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ARRAYX-BOB3-16S-GEVK

ARRAYX-BOB3-16S-GEVK

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    C-ARRAY 3MM 4X4 SUM BOB

  • 数据手册
  • 价格&库存
ARRAYX-BOB3-16S-GEVK 数据手册
        ARRAYX-BOB3-16S-GEVK: C-Array 3mm 4x4 Sum BOB The ArrayX-BOB3-16S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a SensL ArrayC-30035-16P, 3mm 4x4 SiPM array, in addition to all of the individual fast output signals. The Summed Breakout Board has a centrally located Hirose 40-way connector DF17(2.0)-40DS-0.5V(57). This connector mates with the Hirose DF17(2.0)-40DP-0.5V(57) board-to-board connector on the ArrayC-30035-16P. See Figure 7 in the previous section for information on orientating the array on the BOB. A schematic of the board is shown in Figure 8 below. Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. These pins are formed by two 20-way (10x2 row) 2.54mm pitch headers; J2 and J3. Each of the headers also has 2 pins that connect to the common cathode (CM) and 2 pins left unconnected (NC) to allow prototyping for evaluation purposes. Two SMA connectors and Balun transformers are provided with 4-pin headers to allow any fast signal to be connected directly to the SMA or via the transformer using jumper wires. Evaluation/Development Tool Information Product Status Compliance Short Description Parts Used ARRAYX-BOB3-16S-GEVK Active ARRAYC-30035-16P-PCB C-Array 3mm 4x4 Sum BOB Action Contact Local Sales Office                               https://www.onsemi.com/PowerSolutions/evalBoard.do?id=ARRAYX‐BOB3‐16S‐GEVK 11‐16‐18   
ARRAYX-BOB3-16S-GEVK 价格&库存

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