CM1450-08CS

LCD and Camera EMI Filter Array with ESD Protection CM1450 Features • • • • • • • • • High bandwidth, high RF rejection filter array Six and eight channels of EMI filtering Utilizes Praetorian® inductor-based design technology for true L-C filter implementation OptiGuard™ coating for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Maintains signal integrity for signals that have a risetime and falltime as fast as 2ns Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 3.006mm x 1.376mm footprint Chip Scale Package (CM1450-06CS/CP) 20-bump, 4.006mm x 1.376mm footprint Chip Scale Package (CM1450-08CS/CP) RoHS-compliant, lead-free finishing Product Description The CM1450 comprises a family of inductor-capacitor (L-C) based EMI filter arrays with integrated ESD protection in a CSP form factor. The CM1450-06 and CM1450-08 are configured in 6 and 8 channel formats respectively. Each EMI filter channel of the CM1450 is implemented as a 5-pole L-C filter where the component values are 14pF-17nH-14pF-17nF14pF. The CM1450's roll-off frequency at -10dB attenuation is 400MHz and can be used in applications where the data rates are as high as 160Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±15kV, exceeding the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1450 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets while maintaining the integrity of signals that have rise/fall times as fast as 2ns. The CM1450 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1450 is available in a space-saving, low-profile Chip Scale Package with lead-free finishing. • • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computers Wireless handsets / cell phones Handheld PCs/PDAs LCD and camera modules ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1450/D CM1450 Rev. 2 | Page 2 of 16 | www.onsemi.com CM1450 PIN DESCRIPTIONS CM1450-06 PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 CM1450-08 PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Device Ground CM1450-06 PIN(s) C1 C2 C3 C4 C5 C6 CM1450-08 PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 15 20 Package CSP CSP Ordering Part Number1 CM1450-06CS CM1450-08CS Lead-free Finish2 Ordering Part Number1 CM1450-06CP CM1450-08CP Part Marking N506 N508 Part Marking N506 N508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 16 | www.onsemi.com CM1450 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range Current per Inductor DC Package Power Rating RATING -65 to +150 30 500 UNITS °C mA mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev. 2 | Page 4 of 16 | www.onsemi.com CM1450 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL LTOT L1, L2 RDC IN-OUT CTOT C1, C2, C3 PARAMETER Total Channel Inductance (L1 + L2) Inductance DC Channel Resistance Total Channel Capacitance (C1+ C2 + C3 ) Capacitance Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Roll-off Frequency at -10dB Attenuation ZSOURCE=50Ω, ZLOAD=50Ω Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative IDIODE=10μA VDIODE=+3.3V ILOAD = 10mA 5.6 -1.5 Note 2 ±30 ±15 kV kV 6.8 -0.8 9.0 -0.4 V V At 2.5V DC, 1MHz, 30mV AC, Note 3 At 2.5V DC, 1MHz, 30mV AC, Note 3 33.6 11.2 CONDITIONS MIN TYP 34 17 18 42 14 50.4 16.8 MAX UNITS nH nH Ω pF pF f f C 137 MHz RO 400 6.0 0.1 1.0 MHz V μA VDIODE ILEAK VSIG VESD RDYN 2.30 0.90 Ω Ω Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 5 of 16 | www.onsemi.com CM1450 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 2 | Page 6 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 2 | Page 7 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) Rev. 2 | Page 8 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4) Rev. 2 | Page 9 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) [pF] D.C.V ltage o Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Transient Response Characteristics Figure 10. Simulated Transient Response (input signal risetime and falltime= 2ns, clocked at 25, 50 and 75 MHz, 15Ω Source Resistance, 5pF Load) Rev. 2 | Page 10 of 16 | www.onsemi.com CM1450 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 11 of 16 | www.onsemi.com CM1450 Mechanical Details CM1450-06 CSP Mechanical Specifications The CM1450-06CS/CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 15 Inches 2.961 3.006 3.051 0.1166 0.1183 0.1201 1.331 1.376 1.421 0.0524 0.0542 0.0559 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.203 0.253 0.303 0.0080 0.0100 0.0119 0.203 0.253 0.303 0.0080 0.0100 0.0119 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1450-06CS/CP Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 2 | Page 12 of 16 | www.onsemi.com CM1450 CSP Tape and Reel Specifications PART NUMBER CM1450-06 CHIP SIZE (mm) 3.006 X 1.376 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 14. Tape and Reel Mechanical Data Rev. 2 | Page 13 of 16 | www.onsemi.com CM1450 Mechanical Details (cont’d) CM1450-08 Mechanical Specifications The package dimensions for the CM1450-08CS/CP are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 20 Inches 3.961 4.006 4.051 0.1559 0.1577 0.1595 1.331 1.376 1.421 0.0524 0.0542 0.0559 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.203 0.253 0.303 0.0080 0.0100 0.0119 0.203 0.253 0.303 0.0080 0.0100 0.0119 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1450-08CS/CP Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 2 | Page 14 of 16 | www.onsemi.com CM1450 CSP Tape and Reel Specifications TAPE WIDTH W 12mm PART NUMBER CM1450-08 CHIP SIZE (mm) 4.006 X 1.376 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 4.11 X 1.57 X 0.76 REEL DIAMETER 330mm (13") QTY PER REEL 3500 P0 4mm P1 4mm Figure 15. Tape and Reel Mechanical Data Rev. 2 | Page 15 of 16 | www.onsemi.com CM1450 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 2 | Page 16 of 16 | www.onsemi.com