PCA9701; PCA9702
18 V tolerant SPI 16-bit/8-bit GPI with INT
Rev. 7 — 26 September 2014
Product data sheet
1. General description
The PCA9701/PCA9702 are low power 18 V tolerant SPI General Purpose Input (GPI)
shift register designed to monitor the status of switch inputs. It generates an interrupt
when one or more of the switch inputs change state. The input level is recognized as a
HIGH when it is greater than 0.7 VDD and as a LOW when it is less than 0.4 VDD
(minimum threshold of 2 V at 5 V node). The PCA9701 can monitor up to 16 switch inputs
and the PCA9702 can monitor up to 8 switch inputs.
The falling edge of the CS pin samples the input port status and clears the interrupt. When
CS is LOW, the rising edge of the SCLK loads the shift register and shifts the value out of
the shift register. The serial input is sampled on the falling edge of SCLK.
Each of the input ports has a 18 V breakdown ESD protection circuit. When used with a
series resistor (minimum 100 k), the input can connect to a 12 V battery and support
double battery, reverse battery, 27 V jump start and 40 V load dump conditions in
automotive applications. Higher voltages can be tolerated on the inputs depending on the
series resistor used to limit the input current.
With both the high breakdown voltage and high ESD, these devices are useful for both
automotive and mobile applications.
The PCA9703/PCA9704 are new pin compatible devices for the PCA9701/PCA9702
which have an interrupt masking feature allowing selected inputs to not generate
interrupts and provides higher ground offset of 0.55 VDD (minimum of 2.5 V at 5 V node)
with minimum hysteresis of 0.05 VDD (minimum of 225 mV at 5 V node).
2. Features and benefits
16 general purpose input ports (PCA9701) or 8 general purpose input ports
(PCA9702)
18 V tolerant input ports with 100 k external series resistor
Input LOW threshold 0.4 VDD with minimum of 2 V at VDD = 4.5 V
Open-drain interrupt output
Interrupt enable pin (INT_EN) disables interrupt output
VDD range: 2.5 V to 5.5 V
IDD is very low 2.5 A maximum
SPI serial interface with speeds up to 5 MHz
ESD protection exceeds 8 kV HBM per JESD22-A114, 350 V MM, and 1000 V CDM
per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Operating temperature range: 40 C to +125 C
PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
PCA9701 offered in SO24, TSSOP24 and HWQFN24 packages
PCA9702 offered in TSSOP16 package
3. Applications
Body control modules
Switch monitoring
Industrial equipment
Cellular telephones
Emergency lighting
SBC wake pin extension
4. Ordering information
Table 1.
Ordering information
Type number
Topside
marking
Package
Name
Description
Version
PCA9701D
PCA9701D
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
PCA9701HF
9701
HWQFN24 plastic thermal enhanced very very thin quad flat package; SOT994-1
no leads; 24 terminals; body 4 4 0.75 mm
PCA9701PW
PCA9701PW TSSOP24
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
PCA9702PW
PCA9702
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
TSSOP16
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum
Temperature range
order quantity
PCA9701D
PCA9701D,118
SO24
Reel 13” Q1/T1
*standard mark SMD
1000
Tamb = 40 C to +125 C
PCA9701HF
PCA9701HF,118
HWQFN24 Reel 13” Q1/T1
*standard mark SMD
6000
Tamb = 40 C to +125 C
PCA9701PW
PCA9701PW,118 TSSOP24
Reel 13” Q1/T1
*standard mark SMD
2500
Tamb = 40 C to +125 C
PCA9702PW
PCA9702PW,118 TSSOP16
Reel 13” Q1/T1
*standard mark SMD
2500
Tamb = 40 C to +125 C
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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PCA9701; PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
5. Block diagram
VDD
PCA9701/PCA9702
INT
IN0
DFF0
IN1
DFF1
INT_EN
SHIFT
REGISTER
INn(1)
SDOUT
SDIN
SCLK
CS
DFFn(1)
INPUT
STATUS
REGISTER
20 μA
VSS
002aac422
(1) n = 15 for PCA9701; n = 7 for PCA9702
Fig 1.
PCA9701_PCA9702
Product data sheet
Block diagram of PCA9701; PCA9702
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PCA9701; PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
6. Pinning information
6.1 Pinning
SDOUT
1
1
2
24 VDD
23 SDIN
SDOUT
INT
INT
2
24 VDD
23 SDIN
INT_EN
3
22 SCLK
INT_EN
3
22 SCLK
IN0
4
21 CS
IN0
4
21 CS
IN1
5
20 IN15
IN1
5
20 IN15
IN2
6
19 IN14
IN2
6
IN3
7
18 IN13
IN3
7
IN4
8
17 IN12
IN4
8
17 IN12
IN5
9
16 IN11
IN5
9
16 IN11
IN6 10
15 IN10
IN6 10
15 IN10
IN7 11
14 IN9
IN7 11
14 IN9
VSS 12
13 IN8
VSS 12
13 IN8
PCA9701D
Fig 3.
Pin configuration for TSSOP24
IN0
1
18 CS
IN1
2
17 IN15
SDOUT
1
16 VDD
IN2
3
16 IN14
INT
2
15 SDIN
IN3
4
15 IN13
INT_EN
3
14 SCLK
IN4
5
14 IN12
IN0
4
IN5
6
13 IN11
IN1
5
IN2
6
11 IN6
IN3
7
10 IN5
VSS
8
IN10 12
IN9 11
IN8 10
9
VSS
8
IN7
IN6
7
PCA9701HF
002aad050
Transparent top view
Fig 4.
18 IN13
19 SCLK
20 SDIN
21 VDD
22 SDOUT
23 INT
24 INT_EN
Pin configuration for SO24
terminal 1
index area
19 IN14
002aac424
002aac636
Fig 2.
PCA9701PW
Product data sheet
13 CS
12 IN7
9
IN4
002aac425
Pin configuration for HWQFN24
PCA9701_PCA9702
PCA9702PW
Fig 5.
Pin configuration for TSSOP16
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PCA9701; PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
6.2 Pin description
Table 3.
Symbol
SDOUT
Pin description
Pin
SO24, TSSOP24
HWQFN24
TSSOP16
1
22
1
Type
Description
output
3-state serial data output; normally high-impedance
INT
2
23
2
output
open-drain interrupt output (active LOW)
INT_EN
3
24
3
input
interrupt output enable
1 = interrupt is enabled
0 = interrupt is disabled and high-impedance
IN0
4
1
4
input
input port 0
IN1
5
2
5
input
input port 1
IN2
6
3
6
input
input port 2
IN3
7
4
7
input
input port 3
IN4
8
5
9
input
input port 4
IN5
9
6
10
input
input port 5
IN6
10
7
11
input
input port 6
IN7
11
8
12
input
input port 7
VSS
12
9[1]
8
ground
ground supply
IN8
13
10
-
input
input port 8
IN9
14
11
-
input
input port 9
IN10
15
12
-
input
input port 10
IN11
16
13
-
input
input port 11
IN12
17
14
-
input
input port 12
IN13
18
15
-
input
input port 13
IN14
19
16
-
input
input port 14
IN15
20
17
-
input
input port 15
CS
21
18
13
input
chip select (active LOW)
SCLK
22
19
14
input
serial input clock
SDIN
23
20
15
input
serial data input (20 A pull-down)
VDD
24
21
16
supply
supply voltage
[1]
HWQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply
ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be
soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias
need to be incorporated in the PCB in the thermal pad region.
PCA9701_PCA9702
Product data sheet
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
7. Functional description
PCA9701 is a 16-bit General Purpose Input (GPI) with an open-drain interrupt output
designed to monitor switch status. By putting an external 100 k series resistor at the
input port, the device allows the input to tolerate momentary double 12 V battery, reverse
battery, 27 V jump start or 40 V load dump conditions. The interrupt output is asserted
when an input port status changes. The open-drain interrupt output is enabled when
INT_EN is HIGH and disabled when INT_EN is LOW. The input port status is accessed
via the 4-wire SPI interface. The PCA9702 is the 8-bit version of the PCA9701.
Multiple PCA9701 or PCA9702 devices can be serially connected for monitoring a large
number of switches by connecting the SDOUT of one device to the SDIN of the next
device. SCLK and CS must be common among all devices and interrupt outputs may be
tied together. No external logic is necessary because all the devices’ interrupt outputs are
open-drain that function as ‘wired-AND’ and can simply be connected together to a single
pull-up resistor.
7.1 SPI bus operation
The PCA9701 or PCA9702 interfaces with the controller via the 4-wire SPI bus that is
comprised of the following signals: chip select (CS), serial clock (SCLK), serial data in
(SDIN), and serial data out (SDOUT). To access the device, the controller asserts CS
LOW, then sends SCLK and SDIN. When reading/writing is complete, the controller
de-asserts CS. See Figure 6 for register access timing.
7.1.1 CS - chip select
The CS pin is the device chip select and is an active LOW input. The falling edge of CS
captures the input port status in the input status register. If the interrupt output is asserted,
the falling edge of CS will clear the interrupt. When CS is LOW, the SPI interface is active.
When CS is HIGH, the SPI interface is disabled.
7.1.2 SCLK - serial clock input
SCLK is the serial clock input to the device. It should be LOW and remain LOW during the
falling and rising edge of CS. When CS is LOW, the first rising edge of SCLK parallel
loads the shift register from the input. The subsequent rising edges on SCLK serially shifts
data out from the shift register. The falling edge of SCLK samples the data on SDIN.
7.1.3 SDIN - serial data input
SDIN is the serial data input port. The data is sampled into the shift register on the falling
edge of SCLK. SDIN is only active when CS is LOW. This input has a 20 A pull-down
current source.
7.1.4 SDOUT - serial data output
SDOUT is the serial data output signal. SDOUT is high-impedance when CS is HIGH and
switches to low-impedance after CS goes LOW. When CS is LOW, after the first rising
edge of SCLK the most significant bit in the shift register is presented on SDOUT.
Subsequent rising edges of SCLK shift the remaining data from the shift register onto
SDOUT.
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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6 of 29
PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
7.1.5 Register access timing
Figure 6 shows the waveforms of the device operation. Initially CS is HIGH and SCLK is
LOW. On the falling edge of CS, input port status, DATA[n:0] is captured into the input
status register, and subsequently the first rising edge of SCLK parallel loads the shift
register. The falling edge of SCLK samples the data on the SDIN. The MSB from the shift
register is valid and available on the SDOUT after the first rising edge of SCLK.
sample
SDIN
CS
SCLK
MSB in
MSB − 1 in
LSB in
SDOUT
MSB out
MSB − 1 out
LSB out
shift
register
DATA[n:0]
SDIN
high-impedance
input status
register
DATA[n:0]
002aac426
DATA[n:0] is data on the input pins, IN[n:0].
For 8-bit GPI (PCA9702), n = 7; for 16-bit GPI (PCA9701), n = 15.
Shaded areas indicate active but invalid data.
Fig 6.
Register access timing
7.2 Interrupt output
INT is the open-drain interrupt output and is active LOW. A pull-up resistor of
approximately 10 k is recommended. The interrupt output is asserted when the input
status is changed, and is cleared on the falling edge of CS or when the input port status
matches the input status register. When there are multiple devices, the INT outputs may
be tied together to a single pull-up.
Table 4 illustrates the state of the interrupt output versus the state of the input port and
input status register. The interrupt output is asserted when the input port and input status
register differ.
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
Table 4.
Interrupt output function truth table
H = HIGH; L = LOW; X = don’t care
INT_EN
Input port status
Input status register[1]
INT output[2]
H
L
L
H
H
L
H
L
H
H
L
L
H
H
H
H
L
X
X
H
[1]
Input status register is the value or content of the D flip-flops.
[2]
Logic states shown for INT pin assumes 10 k pull-up resistor.
7.3 General Purpose Inputs
The General Purpose Inputs (GPI) are designed to behave like a typical input in the 0 V to
5.5 V range, but are also designed to have low leakage currents at elevated voltages. The
input structure allows for elevated voltages to be applied through a series resistor. The
series resistor is required when the input voltage is above 5.5 V. The series resistor is
required for two reasons: first, to prevent damage to the input avalanche diode, and
second, to prevent the ESD protection circuitry from creating an excessive current flow.
The ESD protection circuitry includes a latch-back style device, which provides excellent
ESD protection during assembly or typical 5.5 V applications. The series resistor limits the
current flowing into the part and provides additional ESD protection. The limited current
prevents the ESD latch-back device from latching back to a low voltage, which would
cause excessive current flow and damage the part.
The minimum required series resistance for applications with input voltages above 5.5 V
is 100 k. For applications requiring an applied voltage above 27 V, Equation 1 is
recommended to determine the series resistor. Failure to include the appropriate input
series resistor may result in product failure and will void the warranty.
voltage applied – 17 V
R s = -----------------------------------------------------------II
(1)
The series resistor should be placed physically as close as possible to the connected
input to reduce the effective node capacitance. The input response time is effected by the
RC time constant of the series resistor and the input node capacitance.
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
7.3.1 VIL, VIH and switching points
A minimum LOW threshold of 2.0 V is guaranteed for the logical switching points for the
inputs. See Figure 7 for details.
VI
HIGH
VDD
0.7VDD
VIH
VIL
0.4VDD
hysteresis
minimum
possible ground shift
LOW
0V
002aae128
Fig 7.
Logic level thresholds for general purpose inputs
The VIL is specified as a maximum of 0.40 VDD and is 2.0 V at 4.5 V VDD. This means
that if the user applies 2.0 V or less to the input (with VDD = 4.5 V), or as the voltage
passes this threshold, they will always see a LOW.
The VIH is specified as a minimum of 0.7 VDD. This means that if the user applies 3.15 V
or more to the input (with VDD = 4.5 V), or as the voltage passes this threshold, they will
always see a HIGH.
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
8. Application design-in information
8.1 General application
2.5 V to 5.5 V
18 V
1.5 kΩ
100 kΩ
VDD
IN0
10 kΩ
relay
INT
CS
SCLK
SDIN
SDOUT
18 V
100 kΩ
INT_EN
IN1
180 V
open
CONTROLLER
OR
PROCESSOR
PCA9701/
PCA9702
500 kΩ
IN2
50 kΩ
5V
10 kΩ
INn(1)
VSS
002aac423
(1) n = 15 for PCA9701; n = 7 for PCA9702
Fig 8.
Typical application
8.2 Automotive application
Supports:
•
•
•
•
•
PCA9701_PCA9702
Product data sheet
12 V battery (8 V to 16 V)
Double battery (16 V to 32 V)
Reverse battery (8 V to 16 V)
Jump start (27 V for 60 seconds)
Load dump (40 V)
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
8.2.1 SBC wake port extension with cyclic biasing
System Basis Chips (SBC) offer many functions needed for in-vehicle networking
solutions. Some of the features built into SBC are:
•
•
•
•
Transceivers (HS-CAN, LIN 2.0)
Scalable voltage regulators
Watchdog timers; wake-up function
Fail-safe function
For more information on SBC, refer to
http://www.nxp.com/index.html#/pip/pip=[pfp=53482]|pp=[t=pfp,i=53482].
8.2.1.1
UJA106x with PCA9701, standby
V3
alternate
PVR100AD-B5V0
UJA106x
IN0
INT
IN1
INT_EN
PCA9701
VDD
CS
SDIN
SDOUT
SCLK
IN15
WAKE
V1 GND
VSS
VCC
CSN
μC
MOSI
MISO
SCLK
GND
002aae016
Fig 9.
•
•
•
•
UJA106x with PCA9701 with supplied C (standby)
PCA970x fits to SBC UJA106x and UJA107xA family
PCA970x can be powered by V1 of SBC
Extends the SBC with 8/16 additional wake inputs
C can be set to stop-mode during standby to save ECU standby current. SBC with
GPI periodically monitors the wake inputs
– Cyclic bias via V3
– Very low system current consumption even with clamped switches
PCA9701_PCA9702
Product data sheet
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
8.2.1.2
UJA106x with PCA9701, sleep
alternate
PVR100AD-B5V0
alternate
PMEM4010ND
V3
UJA106x
WAKE
IN0
VDD INT_EN
IN1
INT
PCA9701
RSTN
CS
SDIN
SDOUT
SCLK
IN15
V1
alternate
PDTC144TU
VSS
GND
VCC
CSN
μC
MOSI
MISO
SCLK
GND
002aae017
Fig 10. UJA106x with PCA9701 with unsupplied C (sleep)
• Very low quiescent system current (50 A) due to disabled C and cyclically biasing
of switches
• Wake-up upon change of switches or upon bus traffic (CAN and LIN)
• PCA970x supplied out of cyclically biased transistor regulator
PCA9701_PCA9702
Product data sheet
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Rev. 7 — 26 September 2014
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
8.2.1.3
UJA107xA with PCA9701, standby
BAT
alternate
PDTA144EU
BAT
WBIAS
UJA107xA
IN0
INT
IN1
INT_EN
PCA9701
IN15
VSS
WAKE
V1
GND
VDD
CS
SDIN
SDOUT
SCLK
VCC
CSN
μC
MOSI
MISO
SCLK
GND
002aae018
Fig 11. UJA107xA with PCA9701 with supplied C (standby)
• UJA107xA SBC provides WBIAS pin for cyclic biasing of the inputs
• Compatible with UJA107xA based ASSPs
8.2.2 Application examples including switches to battery
BAT BAT
switch bias
switch bias
IN0
IN0
IN1
IN1
PCA9701
clamp 15
PCA9701
IN15
IN15
002aae019
Fig 12. Clamp 15 (ignition) detection
PCA9701_PCA9702
Product data sheet
002aae020
Fig 13. Switches to battery and ground with
cyclic biasing
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PCA9701; PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Tamb = 40 C to +125 C, unless otherwise specified.
Symbol
Parameter
Conditions
VDD
supply voltage
0.5
+6.0
V
II
input current
IN[n:0] pins with series resistor
and VI > 5.5 V,
[1][2]
-
350
A
VI
input voltage
GPI pins IN[n:0]; no series resistor
[1][2]
0.5
+6
V
Tstg
storage temperature
Tj(max)
maximum junction temperature
SPI pins
operating
Min
Max
Unit
0.5
+6
V
65
+150
C
-
125
C
[1]
With GPI external series resistors, the inputs support double battery, reverse battery and load dump conditions. During double battery or
load dump the input pin will drain slightly higher leakage current until the input drops to 18 V. For more detail of leakage current
specification, please refer to Table 6 “Static characteristics”. See Section 7.3 for series resistor requirements.
[2]
n = 15 for PCA9701; n = 7 for PCA9702.
PCA9701_PCA9702
Product data sheet
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PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
10. Static characteristics
Table 6.
Static characteristics
VDD = 2.5 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +125 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.5
3.3
5.5
V
-
1.0
2.5
A
-
1.8
2.2
V
-
-
0.4VDD V
Supply
VDD
supply voltage
IDD
supply current
VPOR
power-on reset
VDD = 5.5 V; input = 5 V or 18 V; INT_EN = VDD
voltage[1]
General Purpose Inputs
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
[2]
GPI recommended maximum current;
VI > 5.5 V; with series resistor Rs
[3]
0.7VDD -
-
V
-
-
100
A
II
input current
IIH
HIGH-level input current
each input; VI = VDD
1
-
+1
A
ILI
input leakage current
VI = 17 V; 100 k series resistor
1
-
+1
A
Ci
input capacitance
VI = VSS or VDD
-
2.0
5.0
pF
VDD = 4.5 V; VOL = 0.4 V
6
-
-
mA
VDD = 2.5 V; VOL = 0.4 V
3
-
-
mA
Interrupt output
IOL
LOW-level output current
IOH
HIGH-level output current VOH = VDD
1
-
+1
A
Co
output capacitance
-
2
5
pF
-
0.3VDD V
SPI and control
VIL
LOW-level input voltage
-
VIH
HIGH-level input voltage
0.7VDD -
5.5
V
IIH
HIGH-level input current
SDIN; VI = VDD = 5.5 V
-
20
40
A
IOL
LOW-level output current
SDOUT; VOL = 0.4 V
VDD = 4.5 V
5
-
-
mA
VDD = 2.5 V
3
-
-
mA
VDD = 4.5 V
5
11
-
mA
VDD = 2.5 V
3
7
-
mA
IOH
HIGH-level output current SDOUT; VOH = VDD 0.5 V
Ci
input capacitance
VI = VSS or VDD
-
2
5
pF
Co
output capacitance
SDOUT; CS = VDD
-
4
6
pF
[1]
VDD must be lowered to 0.2 V for at least 5 s in order to reset device.
[2]
Minimum VIL is 2.0 V at VDD = 4.5 V.
[3]
For GPI pin voltages > 5.5 V, see Section 7.3.
PCA9701_PCA9702
Product data sheet
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11. Dynamic characteristics
Table 7.
Dynamic characteristics
VDD = 2.5 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +125 C; unless otherwise specified.
Symbol
Parameter
Conditions
fmax
maximum input clock frequency
Min
Typ
Max
Unit
-
-
5
MHz
tr
rise time
SDOUT; 10 % to 90 % at 5 V
-
35
60
ns
tf
fall time
SDOUT; 90 % to 10 % at 5 V
-
25
50
ns
tWH
pulse width HIGH
SCLK
50
-
-
ns
tWL
pulse width LOW
SCLK
50
-
-
ns
tSPILEAD
SPI enable lead time
CS falling edge to SCLK rising edge
50
-
-
ns
tSPILAG
SPI enable lag time
SCLK falling edge to CS rising edge
50
-
-
ns
tsu(SDIN)
SDIN set-up time
SDIN to SCLK falling edge
20
-
-
ns
th(SDIN)
SDIN hold time
from SCLK falling edge
30
-
-
ns
ten(SDOUT)
SDOUT enable time
from CS LOW to
SDOUT low-impedance; Figure 17
-
-
55
ns
tdis(SDOUT)
SDOUT disable time
from rising edge of CS to SDOUT
high-impedance; Figure 17
-
-
85
ns
tv(SDOUT)
SDOUT valid time
from rising edge of SCLK; Figure 18
-
-
55
ns
tsu(SCLK)
SCLK set-up time
SCLK falling to CS falling
50
-
-
ns
th(SCLK)
SCLK hold time
SCLK rising after CS rising
50
-
-
ns
tPOR
power-on reset pulse time
time before CS is active
after VDD > VPOR
-
-
250
ns
trel(int)
interrupt release time
after CS going LOW; Figure 19
-
-
500
ns
tv(INT_N)
valid time on pin INT
after INn changes or INT_EN
goes HIGH
-
-
100
ns
CS
tsu(SCLK) tSPILEAD
tWH
50 %
tsu(SDIN)
SCLK
tSPILAG
tWL
th(SCLK)
50 %
th(SDIN)
MSB in
SDIN
ten(SDOUT)
tv(SDOUT)
tdis(SDOUT)
high-impedance
MSB out
SDOUT
trel(int)
INT
002aac428
Fig 14. Timing diagram
PCA9701_PCA9702
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2.5 V
VDD
VPOR
0V
CS
SCLK
SDOUT
MSB − 1
MSB out
tPOR
002aad158
Fig 15. AC waveform for tPOR timing
CS
INn
STATE 0
STATE 1
STATE 0
INT_EN
tv(INT_N)
tv(INT_N)
INT
trel(int)
trel(int)
002aad159
Fig 16. AC waveform for INT timing
PCA9701_PCA9702
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12. Test information
VDD
open
VDD
PULSE
GENERATOR
VI
RL
10 kΩ
VO
DUT
CL
50 pF
RT
10 kΩ
002aac580
Fig 17. Test circuitry for enable/disable times, SDOUT (ten(SDOUT) and tdis(SDOUT))
VDD
PULSE
GENERATOR
VI
VO
DUT
CL
50 pF
RT
002aac581
Fig 18. Test circuitry for switching times, SDOUT (tv(SDOUT))
VDD
VDD
PULSE
GENERATOR
VI
RL
10 kΩ
VO
DUT
CL
50 pF
RT
002aac582
Fig 19. Test circuitry for switching times, INT
RL = load resistance.
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse
generators.
PCA9701_PCA9702
Product data sheet
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18 V tolerant SPI 16-bit/8-bit GPI with INT
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 20. Package outline SOT137-1 (SO24)
PCA9701_PCA9702
Product data sheet
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18 V tolerant SPI 16-bit/8-bit GPI with INT
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
D
SOT355-1
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT355-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 21. Package outline SOT355-1 (TSSOP24)
PCA9701_PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 22. Package outline SOT403-1 (TSSOP16)
PCA9701_PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.75 mm
B
D
SOT994-1
A
terminal 1
index area
E
A
A1
c
detail X
e1
1/2 e
∅v
∅w
b
e
7
12
M
M
C
C A B
C
y1 C
y
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
b
c
D(1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
0.8
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT994-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
07-02-07
07-03-03
Fig 23. Package outline SOT994-1 (HWQFN24)
PCA9701_PCA9702
Product data sheet
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14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA9701_PCA9702
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18 V tolerant SPI 16-bit/8-bit GPI with INT
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 9.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
PCA9701_PCA9702
Product data sheet
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18 V tolerant SPI 16-bit/8-bit GPI with INT
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 10.
PCA9701_PCA9702
Product data sheet
Abbreviations
Acronym
Description
ASSP
Application Specific Standard Product
CAN
Controller Area Network
CDM
Charged-Device Model
DUT
Device Under Test
ECU
Electronic Control Unit
ESD
ElectroStatic Discharge
GPI
General Purpose Input
HBM
Human Body Model
HS-CAN
High-Speed Controller Area Network
LIN
Local Interconnect Network
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
PCB
Printed-Circuit Board
PPAP
Production Part Approval Process
RC
Resistor-Capacitor network
SBC
System Basis Chip
SPI
Serial Peripheral Interface
C
microcontroller
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16. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9701_PCA9702 v.7
20140926
Product data sheet
-
PCA9701_PCA9702 v.6
Modifications:
•
Section 1 “General description”, Section 2 “Features and benefits”: deleted references to
“AEC-Q100”
•
Table 1 “Ordering information”:
– removed type number PCA9701PW/Q900 (and associated table note [1])
•
•
Figure 3 “Pin configuration for TSSOP24” deleted “PCA9701PW/Q900”
Added Table 2 “Ordering options”
PCA9701_PCA9702 v.6
20111214
Product data sheet
-
PCA9701_PCA9702 v.5
PCA9701_PCA9702 v.5
20091111
Product data sheet
-
PCA9701_PCA9702 v.4
PCA9701_PCA9702 v.4
20090716
Product data sheet
-
PCA9701_PCA9702 v.3
PCA9701_PCA9702 v.3
20081203
Product data sheet
-
PCA9701_PCA9702 v.2
PCA9701_PCA9702 v.2
20070829
Product data sheet
-
PCA9701_PCA9702 v.1
PCA9701_PCA9702 v.1
20070323
Objective data sheet
-
-
PCA9701_PCA9702
Product data sheet
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17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCA9701_PCA9702
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 26 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
27 of 29
PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9701_PCA9702
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 26 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
28 of 29
PCA9701; PCA9702
NXP Semiconductors
18 V tolerant SPI 16-bit/8-bit GPI with INT
19. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.2
7.3
7.3.1
8
8.1
8.2
8.2.1
8.2.1.1
8.2.1.2
8.2.1.3
8.2.2
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
SPI bus operation . . . . . . . . . . . . . . . . . . . . . . . 6
CS - chip select . . . . . . . . . . . . . . . . . . . . . . . . 6
SCLK - serial clock input . . . . . . . . . . . . . . . . . 6
SDIN - serial data input. . . . . . . . . . . . . . . . . . . 6
SDOUT - serial data output . . . . . . . . . . . . . . . 6
Register access timing . . . . . . . . . . . . . . . . . . . 7
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 7
General Purpose Inputs . . . . . . . . . . . . . . . . . . 8
VIL, VIH and switching points. . . . . . . . . . . . . . . 9
Application design-in information . . . . . . . . . 10
General application. . . . . . . . . . . . . . . . . . . . . 10
Automotive application . . . . . . . . . . . . . . . . . . 10
SBC wake port extension with cyclic biasing . 11
UJA106x with PCA9701, standby. . . . . . . . . . 11
UJA106x with PCA9701, sleep. . . . . . . . . . . . 12
UJA107xA with PCA9701, standby . . . . . . . . 13
Application examples including switches to
battery. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering of SMD packages . . . . . . . . . . . . . . 23
Introduction to soldering . . . . . . . . . . . . . . . . . 23
Wave and reflow soldering . . . . . . . . . . . . . . . 23
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
18
19
Contact information . . . . . . . . . . . . . . . . . . . . 28
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 26 September 2014
Document identifier: PCA9701_PCA9702
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