MR27V3266D

1 Semiconductor MR27V3266D 2M x16 / 1M x32 Synchronous OTP ROM DESCRIPTION The MR27V3266D is a 32Mbit One Time Programmable Synchronous Read Only Memory whose configuration can be electrically switched between 2,097,152 x16bit(word mode) and 1,048,576 x32bit(double word mode) by the state of the /WORD pin. The MR27V3266D supports high speed synchronous read operations using a single 3.3V power supply. FEATURES ON READ 3.3V power supply LVTTL compatible with multiplexed address Dual, electrically switchable configurations 2M x16(word mode) / 1M x32(double word mode) All inputs are sampled at the rising edge of the system clock High speed read operation 66MHz : CAS Latency=5 tRCDmin=2 Burst Length (4, 8) Data scramble (sequential, interleave) 50MHz : CAS Latency=4, 5 tRCDmin=1 Burst Length (4, 8) Data scramble (sequential, interleave) DQM for data out masking No Precharge operation is required. No Refresh operation is required. No power on sequence is required. Mode register is automatically initialized to the default state after power on. "Row Active" command to read data is applicable as the first command just after power on. Single Bank operation Package : TSOP II 86-P-400-0.50-K - - FEATURES ON PROGRAMMING 9.75V programming Power supply Programming algorithm is compatible with conventional asynchronous 32M OTP. MR27V3266D can be programmed with conventional EPROM programmers. Synchronous Burst read or Static Programming Operation are selected by the state of STO pin. High STO level enables full static programming. (Program, Program Verify, asynchronous Read) Low STO level enables synchronous burst read. Exclusive 86pin socket adapters are available from OKI to support programming requirements. The socket adapter is used on a 48DIP socket on the programmer. The socket adapter is designed with the STO pin connected to VCC in order to program MR27V3266D as conventional 32M OTP. EPROM programmer must have the proper algorithm for 32M OTP. *Device damage can occur if improper algorithm is used. High speed programming 10µs programming pulse per word allows high speed programming. - August , 1999 Revision 2.4 1 32M Synchronous OTP 1 Semiconductor FUNCTION BLOCK DIAGRAM MR27V3266D Row Decoder Row Address Latch Row Select Memory Cell Array 1Mx32 or 2Mx16 Column Decoder Column Address Latch A0 | A12 Address Buffer Column Select Sence Amplifier & Program Bias CS RAS CAS MR WORD Mode Register Burst Sequence Controller Command Controller Data Output Latch Data Input Buffer Data Outputs Selector CLK Buffer Program Mode Controller Data Output/Input Buffer & Data Output/Address Buffer CKE CLK OE CE STO AMPX DQ24-DQ31 CAP0-CAP7 DQ0-DQ15 DQ16-DQ23 August , 1999 Revision 2.4 2 32M Synchronous OTP 1 Semiconductor PIN CONFIGURATION MR27V3266D TOP VIEW Programming in Static Operation (STO is high) Synchronous Read (STO is VSS or open) VCC DQ0 VCCQ DC DQ1 VSSQ DC DQ2 VCCQ DC DQ3 VSSQ DC DC VCC DC NC /CAS /RAS DC /WORD A12 A11 A10 A0 A1 A2 NC VCC NC DQ4 VSSQ DC DQ5 VCCQ DC DQ6 VSSQ DC DQ7 VCCQ DC VCC VCC DQ0 VCCQ DQ16 DQ1 VSSQ DQ17 DQ2 VCCQ DQ18 DQ3 VSSQ DQ19 /MR VCC DQM NC /CAS /RAS /CS /WORD A12 A11 A10 A0 A1 A2 NC VCC NC DQ4 VSSQ DQ20 DQ5 VCCQ DQ21 DQ6 VSSQ DQ22 DQ7 VCCQ DQ23 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 VSS DQ31 VSSQ DQ15 DQ30 VCCQ DQ14 DQ29 VSSQ DQ13 DQ28 VCCQ DQ12 NC VSS DC DC DC CLK CKE A9 A8 A7 A6 A5 A4 A3 DC VSS DC DQ27 VCCQ DQ11 DQ26 VSSQ DQ10 DQ25 VCCQ DQ9 DQ24 VSSQ DQ8 VSS VSS CAP0 VSSQ DQ15 CAP1 VCCQ DQ14 CAP2 VSSQ DQ13 CAP3 VCCQ DQ12 NC VSS VPP /CE /OE DC DC A9 A8 A7 A6 A5 A4 A3 AMPX VSS STO CAP4 VCCQ DQ11 CAP5 VSSQ DQ10 CAP6 VCCQ DQ9 CAP7 VSSQ DQ8 VSS 86PIN TSOP II DC(Don't Care) : Logical input level is ignored, however the pin is connected to input buffer of OTP August , 1999 Revision 2.4 3 32M Synchronous OTP 1 Semiconductor MR27V3266D PIN FUNCTION FOR SYNCHRONOUS READ OPERATION ( STO pin is low level or open ) PIN NAME STO FUNCTION Static Operation DESCRIPTION Must be low for synchronous operation. Internal resistance (around 10k ohms) pulls the input level down to VSS when this pin is open. High level STO enables programming operation compatible with standard OTPs. All inputs are sampled at the rising edge. Enables command sampling by the CLK signal with a low level on the /CS input. Masks internal system clock to freeze the CLK operation of subsequent CLK cycle. CKE must be enabled for command sampling cycles. CLK is disabled for two types of operations. 1)Clock Suspend 2)Power down. Row and column addresses are multiplexed on the same pins. Row address:RA0-RA12 Column address:CA0-CA6(x32) / CA0-CA7(x16) Functionality depends on the combination. See the function table. CLK /CS CKE System Clock Chip Select Clock Enable A0-A12 Address /RAS /CAS /MR DQ0-DQ31 DQM /WORD Row Address Strobe Column Address Strobe Mode Register Set Data Output Data Output Masking x32/x16 Organization Selection Data outputs are valid at the rising edge of CLK for read cycles. Except for read cycles DQn is high-Z state. Data outputs are masked after two cycles from when high level DQM is applied. The /WORD pin defines the organization of each read command to be x16 (word mode) or x32 (double word mode). High=x32 Low=x16 3.3V Power supply VCC VSS VCCQ VSSQ NC DC Power Supply Ground Data Output Power Supply Data Output Ground No Connection Don't Care 3.3V Power supply to DQ0-DQ31 Logical input level is ignored. August , 1999 Revision 2.4 4 32M Synchronous OTP 1 Semiconductor PIN FUNCTION FOR PROGRAMMING OPERATION ( STO pin is high level ) PIN NAME STO FUNCTION Static Operation DESCRIPTION MR27V3266D Must be set high for programming operation. Internal resistance (around 10k ohms) pulls the input level down to VSS for open state condition to be low level for synchronous read operation. When AMPX is low, the addresses are not multiplexed and all address bits must be supplied to A0-A12(Row Address) and CAP0-CAP7(Column Address) simultaneously. This pin should be set low on programming operation. AMPX Address Multiplex A0-A12 Address When AMPX is low, A0-A12 is row address input. /RAS Row address strobe When AMPX is low, input is not used. /CAS Column address strobe When AMPX is low, input is not used. DQ0-DQ15 /WORD Data Input/Output x32/x16 organization Selection Input of data for programming and output for program verify and read data. The /WORD pin defines the organization to be x16(word mode) or x32(double word mode). High= x32 Low = x16 Must be set low for programming operation. When /WORD is low, High-Z state on CAP0-CAP7 is held to be input pins. When AMPX is low, CAP0 - CAP7 is column address input. Control signal input for programming. /OE of conventional OTP. Control signal input for programming. Function for programming is associated with conventional OTP. Power and ground for the input buffers and the core logic. Power and ground for output. High voltage program power is supplied through VPP pin. When VPP is higher than a predetermined voltage level between VCC+0.5V and VCC+2V, pin function alters to high VPP mode. To keep stable static read operation VPP pin must be kept lower than VCC+0.5V. CAP0-CAP7 Address Input /OE /CE Output Enable Chip Enable VCC/VSS VCCQ/VSSQ VPP Power Supply/Ground Data Output Power/Ground Program Power Supply The functionality of loose device programming must be studied with the specification of socket adapter that will be supplied by OKI. MR27V3266D on the socket adapter is the same programming functionality as conventional OTP. August , 1999 Revision 2.4 5 32M Synchronous OTP 1 Semiconductor FUNCTION TABLE FOR SYNCHRONOUS READ COMMAND NAME Mode Register Set Row Active Read Word (x16) Read Double Word (x32) Burst Stop Precharge Clock Suspend (on Read) FUNCTION Mode Register Set Row Address Latch Column Address Latch Trigger Burst Read Column Address Latch Trigger Burst Read Burst Stop Burst Stop Entry Exit MR27V3266D CKEn-1 CKEn /CS /RAS /CAS /MR DQM Add. /WORD STO Notes H H H H H H H L H L H H H H H H H X X X X X X L H L H X X X L H X X L L L L L L X X H X X X L L L H L L L H H H L X X X X X X H L L X H L H L L H H X X X X X X L L L X H L H H H L L X X X X X X L H H X H X Code X RA X X X X X X X X L H X X X X X CA CA X X X X X X X X X X X X X X X L H X X X X X X X X X X X X X L L L L L L L L L L L L L L L L L 1 2 3 3 4 4 5 5 6 6 Power Down Entry (on Active Standby) Exit Read Output Mask Output No Operation Output Enable High-Z Output Write on SDRAM Self Refresh on SDRAM Illegal on SDRAM ( H=Logical high, L=Logical low, X=Don't Care, L of STO includes pin open due to internal pull down resistor ) ( CKEn expresses the logical level at the simultaneous cycle with a command. ) Note 1. Refer to "Mode register Field Table" for Address Codes, and Mode Transition Chart for operational state. After power on any command can be sampled at any cycle in Active Standby state. After "Mode register Set" command is sampled, no new command can be accepted for 3 CLK cycles. The /CS input must be kept high for the 3 CLK cycles to prevent unexpected sampling of a command. 2. The "Row Active" command is effective till new "Row Active" command is implemented. 3. The /WORD input is sampled simultaneously with "Read" command to select data width. A Double Word Burst(x32 ) or a Word Burst(x16) is selected by the /WORD input for each "Read" command. On condition of constant voltage level on /Word pin, organization is fixed to either x16 or x32. "Read" command ends it's implementation by itself at the finishing cycle of the burst read. 4. Since OTP technology uses static sense amplifiers, the "Precharge" command is not required however, due to customer request for the similarity of logical input code with SDRAM command, the name of "Precharge" is adopted. Function of "Precharge" command and "Burst Stop" command is only to stop the burst read cycles delayed by CAS Latency. 5. Sampled low level CKE disables CLK buffer to suspend internal clock signals at the next rising edge of CLK. Sampled high level CKE enables internal clock at the next rising edge of CLK. Low level CKE sampled in the period from the simultaneous cycle with a "Read" command till the end of the burst read cycle is distinguished with internal command controller from the low level CKE sampled in Active Standby state not to stop data sensing and burst read operation those consume power. 6. Low level CKE sampled in Active Standby state cuts power dissipation to be in Power Down state. High level CKE sampled in Power Down state enables internal CKE to be in Active Standby state with preserved row address. August , 1999 Revision 2.4 6 32M Synchronous OTP 1 Semiconductor MODE REGISTER FIELD TABLE Address Function A5 0 0 0 0 1 1 1 1 A4 0 0 1 1 0 0 1 1 A3 0 1 0 1 0 1 0 1 A5 A4 CAS Latency Length Reserved Reserved Reserved 4 5 Reserved Reserved Reserved A3 A2 Burst Type A2 0 1 Type Sequential Interleave A1 0 0 1 1 A0 0 1 0 1 A1 MR27V3266D A0 Burst Length Length Reserved 4 8 Reserved Note A7 and A8 must be low during Mode Register Set cycle. During power on, mode register is initialized to the default state when VCC reaches a specific voltage. The default state of Mode Register is below. (less than 3.0V) CAS Latency=5 Burst Type=Sequential Burst length=4 BURST SEQUENCE ( BURST LENGTH = 4 ) Initial address A1 0 0 1 1 A0 0 1 0 1 0 1 2 3 Sequential 1 2 3 0 2 3 0 1 3 0 1 2 0 1 2 3 Interleave 1 0 3 2 2 3 0 1 3 2 1 0 BURST SEQUENCE ( BURST LENGTH = 8 ) Initial address A2 0 0 0 0 1 1 1 1 August , 1999 Revision 2.4 7 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 0 2 3 4 5 6 7 0 1 Sequential 3 4 5 6 7 0 1 2 4 5 6 7 0 1 2 3 5 6 7 0 1 2 3 4 6 7 0 1 2 3 4 5 7 0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 1 0 3 2 5 4 7 6 2 3 0 1 6 7 4 5 Interleave 3 2 1 0 7 6 5 4 4 5 6 7 0 1 2 3 5 4 7 6 1 0 3 2 6 7 4 5 2 3 0 1 7 6 5 4 3 2 1 0 32M Synchronous OTP 1 Semiconductor ADDRESSING MAP (1) /WORD = "H" : x32 Organization Pin Name Row Address Column Address A0 RA0 CA0 A1 RA1 CA1 A2 RA2 CA2 A3 RA3 CA3 A4 RA4 CA4 A5 RA5 CA5 A6 RA6 CA6 A7 RA7 X A8 RA8 X A9 MR27V3266D A10 A11 A12 RA9 RA10 RA11 RA12 X X X X (2) /WORD = "L" : x16 Organization Pin Name Row Address Column Address A0 RA0 CA0 A1 RA1 CA1 A2 RA2 CA2 A3 RA3 CA3 A4 RA4 CA4 A5 RA5 CA5 A6 RA6 CA6 A7 RA7 CA7 A8 RA8 X ( X = Don't Care ) A9 A10 A11 A12 RA9 RA10 RA11 RA12 X X X X (3) Programming Address displayed on programmer : x16 Device Address : x16 STO = "H", AMPX = "L" Ad0 Ad1 Ad2 Ad3 Ad4 Ad5 Ad6 Ad7 Ad8 A0 ( X = Don't Care ) Ad9 A1 Ad10 Ad11 Ad12 A2 A3 A4 CAP0 CAP1 CAP2 CAP3 CAP4 CAP5 CAP6 CAP7 Address ( STO = "L" ) /WORD = "L" : x16 Address ( STO = "L" ) /WORD = "H" : x32 Address displayed on programmer : x16 Device Address : x16 STO = "H", AMPX = "L" CA0 Note2 Note3 CA1 CA2 CA1 CA3 CA2 CA4 CA3 CA5 CA4 CA6 CA5 CA7 CA6 RA0 RA0 RA1 RA1 RA2 RA2 RA3 RA3 RA4 RA4 Note1 CA0 Note4 Note5 Ad13 Ad14 Ad15 Ad16 Ad17 Ad18 Ad19 Ad20 A5 A6 A7 A8 A9 A10 A11 A12 Address ( STO = "L" ) /WORD = "L" : x16 Address ( STO = "L" ) /WORD = "H" : x32 RA5 RA5 RA6 RA6 RA7 RA7 RA8 RA8 RA9 RA10 RA11 RA12 RA9 RA10 RA11 RA12 User of MR27V3266D is recommended to study the relation between "Address displayed on programmer" and "Address(STO="L")" ignoring "Device Address:x16, STO="H"". Order of data on Synchronous Read operation(STO="L") is checked on this table. "Device Address:x16, STO="H"" will be utilized to design socket adapter on programmer or to check boards designed to mount blank OTP and program OTP on board. OKI will supply socket adapter to program MR27V3266D as conventional x16 standard OTP. The users and the venders of programmer who use the socket adapter can ignore "Device Address:x16, STO="H"". Note 1. A0 in programmer distinguishes upper word(x16) or lower word(x16) of Double word(x32). On word(x16) organization the address of device corresponds to the address of programmer. On double word(x32) organization the address numeral code of device is half of that in programmer, and output on DQ0-DQ15 is lower word(A0="0") and output on DQ16-DQ31 is upper word(A0="1"). 2. CA1 is MSB of burst read on condition of /WORD="L" and BL=4 3. CA2 is MSB of burst read on condition of /WORD="L" and BL=8 4. CA1 is MSB of burst read on condition of /WORD="H" and BL=4 5. CA2 is MSB of burst read on condition of /WORD="H" and BL=8 August , 1999 Revision 2.4 8 32M Synchronous OTP 1 Semiconductor READ OPERATIONS CLOCK ( CLK ) MR27V3266D The clock input enables MR27V3266D to sample all the inputs, control internal circuitry, and turn on output drivers. All timings are referred to the rising edge of the clock. All inputs with high level CKE and low level /CS should be valid at the rising edge of CLK for proper functionality. CLOCK ENABLE ( CKE ) The clock enable(CKE) turns on or switches off the admission of the clock input into the internal clock signal lines. All internal circuits are controlled by the internal clock signal to implement every command. High level CKE sampled at CKEn-1 clock cycle enables the admission of the rising edge of clock input into internal clock line at CKEn cycle. Low level CKE sampled at CKEn-1 cycle suspends the rising edge of CLK at CKEn cycle. The suspension of internal clock signal in all state ignores new input except CKE, and holds internal state and output state. Low level CKE in Active Standby state, defined as Power Down state, cuts power dissipation. In Power Down state the contents of mode register and Row Address are preserved. After recovering high level CKE to exit from Power Down state, MR27V3266D is in Active Standby state. Low level CKE just after the sampling of "Read" command till the completion of burst read, defined as Clock Suspend, makes read operation go on with power dissipation. Any command operation does not interrupted by arbitrary low level CKE. Sampling command with low level CKE preceded with high level CKE is illegal. POWER ON Apply power and start clock considering following issues. 1. During power on Mode Register is initialized into default state. (default state: CAS latency=5, Burst Type=Sequential, Burst length=4) 2. After power on MR27V3266D is in Active Standby state and ready for "Mode Register set" command or "Row Active" command. MR27V3266D requires neither command nor waiting time as power on sequence after starting CLK input in order to start "Row Active" command to read data. 3. It is recommended in order to utilize default state of Mode Register that /MR and CKE inputs are maintained to be pulled up during power on till the implementation of the first "Row Active" command. After above power on "Row Active" command and "Read" command can be started immediately on default Mode Register state. 4. It is recommended that DQM input is maintained to be pulled up to prevent unexpected operation of output buffers. ORGANIZATION CONTROL Organization of data output(DQ0-DQ31) depends on the logical level on /WORD at the input timing of every "Read" command. High level sampling of /WORD derives double word mode(x32) output and low level sampling of /WORD derives word mode(x16) output. Constant /WORD level input brings consistent organization. MODE REGISTER Mode register stores the operating mode of MR27V3266D. Operating modes are consisted with CAS latency, Burst Type, and Burst Length. Registration of RAS latency is not required, because RAS to CAS delay(tRCD) is requested independently of system clock. When the contents of Mode register are required to be changed for the next operation, "Mode Register Set" command can be sampled at any cycle in Active Standby state. After "Mode Register Set" command is sampled, /CS must be fixed to logical high level to prevent sampling of new command input during succeeding three clock cycles. Refer to Mode Register Field Table for the relation between Operation modes and input pin assignment. August , 1999 Revision 2.4 9 32M Synchronous OTP 1 Semiconductor READ OPERATIONS CAS LATENCY MR27V3266D After sampling "Read" command MR27V3266D starts actual data read operation with sense amplifiers, and transmits the data from sense amplifiers to data out buffers to start burst read. This flow of sequential functionality takes time as clock cycles defined as CAS latency(CL). CAS latency is set in Mode Register as either four cycles or five cycles. In this sequence(from sampling "Read" command to start of driving data bus) sense amplifiers consume maximum current flow. The detailed sequence is below. 1. Fix column address of memory matrix driver. Row address is already fixed with "Row Active" command. (at 1st cycle) 2. Read data of selected memory cells with sense amplifiers. 3. Deliver data detected with sense amplifiers to the register for data output latch. 4. Couple selectively the section of the register storing each (double)word to output buffers. 5. Turn off sense amplifiers to save power. (at CL-1 cycle) 6. Enable output buffers to drive data bus. (at CL-1 cycle) 7. Data output on data bus can be sampled at the rising edge of system clock at CL cycle. New "Row Active" command or new "Read" command can be sampled to perform gapless burst read at CL-1 clock cycle of the last "Read" command. New command preceding CL-1 cycle interrupts sense amplifiers to read the data at the selected memory cells of the last "Read" command. Interrupted "Read" command perishes or outputs invalid data before the starting of the data burst of new "Read" command. Refer to the timing chart of "Burst Read/Interrupt I" and "Burst Read/Interrupt II". BURST READ Data outputs are consecutive during the cycle number defined as Burst Length(BL). The latest burst read is completed unless any interruption such as "Precharge" command stops the sequential data output. Burst Length is set in Mode Register as either four or eight. After sampling of "Read" command the first output can be read at the cycle delayed by CAS latency. Burst Type is also stored in Mode register as either sequential or interleave. The output buffers go into high impedance state after burst read sequence is finished, unless a new "Read" command has been sampled to perform gapless read or preemptive read. Burst read can be interrupted by "Burst Stop" command or "Precharge" command at the cycle delayed by CAS latency from the command. On condition that reading data with sense amplifiers of preceding "Read" command is not interrupted by new "Read" command or "Row active" command, burst read of preceding "Read" command is continued regularly until the burst data sequence of the new "Read" command starts. The new(latest) burst data sequence always starts regularly. DQM Input level on DQM is sampled at rising edge of system clock to mask data at two cycles later. Output of masked data is high-Z state. August , 1999 Revision 2.4 10 32M Synchronous OTP 1 Semiconductor READ OPERATIONS MODE TRANSITION CHART MR27V3266D CKE=H CKE=L Row Active Mode Register Set Power Down Exit Entry Active Standby Entry Read DQM Exit Clock Suspend Burst Stop Precharge* *All operation of "Precharge" command is to stop burst read. Note : passing command : state can be kept for any duration August , 1999 Revision 2.4 11 32M Synchronous OTP 1 Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Voltage on VCC Relative to VSS Voltage on Any pin Relative to VSS Voltage on VPP Relative to VSS Operating Temperature Storage Temperature Short Circuit Current Power Dissipation Symbol VCC,VCCQ VIN, VOUT, DC VPP Ta Tstg IOS PD Min -0.5 -0.5 -0.5 0 -55 Max 5 VCC + 0.5 10 70 125 50 1 Unit V V V degree C degree C mA W MR27V3266D RECOMMENDED OPERATING CONDITIONS for SYNCHRONOUS READ Parameter Power Supply Voltage Voltage Level on DC pin Input High Voltage Input Low Voltage Operating Temperature Symbol VCC,VCCQ VIH VIL Ta Min 3.0 -0.5 2.0 -0.3 0 Typ 3.3 Max 3.6 VCC + 0.3 5 0.8 70 Unit V V V V degree C CAPACITANCE Parameter Input Capacitance Output Capacitance Symbol CIN COUT Min Max 5 7 Unit pF pF August , 1999 Revision 2.4 12 32M Synchronous OTP 1 Semiconductor DC CHARACTERISTICS FOR SYNCHRONOUS READ Parameter Power Down Current Symbol ICCS1 ICCS2 ICC1 Min Max 1 100 100 Unit mA µA mA MR27V3266D Test condition CKE = 0.8V CKE = 0V CKE = 2.0V tCC = 15ns /CS = VCC tCC = 15ns tCC = 15ns, DQM = H, CL = 4, BL = 4 Active Standby Current Gapless Burst Read Current Input Leak Current Output Leak Current Input High Voltage Input Low Voltage Voltage Level on DC pin Output High Voltage Level Output Low Voltage Level ( Voltage levels are referred to VSS ) ICC2 IIL IOL VIH VIL -10 -10 2.0 -0.3 -0.5 150 10 10 5 0.8 VCC + 0.3 0.4 mA µA µA V V V V V CKE = VCC 0V > VIN > VCC + 0.3V 0V > VIN > VCC Note1 VOH VOL 2.4 - IOH = -2mA IOL = 2mA Note 1. VIL min can be -1.5V for the pulse width shorter than 10ns. Pulse width is measured at 50% of pulse peak level. August , 1999 Revision 2.4 13 32M Synchronous OTP 1 Semiconductor AC CHARACTERISTICS FOR SYNCHRONOUS READ ( 1/2 ) Parameter CLK Cycle time Data to Valid Output Delay Data Output Hold Time CLK High Pulse Width CLK Low Pulse Width Input Setup Time Input Hold Time CLK to Output in Low-Z CLK to Output in High-Z Input Level Transition Time "Row Active" to "Read" Delay Time Symbol tCC tAC tOH tCH tCL tSI tHI tOLZ tOHZ tT tRCD Min 15 3 4 4 3 1.5 0 0.1 1CLK 2CLK "Read" to "Row Active" delay ( Words of preceding "Read" command can be read ) < Random Access > BL = 4 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 CL = 4 CL = 5 tCRD tCRD tCRD tCRD tCCD tCCD tCCD tCCD tRC tRC tRC tRC tCCD tCCD tCCD tCCD 3CLK 4CLK 3CLK 4CLK 3CLK 4CLK 3CLK 4CLK 3CLK + tRCD 4CLK + tRCD 3CLK + tRCD 4CLK + tRCD 4CLK 4CLK 8CLK 8CLK 1CLK 1CLK tPDE tSI + 1CLK Max 9 10 10 - MR27V3266D Unit ns ns ns ns ns ns ns ns ns ns Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle Notes 2 1,2 1 1,2 1 1,2 1 1,2 1 1,2 1 1,2 1 2 1 2 BL = 8 "Read" to "Read" delay ( Words of preceding "Read" command can be read ) < Sequential Access > BL = 4 BL = 8 "Row Active" Cycle Time ( Words of preceding "Read" command can be read ) < Random Access > BL = 4 BL = 8 "Read" to "Read" delay ( Gapless burst read ) < Sequential Access > BL = 4 BL = 8 "Read" to "Burst Stop" Delay "Read" to "Precharge" Delay Power Down Exit Setup Time Note 1. Shortage of clock cycles interrupt the data sensing of preceding "Read" command. The shortage of cycle time for preceding command is detected by internal command controller to cease the preceding command operation. The latest "Row Active" or "Read" command is completed. When legal tCCD is shorter than BL, burst read is terminated with another burst read. 2. Up to 50MHz August , 1999 Revision 2.4 14 32M Synchronous OTP 1 Semiconductor AC CHARACTERISTICS FOR SYNCHRONOUS READ ( 2/2 ) Parameter Clock Disable time from CKE Clock Enable time from CKE Output High impedance from DQM Recovery from DQM Output High impedance from "Burst Stop" Output High impedance from "Precharge" "Row Active" input from "Mode Register Set" Symbol tCKE tCKE tDQM tDQM tBOH tPOH tMRD Value 1CLK 1CLK 2CLK 2CLK CL CL 3 Unit MR27V3266D Notes Cycle Cycle Cycle Cycle Cycle Cycle Cycle AC TEST CONDITIONS Parameter Input Signal Levels Timing Reference Level of Input/Output Signals Transition Time of Input Signals Output Load Values VIH / VIL = 2.4V / 0.4V 1.4V tr / tf = 1ns / 1ns LVTTL 1 2 Notes Note1 Transition time of input signals is measured between 0.8V and 2.0V . If tr or tf is longer than 1ns, "Timing Reference Level of Input/Output Signals" is changed to VIL or VIH / 0.8V or 2.0V respectively. Note2 Output Load 1.4V 50 ohms Z0 = 50 ohms Output 50 pF August , 1999 Revision 2.4 15 32M Synchronous OTP 1 Semiconductor Read Cycle I : Random Access @ CAS Latency = 5, Burst Length = 4 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL High CKE tRC CS tSI tHI RAS tRCD CAS ADDR Ra Ca Rb Cb tOH DQ tAC a0 a1 a2 a3 tOHZ b0 b1 b2 b3 MR Row Active Read Row Active Read Don't Care August , 1999 Revision 2.4 16 32M Synchronous OTP 1 Semiconductor MR27V3266D Read Cycle II : Random Access with Gapless Burst @ CAS Latency = 4, Burst Length = 4 (Up to 50MHz) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL High CKE tRC CS tSI tHI RAS tRCD CAS ADDR Ra Ca Rb Cb tOH Rc Cc DQ tAC a0 a1 a2 a3 b0 b1 b2 b3 c0 c1 c2 c3 MR Row Active Read Row Active Read Row Active Read Don't Care August , 1999 Revision 2.4 17 32M Synchronous OTP 1 Semiconductor MR27V3266D Read Cycle III : Consecutive Column Read @ CAS Latency = 5, Burst Length = 4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL High CKE CS tSI tHI RAS tRCD CAS tCCD ADDR Ra Ca Cb tOH DQ tAC a0 a1 a2 a3 b0 b1 b2 b3 tOHZ MR Row Active Read Read Don't Care August , 1999 Revision 2.4 18 32M Synchronous OTP 1 Semiconductor "Burst Stop" command & "Precharge" command @ CAS Latency = 5 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL High CKE CS tSI tHI RAS tRCD CAS tBOH tPOH Cb tOH ADDR Ra Ca Rb DQ tAC a0 a1 tOHZ b0 b1 MR Row Active Read Burst Stop Row Active Read Precharge Don't Care August , 1999 Revision 2.4 19 32M Synchronous OTP 1 Semiconductor Clock Suspend @ CAS Latency = 5, Burst Length = 4 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL CKE tCKE tCKE tCKE tCKE CS tSI tHI RAS tRCD CAS tCCD ADDR Ra Ca Cb Read "a" operation ( Note2 ) Read "b" operation DQ a0 a1 a2 a3 b0 b1 b2 b3 ( Note1 ) MR Row Active Read Read Exit Clock Suspend Clock Suspend Entry Entry Exit Don't Care Note 1. At cycle number 9, 12, 13, rising edge of internal clock is omitted because of low level CKE at cycle 8, 11,12. 2. Clock suspend is defined with the low level CKE sampled in the period of Read operation. August , 1999 Revision 2.4 20 32M Synchronous OTP 1 Semiconductor Power Down @ CAS Latency = 4, Burst Length = 4 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL tSI tPDE Power Down ( Note1 ) Active Standby CKE CS Read Operation RAS CAS ADDR Ca DQ a0 a1 a2 a3 MR Read Power Down Entry Power Down Exit Note Row Active 1. Minimum current consumption is expected in Power Down state. Low level CKE sampled only in Active Standby state is defined as Power Down "Entry" command and it cuts current consumption into minimum level. After Power Down "Exit" the contents of Mode Register and row address is preserved. During Power Down state no command can be sampled. August , 1999 Revision 2.4 21 32M Synchronous OTP 1 Semiconductor Mode Register Set @ CAS Latency = 4, Burst Length = 4 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tCC tCH tCL CKE Power Down tMRD CS RAS CAS ADDR key Rb Cb DQ High-Z b0 b1 b2 b3 MR Power Down Entry Mode Register Set Power Down Exit Row Active Read August , 1999 Revision 2.4 22 32M Synchronous OTP 1 Semiconductor DQM Operation @ CAS Latency = 4, Burst Length = 8 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK CMD RD CKE tCKE tCKE DQM tDQM tDQM Q3 Q4 Q6 Q7 High-Z DQ Q0 Q1 August , 1999 Revision 2.4 23 32M Synchronous OTP 1 Semiconductor Burst Read / Interrupt I @ CAS Latency = 4, Burst Length = 4 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK CMD RD RD tCCD RD RD RD ADDR a b c d e DQ High-Z Qb0 Qb1 Qb2 Qb3 Qc0 Qc1 Qc2 Invalid State Qe0 Qe1 Qe2 Qe3 RD is interrupted by RD. RD command perishes. RD sets up Qc2 as the final Qcn. Output states of interrupted command preceded by data read cycle is invalid. Invalid state : "H","L", or High-Z RD is interrupted by RD. Burst Read / Interrupt II @ CAS Latency = 4, Burst Length = 4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK tRC CMD RD ACT tRCD RD tCRD a ACT RD ADDR c A B b DQ High-Z Invalid State Qa0 Qa1 Qa2 Qa3 Qb0 Qb1 Qb2 Qb3 RD is interrupted by ACT August , 1999 Revision 2.4 24 32M Synchronous OTP 1 Semiconductor Preemptive Burst Read I @ CAS Latency = 4, Burst Length = 8 MR27V3266D 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK CMD RD RD RD RD ADDR a b c d DQ High-Z Qa0 Qa1 Qa2 Qb0 Qb1 Qb2 Qb3 Qc0 Qc1 Qc2 Qc3 Qc4 Qd0 Qd1 Qd2 Preemptive Burst Read II @ CAS Latency = 4, Burst Length = 8 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK CMD ACT RD ACT RD ADDR A a A b DQ High-Z Qa0 Qa1 Qa2 Qa3 Qa4 Qb0 Qb1 Qb2 Qb3 Qb4 Qb5 Qb6 Qb7 August , 1999 Revision 2.4 25 32M Synchronous OTP 1 Semiconductor RECOMMENDED OPERATING CONDITIONS AND DC CHARACTERISTICS FOR PROGRAMMING ( STO is High Level ) Parameter VPP Supply Voltage Symbol VPP1 VPP2 VCC1 VCC Supply Voltage VCC2 VCC3 IPP1 VPP Current IPP2 ICCP1 VCC Current ICCP2 ICCP3 Input Leak Current Output Leak Current Output High Voltage Level Output Low Voltage Level Input High Voltage Input Low Voltage Voltage Level on DC pin /OE Input Distinctive High Voltage Operating Temperature ( Voltage levels are referred to VSS ) VH Ta IIL IOL VOH VOL VIH VIL Min 9.5 -0.3 3.9 2.9 2.9 -10 -10 2.4 2.9 -0.3 -0.3 7.75 20 Typ 9.75 VCC 4.0 3.0 8 25 Max 10 VCC + 0.5 4.1 3.1 3.4 50 100 150 150 10 10 10 0.45 VCC + 0.5 0.45 VCC + 0.5 8.25 30 Unit V V V V V mA µA mA mA mA µA µA V V V V V V degree C MR27V3266D Condition Program Mode Read Mode Program Mode Read Mode Optional Read Mode VPP = 10V, VCC = 4.1V VPP = VCC = 4.1V VPP = 10V, VCC = 4.1V VPP = VCC = 4.1V VPP = VCC = 4.1V, tC = 1µS, /CE = H Notes 1 2 1 2 2 IOH = -400µA IOL = 2.1mA VCC = 4.1V VCC = 2.9V Notes 1. Program represents the modes below. Program, Program Verify, Program Inhibit 2. Read represents the modes below. Read, Output Disable, Standby August , 1999 Revision 2.4 26 32M Synchronous OTP 1 Semiconductor FUNCTION TABLE FOR PROGRAMMING Function Program Program Inhibit Full Static Program Verify Read Output Disable Standby Contact Check Contact Check VCC VPP /CE L H L L L H L L DQ0/OE /WORD DQ15 H H L L H X 8V 8V L L L L L L L L DIN HZ CAP0CAP7 Add. MR27V3266D /RAS /CAS AMPX STO X X X X X X X X L L L L L L X X H H H H H H H H 4.0V 9.75V 4.0V 9.75V 4.0V 9.75V 3.0V 3.0V 3.0V 4.0V 4.0V 3.0V 3.0V 3.0V 4.0V 4.0V A0 - A7 A8 - A20 A0 - A7 A8 - A20 Note s DOUT A0 - A7 A8 - A20 DOUT A0 - A7 A8 - A20 HZ HZ AAAA 5555 A0 - A7 A8 - A20 A0 - A7 A8 - A20 AA 55 16AA 0955 1 1 ( H = Logical High, L = Logical Low, X = Don't Care in the range of logical level ) Note 1. Dual procedures to check complementary output codes on the indicated complementary address inputs assure every address, DQ, and /OE pin connection. When address input code is incorrect, output code is "FFFF". August , 1999 Revision 2.4 27 32M Synchronous OTP 1 Semiconductor PROGRAMMING OPERATION STO MR27V3266D Synchronous read is far different from anyone of conventional nonvolatile memories. STO input level switches operation mode either synchronous read or conventional EPROM/OTP type programming. The word "Programming" contains actual programming(inject electrons into floating gates of memory cells), program verify(verify data on actual programming bias), and read on programmer. High level STO assures full compatible programming operation with conventional EPROM/OTP. Low level STO assures high speed synchronous read. "Full static programming" is recommended for loose devices. PROGRAM MR27V3266D is programmed with 10 microsecond pulse width on 4.0V VCC and 9.75V VPP. OKI recommends consecutive programming, because of the similarity of device sorting process. Almost all words can be programmed sufficiently with one pulse. Programmers are recommended to be equipped with large current capacity of VPP and VCC supplying source and responsive capacitance(around 0.1µF) on each socket to stabilize VPP and VCC voltage level, since switching speed of transistors produced with advanced wafer process technology is very fast and high voltage immunity of those is decreasing. Excessive overshooting of VPP voltage may destroy device permanently. Excessive overshooting of VCC voltage may cause misprogramming or disturbance. Excessive undershooting of VPP or VCC level may cause insufficient electron injection into floating gate. Additional programming increases programming time. PROGRAM INHIBIT When VPP is 9.75V, address must be changed only in "Program Inhibit" mode. PROGRAM VERIFY This operation mode is utilized to check that each word is programmed sufficiently. It is recommended to take time more than some seconds between actual programming and "Program Verify" ("Read") for each word, because just after the actual programming(injection of electron into floating gate) of each word, pretended excessive electrons are attached around floating gate to show false sufficiency of programming. Programing flow is selected to separate "Program" and "Program Verify" to take enough time. CONTACT CHECK When programmed OTP lot contains failed devices by the rate of more than 0.1%, some of or almost all failed devices are caused by misconnection with the sockets on the programmer. The possibility of misconnection is increased with surface mount devices such as SOP or TSOP. OKI will supply socket adapters exclusively applicable to MR27V3266D, but connections of all pins can not be assured with these socket adapters. Following contact check sequence before actual programming is recommended. 1. 2. 3. 4. Supply VCC with 4.0V power source. Bias logical low level on /CE. Supply 8V on /OE to enable contact check mode. Apply two address codes and check each output respectively. If irregular address code is applied, then output is FFFF. 5. /CE must be checked with a method suitable for the programmer. 6. VPP can be checked with current flow(more than 100 µA) in Program Inhibit mode. 7. AMPX and /WORD pins is open in the socket adapter, since these pins are pulled down to VSS when STO is high. August , 1999 Revision 2.4 28 32M Synchronous OTP 1 Semiconductor AC CHARACTERISTICS FOR PROGRAMMING ( STO is High Level ) Parameter VPP Setup Time Address Setup Time Data Setup Time Address Hold Time Data Hold Time Program Pulse Width /OE Setup Time Data Valid from /OE Symbol tVS tAS tDS tAH tDH tPW tOES tOE Min 2 100 100 2 100 9 2 Typ 10 Max 11 100 Unit µs ns ns µs ns µs µs ns MR27V3266D Condition VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V VPP = 9.75V, VCC = 4.0V Notes August , 1999 Revision 2.4 29 32M Synchronous OTP 1 Semiconductor AC CHARACTERISTICS FOR VERIFY AND READ ( STO is High Level ) Parameter Address Access Time /RAS Access Time /CAS Access Time /CE Access Time /OE Access Time /CE High to Output Float Delay /OE High to Output Float Delay Address Hold from /OE high Symbol tACC tACC tACC tCE tOE tCHZ tOHZ tAHO Min 0 Typ Max 80 80 80 80 30 25 20 Unit ns ns ns ns ns ns ns ns MR27V3266D Condition VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V VPP = VCC = 2.9 - 4.1V Notes August , 1999 Revision 2.4 30 32M Synchronous OTP 1 Semiconductor CONSECUTIVE PROGRAMMING WAVEFORMS ( AMPX = L ) CAP0 - CAP7 A0 - A12 tAS tAH tPW MR27V3266D CE High OE tDS tDH DIN tVS DIN DQ0 - DQ15 VPP August , 1999 Revision 2.4 31 32M Synchronous OTP 1 Semiconductor CONSECUTIVE PROGRAM VERIFY CYCLE ( VPP = 9.75V, AMPX = L ) CAP0 - CAP7 A0 - A12 High MR27V3266D CE tACC Note1 tAHO OE tOE tOHZ DQ0 - DQ15 DOUT DOUT Note 1. Falling edge of /OE must be preceded with data stabilizing time of more than tACC max., because output of invalid state can cause unstable system operation. Output buffer of MR27V3266D is designed to drive 100pF load in 5ns. August , 1999 Revision 2.4 32 32M Synchronous OTP 1 Semiconductor PROGRAM AND PROGRAM VERIFY CYCLE WAVEFORMS ( AMPX = L ) CAP0 - CAP7 A0 - A12 tAS tPW tOES MR27V3266D CE OE tOHZ tDS DIN 9.75V tDH tOE DOUT tOHZ DQ0 - DQ15 VPP August , 1999 Revision 2.4 33 32M Synchronous OTP 1 Semiconductor READ CYCLE ( AMPX = L ) CAP0 - CAP7 A0 - A12 MR27V3266D CE tACC tCE tCHZ OE tOE tOHZ DQ0 - DQ15 DOUT DOUT August , 1999 Revision 2.4 34 32M Synchronous OTP 1 Semiconductor PROGRAMMING FLOW CHART MR27V3266D START VPP = VCC = 4.0V CONTACT CHECK ADDRESS = FIRST LOCATION VCC = 4.0V VPP = 9.75V PROGRAM ONE 10µs PULSE INCREMENT ADDRESS NO LAST ADDRESS YES X=0 VERIFY ONE WORD PASS INCREMENT ADDRESS NO NG X=X+1 LAST ADDRESS YES VPP = VCC = 3.0V YES X=2 NO NG READ WORDS PASS DEVICE PASSED PROGRAM ONE 10µs PULSE DEVICE FAILED August , 1999 Revision 2.4 35 32M Synchronous OTP 1 Semiconductor REVISION HISTORY Revision 2.0 Revision 2.1 MR27V3266D 1. Page 13 Active Standby Current (ICC1) was revised from 50mA to 100mA. 2. Page 14 Regarding Note 1, it was revised from " .... internal command controller to cease the preceding command operation to keep output buffer high-Z state instead of the null output " to " .... internal command controller to cease the preceding command operation " ( underlined portion was eliminated. ). 3. Page 24 Regarding the timing diagram of " Burst Read / Interrupt II , DQ timing diagram was revised as bellow : DQ High-Z Qa0 Qa1 Qa2 Qa3 Qb0 Qb1 Qb2 Qb3 DQ High-Z Invalid State Qa0 Qa1 Qa2 Qa3 Qb0 Qb1 Qb2 Qb3 Revision 2.1 Revision 2.2 1. Page 14 tRCD (" Row Active " to " Read " Delay Time ) was revised from 1CLK to 2CLK. 2. Page 17 Contents of this page ( timing diagram of " Random Access with Gapless Burst ") was eliminated. Revision 2.2 Revision 2.3 1. Page 5 , 8 All descriptions of the case in " AMPX is high " were eliminated. 2. Page 27 All function table of " Address Multiplexed " and relational notes (2,3 and 4) were eliminated. 3. Page 29 , 30 All timing parameters regarding " Address Multiplexed " and relational notes (1 and 2) were eliminated. 4. Page 31 , 32 , 33 , 34 All timing waveforms regarding " Address Multiplexed " were eliminated. Revision 2.3 Revision 2.4 1. Page 14 tAC (Data to Valid Output Delay ) was revised from 10ns to 9ns. tOH (Data Output Hold Time ) was revised from 4ns to 3ns. tSI (Input Setup Time ) was revised from 4ns to 3ns. tHI (Input Hold Time ) was revised from 2ns to 1.5ns. tRCD (" Row Active " to " Read " Delay Time ) =1 CLK was added in case of up to 50MHz. 2. Page 17 Contents of this page ( timing diagram of " Random Access with Gapless Burst ") was republished in case of up to 50MHz. August , 1999 Revision 2.4 36 32M Synchronous OTP