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TWR-S08JE128

TWR-S08JE128

  • 厂商:

    NXP(恩智浦)

  • 封装:

    -

  • 描述:

    MCU BRD FOR FSL TOWER

  • 数据手册
  • 价格&库存
TWR-S08JE128 数据手册
 ACCOUNT  ENGLISH ALL  PRODUCTS APPLICATIONS SUPPORT  CART  Search... ABOUT    S9S12DG25F0CPVE :Part Detail Product Summary Page General Information Package Information Environmental and Compliance Information Manufacturing Information Ordering Information Product/Process Change Notice (PCN) Operating Characteristics Reliability Data Lookup GENERAL INFORMATION Part Number S9S12DG25F0CPVE Description 16-bit MCU, S12 core, 256KB Flash, 25MHz, -40/+85degC, Automotive Qualified, QFP 112 Product Line G9FTDG5K PTI JCJD Material Type Tested Packaged Device Life Cycle Description (code) NOT RECOMMENDED(DECLINING) Status Not Recommended for New Design Application/Qualification Tier AUTO; >=10 YEARS APPLICATION LIFE PACKAGE INFORMATION Package Type and Termination Count LQFP 112 Package Description and Mechanical Drawing LQFP 112 20*20*1.4P0.65 Device Weight(g) 1.27830 Package Material Plastic Mounting Style Surface Mount Package Length (nominal)(mm) 20.000 Package Width (nominal)(mm) 20.000 Package Thickness (nominal)(mm) 1.000 Maximum Height Above Board(mm) 1.600 Tape & Reel No ENVIRONMENTAL AND COMPLIANCE INFORMATION Pb-Free RoHS Compliant Halogen Free Yes Material Composition Declaration (MCD) Download MCD Report RoHS Certificate of Analysis (CoA) Download RoHS CoA Report Download MCD Report 2nd Level Interconnect e3 Moisture Sensitivity Level (MSL) 3 Floor Life 168 HOURS Peak Package Body Temperature (PPT)(°C) 260 Maximum Time at Peak Temperature (s) 40 Number of Reflow Cycles 3 REACH SVHC NXP REACH Statement UL94 (plastics flammability test) V0;Burning stops within 10 seconds on a vertical specimen;no drips allowed MANUFACTURING INFORMATION Micron Size(μm) .25 ORDERING INFORMATION Minimum Package Quantity (MPQ) 300 MPQ Container BRICK Exempt from Minimum Delivery Value No Preferred Order Quantity (POQ) 600 POQ Container BOX Leadtime (weeks) 18 Export Control Classification Number (US) 3A991A2 Harmonized Tariff ( CCATS Document - ENC Status - Other Trade Compliance Documents - Budgetary Price excluding tax(US Currency 1 @ US each Device Sample Availability 19 Dec 2005 Device Production Availability 19 Dec 2005 Order PRODUCT/PROCESS CHANGE NOTICE (PCN) Number 16253 14393A Type Title Issue Date Effectivity Date 0.25um ATMC and Product Change TSMCFAB3/11 KLM QFP 09 Jun 2014 09 Dec 2014 Notice Copper Wire and Leadframe Flag Conversion Qualification 9S12D256, 9S12DX12, AND Update Notification 9S12XD64 MANUFACTURING 05 Nov 201028 Feb 2011 IN TSMC3 IN TAIWAN 14393 Product Change Notice 12300 Product Change Notice 9S12D256, 9S12Dx12, and 9S12xD64 manufacturing in 22 Oct 2010 11 May 2011 TSMC3 in Taiwan ADDITION OF WINSTEK PROBE 11 Sep 200604 Sep 2006 SITE FOR ATMC OPERATING CHARACTERISTICS ADC 8-ch. 10-bit ADC (bit) 10 ADC (ch) 8 Additional Features COP Internal Voltage Regulator PLL Ambient Operating Temperature (Min-Max) (°C) -40 to 85 Bus Frequency (Max) (MHz) 25 CAN 2 Core Type S12 EEPROM (KB) 4 GPIOs 91 I2C 1 Internal Flash (KB) 256 Internal RAM (KB) 12 PWM 8-ch. 8-bit PWM (bit) 8 PWM (ch) 8 Sample Exception Availability N SCI 2 SPI 3 Timers 8-ch. 16 bit Reliability Data Lookup ABOUT NXP RESOURCES FOLLOW US NEWS Investors Mobile Apps NXP News Partners Press, News, Blogs  Careers Contact Us Privacy | Terms of Use | Terms of Sale | Feedback   Read More ©2006-2017 NXP Semiconductors. All rights reserved.
TWR-S08JE128 价格&库存

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