EE-SX1109-1

Photomicrosensor (Transmissive) EE-SX1109 Be sure to read Precautions on page 25. ■ Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • Ultra-compact with a 6-mm-wide sensor and a 3-mm-wide slot. • PCB surface mounting type. • High resolution with a 0.5-mm-wide aperture. ■ Absolute Maximum Ratings (Ta = 25°C) Item Emitter Optical axis Detector Cross section AA Recommended Soldering Pattern Internal Circuit Ambient temperature Terminal No. A K C E Symbol IF 25 mA (see note 1) Pulse forward current IFP 100 mA (see note 2) Reverse voltage VR 5V Collector–Emitter voltage VCEO 20 V Emitter–Collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 75 mW (see note 1) Operating Topr –30°C to 85°C Storage Tstg –40°C to 90°C Reflow soldering Tsol 255°C (see note 3) Manual soldering Tsol 350°C (see note 3) Name Anode Cathode Collector Emitter Rated value Forward current Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C. 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. Unless otherwise specified, the tolerances are ±0.15 mm. ■ Electrical and Optical Characteristics (Ta = 25°C) Item Emitter Detector Forward voltage Symbol Value VF 1.1 V typ., 1.3 V max. Condition IF = 5 mA Reverse current IR 10 μA max. VR = 5 V Peak emission wavelength λP 940 nm typ. IF = 20 mA Light current IL 50 μA min., 150 μA typ., 500 μA max. IF = 5 mA, VCE = 5 V Dark current ID 100 nA max. VCE = 10 V, 0 lx Leakage current ILEAK --- --- Collector–Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 μA Peak spectral sensitivity wavelength λP 900 nm typ. --- Rising time tr 10 μs typ. VCC = 5 V, RL = 1 kΩ, IL = 100 μA Falling time tf 10 μs typ. VCC = 5 V, RL = 1 kΩ, IL = 100 μA 70 EE-SX1109 Photomicrosensor (Transmissive) ■ Engineering Data Forward Current vs. Forward Voltage Characteristics (Typical) Forward current IF (mA) Light current IL (μA) Ta = 25°C VCE = 5 V Ambient temperature Ta (°C) IF = 10 mA IF = 5 mA Collector−Emitter voltage VCE (V) Response time tr, tf (μs) VCC = 5 V Ta = 25°C Load resistance RL (kΩ) VCE = 10 V VCE = 2 V Ambient temperature Ta (°C) Sensing Position Characteristics (Typical) Relative light current IL (%) Response Time vs. Load Resistance Characteristics (Typical) IF = 5 mA VCE = 5 V IF = 5 mA VCE = 5 V Distance d (mm) Ambient temperature Ta (°C) Sensing Position Characteristics (Typical) Relative light current IL (%) Light current IL (μA) Ta = 25°C Forward current IF (mA) Forward voltage VF (V) Relative Light Current vs. Ambient Dark Current vs. Ambient TemperTemperature Characteristics (Typical) ature Characteristics (Typical) Relative light current IL (%) Light Current vs. Collector−Emitter Voltage Characteristics (Typical) Light Current vs. Forward Current Characteristics (Typical) Dark current ID (nA) Forward current IF (mA) Collector dissipation PC (mW) Forward Current vs. Collector Dissipation Temperature Rating IF = 5 mA VCE = 5 V Distance d (mm) Response Time Measurement Circuit Input Output 90 % 10 % Input Output EE-SX1109 Photomicrosensor (Transmissive) 71 Unit: mm (inch) ■ Tape and Reel Reel 21±0.8 dia. 330+2 dia. 2±0.5 13± 0.5 dia. 80±1 dia. Product name Quantity Lot No. 12.4+2 0 18.4 max. Tape 1.5 dia. Tape configuration Terminating part (40 mm min.) Parts mounted Pull-out direction Tape quantity 1,000 pcs./reel 72 EE-SX1109 Photomicrosensor (Transmissive) Leading part (400 mm min.) Empty (40 mm min.) Precautions ■ Soldering Information Reflow soldering • The following soldering paste is recommended: Melting temperature: 216 to 220°C Composition: Sn 3.5 Ag 0.75 Cu • The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. • Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. Temperature 1 to 5°C/s 260°C max. 255°C max. 230°C max. 1 to 5°C/s 150 to 180°C 120 sec 10 sec max. 40 sec max. Time Manual soldering • • • • Use ”Sn 60” (60% tin and 40% lead) or solder with silver content. Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30°C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60°C for 24 hours or more Bulk: 80°C for 4 hours or more EE-SX1109 Photomicrosensor (Transmissive) 73