2SC5706-P-E

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16790FD Generic Copy Issue Date: 20-Feb-2013 TITLE: Final PCN for wafer fab transfer from Gunma and Gifu in Japan to Niigata in Japan (Group FD). PROPOSED FIRST SHIP DATE: starting on 20-May-2013 until 3-Jun-2013 (the actual ship date will be different by each product, please check with the responsible Sales person). AFFECTED CHANGE CATEGORY(S): Wafer Fabrication Location Change FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Toshikazu.Hirai@onsemi.com SAMPLES: Contact your local ON Semiconductor Sales Office or Katsuya.Ito@onsemi.com . ADDITIONAL RELIABILITY DATA: May be available Contact your local ON Semiconductor Sales Office or Yasuhiro.Igarashi@onsemi.com. NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact DESCRIPTION AND PURPOSE: This is a Final Process Change Notification to announce the transfer of products from Sanyo wafer fabrication site located in Gifu to Niigata. The product design and electrical specifications will remain identical. A full electrical characterization over the temperature range will be performed for each product to check the device functionality and electrical specifications. Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards. Issue Date: 20-Feb-2013 Rev. 06-Jan-2010 Page 1 of 2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16790FD RELIABILITY DATA SUMMARY Group FD Test: Conditions: Interval: Steady State Operating Life Tj=150degC 1000 hrs High Temperature Reverse Bias Ta=150degC,VDSS/VCES=max 1000 hrs 1000 hrs Temp Humidity Storage Ta=85degC, RH=85% Temperature Cycle Ta=-55degC to 150degC 30min each 100 cycles 50 hrs Pressure Cooker Ta=121degC,2.03×105Pa,100% High Temperature Storage Ta=150degC 1000 hrs Low Temperature Storage Ta=-55degC 1000 hrs Solder Test Ta=260degC±5degC, 10 s Notice) ※1 Pre-treatment: Resistance to Soldering heat (Flow:260degC/10s) Results Pass Pass Pass Pass Pass Pass Pass Pass ELECTRICAL CHARACTERISTIC SUMMARY There is no change in the electrical performance. Datasheet specifications remain unchanged. CHANGED PART IDENTIFICATION No change to current part marking will occur. Marking traceability codes will be able to identify wafer fab die source. List of affected Generic parts: Group FD PART_ID 12A02CH-TL-E 2SA1417S-TD-E 2SA1417T-TD-E 2SA1705S-AN 2SA2039-E 2SA2040-TL-E 2SB1121S-TD-E 2SB1122S-TD-E 2SB1123S-TD-E 2SB1123T-TD-E 2SB1201S-TL-E 2SB1203S-TL-E 2SB1204S-TL-E 2SB1205S-TL-E 2SB1205T-TL-E 2SB1215S-TL-E 2SB1216S-E 2SC3646S-TD-E 2SC3646T-TD-E 2SC3647S-TD-E 2SC3647T-TD-E 2SC3649T-TD-E 2SC4027S-E 2SC4027S-TL-E 2SC4489S-AN 2SC4614S-AN 2SC5226A-5-TL-E 2SC5231A-8-TL-E 2SC5415AE-TD-E 2SC5551AE-TD-E 2SC5706-E 2SC5706-P-E 2SD1207S 2SD1207S-AE 2SD1207T-AE 2SD1623S-TD-E 2SD1623T-TD-E 2SD1624T-TD-E 2SD1802S-TL-E 2SD1802S-TL-E 2SD1802T-TL-E 2SD1803S-E 2SD1803T-TL-H Issue Date: 20-Feb-2013 2SD1815S-E 2SD1815S-TL-E 2SD1815T-E 2SD1816S-TL-E 2SD1816T-TL-E 2SD1816T-TL-H 2SD1835T-AA 2SK3557-6-TB-E 2SK3557-7-TB-E 2SK3666-2-TB-E 2SK596S-B 2SK932-22-TB-E 30C02CH-TL-E 30C02MH-TL-E 3LN01C-TB-E 3LP01C-TB-E 3LP01S-K-TL-E 5HP01C-TB-E 5HP01M-TL-E 5LN01M-TL-E 5LN01SP-AC 5LP01M-TL-E Rev. 06-Jan-2010 CPH3115-TL-E CPH3215-TL-E CPH5506-TL-E CPH5517-TL-E CPH5902G-TL-E CPH5905G-TL-E CPH5905G-TL-E CPH6001A-TL-E CPH6102-TL-E CPH6501-TL-E CPH6538-TL-H MCH6001-TL-E MCH6102-TL-E MCH6602-TL-E PCP1203-TD-H TF252-5-TL-H TF252TH-4-TL-H TF252TH-5-TL-H TIG065E8-TL-H TND321VD-TL-E Page 2 of 2