 3 C1.3 1 2 C1.2 1 1 C1.1 1 0 C1.0 1
6.3 Power-on reset
When power is applied to VDD, an internal power-on reset holds the PCA9539; PCA9539R in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9539; PCA9539R registers and SMBus state machine will initialize to their default states. Thereafter, VDD must be lowered below 0.2 V to reset the device. For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the operating voltage.
6.4 RESET input
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). In the PCA9539 the registers and SMBus/I2C-bus state machine will be held in their default state until the RESET input is once again HIGH. This input typically requires a pull-up to VDD. In the PCA9539R, only the device state machine is initialized. The internal general-purpose registers remain unchanged. Using the PCA9539R hardware reset pin will only reset the I2C-bus interface should it be stuck LOW to regain access to the I2C-bus. This allows the I/O pins to retain their last configured state so that they can keep any lines in their previously defined state and not cause system errors while the I2C-bus is being restored.
6.5 I/O port
When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, then either Q1 or Q2 is on, depending on the state of the Output port register. Care should be exercised if an external voltage is applied to an I/O configured as an output because of the low-impedance path that exists between the pin and either VDD or VSS.
PCA9539_PCA9539R_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
8 of 31
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
data from shift register configuration register data from shift register write configuration pulse write pulse D FF CK Q D FF CK output port register input port register D FF read pulse CK Q
Q2
output port register data VDD
Q1
Q
Q I/O pin VSS
input port register data
to INT polarity inversion register data from shift register write polarity pulse D FF CK
002aad723
Q
polarity inversion register data
At power-on reset, all registers return to default values.
Fig 6. Simplified schematic of I/Os
6.6 Bus transactions
6.6.1 Writing to the port registers
Data is transmitted to the PCA9539; PCA9539R by sending the device address and setting the least significant bit to a logic 0 (see Figure 5 “PCA9539; PCA9539R device address”). The command byte is sent after the address and determines which register will receive the data following the command byte. The eight registers within the PCA9539; PCA9539R are configured to operate as four register pairs. The four pairs are Input ports, Output ports, Polarity inversion ports, and Configuration ports. After sending data to one register, the next data byte will be sent to the other register in the pair (see Figure 7 and Figure 8). For example, if the first byte is sent to Output port 1 (register 3), then the next byte will be stored in Output port 0 (register 2). There is no limitation on the number of data bytes sent in one write transmission. In this way, each 8-bit register may be updated independently of the other registers.
PCA9539_PCA9539R_5
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Product data sheet
Rev. 05 — 28 July 2008
9 of 31
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Product data sheet Rev. 05 — 28 July 2008
© NXP B.V. 2008. All rights reserved. PCA9539_PCA9539R_5
NXP Semiconductors
SCL
1
2
3
4
5
6
7
8
9 command byte A 0 0 0 0 0 0 1 0 A 0.7 acknowledge from slave data to port 0 DATA 0 0.0 A 1.7 acknowledge from slave data to port 1 DATA 1 1.0 A P
slave address SDA S 1 1 1 0 1 A1 A0 0 R/W
START condition
acknowledge from slave
STOP condition
write to port tv(Q) data out from port 0 tv(Q) data out from port 1 DATA VALID
002aad725
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Fig 7. Write to output port registers
PCA9539; PCA9539R
SCL
1
2
3
4
5
6
7
8
9 data to register data to register LSB DATA 0 A acknowledge from slave MSB DATA 1 LSB A P command byte A 0 0 0 0 0 1 1 0 A acknowledge from slave
slave address SDA S 1 1 1 0 1 A1 A0 0 R/W
MSB
START condition
acknowledge from slave
STOP condition
002aad726
10 of 31
Fig 8. Write to configuration registers
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.6.2 Reading the port registers
In order to read data from the PCA9539; PCA9539R, the bus master must first send the PCA9539; PCA9539R address with the least significant bit set to a logic 0 (see Figure 5 “PCA9539; PCA9539R device address”). The command byte is sent after the address and determines which register will be accessed. After a restart, the device address is sent again, but this time the least significant bit is set to a logic 1. Data from the register defined by the command byte will then be sent by the PCA9539; PCA9539R (see Figure 9, Figure 10 and Figure 11). Data is clocked into the register on the falling edge of the acknowledge clock pulse. After the first byte is read, additional bytes may be read but the data will now reflect the information in the other register in the pair. For example, if you read Input port 1, then the next byte read would be Input port 0. There is no limitation on the number of data bytes received in one read transmission but the final byte received, the bus master must not acknowledge the data.
slave address SDA S 1 1 1 0 1 A1 A0 0 R/W acknowledge from slave slave address (cont.) S 1 1 1 0 1 A1 A0 1 R/W acknowledge from slave A A COMMAND BYTE A (cont.)
START condition
acknowledge from slave data from lower or upper byte of register MSB DATA (first byte) LSB A acknowledge from master MSB DATA (last byte) data from upper or lower byte of register LSB NA P STOP condition
(repeated) START condition
no acknowledge from master
at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter
002aad727
Remark: Transfer can be stopped at any time by a STOP condition.
Fig 9. Read from register
PCA9539_PCA9539R_5
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Product data sheet
Rev. 05 — 28 July 2008
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Product data sheet Rev. 05 — 28 July 2008
© NXP B.V. 2008. All rights reserved. PCA9539_PCA9539R_5
NXP Semiconductors
data into port 0
data into port 1
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
INT tv(INT_N) SCL 1 2 3 4 5 6 7 8 R/W 9 I0.x A 7 6 5 4 3 2 1 0 A 7 6 5 I1.x 4 3 2 1 0 A 7 6 5 I0.x 4 3 2 1 0 A 7 6 5 I1.x 4 3 2 STOP condition 1 0 1 P trst(INT_N)
slave address SDA S 1 1 1 0
1 A1 A0 1
START condition read from port 0
acknowledge from slave
acknowledge from master
acknowledge from master
acknowledge from master
non acknowledge from master
PCA9539; PCA9539R
read from port 1
002aad728
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register).
12 of 31
Fig 10. Read input port register, scenario 1
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Product data sheet Rev. 05 — 28 July 2008
© NXP B.V. 2008. All rights reserved. PCA9539_PCA9539R_5
NXP Semiconductors
data into port 0
DATA 00 th(D)
DATA 01
DATA 02 tsu(D) DATA 11 th(D)
DATA 03
data into port 1
DATA 10
DATA 12 tsu(D)
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
INT tv(INT_N) SCL 1 2 3 4 5 6 7 8 R/W 9 I0.x A DATA 00 A acknowledge from master I1.x DATA 10 A acknowledge from master I0.x DATA 03 A acknowledge from master I1.x DATA 12 STOP condition 1 P trst(INT_N)
slave address SDA S 1 1 1 0
1 A1 A0 1
START condition read from port 0
acknowledge from slave
non acknowledge from master
PCA9539; PCA9539R
read from port 1
002aad729
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read input port register).
13 of 31
Fig 11. Read input port register, scenario 2
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.6.3 Interrupt output
The open-drain interrupt output is activated when one of the port pins change state and the pin is configured as an input. The interrupt is deactivated when the input returns to its previous state or the Input port register is read (see Figure 10). A pin configured as an output cannot cause an interrupt. Since each 8-bit port is read independently, the interrupt caused by Port 0 will not be cleared by a read of Port 1 or the other way around. Remark: Changing an I/O from an output to an input may cause a false interrupt to occur if the state of the pin does not match the contents of the Input port register.
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 12).
SDA
SCL data line stable; data valid change of data allowed
mba607
Fig 12. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 13).
SDA
SDA
SCL S START condition P STOP condition
SCL
mba608
Fig 13. Definition of START and STOP conditions
PCA9539_PCA9539R_5
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Product data sheet
Rev. 05 — 28 July 2008
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NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
7.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 14).
SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER
SLAVE
002aaa966
Fig 14. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement
002aaa987
9
Fig 15. Acknowledgement on the I2C-bus
PCA9539_PCA9539R_5
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Product data sheet
Rev. 05 — 28 July 2008
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NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
8. Application design-in information
VDD (5 V) VDD MASTER CONTROLLER SCL SDA INT RESET VSS
10 kΩ
10 kΩ
10 kΩ
10 kΩ
2 kΩ
VDD
100 kΩ (×3)
SUB-SYSTEM 1 (e.g., temp sensor) INT
PCA9539
SCL SDA INT RESET IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 B IO0_6 IO0_7 IO1_0 IO1_1 IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 VSS SUB-SYSTEM 3 (e.g., alarm system) 10 DIGIT NUMERIC KEYPAD ALARM enable SUB-SYSTEM 2 (e.g., counter) RESET A controlled switch (e.g., CBT device)
VDD
A1 A0
002aad730
Device address configured as 1110 100X for this example. IO0_0, IO0_2, IO0_3 configured as outputs. IO0_1, IO0_4, IO0_5 configured as inputs. IO0_6, IO0_7 and (IO1_0 to IO1_7) configured as inputs.
Fig 16. Typical application
PCA9539_PCA9539R_5
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Product data sheet
Rev. 05 — 28 July 2008
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NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
8.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a resistor as shown in Figure 16. Since the LED acts as a diode, when the LED is off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower than VDD. Designs needing to minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD when the LED is off. Figure 17 shows a high value resistor in parallel with the LED. Figure 18 shows VDD less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at or above VDD and prevents additional supply current consumption when the LED is off.
VDD
3.3 V
5V
VDD
LED
100 kΩ
VDD
LED
LEDn
LEDn
002aac189
002aac190
Fig 17. High value resistor in parallel with the LED
Fig 18. Device supplied by a lower voltage
9. Limiting values
Table 13. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI/O IO II IDD ISS Ptot Tstg Tamb Tj(max) Parameter supply voltage voltage on an input/output pin output current input current supply current ground supply current total power dissipation storage temperature ambient temperature maximum junction temperature operating on an I/O pin Conditions Min −0.5 −65 −40 Max +6.0 ±50 ±20 160 200 200 +150 +85 125 Unit V V mA mA mA mA mW °C °C °C
VSS − 0.5 6
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10. Static characteristics
Table 14. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Supplies VDD IDD Istb supply voltage supply current standby current Operating mode; VDD = 5.5 V; no load; fSCL = 100 kHz; I/O = inputs Standby mode; VDD = 5.5 V; no load; VI = VSS; fSCL = 0 kHz; I/O = inputs Standby mode; VDD = 5.5 V; no load; VI = VDD; fSCL = 0 kHz; I/O = inputs VPOR VIL VIH IOL IL Ci I/Os VIL VIH IOL VOH LOW-level input voltage HIGH-level input voltage LOW-level output current HIGH-level output voltage VDD = 2.3 V to 5.5 V; VOL = 0.5 V VDD = 2.3 V to 5.5 V; VOL = 0.7 V IOH = −8 mA; VDD = 2.3 V IOH = −10 mA; VDD = 2.3 V IOH = −8 mA; VDD = 3.0 V IOH = −10 mA; VDD = 3.0 V IOH = −8 mA; VDD = 4.75 V IOH = −10 mA; VDD = 4.75 V ILIH ILIL Ci Co IOL VIL VIH ILI
[1] [2]
[2] [2] [3] [3] [3] [3] [3] [3]
Conditions
Min 2.3 −0.5 0.7VDD
Typ 135 0.25 0.25 1.5 6 9 11 3.7 3.7 -
Max 5.5 200 1 1 1.65
Unit V µA µA µA V
power-on reset voltage[1] LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance
no load; VI = VDD or VSS
Input SCL; input/output SDA +0.3VDD V 5.5 +1 10 V mA µA pF
VOL = 0.4 V VI = VDD = VSS VI = VSS
3 −1 −0.5 0.7VDD 8 10 1.8 1.7 2.6 2.5 4.1 4.0 -
+0.3VDD V 5.5 1 −1 5 5 V mA mA V V V V V V µA µA pF pF mA
HIGH-level input leakage current LOW-level input leakage current input capacitance output capacitance LOW-level output current LOW-level input voltage HIGH-level input voltage input leakage current
VDD = 5.5 V; VI = VDD VDD = 5.5 V; VI = VSS
Interrupt INT VOL = 0.4 V 3 −0.5 0.7VDD −1 Select inputs A0, A1 and RESET +0.3VDD V 5.5 +1 V µA
VDD must be lowered to 0.2 V for at least 5 µs in order to reset part. Each I/O must be externally limited to a maximum of 25 mA and each octal (IO0_0 to IO0_7 and IO1_0 to IO1_7) must be limited to a maximum current of 100 mA for a device total of 200 mA.
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
[3]
The total current sourced by all I/Os must be limited to 160 mA (80 mA for IO0_0 through IO0_7 and 80 mA for IO1_0 through IO1_7).
11. Dynamic characteristics
Table 15. Symbol Dynamic characteristics Parameter Conditions Standard-mode I2C-bus Min fSCL tBUF tHD;STA tSU;STA tSU;STO tVD;ACK tHD;DAT tVD;DAT tSU;DAT tLOW tHIGH tf tr tSP SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition set-up time for a repeated START condition set-up time for STOP condition data valid acknowledge time data hold time data valid time data set-up time LOW period of the SCL clock HIGH period of the SCL clock fall time of both SDA and SCL signals rise time of both SDA and SCL signals pulse width of spikes that must be suppressed by the input filter data output valid time data input set-up time data input hold time valid time on pin INT reset time on pin INT reset pulse width reset recovery time reset time
[5][6] [4] [3] [3] [2] [1]
Fast-mode I2C-bus Min 0 1.3 0.6 0.6 0.6 0.1 0 50 100 1.3 0.6 20 + 0.1Cb 20 + 0.1Cb Max 400 0.9 300 300 50
Unit
Max 100 3.45 300 1000 50
0 4.7 4.0 4.7 4.0 0.3 0 300 250 4.7 4.0 -
kHz µs µs µs µs µs ns ns ns µs µs ns ns ns
Port timing tv(Q) tsu(D) th(D) tv(INT_N) trst(INT_N) tw(rst) trec(rst) trst
[1] [2] [3] [4] [5] [6]
150 1 4 0 400
200 4 4 -
150 1 4 0 400
200 4 4 -
ns ns µs µs µs ns ns ns
Interrupt timing
RESET timing
tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW. tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. Cb = total capacitance of one bus line in pF. tv(Q) measured from 0.7VDD on SCL to 50 % I/O output. Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions. Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
SDA tBUF tLOW SCL tr tf tHD;STA tSP
tHD;STA P S tHD;DAT tHIGH tSU;DAT Sr
tSU;STA
tSU;STO P
002aaa986
Fig 19. Definition of timing on the I2C-bus
START SCL
ACK or read cycle
SDA 30 % trst RESET 50 % trec(rst) 50 % tw(rst) trst IOn 50 % after reset, I/Os reconfigured as inputs
002aad732
50 %
Fig 20. Definition of RESET timing in PCA9539
START SCL
ACK or read cycle
SDA 30 % trst RESET 50 % trec(rst) 50 % tw(rst) trst IOn 50 % after reset, I/Os unchanged; device state machine reset
002aad733
50 %
Fig 21. Definition of RESET timing in PCA9539R
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
SCL
2
1
0
A
P
70 % 30 %
SDA tsu(D) th(Q)
input tv(INT_N) INT
002aad734
50 % trst(INT_N)
Fig 22. Expanded view of read input port register
SCL
2
1
0
A
P
70 %
SDA tv(Q)
output
002aad735
50 %
Fig 23. Expanded view of write to output port register
protocol
START condition (S) tSU;STA
bit 7 MSB (A7) tLOW tHIGH
bit 6 (A6)
bit 1 (D1)
bit 0 (D0)
acknowledge (A)
STOP condition (P)
1 / fSCL
SCL tBUF tr tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab285
Rise and fall times refer to VIL and VIH.
Fig 24. I2C-bus timing diagram
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12. Test information
VDD open GND
VDD PULSE GENERATOR VI DUT
RT
VO
RL 500 Ω
CL 50 pF
002aab284
RL = load resistor. CL = load capacitance includes jig and probe capacitance. RT = termination resistance should be equal to the output impedance of Zo of the pulse generators.
Fig 25. Test circuitry for switching times
RL
S1
from output under test
CL 50 pF
500 Ω RL 500 Ω
2VDD open GND
002aac226
Fig 26. Load circuit Table 16. Test tv(Q) Test data Load CL 50 pF RL 500 Ω 2 × VDD Switch
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) θ A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
θ
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 27. Package outline SOT137-1 (SO24)
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
θ Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 θ 8o 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 28. Package outline SOT355-1 (TSSOP24)
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PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
D
B
A
terminal 1 index area A A1 E c
detail X
e1
1/2 e
C b 12 vMCAB wMC 13 e y1 C y
e 7 L 6
Eh
1/2 e
e2
1
18
terminal 1 index area
24 Dh 0
19 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.1 3.9 Dh 2.25 1.95 E (1) 4.1 3.9 Eh 2.25 1.95 e 0.5 e1 2.5 e2 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT616-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22
Fig 29. Package outline SOT616-1 (HVQFN24)
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
• • • • • •
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
• Solder bath specifications, including temperature and impurities 15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 17 and 18
Table 17. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 18. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 30.
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.
16. Abbreviations
Table 19. Acronym ACPI CBT CDM CMOS ESD FET FF GPIO HBM I2C-bus I/O LED MM SMBus Abbreviations Description Advanced Configuration and Power Interface Cross-Bar Technology Charged-Device Model Complementary Metal-Oxide Semiconductor ElectroStatic Discharge Field-Effect Transistor Flip-Flop General Purpose Input/Output Human Body Model Inter-Integrated Circuit bus Input/Output Light Emitting Diode Machine Model System Management Bus
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17. Revision history
Table 20. Revision history Release date 20080728 Data sheet status Product data sheet Change notice Supersedes PCA9539_PCA9539R_4 Document ID PCA9539_PCA9539R_5 Modifications:
•
Section 1 “General description”: – split (old) 4th paragraph to 2 (new) 4th and (new) 5th paragraphs – (new) 5th paragraph re-written
•
Table 2 “Ordering options”: – changed Topside mark for Type number PCA9539RPW from “PCA9539RPW” to “PA9539RPW” – changed Topside mark for Type number PCA9539RBS from “9539R” to “539R”
PCA9539_PCA9539R_4 PCA9539_3 PCA9539_2 (9397 750 14048) PCA9539_1 (9397 750 12898)
20080519 20060921 20040930 20040827
Product data sheet Product data sheet Product data sheet Product data sheet
-
PCA9539_3 PCA9539_2 PCA9539_1 -
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18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
20. Contents
1 2 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.3 6.4 6.5 6.6 6.6.1 6.6.2 6.6.3 7 7.1 7.1.1 7.2 7.3 8 8.1 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6 Registers 0 and 1: Input port registers . . . . . . . 7 Registers 2 and 3: Output port registers. . . . . . 7 Registers 4 and 5: Polarity inversion registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Registers 6 and 7: Configuration registers . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9 Writing to the port registers . . . . . . . . . . . . . . . 9 Reading the port registers . . . . . . . . . . . . . . . 11 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14 Characteristics of the I2C-bus. . . . . . . . . . . . . 14 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 START and STOP conditions . . . . . . . . . . . . . 14 System configuration . . . . . . . . . . . . . . . . . . . 15 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application design-in information . . . . . . . . . 16 Minimizing IDD when the I/Os are used to control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 Static characteristics. . . . . . . . . . . . . . . . . . . . 18 Dynamic characteristics . . . . . . . . . . . . . . . . . 19 Test information . . . . . . . . . . . . . . . . . . . . . . . . 22 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Handling information. . . . . . . . . . . . . . . . . . . . 26 Soldering of SMD packages . . . . . . . . . . . . . . 26 Introduction to soldering . . . . . . . . . . . . . . . . . 26 Wave and reflow soldering . . . . . . . . . . . . . . . 26 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29 18 18.1 18.2 18.3 18.4 19 20 Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 30 30 30 30 30 31
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 28 July 2008 Document identifier: PCA9539_PCA9539R_5