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7WBD3306DTR2G

7WBD3306DTR2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSSOP8

  • 描述:

    IC BUS SWITCH 1 X 1:1 8TSSOP

  • 数据手册
  • 价格&库存
7WBD3306DTR2G 数据手册
ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 2-Bit Translating Bus Switch 7WBD3306 The 7WBD3306 is an advanced high−speed low−power 2−bit translating bus switch in ultra−small footprints. Features • • • • • • • www.onsemi.com High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices− MARKING DIAGRAMS 8 1 UDFN8 MU SUFFIX CASE 517AJ UDFN8 1.95 x 1.0 CASE 517CA AHM G XM 1 8 Micro8 DM SUFFIX CASE 846A D125 AYWG G 1 1 8 UQFN8 MU SUFFIX CASE 523AN 1 US8 US SUFFIX CASE 493 AH M*G G AF ALYW 8 TSSOP8 DT SUFFIX CASE 948AL AAE YWWA G 1 AH, X, D125, AF, AAE M A L Y W G = Specific Device Code = Date Code = Assembly Location = Lot Code = Year Code = Work Week Code = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2014 January, 2021 − Rev. 4 1 Publication Order Number: 7WBD3306/D 7WBD3306 OE1 1 8 VCC A1 2 7 OE2 GND 3 6 4 5 A1 B1 7 6 5 8 VCC B1 OE1 4 GND B2 A2 1 2 3 OE2 B2 A2 Figure 2. UQFN8 Figure 1. UDFN8 (Top Thru−View) (Top Thru−View) OE1 1 8 VCC A1 2 7 OE2 B1 3 6 B2 GND 4 5 A2 Figure 3. US8/Micro8/TSSOP8 (Top View) A1 B1 FUNCTION TABLE OE1 A2 B2 OE2 Figure 4. Logic Diagram www.onsemi.com 2 Input OEn Function L Bn = An H Disconnect 7WBD3306 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL FR VESD ILATCHUP 150 °C US8 (Note 1) UDFN8 UQFN8 Micro8 TSSOP8 251 111 208 392 150 °C/W US8 UDFN8 UQFN8 Micro8 TSSOP8 498 1127 601 319 833 mW Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) > 2000 > 200 N/A V $200 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V VCC Positive DC Supply Voltage VIN Control Pin Input Voltage 0 5.5 V VI/O Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V TA Operating Free−Air Temperature Dt / DV Input Transition Rise or Fall Rate Control Input Switch I/O Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 7WBD3306 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min Unit −1.2 V Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 5 Input Leakage Current 0 v VIN v 5.5 V 5.5 ±0.1 ±1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 ±0.1 ±1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V OE1 = OE2 = GND OE1 = OE2 = VCC 5.5 ±1.0 ±0.1 ±1.0 ±1.0 mA mA 2.5 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 −1.2 Max VIK IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 4.0 2.0 V 3 3 7 7 7 7 15 50 50 50 70 70 W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Condition TA = −555C to +1255C TA = 25 5C Min Typ Max Min Unit 0.25 ns ns tPD Propagation Delay, Bus to Bus See Figure 6 4.0 to 5.5 tEN Output Enable Time See Figure 6 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 4.0 0.8 3.0 4.6 0.8 4.6 4.5 to 5.5 0.8 3.0 4.8 0.8 4.8 4.0 0.8 2.9 4.4 0.8 4.4 tDIS CIN Output Disable Time 0.25 Max ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF www.onsemi.com 4 7WBD3306 TYPICAL DC CHARACTERISTICS VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 IOH = −0.1 mA 3.50 −6 mA −12 mA −24 mA 3.25 3.00 2.75 2.50 TA = +85°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = +25°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = −40°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) Figure 5. Output Voltage High vs Supply Voltage www.onsemi.com 5 7WBD3306 AC LOADING AND WAVEFORMS Parameter Measurement Information From Output Under Test 500 W S1 7V Open Test S1 tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open GND CL = 50 pF* 500 W *CL includes probes and jig capacitance. 1.5 V 1.5 V Output Control 3V Input tPHL VOH Output 1.5 V 1.5 V Output Waveform 2 S1 at Open (Note 6) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZL Output Waveform 1 S1 at 7 V (Note 6) tPZH 0V tPLH 1.5 V 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLZ and tPHZ are the same as tDIS. 10. tPZL and tPZH are the same as tEN. 11. tPHL and tPLH are the same as tPD. Figure 6. tPD, tEN, tDIS Loading and Waveforms www.onsemi.com 6 7WBD3306 ORDERING INFORMATION Package Shipping† 7WBD3306USG US8 (Pb−Free) 3000 / Tape & Reel 7WBD3306MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel 7WBD3306AMUTCG UQFN8 (Pb−Free) 3000 / Tape & Reel 7WBD3306DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel 7WBD3306DTR2G TSSOP8 (Pb−Free) 4000 / Tape & Reel UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel Device 7WBD3306DMUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 7 7WBD3306 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ ISSUE O PIN ONE REFERENCE ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C L1 E DETAIL A NOTE 5 TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW e/2 A1 e (b2) 1 C SEATING PLANE DETAIL A 8X L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 7WBD3306 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE A www.onsemi.com 9 7WBD3306 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN ISSUE O A B D ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C EXPOSED Cu E A1 ÇÇ ÉÉ ÉÉ MOLD CMPD A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE (0.15) DETAIL A SOLDERING FOOTPRINT* OPTIONAL CONSTRUCTION 1.70 8X 8X L3 L 0.50 PITCH 1 e 5 3 1 DETAIL A MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 0.35 7 8 8X b 0.10 C A B BOTTOM VIEW 1.70 0.05 C 7X NOTE 3 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 7WBD3306 PACKAGE DIMENSIONS US8 CASE 493 ISSUE D X Y A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203MM (0.003−0.008”). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508MM (0.0002”). J 5 DETAIL E B L 1 4 R S G P U C SEATING PLANE T D H 0.10 (0.004) T K 0.10 (0.004) M N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V RECOMMENDED SOLDERING FOOTPRINT* 8X 0.30 8X 0.68 3.40 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 11 MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 0_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.128 0_ 6_ 0_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC 7WBD3306 PACKAGE DIMENSIONS Micro8 CASE 846A ISSUE K www.onsemi.com 12 7WBD3306 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O b SYMBOL MIN NOM E1 E MAX 1.20 A A1 0.05 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.90 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 1.05 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 13 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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