PCA9570GMH

PCA9570 Remote 4-bit general purpose outputs for 1 MHz I2C-bus Rev. 5 — 16 November 2017 Product data sheet 1. General description The PCA9570 is a CMOS device that provides 4 bits of General Purpose parallel Output (GPO) expansion in low voltage processor and handheld battery powered mobile applications. It operates at 1 MHz I2C-bus speeds while maintaining backward compatibility to Fast-mode (400 kHz) and Standard-mode (100 kHz). The PCA9570 is a streamlined GPO that consists of 4-bit push-pull outputs that offer low current consumption, small packaging options and a low operating voltage range of 1.1 V to 3.6 V. The latched outputs are symmetrical 4 mA current drive capability at 3.3 V to drive various control logic. The PCA9570 output expander provides a simple solution when additional outputs are needed while keeping interconnections and floor space to a minimum, for example, in battery powered mobile applications where PCBs are crowded for interfacing to sensors, push buttons, etc. The PCA9570 contains an internal Power-On Reset (POR) and a Software Reset feature that initializes the device to its default state. 2. Features and benefits  1 MHz I2C-bus interface with 6 mA SDA sink capability for lightly loaded buses ( VDD - 18 mA continuous; P port - 25 mA LOW-level output current continuous; SDA; VO = 0 V to VDD - 25 mA IDD supply current continuous through VSS - 100 mA Tstg storage temperature 65 +150 C Tj junction temperature - 125 C [1] [1] If the input and output current ratings are observed, the input negative-voltage and output voltage ratings may be exceeded 11. Thermal characteristics Table 5. Symbol Zth(j-a) [1] Thermal characteristics Parameter Conditions transient thermal impedance from junction to ambient XQFN8 (SOT902-2) [1] Max Unit 62 K/W The package thermal impedance is calculated in accordance with JESD 51-7. PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 11 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 12. Static characteristics Table 6. Static characteristics Tamb = 40 C to +85 C; VDD = 1.1 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions VIK input clamping voltage II = 18 mA VDD supply voltage VPOR power-on reset voltage VOL LOW-level output voltage VOH HIGH-level output voltage LOW-level output current IOL Min Typ[1] Max Unit 1.2 - - V 1.1 - 3.6 V VI = VDD or VSS; IO = 0 mA - 0.7 1.0 V P port; IOL = 2 mA; VDD = 1.65 V - - 0.25 V P port; IOL = 3 mA; VDD = 2.3 V - - 0.25 V P port; IOL = 4 mA; VDD = 3 V - - 0.25 V P port; IOH = 2 mA; VDD = 1.65 V 1.35 - - V P port; IOH = 3 mA; VDD = 2.3 V 2.0 - - V P port; IOH = 4 mA; VDD = 3 V 2.7 - - V SDA; VOL = 0.4 V; VDD = 2.1 V to 3.6 V 3 - - mA SDA; VOL = 0.2  VDD; VDD = 1.1 V to 2.0 V 1 - - mA 0.8  VDD - 1.2 V V VIH HIGH-level input voltage SCL, SDA; VDD = 1.1 V to 1.2 V SCL, SDA; VDD = 1.2 V to 3.6 V 0.7  VDD - 3.6 VIL LOW-level input voltage SCL, SDA; VDD = 1.1 V to 1.2 V 0.5 - 0.2  VDD V SCL, SDA; VDD = 1.2 V to 3.6 V 0.5 - 0.3  VDD V - - 1 A VDD = 2.3 V to 3.6 V - 6.5 15 A VDD = 1.1 V to 2.3 V - 4 9 A VDD = 2.3 V to 3.6 V - 1 3.2 A VDD = 1.1 V to 2.3 V - 0.6 1.7 A II input current SCL, SDA; VDD = 1.1 V to 3.6 V; VI = VDD or VSS IDD supply current SDA, P port; VI on SDA = VDD or VSS; IO = 0 mA; fSCL = 400 kHz SCL, SDA, P port; VI on SCL, SDA = VDD or VSS; IO = 0 mA; fSCL = 0 kHz Active mode: SCL, SDA, P port; IO = 0 mA; fSCL = 400 kHz; continuous register read - 50 75 A Ci input capacitance VI = VDD or VSS - 6 7 pF Co output capacitance VO = VDD or VSS - 3 5 pF Tamb ambient temperature operating in free air 40 - +85 C VDD = 1.1 V to 2.3 V [1] The typical values are at VDD = 2.2 V and Tamb = 25 C. PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 12 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 12.1 Typical characteristics aaa-011393 12 IDD (μA) IDD(stb) (nA) VDD = 3.6 V 3.3 V 2.5 V 1.8 V 1.1 V 8 aaa-011394 120 VDD = 3.6 V 3.3 V 2.5 V 1.8 V 1.1 V 80 4 40 0 −40 −15 10 35 0 −40 60 85 Tamb (°C) Fig 13. Supply current versus ambient temperature −15 10 35 60 85 Tamb (°C) Fig 14. Standby supply current versus ambient temperature aaa-011395 10 IDD (μA) 8 6 4 2 1 1.1 1.8 2.5 3.3 3.6 VDD (V) Tamb = 25 C Fig 15. Supply current versus supply voltage PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 13 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus aaa-011487 8 Isink (mA) Tamb = −40 °C 25 °C 85 °C Isink (mA) 6 aaa-011488 18 Tamb = −40 °C 25 °C 85 °C 12 4 6 2 0 0 0 0.2 0.4 0.6 0 0.2 0.4 VOL (V) a. VDD = 1.2 V b. VDD = 1.8 V aaa-011489 30 Isink (mA) Tamb = −40 °C 25 °C 85 °C Isink (mA) 0.6 VOL (V) aaa-011490 36 20 24 10 12 Tamb = -40 °C 25 °C 85 °C 0 0 0 0.2 0.4 0.6 0 VOL (V) 0.2 0.4 0.6 VOL (V) c. VDD = 2.5 V d. VDD = 3.3 V Fig 16. I/O sink current versus LOW-level output voltage PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 14 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus aaa-011563 6 Isource (mA) Tamb = −40 °C 25 °C 85 °C 4 aaa-011564 14 Isource (mA) 12 Tamb = −40 °C 25 °C 85 °C 10 8 6 2 4 2 0 0 0 0.2 0.4 0.6 VDD − VOH (V) 0 a. VDD = 1.2 V aaa-011566 36 Isource (mA) Tamb = −40 °C 25 °C 85 °C 15 0.4 0.6 VDD − VOH (V) b. VDD = 1.8 V aaa-011565 25 Isource (mA) 20 0.2 Tamb = −40 °C 25 °C 85 °C 24 10 12 5 0 0 0 0.2 0.4 0.6 VDD − VOH (V) 0 c. VDD = 2.5 V 0.2 0.4 0.6 VDD − VOH (V) d. VDD = 3.3 V Fig 17. I/O source current versus HIGH-level output voltage aaa-011567 60 VOL (mV) (1) 40 20 (2) 0 −40 −15 10 35 60 85 Tamb (°C) (1) VDD = 1.8 V; Isink = 2 mA (2) VDD = 1.8 V; Isink = 100 A Fig 18. LOW-level output voltage versus temperature PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 15 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 13. Dynamic characteristics Table 7. Dynamic characteristics VDD = 1.1 V to 3.6 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Standard mode I2C-bus Fast mode I2C-bus 1 MHz I2C-bus[1] Min Max Min Max Min 0 100 0 400 0 Unit Max fSCL SCL clock frequency 1000 kHz tBUF bus free time between a STOP and START condition 4.7 - 1.3 - 0.5 - s tHD;STA hold time (repeated) START condition 4.0 - 0.6 - 0.26 - s tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - 0.26 - s tSU;STO set-up time for STOP condition 4.0 - 0.6 - 0.26 - s tHD;DAT data hold time 0 - 0 - 0 - ns tVD;ACK data valid acknowledge time [2] - 3.45 - 0.9 - 0.45 s tVD;DAT data valid time [3] - 3.45 - 0.9 - 0.45 s tSU;DAT data set-up time 250 - 100 - 50 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - 0.5 - s tHIGH HIGH period of the SCL clock 4.0 - 0.6 - 0.26 - s tf fall time of both SDA and SCL signals - 300 20  (VDD / 5.5 V) 300 20  (VDD / 5.5 V) 120 ns tr rise time of both SDA and SCL signals - 1000 20 300 - 120 ns tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 - 50 ns - 200 - 200 - 200 ns [4] Port timing data output valid time tv(Q) [1] Fm+ mode on a non-standard, lightly loaded bus ( 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 25. PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 23 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 19. Soldering: PCB footprints              VROGHUODQGV RFFXSLHGDUHD 'LPHQVLRQVLQPP VRWBIU Fig 26. PCB footprint for SOT505-1 (TSSOP8); reflow soldering PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 24 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus )RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI627SDFNDJH 627                   RFFXSLHGDUHD VROGHUUHVLVW VROGHUODQGV VROGHUSDVWH 'LPHQVLRQVLQPP ,VVXHGDWH   VRWBIU Fig 27. PCB footprint for SOT1309-1 (XQFN8); reflow soldering PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 25 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus )RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI;4)1SDFNDJH 627 +[ ' î   &î +\ $\  6/\   6/[  VROGHUODQG VROGHUSDVWHGHSRVLW VROGHUODQGSOXVVROGHUSDVWH RFFXSLHGDUHD ',0(16,216LQPP $\ &   ,VVXHGDWH ' 6/[ 6/\ +[ +\        VRWBIU Fig 28. PCB footprint for SOT902-2 (XQFN8); reflow soldering PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 26 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 20. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged-Device Model ESD ElectroStatic Discharge FM Frequency Modulation GPIO General Purpose Input/Output GPS Global Positioning Satellite HBM Human Body Model I2C-bus Inter-Integrated Circuit bus I/O Input/Output IC Integrated Circuit ID Identification LED Light Emitting Diode LSB Least Significant Bit MP3 MPEG audio layer 3 MSB Most Significant Bit SMBus System Management Bus 21. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9570 v.5 20171116 Product data sheet - PCA9570 v.4 Modifications: PCA9570 v.4 Modifications: • Removed PCA9570DP and PCA9570GM4 20140917 • • • • • Product data sheet - Table 1 “Ordering information”: Added table note PCA9570 v.3 [1]. Table 2 “Ordering options”: Added table note [1]. Table 4 “Limiting values”, IDD; changed max from “200” to “100”. Section 14 “Power-on reset requirements”: Deleted paragraphs 2 and 3; deleted Fig 22. Table 8 “Recommended supply sequencing and ramp rates”: – td(rst): Deleted 2nd row – VDD(gl): Changed VDD condition from “1.8 V” to “2.1 V” PCA9570 v.3 20140515 Product data sheet - PCA9570 v.2 PCA9570 v.2 20140204 Product data sheet - PCA9570 v.1 PCA9570 v.1 20130910 Product data sheet - - PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 27 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 22. Legal information 22.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 22.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 22.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA9570 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 28 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 22.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 23. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9570 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 16 November 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 29 of 30 PCA9570 NXP Semiconductors Remote 4-bit general purpose outputs for 1 MHz I2C-bus 24. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.2.1 7.2.2 8 8.1 8.2 8.3 8.4 9 9.1 10 11 12 12.1 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 21 22 22.1 22.2 22.3 22.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 4 Software Reset Call, and device ID addresses 5 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 6 Device ID (PCA9570 ID field) . . . . . . . . . . . . . . 7 I/O programming . . . . . . . . . . . . . . . . . . . . . . . . 8 I/O architecture . . . . . . . . . . . . . . . . . . . . . . . . . 8 Writing to the port (Output mode) . . . . . . . . . . . 8 Reading from a port (Input mode) . . . . . . . . . . 9 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application design-in information . . . . . . . . . 10 I/O expander applications . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal characteristics . . . . . . . . . . . . . . . . . 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 12 Typical characteristics . . . . . . . . . . . . . . . . . . 13 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 Power-on reset requirements . . . . . . . . . . . . . 17 Parameter measurement information . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 Handling information. . . . . . . . . . . . . . . . . . . . 22 Soldering of SMD packages . . . . . . . . . . . . . . 22 Introduction to soldering . . . . . . . . . . . . . . . . . 22 Wave and reflow soldering . . . . . . . . . . . . . . . 22 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 Soldering: PCB footprints. . . . . . . . . . . . . . . . 24 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 29 23 24 Contact information . . . . . . . . . . . . . . . . . . . . 29 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 November 2017 Document identifier: PCA9570