AMIS-49200-XTP

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The AMIS−49200 was originally designed to be a near pin-for-pin replacement of the Yokogawa mSAA22Q MAU. “Near pin-for-pin” means that associated component values may change, but no board changes are required. A micro-leadframe package option (NQFP) is also available, the AMIS−49250. www.onsemi.com Features AMIS−492x0 Fieldbus MAU is a transceiver IC for low speed FOUNDATION Fieldbus and Profibus PA devices. It incorporates the following features: • All Node Power can be Supplied by the Bus, via the AMIS-492x0 • Current Consumption 500 mA (Typ) • VCC Voltage: 6.2 V to 4.75 V • VDD Voltage: 5.5 V to 2.7 V • Compatible to IEC 1158−2 and ISA 50.02 • Shunt Regulator • Voltage Reference (Internal Only) • Series Regulator • Band-pass Filter • Slew Rate Control • Segment Current Control • Low Voltage Detection • Carrier Detect • Data Rate: 31.25 kbps Voltage Mode • Dual Voltage Supply 3−6.2 V • 44-pin LQFP/NQFP Package • These Devices are Pb−Free and are RoHS Compliant LQFP−44, 10x10 CASE 561AA NQFP 44, 7x7 CASE 560BD ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet. Applications • Process Automation • Pressure and Temperature Monitoring Definitions, Acronyms and Abbreviations IC ESD FF LQFP Manchester MAU MDS NQFP mSAA22Q − Integrated Circuit − Electrostatic Discharge − FOUNDATION Fieldbus − Low Profile Quad Flat Pack − Communications Encoding Scheme Implemented in FOUNDATION Fieldbus − Medium Attachment Unit − Medium Dependent Sub-layer − “Near Chip-scale” Quad Flat Pack − Name of Yokogawa’s MAU IC © Semiconductor Components Industries, LLC, 2016 August, 2016 − Rev. 8 1 Publication Order Number: AMIS−492x0/D AMIS−492x0 Block Diagram 33 VSS Receive Block 35 RXS 31 30 FLTOUT FLT HPF Zero-cross Detector SIGIN Bandpass Filter 34 32 RXA LPF Carrier Detector 28 27 29 CCD Transmit Block 36 37 1 41 42 43 39 40 POL MDS Interface TXE VSS VSS VSS CCINP VSS Current Driver VSS VSS Power Supply Block VSS VCC Basic Circuitry 18 CCOUT Vmid Reference VCC VCC CCINM VCC VSS VCC 11 15 14 5 SHSETIN SRSETIN 12 N_PFail1 SRTR SRAO VSS N_PFail2 SRSET Shunt Regulator Low Voltage Detectors Series Regulator 20 22 23 24 25 3 2 Vref 4 SHSET VO 19 Vmid Vref Bandgap VCC 17 21 Vmid VDD 13 CRT TXS 44 16 VDRV Tri-level Modulator & Slew Control SHUNT 38 6 7 8 SGND 26 MDS_CTRL 9 VSS 10 Figure 1. AMIS−492x0 Fieldbus MAU Block Diagram Table 1. PIN NUMBERS AND SIGNAL DESCRIPTION Signal Name Pin No. I/O (Note 1) Description VSS 1 Ground VREF 2 AO Connect to Ground. Internal bandgap voltage (1.18 V). VMID 3 AO 2 V bias voltage for AC signals. N_PFAIL1 4 AI/O Power fail alarm at VCC input. This pin is an open-drain output of negative logic. N_PFAIL2 5 AI/O Power fail alarm at VDD input. This pin is an open-drain output of negative logic. SHSETIN 6 AI Feedback (non-inverting) input for the shunt regulator. SHSET 7 AO Divided voltage of VCC input. Feeding this voltage to SHSETIN pin results in 5 V voltage at VCC. 1. AI = Analog Input, AO = Analog Output, AI/O = Analog Input/Output, DIS = CMOS Digital Input (Schmitt Trigger), DO = CMOS Digital Output. www.onsemi.com 2 AMIS−492x0 Table 1. PIN NUMBERS AND SIGNAL DESCRIPTION (continued) Signal Name Pin No. I/O (Note 1) SHUNT 8 AI Control pin of the shunt regulator. Its sink current (25 mA max) is controlled so that the voltage at SHSETIN is equal to VREF (1.18 V). VSS/SGND 9 Ground The Current absorbed by SHUNT pin (25 mA max) is fed to this pin, which must be connected to the ground level. VSS 10 Ground Ground VSS 11 Ground Ground SRSETIN 12 AI Feedback (inverting) input for the series regulator. The series regulator controls its output (SRAO) to make this input voltage is equal to VREF (1.18 V). SRSET 13 AO Divided voltage of VO output. Feeding this voltage into SRSETIN pin results in 3 V at VO pin. SRAO 14 AO Output pin of an operational amplifier for the series regulator. SRTR 15 AI Gate of a PMOS transistor for the series regulator. VO 16 AO Output pin of the series regulator (20 mA max). VDD 17 Digital Supply Supply voltage input for digital block. VCC 18 Analog Supply Analog supply voltage. CRT 19 AI/O VSS 20 Ground VDRV 21 AO VSS 22 Ground CCINP 23 AI Non-inverting input of an operational amplifier for transmission current driver. Description Current integration to limit output slew rate. Ground Output of an operational amplifier for slew rate control. This signal can be fed to current driver. Ground CCINM 24 AI Inverting input of an operational amplifier for transmission current driver. CCOUT 25 AO Output of an operational amplifier for transmission current driver. MDS_CTRL 26 AI For POL = VDD MDS_CTRL should = VSS For POL = VSS MDS_CTRL can be tied to VDD or used as a not reset to control when transmit communications will be enabled. SIGIN 27 AI Input pin of the band-pass filter. This pin si connected to VMID bias level with 270 kW resistor. HPF 28 AI Feedback signal of high-pass filter. This pin si connected to the output of an op-amp for high pass filter with 75 kW resistor. LPF 29 AI Non-inverting input of an operational amplifier for the low-pass filter. FLT 30 AI Input pin of low-pass filter for feedback. This pin is connected to the output of the high-pass filter through 20 kW and the non-inverting input of the low-pass filter through 54 kW resisters. FLTOUT 31 AO Output of the operational amplifier for the low-pass filter. This signal is internally connected to non-inverting input to form a voltage-follower. CCD 32 AO Current integration (for carrier detect circuit). VSS 33 Ground RXA 34 DO MDS−MAU interface signal for received signal activity. This pin is a push-pull output. RXS 35 DO MDS−MAU interface signal for received signal. This pin is a push-pull output. TXE 36 DIS MDS−MAU interface signal for enable signal transmission (Schmitt Trigger input). TXS 37 DIS MDS−MAU interface signal for signal to be transmitted (Schmitt Trigger input). POL 38 DIS Selects polarity of TxE input. When this pin is connected to GND, TxE is active high. When this pin is connected to VDD, TxE is active low. VSS 39 Ground Ground VSS 40 Ground Ground VSS 41 Ground Connect to ground. VSS 42 Ground Connect to ground. VSS 43 Ground Connect to ground. VCC 44 Analog Supply Ground Analog supply voltage. 1. AI = Analog Input, AO = Analog Output, AI/O = Analog Input/Output, DIS = CMOS Digital Input (Schmitt Trigger), DO = CMOS Digital Output. www.onsemi.com 3 AMIS−492x0 ELECTRICAL CHARACTERISTICS Operating Conditions Unless otherwise noted, all block and sub-block specifications apply over the operating temperature (−40 to +85°C). Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Analog Block Supply Voltage VCC −0.3 6.5 V Digital Block Supply Voltage VDD −0.3 6.0 V (TxS, TxE and POL Pins) −0.3 VDD + 0.3 V (RxS and RxA Pins) −0.3 VDD + 0.3 V Digital Input Pin Voltage VIN Digital Output Pin Voltage VOUT Not for Shunt Pin − ±5 mA For Shunt, SGND and VO − 30 mA ESD, Human Body Model − 2,250 V ESD, Machine Model − 250 V − 1,000 V −55 125 °C Input Pin Current IIN Output Pin Current IOUT ESD, Charged Device Model Storage Temperature TStorage Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. NORMAL OPERATING CONDITIONS Parameter Analog Supply Voltage Symbol VCC Digital Supply Voltage VDD Storage Temperature TOperating Current Consumption ICC Conditions Supply voltages are configurable, or can be supplied from off-chip. Min Typ Max Unit 4.75 5 6.2 V 2.7 3 VCC − 1.1 V −40 − 85 °C − 500 800 mA Symbol Min Max Unit Input High Voltage VIH 0.7 × VDD VDD V Input Low Voltage VIL 0 0.3 × VDD V Input High Current IIH − 1 mA Input Low Current IIL − −1 mA Schmitt Negative Threshold Vt− 0.2 × VDD − V Schmitt Positive Threshold Vt+ − 0.8 × VDD V Schmitt Hysteresis Vh 1 − V 25°C, SHUNT current = 1 mA, no current from series regulator. Table 4. CMOS INPUT SPECIFICATIONS Parameter www.onsemi.com 4 AMIS−492x0 Power Supply Blocks Table 5. REGULATOR SPECIFICATIONS Parameter Symbol Conditions Min Typ Max Unit Preset, ISH = 1 to 5 mA 4.85 5.0 5.15 V External Setting 4.75 − 6.2 V Internal Pass Transistor N-ch and Pad 0.001 − 25 mA 5 − − mF ISH = 1 to 25 mA 0 1.6 4 % No Load Capacitance − − ±200 ppm/°C Shunt Regulator Output Voltage VCC Sink Current ISH Load Capacitance CSH Load Regulation Temperature Coefficient TCVcc Series Regulator Input Voltage VCC Internally Tied to VCC Pin 4.75 − 6.2 V Output Voltage VO Preset, ISR = 0 2.91 3.0 3.09 V External Setting and N-JFET 2.85 − 3.5 V Output Current ISR Internal Pass Transistor P-ch and Pad − − 20 mA Load Capacitance CSR For Stability use CAP w/ESR 5 − − mF ISR = 0 to 20 mA 0 2 4 % − ±200 − ppm/°C 85 90 95 % Vref 0.012 0.025 0.038 V VOL = 0.4 V (Open Drain) 30 − 135 mA VOH = 5 V − − 1 mA Min Typ Max Unit 1.157 1.185 1.205 V − 50 − ppm/°C − 100 − mV 4.75 5 6.2 V − − 0 mA Load Regulation Temperature Coefficient TCVo Low Voltage Detectors (Applies to N_PFail1 and PFail2) Threshold VTH9 SxSETIN > VTH9 (Output: L → H) Hysteresis VHYS5 SxSETIN < (VTH9 − VHYS5) (Output: H → L) Output Sink Current Output Leakage Current IOL IL Table 6. VOLTAGE REFERENCE SPECIFICATIONS Parameter Symbol Conditions Bandgap Voltage Reference Output Voltage Tolerance VREF Equates to: ±2% Temperature Drift Hysteresis VREFHYS Supply Voltage VCCREF Load Current IREFOUT (Note 2) No Load During Operation VMID Voltage Reference Output Voltage VMID 1.95 2.0 2.05 V Output Current IMID −30 − 100 mA Load Capacitance CMID 0.01 0.1 1 mF − − ±200 ppm/°C Temperature Coefficient DVC6000F Uses 1 mF TCMID 2. Hysteresis is defined as the change in the 25°C reading after 85°C to 25°C cycle and –40°C to 25°C cycle. www.onsemi.com 5 AMIS−492x0 Transmitter Blocks Table 7. MDS−MAU INTERFACE Parameter Symbol Min Typ Max Unit POL Input Pin POL See Schmitt Trigger Input Specs V TxE Input Pin TxE See Schmitt Trigger Input Specs V TxS input Pin TxS See Schmitt Trigger Input Specs V NOTE: The associated MDS chip must handle the jabber detect function. Table 8. TRI-LEVEL MODULATOR Parameter Symbol Conditions Min Typ Max Unit VMID − 3.02 V −35 − +120 mA VMID + 0.485 VMID + 0.500 VMID + 0.515 V Tri-level Modulator and Slew Control (Output is at VDRV) Output Voltage VO Load Current IO ⎪DV⎪ 10 mV Output for Silence (Note 3) VS TXE Disabled Output for High Level (Note 3) VH TXE Active VS + 0.380 VS + 0.400 VS + 0.420 V VL TXE Active VS − 0.420 VS − 0.400 VS − 0.380 V −0.02 − 0.02 V − 4.7 − msec Output for Low Level (Note 3) Asymmetry of VH and VL Rise and Fall Times (Note 4) DVHL tf, tr CRT = 22 pF (Note 4) 3. Nominal values are: VS = 2.5 V, VH = 2.9 V and VL = 2.1 V. 4. By adding an external capacitor between the CRT pin and ground, slew rate at VDRV output can be controlled. The controlling equation is tf or tr = 2 ms + (0.123 ms/pF * CRT). CRT is nominally 22 pF, yielding tf = tr = 4.7 ms. The constant comes from an internal capacitor. The hot side of the capacitor and the CRT pin should have a guard pattern around them to avoid unnecessary interference. Table 9. CURRENT CONTROL AMPLIFIER Parameter Min Typ Max Unit VCM 0 − VCC − 1 V Output Voltage Swing VO 1 − VCC − 0.5 V Load Current IO −2,300 − 100 mA VOS −3 − +3 mV − 0.54 − V/ms − 1.15 − MHz − 66 − Deg Input Common Mode Voltage Range Input Offset Voltage Slew Rate Gain Bandwidth Product Phase Margin Symbol SR GBW Conditions CL = 10 pF RL = 200 kW PM www.onsemi.com 6 AMIS−492x0 Receiver Block Table 10. RECEIVER SUB-BLOCKS Parameter Symbol Conditions Min Typ Max Unit 1 − 4 V FLTOUT 1 − 4 V Output Slew Rate SR − 0.6 − V/ms Input Offset Voltage VOS − − ±5 mV Filter Resistors (Note 5) RF1 60 75 90 kW RF2 216 270 324 kW RF3 16 20 24 kW RF4 43 54 65 kW 40 50 60 mV −60 −50 −40 mV Band Pass Filter Input Voltage Output Voltage Swing VBP SIGIN Pint to GND Carrier Detector Threshold Voltage VTH+ Relative to VMID VTH− Output High Voltage VOH IOH = 0 mA VDD − 0.6 − − V Output Low Voltage VOL IOL = 0 mA − − 0.3 V Output High Current IOH VDD − VO ≤ 0.6 V 50 − − mA Output Low Current IOL VO ≤ 0.6 V 50 − − mA Output Rising Time tR CL = 10 pF − 0.3 − ms Output Leak Current tF CL = 10 pF − 0.3 − ms VTH+ No Carrier VMID + 0.025 VMID + 0.040 VMID + 0.058 V VTH− Carrier Active VMID VMID VMID V Output High Voltage VOH IOH = 0 mA VDD − 0.6 − − V Output Low Voltage VOL IOL = 0 mA − − 0.3 V Output High Current IOH VDD − VO ≤ 0.6 V 50 − − mA Output Low Current IOL VO ≤ 0.6 V 50 − − mA Output Rising Time tR CL = 10 pF − 0.3 − ms Output Leak Current tF CL = 10 pF − 0.3 − ms Zero-cross Detector Threshold Voltage 5. The band pass filter is made up of a two pole high pass filter in series with a two pole low pass filter. The filter consists of four resistors internal to AMIS−492x0, and four external capacitors. The active part of each filter is an amplifier connected in a follower configuration. www.onsemi.com 7 AMIS−492x0 THEORY OF OPERATION Overview It is possible to increase the VCC voltage up to 6.2 V by dividing VCC with an external network to supply the appropriate voltage to SHSETIN pin. In this case, SHSET pin must be kept open. The output voltage is determined by the following equation: The AMIS−492x0 incorporates two different power supply circuits. Both derive their power from the bus. Using the internal configuration, the shunt regulator is set for 5 V and the series regulator is set for 3 V. Users can modify either power supply by adding external components. The AMIS−492x0 Fieldbus can also monitor these power supply voltages and generate power-fail signals if they fall below a specified value. Please refer to the AMIS−492x0 Fieldbus MAU Reference Design Application Note for ways to adjust the shunt and series voltage regulators. The AMIS−492x0 Fieldbus MAU transmits a Manchester-encoded signal provided from a standard MDS−MAU interface. The output driver makes it possible to design various signal circuits, which depend on the power requirements of your device. The slew rate of the signal can be controlled to minimize unnecessary radiation as specified in IEC/ISA standards. The AMIS−492x0 Fieldbus MAU has a built-in band pass filter which makes it easy to design your own receiver. The receive block operates on a Manchester-encoded signal. It decodes the signal and verifies proper amplitude with a zero-cross and carrier detect circuit, respectively. Detected signals are then passed on to a controller with the standard MDS−MAU interface. V CC + V REF ǒ 1) R1 R2 Ǔ (eq. 1) Shunt Regulator (Internal Configuration) System VCC VCC 18 Cfb 3.25 Rsh SHUNT 16 Meg 50 pF 8 − VREF 25 mA (Max) A6 Rsh + 7 SHSET 6 SHSETIN 9 SGND Shunt Regulator (External Configuration) Power Supply Block System VCC VCC The power supply block contains four sub-blocks: 1. A Shunt Regulator − for establishing a supply voltage of VCC (typ. = 5 V) used by the analog circuitry. 2. A Series Regulator − for establishing a supply voltage of VDD (typ. = 3 V) used for digital circuitry. 3. Two Low Voltage Detectors − for monitoring the two supply voltages. 4. A Bandgap Voltage Reference − which is used internally for generating a bias level for AC signals. 18 Cfb 3.25 Rsh R1 SHUNT 16 Meg 50 pF 8 − VREF 25 mA (Max) A6 Rsh + 7 SHSET 6 SHSETIN 9 R2 SGND N/C Figure 2. Shunt Regulator Shunt Regulator The shunt regulator controls its sink current to the SHUNT pin so that the voltage applied to the SHSETIN pin is equal to VREF. The VCC input is divided by an internal network to provide a voltage equal to Vref at the SHSET pin. If SHSET and SHSETIN pins are tied together, and VCC and SHUNT pins are connected to a power source of high impedance (e.g., current mirror circuit of signal driver), the shunt regulator provides 5 V power to itself and external circuits. A capacitor of 5 mF or larger capacity is necessary to stabilize this regulator. Figure 11 shows C10 (22 mF) connected to Pin 8 to accomplish stabilization. The SHUNT pin is normally connected to VCC. It is possible to insert a resister between VCC and SHUNT to measure the shunt current. Its value should be small enough to keep VDS (voltage between SHUNT pin and SGND pin) larger than 2.5 V (i.e., resistor must be less than 100 W). Since the internal transistor can sink as much as 25 mA, no additional circuit is necessary in most cases. Note that the drain current must not exceed 25 mA because no protection is implemented for the internal transistor. If you do not need the shunt regulator, you should connect SHUNT and SHSETIN pins to GND and open SHSET pin. Then VCC must be supplied from another source. www.onsemi.com 8 AMIS−492x0 Series Regulator The series regulator produces a regulated voltage at the VO pin from VCC. If you connect SRAO and SRTR pins together, the internal amplifier will regulate the input voltage at SRSETIN pin to equal VREF. An internal feedback signal is generated to produce a voltage equal to VREF at pin SRSET. If you connect SRSET and SRSETIN pins, the series regulator supplies 3 V at pin VO. A capacitor (CD in Figure 3) of 5 mF or larger capacity is necessary to stabilize this regulator. The capacitor is expected to have an ESR resistor for the circuit to be stable. If the capacitor is low, a series resistor with the cap load will help stabilize the circuit). V O + V REF VCC Cfb1 VO 20 mA (Max) 16 40 pF Cc2 20 pF CD − 1.54 Rsr SRSET 1) R4 R5 Ǔ (eq. 2) Low Voltage Detectors Low voltage detectors are included to monitor supply voltages and generate “power fail” signals. The low voltage alarms are detected by sensing the voltage on pins SHSETIN and SRSETIN. These pins also provide feedback for the shunt and series regulators. If the voltage on the SHSETIN pin is lower than the threshold, VTH9 (90 percent VREF), N_PFAIL1 goes low. Typically SHSETIN monitors the analog rail voltage VCC. If the voltage on the SRSETIN pin is lower than the threshold, VTH9, N_PFAIL2 goes low. Typically SRSETIN monitors the digital rail voltage VDD. Both outputs are open drain, so a resistor will be required. If you do not use one of these pins, it should be connected to GND. You can also add capacitors to delay these signals. In this case, sink current must not exceed the maximum value. If you do not wish to use one of the low voltage detectors its corresponding output pin should be connected to GND. Series Regulator (Internal Configuration) May Supply VDD ǒ VREF A7 + 13 VDD Rsr R1 VCC2 SRTR 15 14 12 SRAO SRSETIN 0.9 x VREF + SRSETIN − N_PFail1 4 C3 C1 VDD Series Regulator (External Configuration) May Supply VDD R2 VCC2 VCC Cfb1 VO 20 mA (Max) 16 0.9 x VREF + SRSETIN − N_PFail2 5 C4 40 pF C2 Cc2 20 pF CD SRSET R4 N/C 13 − 1.54 Rsr VREF A7 Figure 4. Low Voltage Detectors + If you do not use one of the regulators, the corresponding alarm signal can potentially be used to monitor another signal. For example, if the series regulator is not used, SRAO should be left open, SRTR tied to VCC, VO grounded and SRSET left open. Then SRSETIN can be the input for monitoring another voltage signal with N_PFAIL2. Rsr R5 SRTR 15 14 SRAO 12 SRSETIN Figure 3. Series Regulator Voltage Reference The voltage reference circuitry generates two voltage signals, VREF and VMID. VREF comes from a bandgap circuit and is used as the reference voltage for all circuits in the AMIS−492x0 Fieldbus MAU. The typical value for VREF is 1.185 V. See Figure 5. An operational amplifier is regulating VMID to provide a bias (common) level for the AC signals. Its typical voltage is 2 V. A capacitor larger than 0.01 mF is necessary on VMID to remove high-frequency ripple. The supply current must not exceed 20 mA because no current limiting is applied to the internal transistor. You can increase VO voltage up to 3.5 V by dividing VO with an external network to supply the appropriate voltage to pin SRSETIN. In this case, pin SRSET must be kept open. The drain-source voltage of the internal transistor must be larger or equal to 2 V. If this condition is not satisfied, you may need an external P-channel JFET to create the desired low voltage-drop regulator. The output voltage is determined by the following equation: www.onsemi.com 9 AMIS−492x0 Voltage Reference VMID Reference VCC R 0.688 R 237 kW 163.1 kW VREFBG VCC Bandgap 2 39 VREF Vmid − A5 Vref = 1.185 V (Typ) Tol. = ±2% VREFBG 3 + VSS Vmid Bandgap should have its own ground trace or star connection to system ground. Figure 5. Bandgap and VMID Voltage Reference Transmit Block assumed to be active high (positive logic). Likewise, if POL is connected to VDD, TxE is assumed to be active low (negative logic). See Table 1 on page 2, Table 11, and Figure 6 to see how MDS_CTRL Pin 26 can be used to control MDS interface operation. Table 11 shows the resulting VDRV output for the various combinations of interface signals. The transmit block contains four sub-blocks: 1. MDS-interface – decodes input signals to generate internal control signals. 2. Tri-level Modulator – generates current signals used as inputs to the slew-rate controller. 3. Slew Rate Controller – converts current to three distinct VDRV voltage levels (VS, VH, VL). 4. Current Drive Amplifier – op amp designed to drive current drivers for 31.25 kbps voltage-mode medium. Table 11. MDS-INTERFACE LOGIC POL TxS VDRV Low Low MDS-interface The MDS-interface decodes input signals to generate internal control signals. The POL pin is used to select the polarity of TxE (transmit enable). The TxE and TxS (transmit signal) are the MDS−MAU interface signals. TxS represents the manchester encoded output of the Link Layer controller, and is the input signal of the AMIS−492x0. These three signals are CMOS logic signals powered by the VDD supply voltage. When POL is connected to GND, TxE is 26 TxE Low High Low High MDS Interface Low VH High VL Low VH High VL Low High MDS_CTRL VS High VS High Inverters powered by VMID to ensure VDRV goes to Vs = 2.5 V if VDD = 0 (i.e. start-up) VCC 37 TXS VMID VDD 38 VMID − + VDD − Level + Shift 2p5V_N CMPOUT POL VDD 36 TXE Tx_enbl Figure 6. MDS Interface www.onsemi.com 10 Out N_Vs VCCL 2p1V VMID VDD VCCL − Level + Shift Out N_VL AMIS−492x0 Tri-level Modulator The tri-level modulator switches current signals into a summing node. The slew rate controller converts the current to a voltage signal, VDRV. The DC level of silence (VS) is nominally 2.5 V. Transmission high (VH) is nominally 2.9 V and transmission low (VL) is nominally 2.1 V, yielding an amplitude of 0.8 V. Tri-level Modulator & Slew Control N_VL N_Vs Active Low Active Low 4R 4R R 80 kW 80 kW 20 kW VCC − VDRV A3 20R 400 kW + VMID 1.2 kW 21 1.2 kW CRT 19 1.2 kW Figure 7. Tri-level Modulator Slew Rate Controller Amplifier (A3), shown in the above figure, controls the slew rate. The amplifier converts the current signals from the tri-level modulator to a voltage signal, VDRV. It controls its slew rate with a capacitor (CRT) connected to the CRT pin. The waveform at the VDRV pin is symmetric and the fall/rise times are determined by the following equation: t F, t R + 2.0[ms] ) 0.12[msńpF] C RT Vmid VDRV R2 VCC CCOUT + A4 24 25 − CCINM R3 R11 Bus (eq. 3) Rf Figure 8. Current Control Circuit Receive Block Current Drive Amplifier The drive amplifier is an operational amplifier optimized to drive current drivers for 31.25 kbps voltage-mode medium. Its input and output signals are exposed to allow flexible design of the external driver. Note that this amplifier cannot directly sink the necessary current from the medium. In the following drive circuit the current (IBUS) through the current-detect resister (RF) is determined by the following equation. ƪR 3V mid ǒR12 ) R11Ǔƫ * ƪV DRV ǒR2R 11 ) R3R 11Ǔƫ * ƪR F ǒR 2R 12 ) R 3R 12Ǔƫ CCINP 23 The constant part comes from the internal capacitor (not shown). It is recommended to make a guard pattern on your circuit board around the CRT pin and the hot side of CRT to avoid unnecessary interference. I bus + R12 The receive block contains three sub-blocks, which are internally connected: 1. A Band Pass Filter – to filter the desired incoming communication signal. 2. Carrier Detector – generates the RxA signal by detecting the signal amplitude. 3. Zero-cross Detector generates the RxS signal by detecting the high/low transitions of the Manchester code. Band Pass Filter The band pass filter is a series connection of a high-pass and a low-pass filters each having two poles. Each filter is comprised of a voltage follower and on chip resisters, so only four external capacitors are necessary. The following figure shows an internal circuit and the connection of external capacitors. Cut-off frequency, fL, of the high-pass (eq. 4) A diode and/or a resistor connected to the emitter are necessary to shift the DC level of CCOUT and to suppress the loop gain. The resistance value depends on your design (overall gain and emitter current). www.onsemi.com 11 AMIS−492x0 filter is determined by C1 and C2 while cut-off frequency, fH, of the low-pass filter is determined by C3 and C4. fL + 1 2p 1 QL + 2 Ǹ Ǹ 1 R F2 C 1 R F1 1 2p fH + C2 Ǹ Q L + 0.44 (eq. 5) R F2 + 0.95 R F1 Ǹ C4 (eq. 6) C3 + 0.95 C4 The possible ranges of fL and fH are 1 kHz ~ 10 kHz and 10 kHz ~ 100 kHz, respectively. The values in the following figure are recommended to obtain 1 kHz and 47.6 kHz cut-off frequencies. C3 = 220 pF FLTOUT 31 1 R F4 C 3 R F3 30 FLT HPF RF1 To Detectors 28 75 kW VCC VCC − RF4 A2 RF3 + − SIGIN + 27 A1 54 kW 20 kW Signal Input C2 1000 pF RF2 270 kW C1 1000 pF Vmid 29 C4 = 47 pF Figure 9. Band Pass Filter between high and low levels of the incoming Manchester code. Hysteresis of +40 mV (TYP) is applied to avoid unnecessary switching by noise. Once the carrier-detect goes active the hysteresis is removed and the switching point threshold is set to Vmid. The output can drive a CMOS input of VDD supply voltage. RxS represents the received output of the AMIS−492x0, and is the input signal for the Link Layer controller, which will decode the manchester encoded signal. Receive Signal Detection The carrier detector generates the receive activity (RxA) signal by detecting the input signal amplitude. Minimum amplitude is 100 mVp-p (TYP). A delay, determined by the capacitor connected between the CCD pin and GND, is added to avoid detection of transient noise. The recommended value of CCD is 120 pF. The output can drive a CMOS input of VDD supply voltage. The zero-cross detector generates the receive signal (RxS) with minimum phase error (jitter) by detecting the transition Zero-cross Detector RXS 35 VDD Level Convert VCC + C1 − ZC Tript Pt Carrier Detector VDD 34 CCD RxSig VCC VCC RXA + C2 Level Convert − CD_Output Vmid Vtrip = Vmid Vhyst = +40 mV VCC + 32 R (1 MW) C (60 pF) VHi50 VHi50 = Vmid + 50 mV Vlo50 = Vmid − 50 mV VLo50 C2 − Figure 10. Receive Signal Detectors www.onsemi.com 12 Filtered received signal from Bandpass Filter AMIS−492x0 AMIS−49200 AS REPLACEMENT FOR YOKOGAWA mSAA22Q Table 1 for a detailed description of the interaction between MDS_CTRL and POL. In Table 12, the mSAA22Q recommends that the JAB/ signal (Pin 39) be connected to ground if the signal is not used. On AMIS−492x0, Pin 39 must be connected to ground. The AMIS−49200 is a near pin-for-pin compatible replacement for the Yokogawa mSAA22Q Fieldbus MAU. There are some differences between the two chips both in the internal operation, the required external connections and the value (or existence) of some of the external components. These differences are small and those who used the mSAA22Q would most likely be able to use the AMIS−49200 in designs with only some component value changes. Low Power Mode The low power mode on the mSAA22Q allows the user to have a quiescent current draw of less than 10 mA yet still communicate at the proper IEC 61158−2 signal levels. Very few, if any, Fieldbus devices are capable of operating at such a low current level so this capability was not included in the AMIS−492x0. The pins affected by this are 41, 42 and 43. If the low power mode is not being used on the mSAA22Q, these three pins are grounded. On the AMIS−492x0 it is required that these pins be grounded. Functional Differences between the mSAA22Q and the AMIS−492x0 Jabber Inhibit The AMIS−492x0 does not implement the Jabber Inhibit function in the mSAA22Q. Typically the AMIS−492x0 will be connected with a link controller chip such as the UFC100−F1 from Aniotek/Softing. This link controller has a Jabber Inhibit function so the absence of this function in the AMIS−492x0 should not be a problem. As can be seen in Table 12, MDS_CTRL is only connected to ground if POL is connected to VDD. See Pin Differences between the mSAA22Q and the AMIS−492x0 Pin differences are shown in Table 12. Table 12. PIN CONNECTION DIFFERENCES BETWEEN THE mSAA22Q AND THE AMIS−492x0 mSAA22Q AMIS−492x0 Pin No. Signal Name Recommended Connection Signal Name Required Connection 1 NC Ground VSS Ground 11 NC Ground VSS Ground 22 NC Ground VSS Ground 26 NC Ground MDS_CTRL Ground* 33 NC Ground VSS Ground 39 JAB/ Ground if Not Used VSS Ground 41 CJB 1 mF cap VSS Ground 42 VTX Ground VSS Ground 43 VSL Ground VSS Ground *MDS_CTRL is only connected to ground if POL is connected to VDD. See Table 1 for a detailed description of the interaction between MDS_CTRL and POL. External Circuitry Table 13. PASSIVE EXTERNAL COMPONENT VALUE DIFFERENCES BETWEEN THE mSAA22Q AND THE AMIS−492x0 Figure 11 shows the external circuitry required to connect the AMIS−492x0 to an IEC 61158−2 conformant network. This schematic is the circuit that was used to pass the FOUNDATION Fieldbus Physical Layer Conformance test as specified in FOUNDATION Fieldbus specification FF830, Rev 1.5. This circuit is similar but not identical to the circuit recommended by Yokogawa for the mSAA22Q. Table 13 lists the four external component values that need to be changed with using the AMIS−492x0 in a circuit that previously used the mSAA22Q. Component mSAA22Q Value AMIS−492x0 Value C1 100 pF 150 pF C3 100 pF 47 pF C4 470 pF 220 pF C8 10 nF 1 mF www.onsemi.com 13 www.onsemi.com 14 Receive Data (26) MDS_CTRL (35) RXS (34) RXA (37) TXS (36) TXE (5) PFAIL2/ System Reset Transmit Data (2) INTREF N/C SRSET (13) SRSETIN (12) (1) MOUT (43) MS2 (16) VO AMIS−492x0 SHSETIN (6) (41) MS0 Series Voltage Regulator Out SHSET (7) (4) PFAIL1/ (38) POL (17) VDO SRTR (15) Figure 11. AMIS−492x0 Reference Circuit Implementation SRAO (14) C1 C2 150 pF 22 pF (32) CCD (42) MS1 (10 11 20 22 33 39 40) VSS C4 220 pF FLTOUT (31) (19) CRT Digital Vdd (9) SGND CCIN− (24) VMID (3) HPF (28) SIGIN (27) C3 47 pF VCC (44) VCC (18) SHUNT (8) CCOUT (25) CCIN+ (23) VDRV (21) FLT (30) (29) LPF C9 1 mF R3 49.9 kW R2 249 kW R1 51.1 kW C6 1 nF C11 47 pF Q2 Q1 C10 22 mF R6 1 kW V Shunt R5 100 kW C9 330 pF C7 R4 3.3 nF 5.11 kW D3 5.1 V R11 49.9 kW D1 D2 BAV99 BZX84C5V1 MMBT3904LT1 MMBT2907ALT1 R12 249 kW C5 1 nF D1, D2: D3: Q1, Q4: Q2, Q3: − R8 510 W Q3 R10 10 W R9 2 kW Q4 R7 8.2 W + AMIS−492x0 H1 Segment AMIS−492x0 Active Components C1 connects to signal CCD (Pin 32) and controls the carrier detect assert and drop-out timing. Particular implementations may require that the value of C1 be changed to accommodate received signal level changes introduced by the addition of intrinsic safety components added to the external circuitry. C3 and C4 are part of the receive filter and determine the band pass characteristics of the receive filter. It is unlikely that these would need to be changed. C8 is a noise filter for VMID. It is important that VMID have as little noise as possible as it is used as a reference for many sub-circuits in the AMIS−492x0. C8 must be a large capacitor with maximum of 100 nF. C8 recommended value is 1 mF. There is one other minor difference in the recommended external circuitry between the mSAA22Q and the AMIS−492x0. Figure 12 shows the start-up circuits recommended for the mSAA22Q and the AMIS−492x0. The circuit shown for the AMIS−492x0 is different from that shown for the mSAA22Q but either one will work. Both are current sources that turn on when power is applied to the H1 segment terminals so that the AMIS−492x0 can turn on without any turn-on transients on the network. mSAA22Q Start-up Circuit Transistors Q1–Q4 are ordinary small signal transistors. Diodes D1 and D2 are similarly ordinary small signal diodes. Users desiring to replace a mSAA22Q with the AMIS−49200 in an existing design should be able to use whatever transistors and diodes were used with the mSAA22Q. For new designs, the specified transistors can be used or other devices may be chosen. Alternative Designs Some users of the Yokogawa mSAA22Q did not use the exact recommended external circuit for the media interface circuit (see Figure 11). Using the AMIS−492x0 without the Yokogawa recommended external circuit may result in some compatibility problems. There are many alternative designs and it is beyond the scope of this document to identify all possible configurations and their associated design implications. Please refer to the AMIS−492x0 Fieldbus MAU Reference Design Application Note for a recommended, FOUNDATION Fieldbus certifiable board design. Verification All designs using the AMIS−492x0 should re-run the entire physical layer conformance test as defined in FOUNDATION Fieldbus document FF−830, FOUNDATION® Specification 31.25 kbit/s Physical Layer Conformance Test. Board layout can alter the behavior of all circuit implementations, even designs that follow the recommended implementation. AMIS−49200 Start-up Circuit Loop + Loop + R5 100 kW R6 1 kW Q1 V Shunt V Shunt D3 5.1 V Figure 12. Recommended Start-up Circuits Table 14. ORDERING INFORMATION Part Number Package Temperature Range Shipping† AMIS−49200−XTD 44 LQFP 10 × 10 mm (Pb−Free/RoHS Compliant) −40°C to 85°C 160 / Tray AMIS−49200−XTP 44 LQFP 10 × 10 mm (Pb−Free/RoHS Compliant) −40°C to 85°C 1,500 / Tape & Reel AMIS−49250−XTD 44 NQFP 7 × 7 mm (Pb−Free/RoHS Compliant) −40°C to 85°C 160 / Tray AMIS−49250−XTP 44 NQFP 7 × 7 mm (Pb−Free/RoHS Compliant) −40°C to 85°C 1,500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. www.onsemi.com 15 AMIS−492x0 APPENDIX − MANCHESTER ENCODING bit time is 32 msec, with the transition occurring at 16 msec. The Manchester encoding rules have been extended to include two additional symbols, non-data plus (N+) and non-data minus (N−). The symbol encoding rules are shown in Figure 13. All Fieldbus devices transmit the data onto the media as a Manchester-encoded baseband signal. With Manchester encoding, zeros and ones are represented by transitions that occur in the middle of the bit period (see below). For FOUNDATION Fieldbus H1 and Profibus PA, the nominal 32 usec −T 2 −T 2 T 2 Logical ”0” −T 2 T 2 Logical ”1” −T 2 T 2 ”N+” T 2 ”N−” Figure 13. Manchester Encoding www.onsemi.com 16 AMIS−492x0 PACKAGE DIMENSIONS LQFP−44, 10x10 CASE 561AA ISSUE O R1 RADIUS www.onsemi.com 17 AMIS−492x0 PACKAGE DIMENSIONS NQFP 44, 7x7 CASE 560BD ISSUE A (1/2) www.onsemi.com 18 AMIS−492x0 PACKAGE DIMENSIONS NQFP 44, 7x7 CASE 560BD ISSUE A (2/2) www.onsemi.com 19 AMIS−492x0 REFERENCES [1] Fieldbus Medium Attachment Unit (MAU) Chip, mSAA22Q, Yokogawa Electric Corporation, June 12, 1998, Document No.: SS−96−01 (Rev.3). [3] Profibus PA specifications EN 50170 (formerly DIN 19245) covers all of Profibus and includes PA (31.25 kbps Intrinsically Safe Physical Layer), references IEC 61158−2. [2] Fieldbus Standard for Use in Industrial Control Systems Part 2: Physical Layer Specification and Service Definition, Amendment to Clause 22 ISA/SP50 – 1996−544B, dS50.02, Part 2, Draft Standard. FOUNDATION is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 20 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative AMIS−492x0/D