ADM1032
+15C Remote and Local
System Temperature Monitor
The ADM1032 is a dual-channel digital thermometer and
under/overtemperature alarm intended for use in PCs and thermal
management systems. The device can measure the temperature of a
remote thermal diode, which can be located on the processor die or can
be a discrete device (2N3904/06), accurate to 1°C. A novel
measurement technique cancels out the absolute value of the
transistor’s base emitter voltage so that no calibration is required. The
ADM1032 also measures its ambient temperature.
The ADM1032 communicates over a 2-wire serial interface
compatible with System Management Bus (SMBus) standards.
Under/overtemperature limits can be programmed into the device over
the SMBus, and an ALERT output signals when the on−chip or remote
temperature measurement is out of range. This output can be used as
an interrupt or as a SMBus alert. The THERM output is a comparator
output that allows CPU clock throttling or on/off control of a cooling
fan. An ADM1032−1 and ADM1032−2 are available. The difference
between the ADM1032 and the ADM1032−1 is the default value of
the external THERM limit. The ADM1032−2 has a different SMBus
address. The SMBus address of the ADM1032−2 is 0x4D.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
SOIC−8 NB
CASE 751
MSOP−8
CASE 846AB
PIN ASSIGNMENT
D+ 2
8 SCLK
7 SDATA
D− 3
THERM 4
6 ALERT
5 GND
VDD
1
(Top View)
MARKING DIAGRAMS
8
8
On-chip and Remote Temperature Sensing
Offset Registers for System Calibration
0.125°C Resolution/1°C Accuracy on Remote Channel
1°C Resolution/3°C Accuracy on Local Channel
Fast (Up to 64 Measurements Per Second)
2-wire SMBus Serial Interface
Supports SMBus Alert
Programmable Under/Overtemperature Limits
Programmable Fault Queue
Overtemperature Fail-safe THERM Output
Programmable THERM Limits
Programmable THERM Hysteresis
170 mA Operating Current
5.5 mA Standby Current
3.0 V to 5.5 V Supply
Small 8-lead SOIC and MSOP Packages
These are Pb-Free Devices*
1032AR
01
#YYWW
1032AR
#YYWW
XXXX
1
1
Marking #1
Marking #2
SOIC−8 NB
1023AR
#
YY
W
XX
= Specific Device Code
= Pb-Free Package
= Year
= Work Week
= Assembly Lot
8
T1x
AYWG
G
1
MSOP−8
T1x
A
Y
W
G
Applications
•
•
•
•
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•
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Desktop and Notebook Computers
Smart Batteries
Industrial Controllers
Telecommunications Equipment
Instrumentation
Embedded Systems
= Refer to Order Info Table
= Assembly Location
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. 13
1
Publication Order Number:
ADM1032/D
ADM1032
ADDRESS POINTER
REGISTER
CONVERSION RATE
REGISTER
2
D−
3
A/D
CONVERTER
ANALOG
MUX
BUSY
RUN/STANDBY
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
LIMIT
COMPARATOR
DIGITAL MUX
D+
LOCAL TEMPERATURE
VALUE REGISTER
DIGITAL MUX
ON-CHIP
TEMPERATURE
SENSOR
REMOTE TEMPERATURE
VALUE REGISTER
REMOTE TEMPERATURE
LOW LIMIT REGISTER
REMOTE TEMPERATURE
HIGH LIMIT REGISTER
LOCAL THERM LIMIT
REGISTER
REMOTE OFFSET
REGISTER
EXTERNAL THERM LIMIT
REGISTER
CONFIGURATION
REGISTER
EXTERNAL DIODE OPEN-CIRCUIT
INTERRUPT
MASKING
STATUS REGISTER
ADM1032
6
ALERT
4
THERM
SMBUS INTERFACE
1
5
7
8
VDD
GND
SDATA
SCLK
Figure 1. Functional Block Diagram
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Positive Supply Voltage (VDD) to GND
Rating
Unit
−0.3, +5.5
V
−0.3 to VDD + 0.3
V
D− to GND
−0.3 to +0.6
V
SCLK, SDATA, ALERT
−0.3 to +5.5
V
D+
THERM
Input Current, SDATA, THERM
Input Current, D−
−0.3 to VDD + 0.3
V
−1, +50
mA
±1
mA
> 1000
V
150
°C
Storage Temperature Range
−65 to +150
°C
IR Reflow Peak Temperature
220
°C
IR Reflow Peak Temperature for Pb-Free
260
°C
Lead Temperature (Soldering 10 sec)
300
°C
ESD Rating, All Pins (Human Body Model)
Maximum Junction Temperature (TJ Max)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS
Package Type
qJA
Unit
8-lead SOIC NB Package
121
°C
8-lead MSOP Package
142
°C
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ADM1032
Table 3. PIN ASSIGNMENT
Pin No.
Mnemonic
Description
1
VDD
Positive Supply, 3.0 V to 5.5 V.
2
D+
Positive Connection to Remote Temperature Sensor.
3
D−
Negative Connection to Remote Temperature Sensor.
4
THERM
5
GND
6
ALERT
Open-Drain Logic Output Used as Interrupt or SMBus Alert.
7
SDATA
Logic Input/Output, SMBus Serial Data. Open-drain output. Requires pullup resistor.
8
SCLK
Logic Input, SMBus Serial Clock. Requires pullup resistor.
THERM is an open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event
of an overtemperature condition. Requires pullup to VDD, the same supply as the ADM1032.
Note: Please refer to Power Sequencing Considerations; THERM Pin Pullup on page 15 for more
information.
Supply Ground Connection.
Table 4. ELECTRICAL CHARACTERISTICS
Parameter
Conditions
Min
Typ
Max
Unit
3.0
3.30
5.5
V
−
170
215
mA
Power Supply
Supply Voltage, VDD
Average Operating Supply Current, ICC
0.0625 Conversions/Sec Rate (Note 1)
Standby Mode
Undervoltage Lockout Threshold
VDD Input, Disables ADC, Rising Edge
Power-On Reset Threshold
−
5.5
10
mA
2.35
2.55
2.8
V
1.0
−
2.4
V
−
±1
±3
°C
−
1.0
−
°C
−
−
−
−
±1
±3
°C
−
0.125
−
°C
−
−
230
13
−
−
mA
35.7
−
142.8
ms
5.7
−
22.8
Temperature-To-Digital Converter
Local Sensor Accuracy
0 ≤ TA ≤ 100°C, VCC = 3 V to 3.6 V
Resolution
Remote Diode Sensor Accuracy
60°C ≤ TD ≤ 100°C, VCC = 3 V to 3.6 V
0°C ≤ TD ≤ 120°C
Resolution
Remote Sensor Source Current
High Level (Note 2)
Low Level (Note 2)
Conversion Time
From stop bit to conversion complete
Both channels: one-shot mode with averaging
switched on
One-shot mode with averaging off (that is,
conversion rate = 32 or 64 conversions per second)
Open-Drain Digital Outputs (THERM, ALERT)
Output Low Voltage, VOL
IOUT = −6.0 mA (Note 2)
−
−
0.4
V
High Level Output Leakage Current, IOH
VOUT = VDD (Note 2)
−
0.1
1.0
mA
Logic Input High Voltage, VIH
SCLK, SDATA
VDD = 3.0 V to 5.5 V
2.1
−
−
V
Logic Input Low Voltage, VIL
VDD = 3.0 V to 5.5 V
−
−
0.8
V
−
500
−
mV
Serial Bus Timing (Note 2)
Hysteresis
SCLK, SDATA
SDATA Output Low Sink Current
SDATA Forced to 0.6 V
6.0
−
−
mA
ALERT Output Low Sink Current
ALERT Forced to 0.4 V
1.0
−
−
mA
−1.0
−
+1.0
mA
−
5.0
−
pF
Logic Input Current, IIH, IIL
Input Capacitance, SCLK, SDATA
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ADM1032
Table 4. ELECTRICAL CHARACTERISTICS
Parameter
Conditions
Min
Typ
Max
Unit
Clock Frequency
−
−
400
kHz
SMBus Timeout (Note 3)
−
25
64
ms
Serial Bus Timing (Note 2)
SCLK Clock Low Time, tLOW
tLOW between 10% Points
1.3
−
−
ms
SCLK Clock High Time, tHIGH
tHIGH between 90% Points
0.6
−
−
ms
600
−
−
ns
Start Condition Setup Time, tSU:STA
Start Condition Hold Time, tHD:STA
Time from 10% of SDATA to 90% of SCLK
600
−
−
ns
Stop Condition Setup Time, tSU:STO
Time from 90% of SCLK to 10% of SDATA
600
−
−
ns
Data Valid to SCLK Rising Edge Time,
tSU:DAT
Time for 10% or 90% of SDATA to 10% of SCLK
100
−
−
ns
300
−
−
ns
1.3
−
−
ms
SCLK, SDATA Rise Time, tR
−
−
300
ns
SCLK, SDATA Fall Time, tF
−
−
300
ns
Data Hold Time, tHD:DAT
Bus Free Time, tBUF
Between Start/Stop Condition
1. See Table 10 for information on other conversion rates.
2. Guaranteed by design, not production tested.
3. The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface
section.
t LOW
tF
t HD; STA
tR
SCLK
t HD; STA
t HD; DAT
t HIGH
t SU; STA
t SU; DAT
t SU; STO
SDATA
P
t BUF
S
S
Figure 2. Serial Bus Timing Diagram
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ADM1032
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
16
TEMPERATURE ERROR (°C)
TEMPERATURE ERROR (°C)
20
12
8
D+ To GND
4
0
−4
D+ To VDD
−8
−12
−16
0.5
0
−0.5
0
10
100
0
20
40
LEAKAGE RESISTANCE (MW)
Figure 3. Temperature Error vs. Leakage
Resistance
100
120
12
11
TEMPERATURE ERROR (°C)
TEMPERATURE ERROR (°C)
80
Figure 4. Temperature Error vs. Actual
Temperature Using 2N3906
13
9
7
VIN = 40 mV p−p
5
3
1
VIN = 10 mV p−p
−1
100K
1M
10
VIN = 250 mV p−p
8
6
4
VIN = 100 mV p−p
2
0
10M
1M
10
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5. Temperature Error vs. Differential Mode
Noise Frequency
Figure 6. Temperature Error vs. Power Supply
Noise Frequency
18
2.0
16
SUPPLY CURRENT (mA)
TEMPERATURE ERROR (°C)
60
TEMPERATURE (°C)
14
12
10
8
6
4
1.5
1.0
VDD = 5 V
0.5
2
0
1
6
11
16
21
26
31
0.0
0.01
36
CAPACITANCE (nF)
VDD = 3 V
0.1
1
10
CONVERSION RATE (Hz)
Figure 7. Temperature Error vs. Capacitance
Between D+ and D−
Figure 8. Operating Supply Current vs.
Conversion Rate
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ADM1032
TYPICAL PERFORMANCE CHARACTERISTICS (Cont’d)
80
70
SUPPLY CURRENT (mA)
10
VIN = 100 mV p−p
8
6
4
VIN = 50 mV p−p
2
0
100K
60
50
VDD = 5 V
40
30
20
10
VIN = 25 mV p−p
1M
10M
0
100M
VDD = 3.3 V
1
5
10 25
Figure 9. Temperature Error vs. Common-mode
Noise Frequency
75 100 250 500 750 1000
Figure 10. Standby Supply Current vs. Clock
Frequency
40
35
30
25
20
15
10
5
0
50
SCLK FREQUENCY (kHz)
FREQUENCY (Hz)
STANDBY SUPPLY CURRENT (mA)
TEMPERATURE ERROR (°C)
12
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SUPPLY VOLTAGE (V)
Figure 11. Standby Supply Current vs. Supply Voltage
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ADM1032
Functional Description
This is given by:
The ADM1032 is a local and remote temperature sensor
and overtemperature alarm. When the ADM1032 is
operating normally, the on-board A/D converter operates in
a free running mode. The analog input multiplexer
alternately selects either the on-chip temperature sensor to
measure its local temperature or the remote temperature
sensor. These signals are digitized by the ADC, and the
results are stored in the local and remote temperature value
registers.
The measurement results are compared with local and
remote, high, low, and THERM temperature limits stored in
nine on-chip registers. Out-of-limit comparisons generate
flags that are stored in the status register, and one or more
out-of-limit results cause the ALERT output to pull low.
Exceeding THERM temperature limits causes the THERM
output to assert low.
The limit registers can be programmed, and the device
controlled and configured, via the serial SMBus. The
contents of any register can also be read back via the SMBus.
Control and configuration functions consist of:
• Switching the Device between Normal Operation and
Standby Mode
• Masking or Enabling the ALERT Output
• Selecting the Conversion Rate
DV BE + ǒn f Ǔ KT
q
The ADM1032 is trimmed for an ideality factor of 1.008.
Figure 12 shows the input signal conditioning used to
measure the output of an external temperature sensor.
Figure 12 shows the external sensor as a substrate transistor,
provided for temperature monitoring on some
microprocessors, but it could equally well be a discrete
transistor. If a discrete transistor is used, the collector is not
grounded and should be linked to the base. To prevent
ground noise interfering with the measurement, the more
negative terminal of the sensor is not referenced to ground
but is biased above ground by an internal diode at the D−
input. If the sensor is operating in a noisy environment, C1
can optionally be added as a noise filter. Its value should be
no more than 1000 pF. See the Layout Considerations
section for more information on C1.
To measure DVBE, the sensor is switched between the
operating currents of I and N × I. The resulting waveform is
passed through a 65 kHz low-pass filter to remove noise, and
then to a chopper-stabilized amplifier that performs the
functions of amplification and rectification of the waveform
to produce a dc voltage proportional to DVBE. This voltage
is measured by the ADC to give a temperature output in twos
complement format. To further reduce the effects of noise,
digital filtering is performed by averaging the results of 16
measurement cycles.
Signal conditioning and measurement of the internal
temperature sensor is performed in a similar manner.
A simple method of measuring temperature is to exploit
the negative temperature coefficient of a diode, or the
base-emitter voltage of a transistor, operated at constant
current. Unfortunately, this technique requires calibration to
null out the effect of the absolute value of VBE, which varies
from device to device.
The technique used in the ADM1032 is to measure the
change in VBE when the device is operated at two different
currents.
N×I
VDD
IBIAS
VOUT+
D+
REMOTE
SENSING
TRANSISTOR
To ADC
C1*
D−
(eq. 1)
where:
K is Boltzmann’s constant (1.38 × 10–23)
q is the charge on the electron (1.6 × 10–19 Coulombs)
T is the absolute temperature in Kelvins
N is the ratio of the two currents
nf is the ideality factor of the thermal diode.
Measurement Method
I
In(N)
BIAS
DIODE
VOUT−
LOW-PASS FILTER
fC = 65 kHz
* CAPACITOR C1 IS OPTIONAL AND IT SHOULD ONLY BE USED IN VERY NOISY ENVIRONMENTS. C1 = 1000 pF Max.
Figure 12. Input Signal Conditioning
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ADM1032
Temperature Data Format
Value Registers
One LSB of the ADC corresponds to 0.125°C, so the ADC
can measure from 0°C to 127.875°C. The temperature data
format is shown in Table 5 and Table 6.
The results of the local and remote temperature
measurements are stored in the local and remote temperature
value registers and are compared with limits programmed
into the local and remote high and low limit registers.
The ADM1032 has three registers to store the results of
local and remote temperature measurements. These
registers are written to by the ADC only and can be read over
the SMBus.
Offset Register
Series resistance on the D+ and D− lines in processor
packages and clock noise can introduce offset errors into the
remote temperature measurement. To achieve the specified
accuracy on this channel, these offsets must be removed.
The offset value is stored as an 11-bit, twos complement
value in Register 11h (high byte) and Register 12h (low
byte, left justified). The value of the offset is negative if the
MSB of Register 11h is 1 and positive if the MSB of
Register 12h is 0. The value is added to the measured value
of the remote temperature.
The offset register powers up with a default value of 0°C
and has no effect if nothing is written to them.
Table 5. TEMPERATURE DATA FORMAT
(LOCAL TEMPERATURE AND REMOTE
TEMPERATURE HIGH BYTE)
Temperature
Digital Output
0°C
0 000 0000
1°C
0 000 0001
10°C
0 000 1010
25°C
0 001 1001
50°C
0 011 0010
75°C
0 100 1011
100°C
0 110 0100
125°C
0 111 1101
127°C
Table 7. SAMPLE OFFSET REGISTER CODES
Offset Value
11h
12h
−4°C
1 111 1100
0 000 0000
0 111 1111
Table 6. EXTENDED TEMPERATURE RESOLUTION
(REMOTE TEMPERATURE LOW BYTE)
−1°C
1 111 1111
0 000 0000
−0.125°C
1 111 1111
1 110 0000
0°C
0 000 0000
0 000 0000
+0.125°C
0 000 0000
0 010 0000
+1°C
0 000 0001
0 000 0000
+4°C
0 000 0100
0 000 0000
Extended Resolution
Remote Temperature
Low Byte
0.000°C
0 000 0000
0.125°C
0 010 0000
0.250°C
0 100 0000
Status Register
0.375°C
0 110 0000
0.500°C
1 000 0000
0.625°C
1 010 0000
0.750°C
1 100 0000
0.875°C
1 110 0000
Bit 7 of the status register indicates that the ADC is busy
converting when it is high. Bit 6 to Bit 3, Bit 1, and Bit 0 are
flags that indicate the results of the limit comparisons. Bit 2
is set when the remote sensor is open circuit.
If the local and/or remote temperature measurement is
above the corresponding high temperature limit, or below or
equal to the corresponding low temperature limit, one or
more of these flags is set. These five flags (Bit 6 to Bit 2) are
NOR’ed together, so that if any of them are high, the ALERT
interrupt latch is set and the ALERT output goes low.
Reading the status register clears the five flag bits, provided
that the error conditions that caused the flags to be set have
gone away. While a limit comparator is tripped due to a value
register containing an out-of-limit measurement, or the
sensor is open circuit, the corresponding flag bit cannot be
reset. A flag bit can only be reset if the corresponding value
register contains an in-limit measurement or the sensor is
good.
The ALERT interrupt latch is not reset by reading the
status register but is reset when the ALERT output is
serviced by the master reading the device address, provided
the error condition has gone away and the status register flag
bits are reset.
When Flag 1 and Flag 0 are set, the THERM output goes
low to indicate that the temperature measurements are
ADM1032 Registers
The ADM1032 contains registers that are used to store the
results of remote and local temperature measurements and
high and low temperature limits and to configure and control
the device. A description of these registers follows, and
further details are given in Table 7 to Table 11.
Address Pointer Register
The address pointer register itself does not have, or
require, an address because it is the register the first data byte
of every write operation is written to automatically. This
data byte is an address pointer that sets up one of the other
registers for the second byte of the write operation or for a
subsequent read operation.
The power-on default value of the address pointer register
is 00h. Therefore, if a read operation is performed
immediately after power-on without first writing to the
address pointer, the value of the local temperature is returned
because its register address is 00h.
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ADM1032
outside the programmed limits. THERM output does not
need to be reset, unlike the ALERT output. Once the
measurements are within the limits, the corresponding status
register bits are reset and the THERM output goes high.
Table 10. CONVERSION RATE REGISTER CODES
Data
Conversion/Sec
Average Supply Current
mA Typ at VDD = 5.5 V
00h
0.0625
0.17
01h
0.125
0.20
Function
02h
0.25
0.21
BUSY
1 When ADC Converting
03h
0.5
0.24
LHIGH
1 When Local High Temp Limit Tripped
04h
1
0.29
05h
2
0.40
06h
4
0.61
07h
8
1.1
08h
16
1.9
09h
32
0.73
0Ah
64
1.23
0B to FFh
Reserved
Table 8. STATUS REGISTER BIT ASSIGNMENTS
Bit
7
6
5
4
3
Name
(Note 1)
LLOW
1 When Local Low Temp Limit Tripped
RHIGH
1 When Remote High Temp Limit
Tripped
(Note 1)
(Note 1)
(Note 1)
RLOW
1 When Remote Low Temp Limit
Tripped
OPEN
1 When Remote Sensor Open-Circuit
1
RTHRM
1 When Remote THERM Limit Tripped
0
LTHRM1
1 When Local THERM Limit Tripped
2
(Note 1)
Limit Registers
The ADM1032 has nine limit registers to store local and
remote, high, low, and THERM temperature limits. These
registers can be written to and read back over the SMBus.
The high limit registers perform a > comparison, while the
low limit registers perform a < or = to comparison. For
example, if the high limit register is programmed with 80°C,
measuring 81°C results in an alarm condition. If the low
limit register is programmed with 0°C, measuring 0°C or
lower results in an alarm condition. Exceeding either the
local or remote THERM limit asserts THERM low. A
default hysteresis value of 10°C is provided, which applies
to both channels. This hysteresis can be reprogrammed to
any value after powerup (Reg 0x21h).
1. These flags stay high until the status register is read, or they are
reset by POR.
Configuration Register
Two bits of the configuration register are used. If Bit 6 is
0, which is the power-on default, the device is in operating
mode with the ADC converting. If Bit 6 is set to 1, the device
is in standby mode and the ADC does not convert. The
SMBus does, however, remain active in standby mode so
values can be read from or written to the SMBus. The
ALERT and THERM O/Ps are also active in standby mode.
Bit 7 of the configuration register is used to mask the alert
output. If Bit 7 is 0, which is the power-on default, the output
is enabled. If Bit 7 is set to 1, the output is disabled.
One-Shot Register
The one-shot register is used to initiate a single conversion
and comparison cycle when the ADM1032 is in standby
mode, after which the device returns to standby. This is not
a data register as such, and it is the write operation that
causes the one-shot conversion. The data written to this
address is irrelevant and is not stored. The conversion time
on a single shot is 96 ms when the conversion rate is 16
conversions per second or less. At 32 conversions per
second, the conversion time is 15.3 ms. This is because
averaging is disabled at the faster conversion rates (32 and
64 conversions per second).
Table 9. CONFIGURATION REGISTER BIT
ASSIGNMENTS
Power-On
Default
Bit
Name
Function
7
MASK1
0 = ALERT Enabled
1 = ALERT Masked
0
6
RUN/STOP
0 = Run
1 = Standby
0
Reserved
0
5 to 0
Conversion Rate Register
Consecutive ALERT Register
The lowest four bits of this register are used to program the
conversion rate by dividing the internal oscillator clock by
1, 2, 4, 8, 16, 32, 64, 128, 256, 512, or 1024 to give
conversion times from 15.5 ms (Code 0Ah) to 16 seconds
(Code 00h). This register can be written to and read back
over the SMBus. The higher four bits of this register are
unused and must be set to 0. Use of slower conversion times
greatly reduces the device power consumption, as shown in
Table 10.
This value written to this register determines how many
out-of limit measurements must occur before an ALERT is
generated. The default value is that one out-of-limit
measurement generates an ALERT. The maximum value
that can be chosen is four. The purpose of this register is to
allow the user to perform some filtering of the output. This
is particularly useful at the faster two conversion rates where
no averaging takes place.
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ADM1032
Serial Bus Interface
Table 11. CONSECUTIVE ALERT REGISTER CODES
NOTE:
Register Value
Number of Out-of-Limit
Measurements Required
yxxx 000x
1
yxxx 001x
2
yxxx 011x
3
yxxx 111x
4
Control of the ADM1032 is carried out via the serial bus.
The ADM1032 is connected to this bus as a slave device,
under the control of a master device.
There is a programmable SMBus timeout. When this is
enabled, the SMBus times out after typically 25 ms of no
activity. However, this feature is not enabled by default. To
enable it, set Bit 7 of the consecutive alert register
(Address = 22h).
x = don’t care bits, and y = SMBus timeout bit.
Default = 0. See SMBus section for more information.
Table 12. LIST OF ADM1032 REGISTERS
Read Address (Hex)
Write Address (Hex)
Not Applicable
Not Applicable
Address Pointer
Undefined
00
Not Applicable
Local Temperature Value
0000 0000 (00h)
01
Not Applicable
External Temperature Value High Byte
0000 0000 (00h)
02
Not Applicable
Status
Undefined
03
09
Configuration
0000 0000 (00h)
04
0A
Conversion Rate
0000 1000 (08h)
05
0B
Local Temperature High Limit
0101 0101 (55h) (85°C)
06
0C
Local Temperature Low Limit
0000 0000 (00h) (0°C)
07
0D
External Temperature High Limit High Byte
0101 0101 (55h) (85°C)
08
0E
External Temperature Low Limit High Byte
0000 0000 (00h) (0°C)
Not Applicable
0F
One-Shot
10
Not Applicable
External Temperature Value Low Byte
0000 0000
11
11
External Temperature Offset High Byte
0000 0000
12
12
External Temperature Offset Low Byte
0000 0000
13
13
External Temperature High Limit Low Byte
0000 0000
14
14
External Temperature Low Limit Low Byte
0000 0000
19
19
External THERM Limit
0101 0101 (55h) (85°C) (ADM1032)
0110 1100 (6Ch) (108°C)
(ADM1032−1)
20
20
Local THERM Limit
0101 0101 (55h) (85°C)
21
21
THERM Hysteresis
0000 1010 (0Ah) (10°C)
22
22
Consecutive ALERT
0000 0001 (01h)
FE
Not Applicable
Manufacturer ID
0100 0001 (41h)
FF
Not Applicable
Die Revision Code
Undefined
NOTE:
Name
Power-On Default
Writing to Address 0F causes the ADM1032 to perform a single measurement. It is not a data register as such and it does not
matter what data is written to it.
Addressing the Device
The serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a
START condition, defined as a high-to-low
transition on the serial data line SDATA, while the
serial clock line SCLK remains high. This
indicates that an address/data stream follows. All
slave peripherals connected to the serial bus
respond to the START condition and shift in the
next eight bits, consisting of a 7-bit address (MSB
first) plus an R/W bit, which determines the
In general, every SMBus device has a 7-bit device address
(except for some devices that have extended, 10-bit
addresses). When the master device sends a device address
over the bus, the slave device with that address responds.
The ADM1032 and the ADM1032−1 are available with one
SMBus address, which is Hex 4C (1001 100). The
ADM1032−2 is also available with one SMBus address;
however, that address is Hex 4D (1001 101).
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ADM1032
that the correct data register is addressed. The first byte of
a write operation always contains a valid address that is
stored in the address pointer register. If data is written to the
device, the write operation contains a second data byte that
is written to the register selected by the address pointer
register.
This is illustrated in Figure 13. The device address is sent
over the bus followed by R/W set to 0. This is followed by
two data bytes. The first data byte is the address of the
internal data register to be written to, which is stored in the
address pointer register. The second data byte is the data to
be written to the internal data register.
When reading data from a register, there are two
possibilities:
1. If the address pointer register value is unknown or
not the desired value, it is first necessary to set it
to the correct value before data can be read from
the desired data register. This is done by
performing a write to the ADM1032 as before, but
only the data byte containing the register read
address is sent because data is not to be written to
the register. This is shown in Figure 14.
A read operation is then performed consisting of
the serial bus address, R/W bit set to 1, followed
by the data byte read from the data register. This is
shown in Figure 15.
2. If the address pointer register is known to be at the
desired address already, data can be read from the
corresponding data register without first writing to
the address pointer register and Figure 14 can be
omitted.
direction of the data transfer, that is, whether data
is written to or read from the slave device.
The peripheral whose address corresponds to the
transmitted address responds by pulling the data
line low during the low period before the ninth
clock pulse, known as the acknowledge bit. All
other devices on the bus now remain idle while the
selected device waits for data to be read from or
written to it. If the R/W bit is a 0, the master writes
to the slave device. If the R/W bit is a 1, the
master reads from the slave device.
2. Data is sent over the serial bus in sequences of
nine clock pulses, eight bits of data followed by an
acknowledge bit from the slave device. Transitions
on the data line must occur during the low period
of the clock signal and remain stable during the
high period, since a low-to-high transition when
the clock is high can be interpreted as a STOP
signal. The number of data bytes that can be
transmitted over the serial bus in a single read or
write operation is limited only by what the master
and slave devices can handle.
3. When all data bytes are read or written, stop
conditions are established. In write mode, the
master pulls the data line high during the 10th
clock pulse to assert a STOP condition. In read
mode, the master device overrides the
acknowledge bit by pulling the data line high
during the low period before the ninth clock pulse.
This is known as no acknowledge. The master then
takes the data line low during the low period
before the 10th clock pulse, and high during the
10th clock pulse to assert a STOP condition.
NOTES:
1. Although it is possible to read a data byte from a data
register without first writing to the address pointer register,
if the address pointer register is already at the correct value,
it is not possible to write data to a register without writing to
the address pointer register. The first data byte of a write is
always written to the address pointer register.
2. Don’t forget that some of the ADM1032 registers have
different addresses for read and write operations. The write
address of a register must be written to the address pointer
if data is to be written to that register, but it is not possible
to read data from that address. The read address of a
register must be written to the address pointer before data
can be read from that register.
Any number of bytes of data can be transferred over the
serial bus in one operation, but it is not possible to mix read
and write in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
In the case of the ADM1032, write operations contain
either one or two bytes, while read operations contain one
byte and perform the following functions.
To write data to one of the device data registers or read
data from it, the address pointer register must first be set so
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11
ADM1032
1
9
1
9
SCLK
SDATA
A6
A5
A4
A2
A3
A0
A1
D6
D7
R/W
START BY
MASTER
D4
D5
D2
D3
D1
D0
ACK. BY
ADM1032
ACK. BY
ADM1032
FRAME 2
ADDRESS POINTER REGISTER BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
1
9
SCLK (CONTINUED)
D7
SDATA (CONTINUED)
D4
D5
D6
D2
D3
D1
D0
ACK. BY
ADM1032
FRAME 3
DATA BYTE
STOP BY
MASTER
Figure 13. Writing a Register Address to the Address Pointer Register,
then Writing Data to the Selected Register
1
9
9
1
SCLK
SDATA
A6
A5
A4
A3
A2
A1
A0
START BY
MASTER
D7
R/W
D6
D4
D5
D3
D2
D1
D0
STOP BY
MASTER
ACK. BY
ADM1032
ACK. BY
ADM1032
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
ADDRESS POINTER REGISTER BYTE
Figure 14. Writing to the Address Pointer Register Only
9
1
9
1
SCLK
SDATA
START BY
MASTER
A6
A5
A4
A3
A2
A1
A0
FRAME 1
SERIAL BUS ADDRESS BYTE
R/W
D7
D6
ACK. BY
ADM1032
D5
D4
D3
D2
D1
FRAME 2
DATA BYTE FROM ADM1032
D0
ACK. BY
ADM1032
STOP BY
MASTER
Figure 15. Reading Data from a Previously Selected Register
ALERT Output
MASTER
RECEIVES
SMBALERT
The ALERT output goes low whenever an out-of-limit
measurement is detected, or if the remote temperature sensor
is open-circuit. It is an open drain and requires a pullup to
VDD. Several ALERT outputs can be wire-OR’ed together
so that the common line goes low if one or more of the
ALERT outputs goes low.
The ALERT output can be used as an interrupt signal to a
processor, or it can be used as an SMBALERT. Slave devices
on the SMBus can not normally signal to the master that they
want to talk, but the SMBALERT function allows them to do
so.
One or more ALERT outputs can be connected to a
common SMBALERT line connected to the master. When
the SMBALERT line is pulled low by one of the devices, the
following procedure occurs (see Figure 16).
START
ALERT RESPONSE
ADDRESS
MASTER SENDS
ARA AND READ
COMMAND
RD ACK
DEVICE
ADDRESS
NO
STOP
ACK
DEVICE SENDS
ITS ADDRESS
Figure 16. Use of SMBALERT
1. SMBALERT is pulled low.
2. Master initiates a read operation and sends the
alert response address (ARA = 0001 100). This is
a general call address that must not be used as a
specific device address.
3. The device whose ALERT output is low responds
to the alert response address and the master reads
its device address. Since the device address is
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12
ADM1032
2. If the local or remote temperature continues to
increase and either one exceeds the THERM limit,
the THERM output asserts low. This can be used
to throttle the CPU clock or switch on a fan.
seven bits, an LSB of 1 is added. The address of
the device is now known, and it can be
interrogated in the usual way.
4. If more than one device’s ALERT output is low,
the one with the lowest device address has priority
in accordance with normal SMBus arbitration.
5. Once the ADM1032 has responded to the alert
response address, it resets its ALERT output,
provided that the error condition that caused the
ALERT no longer exists. If the SMBALERT line
remains low, the master sends ARA again, and so
on until all devices whose ALERT outputs were
low have responded.
A THERM hysteresis value is provided to prevent a
cooling fan cycling on and off. The power-on default value
is 10°C, but this can be reprogrammed to any value after
powerup. This hysteresis value applies to both the local and
remote channels.
Using these two limits in this way, allows the user to gain
maximum performance from the system by only slowing it
down should it be at a critical temperature.
The THERM signal is open drain and requires a pullup to
VDD. The THERM signal must always be pulled up to the
same power supply as the ADM1032, unlike the SMBus
signals (SDATA, SCLK, and ALERT) that can be pulled to
a different power rail, usually that of the SMBus controller.
Low Power Standby Mode
The ADM1032 can be put into a low power standby mode
by setting Bit 6 of the configuration register. When Bit 6 is
low, the ADM1032 operates normally. When Bit 6 is high,
the ADC is inhibited and any conversion in progress is
terminated without writing the result to the corresponding
value register.
The SMBus is still enabled. Power consumption in the
standby mode is reduced to less than 10 mA if there is no
SMBus activity, or 100 mA if there are clock and data signals
on the bus.
When the device is in standby mode, it is still possible to
initiate a one-shot conversion of both channels by writing
XXh to the one-shot register (Address 0Fh), after which the
device returns to standby. It is also possible to write new
values to the limit register while it is in standby. If the values
stored in the temperature value registers are now outside the
new limits, an ALERT is generated even though the
ADM1032 is still in standby.
100°C
90°C
80°C
LOCAL THERM LIMIT
70°C
TEMPERATURE
60°C
LOCAL THERM LIMIT
− HYSTERESIS
50°C
40°C
THERM
Figure 17. Operation of the THERM Output
Table 13. THERM HYSTERESIS SAMPLE VALUES
The ADM1032 Interrupt System
The ADM1032 has two interrupt outputs, ALERT and
THERM. These have different functions. ALERT responds
to violations of software-programmed temperature limits
and is maskable. THERM is intended as a fail-safe interrupt
output that cannot be masked.
If the temperature goes equal to or below the lower
temperature limit, the ALERT pin is asserted low to indicate
an out-of-limit condition. If the temperature is within the
programmed low and high temperature limits, no interrupt
is generated.
If the temperature exceeds the high temperature limit, the
ALERT pin is asserted low to indicate an overtemperature
condition. A local and remote THERM limit can be
programmed into the device to set the temperature limit
above which the overtemperature THERM pin is asserted
low. This temperature limit should be equal to or greater than
the high temperature limit programmed.
The behavior of the high limit and THERM limit is as
follows:
1. If either temperature measured exceeds the high
temperature limit, the ALERT output is asserted
low.
THERM Hysteresis
Binary Representation
0°C
0 000 0000
1°C
0 000 0001
10°C
0 000 1010
Sensor Fault Detection
At the D+ input, the ADM1032 has a fault detector that
detects if the external sensor diode is open circuit. This is a
simple voltage comparator that trips if the voltage at D+
exceeds VDD − 1.0 V (typical). The output of this
comparator is checked when a conversion is initiated and
sets Bit 2 of the status register if a fault is detected.
If the remote sensor voltage falls below the normal
measuring range, for example, due to the diode being
short-circuited, the ADC outputs −128 (1000 0000). Since
the normal operating temperature range of the device only
extends down to 0°C, this output code should never be seen
in normal operation, so it can be interpreted as a fault
condition. Since it is outside the power-on default low
temperature limit (0°C) and any low limit that would
normally be programmed, a short-circuit sensor causes an
SMBus alert.
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ADM1032
If a discrete transistor is being used with the ADM1032,
the best accuracy is obtained by choosing devices according
to the following criteria:
• Base-emitter Voltage Greater than 0.25 V at 6 mA, at
the Highest Operating Temperature
• Base-emitter Voltage Less than 0.95 V at 100 mA, at
the Lowest Operating Temperature
• Base Resistance Less than 100 W
• Small Variation in hFE (say 50 to 150) that Indicates
Tight Control of VBE Characteristics
In this respect, the ADM1032 differs from and improves
upon competitive devices that output zero if the external
sensor goes short-circuit. These devices can misinterpret a
genuine 0°C measurement as a fault condition.
When the D+ and D− lines are shorted together, an
ALERT is always generated. This is because the remote
value register reports a temperature value of −128°C. Since
the ADM1032 performs a less-than or equal-to comparison
with the low limit, an ALERT is generated even when the
low limit is set to its minimum of −128°C.
Applications Information − Factors Affecting
Accuracy
Transistors such as 2N3904, 2N3906, or equivalents in
SOT−23 packages are suitable devices to use.
Remote Sensing Diode
Thermal Inertia and Self-heating
The ADM1032 is designed to work with substrate
transistors built into processors’ CPUs or with discrete
transistors. Substrate transistors are generally PNP types
with the collector connected to the substrate. Discrete types
can be either a PNP or an NPN transistor connected as a
diode (base shorted to collector). If an NPN transistor is
used, the collector and base are connected to D+ and the
emitter to D−. If a PNP transistor is used, the collector and
base are connected to D− and the emitter to D+. Substrate
transistors are found in a number of CPUs. To reduce the
error due to variations in these substrate and discrete
transistors, a number of factors should be taken into
consideration:
1. The ideality factor, nf, of the transistor. The
ideality factor is a measure of the deviation of the
thermal diode from the ideal behavior. The
ADM1032 is trimmed for an nf value of 1.008.
The following equation can be used to calculate
the error introduced at a temperature T°C when
using a transistor whose nf does not equal 1.008.
Consult the processor data sheet for nf values.
DT +
ǒnnatural * 1.008Ǔ
1.008
ǒ273.15 Kelvin ) TǓ
Accuracy depends on the temperature of the
remote-sensing diode and/or the internal temperature sensor
being at the same temperature as that being measured, and
a number of factors can affect this. Ideally, the sensor should
be in good thermal contact with the part of the system being
measured, for example, the processor. If it is not, the thermal
inertia caused by the mass of the sensor causes a lag in the
response of the sensor to a temperature change. In the case
of the remote sensor, this should not be a problem, since it
is either a substrate transistor in the processor or a small
package device, such as the SOT−23, placed in close
proximity to it.
The on-chip sensor, however, is often remote from the
processor and is only monitoring the general ambient
temperature around the package. The thermal time constant
of the SOIC−8 package in still air is about 140 seconds, and
if the ambient air temperature quickly changed by 100°, it
would take about 12 minutes (five time constants) for the
junction temperature of the ADM1032 to settle within 1° of
this. In practice, the ADM1032 package is in electrical and
therefore thermal contact with a printed circuit board and
can also be in a forced airflow. How accurately the
temperature of the board and/or the forced airflow reflect the
temperature to be measured also affects the accuracy.
Self-heating due to the power dissipated in the ADM1032
or the remote sensor causes the chip temperature of the
device or remote sensor to rise above ambient. However, the
current forced through the remote sensor is so small that
self-heating is negligible. In the case of the ADM1032, the
worst-case condition occurs when the device is converting
at 16 conversions per second while sinking the maximum
current of 1 mA at the ALERT and THERM output. In this
case, the total power dissipation in the device is about
11 mW. The thermal resistance, qJA, of the SOIC−8 package
is about 121°C/W.
In practice, the package has electrical and therefore
thermal connection to the printed circuit board, so the
temperature rise due to self-heating is negligible.
(eq. 2)
This value can be written to the offset register and
is automatically added to or subtracted from the
temperature measurement.
2. Some CPU manufacturers specify the high and
low current levels of the substrate transistors. The
high current level of the ADM1032, IHIGH, is
230 mA and the low level current, ILOW, is 13 mA.
If the ADM1032 current levels do not match the
levels of the CPU manufacturers, then it can
become necessary to remove an offset. The CPU’s
data sheet advises whether this offset needs to be
removed and how to calculate it. This offset can be
programmed to the offset register. It is important
to note that if accounting for two or more offsets is
needed, then the algebraic sum of these offsets
must be programmed to the offset register.
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ADM1032
Layout Considerations
6. If the distance to the remote sensor is more than
eight inches, the use of twisted pair cable is
recommended. This works up to about 6 feet to
12 feet.
7. For really long distances (up to 100 feet), use
shielded twisted pair, such as Belden #8451
microphone cable. Connect the twisted pair to D+
and D− and the shield to GND close to the
ADM1032. Leave the remote end of the shield
unconnected to avoid ground loops.
Digital boards can be electrically noisy environments, and
the ADM1032 is measuring very small voltages from the
remote sensor, so care must be taken to minimize noise
induced at the sensor inputs. The following precautions
should be taken.
1. Place the ADM1032 as close as possible to the
remote sensing diode. Provided that the worst
noise sources, that is, clock generators,
data/address buses, and CRTs, are avoided, this
distance can be four to eight inches.
2. Route the D+ and D− tracks close together, in
parallel, with grounded guard tracks on each side.
Provide a ground plane under the tracks if
possible.
3. Use wide tracks to minimize inductance and
reduce noise pickup. 10 mil track minimum width
and spacing is recommended.
GND
Because the measurement technique uses switched
current sources, excessive cable and/or filter capacitance
can affect the measurement. When using long cables, the
filter capacitor can be reduced or removed.
Cable resistance can also introduce errors. 1 W series
resistance introduces about 1°C error.
Power Sequencing Considerations
Power Supply Slew Rate
10 MIL
When powering up the ADM1032 you must ensure that
the slew rate of VDD is less than 18 mV/ms. A slew rate larger
than this may cause power-on-reset issues and yield
unpredictable results.
10 MIL
D+
10 MIL
10 MIL
D−
10 MIL
THERM Pin Pullup
10 MIL
GND
As mentioned above, the THERM signal is open drain and
requires a pullup to VDD. The THERM signal must always
be pulled up to the same power supply as the ADM1032,
unlike the SMBus signals (SDA, SCL and ALERT) that can
be pulled to a different power rail. The only time the
THERM pin can be pulled to a different supply rail (other
than VDD) is if the other supply is powered up simultaneous
with, or after the ADM1032 main VDD. This is to protect the
internal circuitry of the ADM1032. If the THERM pullup
supply rail were to rise before VDD, the POR circuitry may
not operate correctly.
10 MIL
Figure 18. Typical Arrangement of Signal Tracks
4. Try to minimize the number of copper/solder
joints, which can cause thermocouple effects.
Where copper/solder joints are used, make sure
that they are in both the D+ and D− path and at the
same temperature.
Thermocouple effects should not be a major
problem since 1°C corresponds to about 200 mV
and thermocouple voltages are about 3 mV/°C of
temperature difference. Unless there are two
thermocouples with a big temperature differential
between them, thermocouple voltages should be
much less than 200 mV.
5. Place a 0.1 mF bypass capacitor close to the VDD
pin. In very noisy environments, place a 1000 pF
input filter capacitor across D+ and D− close to the
ADM1032.
Application Circuit
Figure 19 shows a typical application circuit for the
ADM1032, using a discrete sensor transistor connected via
a shielded, twisted pair cable. The pullups on SCLK,
SDATA, and ALERT are required only if they are not
already provided elsewhere in the system.
The SCLK and SDATA pins of the ADM1032 can be
interfaced directly to the SMBus of an I/O controller, such
as the Intel 820 chipset.
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15
ADM1032
0.1 mF
VDD
3 V to 3.6 V
TYP 10 kW
ADM1032
D+
SCLK
D−
2N3906
or
CPU THERMAL
DIODE
SMBUS
CONTROLLER
SDATA
SHIELD
ALERT
VDD
5 V or 12 V
THERM
TYP 10 kW
GND
FAN
ENABLE
FAN
CONTROL
CIRCUIT
Figure 19. Typical Application Circuit
Table 14. ORDERING INFORMATION
Package
Description
Package
Option
Part
Marking
SMBus
Address
Shipping†
ADM1032ARZ−REEL
8-lead SOIC NB
R−8
#1
4C
2,500 Tape & Reel
85°C
ADM1032ARZ−1REEL
8-lead SOIC NB
R−8
#2
4C
2,500 Tape & Reel
108°C
ADM1032ARMZ−REEL
8-lead MSOP
RM−8
T1J
4C
3,000 Tape & Reel
85°C
ADM1032ARMZ−1RL
8-lead MSOP
RM−8
T13
4C
3,000 Tape & Reel
108°C
ADM1032ARMZ−2R
8-lead MSOP
RM−8
T1C
4D
3,000 Tape & Reel
85°C
Device Order Number*
External THERM
Default
*The “Z’’ suffix indicates Pb-Free package.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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16
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
8
1
SCALE 1:1
−X−
DATE 16 FEB 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
8
8
1
1
IC
4.0
0.155
XXXXX
A
L
Y
W
G
IC
(Pb−Free)
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
XXXXXX
AYWW
1
1
Discrete
XXXXXX
AYWW
G
Discrete
(Pb−Free)
XXXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.270
0.050
SCALE 6:1
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
8
8
XXXXX
ALYWX
G
XXXXX
ALYWX
1.52
0.060
0.6
0.024
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
7.0
0.275
DIM
A
B
C
D
G
H
J
K
M
N
S
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−8 NB
CASE 751−07
ISSUE AK
DATE 16 FEB 2011
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
7. BASE
8. EMITTER
STYLE 2:
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
6. EMITTER, #2
7. BASE, #1
8. EMITTER, #1
STYLE 3:
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
6. SOURCE, #2
7. GATE, #1
8. SOURCE, #1
STYLE 4:
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
8. COMMON CATHODE
STYLE 5:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
6. GATE
7. SOURCE
8. SOURCE
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. DRAIN
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
STYLE 7:
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
3. BASE, #2
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
STYLE 9:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 10:
PIN 1. GROUND
2. BIAS 1
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 12:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 14:
PIN 1. N−SOURCE
2. N−GATE
3. P−SOURCE
4. P−GATE
5. P−DRAIN
6. P−DRAIN
7. N−DRAIN
8. N−DRAIN
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
5. RXE
6. VEE
7. GND
8. ACC
STYLE 18:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
STYLE 19:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. MIRROR 2
7. DRAIN 1
8. MIRROR 1
STYLE 20:
PIN 1. SOURCE (N)
2. GATE (N)
3. SOURCE (P)
4. GATE (P)
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 21:
PIN 1. CATHODE 1
2. CATHODE 2
3. CATHODE 3
4. CATHODE 4
5. CATHODE 5
6. COMMON ANODE
7. COMMON ANODE
8. CATHODE 6
STYLE 22:
PIN 1. I/O LINE 1
2. COMMON CATHODE/VCC
3. COMMON CATHODE/VCC
4. I/O LINE 3
5. COMMON ANODE/GND
6. I/O LINE 4
7. I/O LINE 5
8. COMMON ANODE/GND
STYLE 23:
PIN 1. LINE 1 IN
2. COMMON ANODE/GND
3. COMMON ANODE/GND
4. LINE 2 IN
5. LINE 2 OUT
6. COMMON ANODE/GND
7. COMMON ANODE/GND
8. LINE 1 OUT
STYLE 24:
PIN 1. BASE
2. EMITTER
3. COLLECTOR/ANODE
4. COLLECTOR/ANODE
5. CATHODE
6. CATHODE
7. COLLECTOR/ANODE
8. COLLECTOR/ANODE
STYLE 25:
PIN 1. VIN
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
STYLE 26:
PIN 1. GND
2. dv/dt
3. ENABLE
4. ILIMIT
5. SOURCE
6. SOURCE
7. SOURCE
8. VCC
STYLE 29:
PIN 1. BASE, DIE #1
2. EMITTER, #1
3. BASE, #2
4. EMITTER, #2
5. COLLECTOR, #2
6. COLLECTOR, #2
7. COLLECTOR, #1
8. COLLECTOR, #1
STYLE 30:
PIN 1. DRAIN 1
2. DRAIN 1
3. GATE 2
4. SOURCE 2
5. SOURCE 1/DRAIN 2
6. SOURCE 1/DRAIN 2
7. SOURCE 1/DRAIN 2
8. GATE 1
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
STYLE 27:
PIN 1. ILIMIT
2. OVLO
3. UVLO
4. INPUT+
5. SOURCE
6. SOURCE
7. SOURCE
8. DRAIN
STYLE 28:
PIN 1. SW_TO_GND
2. DASIC_OFF
3. DASIC_SW_DET
4. GND
5. V_MON
6. VBULK
7. VBULK
8. VIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Micro8
CASE 846A−02
ISSUE K
DATE 16 JUL 2020
SCALE 2:1
GENERIC
MARKING DIAGRAM*
8
XXXX
AYWG
G
1
XXXX
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB14087C
MICRO8
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
DRAIN
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE 1
GATE 1
SOURCE 2
GATE 2
DRAIN 2
DRAIN 2
DRAIN 1
DRAIN 1
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N-SOURCE
N-GATE
P-SOURCE
P-GATE
P-DRAIN
P-DRAIN
N-DRAIN
N-DRAIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
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Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
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