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PDTA114TS

PDTA114TS

  • 厂商:

    NXP(恩智浦)

  • 封装:

  • 描述:

    PDTA114TS - PNP resistor-equipped transistors; R1 = 10 kW, R2 = open - NXP Semiconductors

  • 数据手册
  • 价格&库存
PDTA114TS 数据手册
PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open Rev. 07 — 20 April 2007 Product data sheet 1. Product profile 1.1 General description PNP Resistor-Equipped Transistors (RET) family in small plastic packages. Table 1. Product overview Package NXP PDTA114TE PDTA114TK PDTA114TM PDTA114TS[1] PDTA114TT PDTA114TU [1] Type number NPN complement JEITA SC-75 SC-59A SC-101 SC-43A SC-70 JEDEC TO-236 TO-92 TO-236AB PDTC114TE PDTC114TK PDTC114TM PDTC114TS PDTC114TT PDTC114TU SOT416 SOT346 SOT883 SOT54 SOT23 SOT323 Also available in SOT54A and SOT54 variant packages (see Section 2). 1.2 Features I 100 mA output current capability I Built-in bias resistors I Simplifies circuit design I Reduces component count I Reduces pick and place costs 1.3 Applications I Digital applications I Control of IC inputs I Cost-saving alternative to BC857 series in digital applications I Low current peripheral driver 1.4 Quick reference data Table 2. Symbol VCEO IO R1 Quick reference data Parameter collector-emitter voltage output current bias resistor 1 (input) Conditions open base Min 7 Typ 10 Max −50 −100 13 Unit V mA kΩ NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 2. Pinning information Table 3. Pin SOT54 1 2 3 input (base) output (collector) GND (emitter) 1 2 3 001aab347 006aaa217 R1 Pinning Description Simplified outline Symbol 2 1 3 SOT54A 1 2 3 input (base) output (collector) GND (emitter) 1 2 3 001aab348 006aaa217 R1 2 1 3 SOT54 variant 1 2 3 input (base) output (collector) GND (emitter) 1 2 3 001aab447 006aaa217 R1 2 1 3 SOT23; SOT323; SOT346; SOT416 1 2 3 input (base) GND (emitter) output (collector) 1 1 2 006aaa144 sym009 3 R1 3 2 SOT883 1 2 3 input (base) GND (emitter) output (collector) 1 3 2 Transparent top view 1 R1 3 2 sym009 PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 2 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 3. Ordering information Table 4. Ordering information Package Name PDTA114TE PDTA114TK PDTA114TM PDTA114TS[1] PDTA114TT PDTA114TU [1] Type number Description plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads Version SOT416 SOT346 SC-75 SC-59A SC-101 SC-43A SC-70 leadless ultra small plastic package; 3 solder lands; SOT883 body 1.0 × 0.6 × 0.5 mm plastic single-ended leaded (through hole) package; SOT54 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads SOT23 SOT323 Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9). 4. Marking Table 5. Marking codes Marking code[1] 11 23 DE TA114T *11 *23 Type number PDTA114TE PDTA114TK PDTA114TM PDTA114TS PDTA114TT PDTA114TU [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 3 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IO ICM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage output current peak collector current total power dissipation PDTA114TE PDTA114TK PDTA114TM PDTA114TS PDTA114TT PDTA114TU Tj Tamb Tstg [1] [2] [3] Conditions open emitter open base open collector single pulse; tp ≤ 1 ms Tamb ≤ 25 °C [1] [1] [2][3] [1] [1] [1] Min - Max −50 −50 −5 −100 −100 Unit V V V mA mA −65 −65 150 250 250 500 250 200 150 +150 +150 mW mW mW mW mW mW °C °C °C junction temperature ambient temperature storage temperature Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient PDTA114TE PDTA114TK PDTA114TM PDTA114TS PDTA114TT PDTA114TU [1] [2] [3] Conditions in free air [1] [1] [2][3] [1] [1] [1] Min Typ Max Unit - - 833 500 500 250 500 625 K/W K/W K/W K/W K/W K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 4 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter ICBO ICEO collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage bias resistor 1 (input) collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz Conditions VCB = −50 V; IE = 0 A VCE = −30 V; IB = 0 A VCE = −30 V; IB = 0 A; Tj = 150 °C VEB = −5 V; IC = 0 A VCE = −5 V; IC = −1 mA IC = −10 mA; IB = −0.5 mA Min 200 7 Typ 10 Max −100 −1 −50 −100 −150 13 3 mV kΩ pF Unit nA µA µA nA IEBO hFE VCEsat R1 Cc 600 hFE (1) 006aaa554 −1 006aaa555 VCEsat (V) 400 −10−1 (1) (2) (3) (2) 200 (3) 0 −10−1 −1 −10 IC (mA) −102 −10−2 −10−1 −1 −10 IC (mA) −102 VCE = −5 V (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −40 °C IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −40 °C Fig 1. DC current gain as a function of collector current; typical values Fig 2. Collector-emitter saturation voltage as a function of collector current; typical values PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 5 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 8. Package outline 3.1 2.7 3 0.6 0.2 1.3 1.0 1.8 1.4 3 0.45 0.15 0.95 0.60 1.75 0.9 1.45 0.7 3.0 1.7 2.5 1.3 1 2 0.30 0.15 1 0.25 0.10 04-11-04 1 2 0.50 0.35 0.26 0.10 04-11-11 1.9 Dimensions in mm Dimensions in mm Fig 3. Package outline SOT416 (SC-75) 0.62 0.55 0.55 0.47 0.30 0.22 3 Fig 4. Package outline SOT346 (SC-59A/TO-236) 0.50 0.46 4.2 3.6 0.45 0.38 0.65 0.30 0.22 0.20 0.12 0.35 Dimensions in mm 1.02 0.95 4.8 4.4 0.48 0.40 1 2 2.54 3 1.27 2 1 5.2 5.0 03-04-03 Dimensions in mm 14.5 12.7 04-11-16 Fig 5. Package outline SOT883 (SC-101) Fig 6. Package outline SOT54 (SC-43A/TO-92) 0.45 0.38 4.2 3.6 1.27 4.2 3.6 0.45 0.38 0.48 0.40 1 3 max 2.5 max 1 0.48 0.40 2 2.54 3 1.27 4.8 4.4 2 5.08 2.54 3 5.2 5.0 14.5 12.7 04-06-28 5.2 5.0 Dimensions in mm 14.5 12.7 4.8 4.4 Dimensions in mm 05-01-10 Fig 7. Package outline SOT54A Fig 8. Package outline SOT54 variant PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 6 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 3.0 2.8 3 1.1 0.9 2.2 1.8 3 0.45 0.15 1.1 0.8 0.45 0.15 2.5 1.4 2.1 1.2 2.2 1.35 2.0 1.15 1 2 1 0.48 0.38 0.15 0.09 04-11-04 Dimensions in mm 2 0.4 0.3 1.3 04-11-04 0.25 0.10 1.9 Dimensions in mm Fig 9. Package outline SOT23 (TO-236AB) Fig 10. Package outline SOT323 (SC-70) PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 7 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PDTA114TE PDTA114TK PDTA114TM PDTA114TS Package SOT416 SOT346 SOT883 SOT54 SOT54A SOT54 variant PDTA114TT PDTA114TU [1] Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel bulk, straight leads tape and reel, wide pitch tape ammopack, wide pitch bulk, delta pinning 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -115 -115 -215 -115 5000 -412 -112 10000 -135 -135 -315 -116 -126 -235 -135 SOT23 SOT323 For further information and the availability of packing methods, see Section 12. PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 8 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 10. Revision history Table 10. Revision history Release date 20070420 Data sheet status Product data sheet Change notice Supersedes PDTA114T_SERIES_6 Document ID PDTA114T_SER_7 Modifications: • • • • • • • • • • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type number PDTA114TEF removed Section 1.2 “Features”: amended Section 1.3 “Applications”: amended Table 4 “Ordering information”: added Table 5 “Marking codes”: enhanced table note section Table 6 “Limiting values”: ICM peak collector current conditions added Figure 1, 2, 7 and 8: added Figure 3, 4, 5, 6, 9 and 10: superseded by minimized package outline drawings Section 9 “Packing information”: added Section 11 “Legal information”: updated Product specification Product specification Product specification PDTA114T_SERIES_5 PDTA114T_SERIES_4 PDTA114TE_2 PDTA114TK_3 PDTA114TS_2 PDTA114TT_3 PDTA114TU_3 PDTA114TE_1 PDTA114TK_2 PDTA114TS_1 PDTA114TT_2 PDTA114TU_2 PDTA114T_SERIES_6 PDTA114T_SERIES_5 PDTA114T_SERIES_4 20040802 20030909 20030410 PDTA114TE_2 PDTA114TK_3 PDTA114TS_2 PDTA114TT_3 PDTA114TU_3 19980723 19980515 19980515 19990413 19990413 Preliminary specification Product specification Product specification Objective specification Product specification - PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 9 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com PDTA114T_SER_7 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 07 — 20 April 2007 10 of 11 NXP Semiconductors PDTA114T series PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 April 2007 Document identifier: PDTA114T_SER_7
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