MSM6595

E2D0038-39-21 ¡ Semiconductor MSM6595A-xxx ¡ Semiconductor 1-Mbit Serial Voice ROM This version: Feb. 1999 MSM6595A-xxx Previous version: May. 1997 GENERAL DESCRIPTION The MSM6595A is a MSM6595 short TAT process version. The MSM6595A is a serial voice ROM with a 1,048,576-word ¥ 1-bit configuration. The MSM6595A has a built-in internal address-generating circuit. A single, external clock input allows continuous, serial read operations. The internal addresses are automatically incremented by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. A read and playback device with predetermined messages can easily be configured by storing voice data into the MSM6595A and by combining it with one of Oki's recording and playback ICs and a serial register IC. A serial register is required to drive the MSM6595A by the MSM6388 or MSM6588. (The MSM6595A does not operate without a serial register.) The major differences between the MSM6595A and MSM6595 are shown below. MSM6595A DC Characteristics VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Parameter Current consumption (1) Symbol IDD Condition tRDC = 2.5 ms CS = VDD–0.2 V Ta = –40 to +70°C Ta = –40 to +85°C Min — — — Typ 9 — — Max 20 10 mA 50 Unit mA Current consumption (2) IDS Typical values are at VDD = 5.0 V, Ta = 25°C. MSM6595 DC Characteristics VDD = 3.5 to 5.5 V, Ta = –40 to +85°C Parameter Current consumption (1) Current consumption (2) Symbol IDD IDS Condition tRDC = 2.5 ms CS = VDD–0.2 V Min — — Typ — — Max 15 10 Unit mA mA FEATURES • Configuration : 1,048,576 words ¥ 1 bit • Serial access : Read cycle time of 2.5 ms • Shorter-TAT processing • Power-supply voltage : 2.7 to 5.5 V • Package options : 18-pin plastic QFJ (QFJ18-P-R290-1.27) (Product Name : MSM6595A-xxxJS) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product Name : MSM6595A-xxxGS-K) 18-pin plastic DIP (DIP18-P-300-2.54) (Product name : MSM6595A-xxxRS) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name : MSM6595A-xxxGS-AK) xxx indicates the code number 1/12 ¡ Semiconductor MSM6595A-xxx BLOCK DIAGRAM SADX X-ADDRESS COUNTER X-DECODER Sin X-ADDRESS REGISTER 10 1 10 Memory Cell Matrix 131072 ¥ 8 VDD GND TEST TEST TESTO1 TESTO2 SASX SADY CK Sin LD CK Y-DECODER MULTIPLEXER Y-ADDRESS COUNTER Y-ADDRESS REGISTER 10 6 3 MULTIPLEXER SASY TAS RDCK CS CK LD CK DOUT CS CONTROL 2/12 ¡ Semiconductor MSM6595A-xxx PIN CONFIGURATIONS (TOP VIEW) DOUT SADY SASY GND 2 1 18 17 TEST 3 CS 4 NC 5 SADX 6 SASX 7 16 TESTO1 15 NC 14 NC 13 RDCK 12 NC 8 TAS 9 VDD 10 11 TEST TESTO2 SADY SASY TEST CS NC NC NC NC SADX SASX TAS VDD 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 GND NC DOUT TESTO1 NC NC NC NC NC RDCK TESTO2 TEST NC : No connection 18-Pin Plastic QFJ NC : No connection 24-Pin Plastic SOP SADY SASY TEST CS NC SADX SASX TAS VDD 1 2 3 4 5 6 7 8 9 18 GND 17 DOUT 16 TESTO1 15 NC 14 NC 13 RDCK 12 NC 11 TESTO2 10 TEST SADY SASY TEST NC CS NC NC NC NC NC NC SADX SASX TAS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VDD 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 GND NC DOUT TESTO1 NC NC NC NC NC NC NC NC RDCK TESTO2 TEST NC : No connection 18-Pin Plastic DIP NC : No connection 30-Pin Plastic SSOP 3/12 ¡ Semiconductor MSM6595A-xxx PIN DESCRIPTIONS Pin QFJ SOP DIP SSOP 9 18 6 12 24 9 9 18 6 15 30 12 Symbol Type Description Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ground pin (SERIAL ADDRESS) This pin inputs the starting X address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AX0 - AX9) serial data via the SADX pin. (SERIAL ADDRESS) This pin inputs the starting Y address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AY0 - AY9) serial data via the SADY pin. (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the X address into the device's internal register. (SERIAL ADDRESS STROBE) This is the clock input pin to store the serial address data of the Y address into the device's internal register. (ADDRESS TRANSFER STROBE) This is the input pin for loading the serial address data into the internal address counter. The X and Y addresses are stored at the falling edge of TAS. (READ CLOCK) This is the clock input pin for reading information out of the data register. Internal operation starts at the falling edge of RDCK. The information in the data register is output on the DOUT pin. The internal address counter is automatically incremented at the falling edge of RDCK. (DATA OUT) The data output pin is always kept in a high-impedance state when RDCK or CS is kept at "H". This pin reflects the "H" or "L" level data being read, and the current data is held until RDCK is asserted High. (CHIP SELECT) Setting this pin to "H" disables all input and output pins. This pin enables parallel use of multiple serial voice ROMs by connecting the data output pins. Pins for testing. Apply a "L" level to the TEST pin and "H" level to the TEST pin. Pins for testing. Leave these pins open. VDD GND SADX — — I 1 1 1 1 SADY I 7 2 10 2 7 2 13 2 SASX SASY I I 8 11 8 14 TAS I 13 15 13 18 RDCK I 17 22 17 28 DOUT O 4 10 3 16 11 4 13 3 21 14 4 10 3 16 11 5 16 3 CS TEST TEST I I O 27 TESTO1 17 TESTO2 ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25°C Ta = 25°C — Rating –0.3 to +7.0 –0.3 to VDD+0.3 –55 to +150 Unit V V °C 4/12 ¡ Semiconductor MSM6595A-xxx RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Symbol VDD Top Condition GND=0 V — Range 2.7 to 5.5 –40 to +85 Unit V °C ELECTRICAL CHARACTERISTICS DC Characteristics VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Parameter "H" Level Input Voltage "L" Level Input Voltage "H" Level Output Voltage "L" Level Output Voltage "H" Level Input Current "L" Level Input Current Current Consumption (1) Symbol VIH VIL VOH VOL IIH IIL IDD Condition — — IOH = –40 mA IOL = 2 mA VIH = VDD VIL = GND tRDC = 2.5 ms CS = VDD–0.2 V Ta = –40 to +70°C Ta = –40 to +85°C Min. 0.85xVDD — VDD–0.3 — — –10 — — — Typ. — — — — — — 9 — — Max. — 0.15xVDD — 0.45 10 — 20 10 mA 50 Unit V V V V mA mA mA Current Consumption (2) IDS Typical values are at VDD = 5.0 V, Ta = 25°C. AC Characteristics VDD = 2.7 to 5.5 V, Ta = –40 to +85°C Parameter CS, SAS Setup Time SASX, SASY Cycle Time SASX, SASY Precharge Time SASX, SASY Pulse Width Address Setup Time Address Hold Time TAS Setup Time TAS, RDCK Setup Time TAS Pulse Width Read Cycle Time Access Time Output Turn-off Delay Time RDCK Precharge Time RDCK Pulse Width Symbol tCSS tSSC tSAP tSAS tAS tAH tATS tTRS tTAS tRDC tACC tOFF tRDP tRD Min. 1000 500 250 250 100 100 500 500 250 2500 — 0 1000 1500 Max. — — — — — — — — — — 1500 200 — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns 5/12 Serial Address Input Timing TIMING DIAGRAMS ¡ Semiconductor
 
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,  , CS (I) SADX (I) AX0 AX1 AX2 AX3 tAH tAS SASX (I) tSAS tSAP tCSS tSSC SADY (I) AY0 tAH AY1 AY2 AY3 tAS SASY (I) tSAS tSAP tCSS tSSC TAS (I) 
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,, AX9 tATS AY9 tATS tTAS AX4 AX5 AX6 AX7 AX8 AY4 AY5 AY6 AY7 AY8 MSM6595A-xxx 6/12 Read Access Timing ¡ Semiconductor TAS (I) RDCK (I) DOUT (O)  

,, tTAS tTRS tRDC tRD tRDP tOFF XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC MSM6595A-xxx 7/12 ¡ Semiconductor MSM6595A-xxx APPLICATION CIRCUIT MSM6588 Playback Storage Example DVDD DVDD' AVDD MICROCONTROLLER D3 D2 D1 D0 RD WR CE MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET SAD SAS TAS RWCK WE DI/O SAD SAS TAS RWCK WE DIN DOUT AU/D TEST TEST TEST TEST TEST CS CS1 CS2 CS3 CS4 MON XT XT VDD VDD SADX SASX TAS RDCK DOUT SASY SADY VDD 1-Mbit SERIAL VOICE ROM MSM6595A-xxx GND 1-Mbit SERIAL REGISTER MSM6389 MSM6389 MSM6588 GND CS GND TEST TEST CS + MIN MOUT 4.096 MHz DGND LIN AVDD + LOUT AMON FIN FOUT ADIN SG DGND AOUT Speaker amplifier + AGND AGND Note: When the MSM6595A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6595A does not operate without it.) The MSM6389 is being used as the serial register in the above example. 8/12 ¡ Semiconductor MSM6595A-xxx PACKAGE DIMENSIONS (Unit : mm) QFJ18-P-R290-1.27 Spherical surface Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/12 ¡ Semiconductor MSM6595A-xxx (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/12 ¡ Semiconductor MSM6595A-xxx (Unit : mm) DIP18-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP. 11/12 ¡ Semiconductor MSM6595A-xxx (Unit : mm) SSOP30-P-56-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation. 2. 3. 4. 5. 6. 7. 8. 9. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan