CM6305

CM6305 EMI Filter with ESD Protection for SIM Card Applications Product Description http://onsemi.com The CM6305 is a 3 x 3, 8−bump EMI filter with ESD protection device for SIM card applications in a 0.4 mm pitch CSP form factor. It is fully compliant with IEC 61000−4−2. The CM6305 is also RoHS II compliant. ELECTRICAL SCHEMATIC WLCSP8 CASE 567CE R1 R2 R3 O1 (A3) O2 (B3) O3 (C3) I1 (A2) I2 (B1) I3 (C1) MARKING DIAGRAM External Internal V (C2) {External} 65 YWW 65 YWW GND (B2) PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking ORDERING INFORMATION Bottom View (Bumps Up View) Device CM6305 1 A B 2 3 + 65 C = CM6305 = Date Code 1 3 2 A A3 A2 B B3 B2 B1 C C3 C2 C1 Package Shipping† WLCSP−8 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. A1 A1 Corner Indicator Table 1. PIN DESCRIPTIONS Pin Description Pin Description A2 Channel 1 External A3 Channel 1 Internal B1 Channel 2 External B3 Channel 2 Internal C1 Channel 3 External C3 Channel 3 Internal B2 GND C2 V External © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 2 1 Publication Order Number: CM6305/D CM6305 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Units Storage Temperature Range –55 to +150 °C Operating Temperature Range –40 to +85 °C 60 mW Power Dissipation at 70°C per Channel Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units R1 Resistance 80 100 120 W R2 Resistance 37.6 47 56.4 W R3 Resistance 80 100 120 W 10 100 nA ILEAK C VB VESD Leakage Current per Channel VIN = 3.0 V Capacitance on Filter Channels 1, 2 and 3 At 1 MHz, VIN = 0 V 8 10 12 pF Capacitance on Clamp Channel (pin C2) At 1 MHz, VIN = 0 V 8 10 12 pF Breakdown Voltage (Positive) IR = 1 mA 6 7 9 V ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at C2 pin a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) kV ±8 ±15 kV ±15 ±15 kV ±2 ±2 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. Table 4. CSP TAPE AND REEL SPECIFICATIONS † Part Number Chip Size (mm) Pocket Size (mm) B0 X A0 X K0 Tape Width W Reel Dia. Qty Per Reel P0 P1 CM6305 1.16 X 1.16 X 0.60 1.27 X 1.27 X 0.69 8 mm 178 mm (7″) 5000 4 mm 4 mm †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 2 CM6305 RF CHARACTERISTICS Figure 1. Insertion Loss, Filter 1 (pins A2, A3) and Filter 3 (pins C1, C3) (Bias = 0 V, TA = 255C) Figure 2. Insertion Loss, Filter 2 (pins B1, B3) (Bias = 0 V, TA = 255C) http://onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.16x1.16 CASE 567CE−01 ISSUE O SCALE 4:1 D PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C DATE 27 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. A B ÈÈ ÈÈ E DIM A A1 A2 b D E e TOP VIEW A2 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 8X A1 0.03 C e C A 0.40 PITCH 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS 1 2 3 BOTTOM VIEW DESCRIPTION: PACKAGE OUTLINE 8X B DOCUMENT NUMBER: A1 SEATING PLANE e b 0.05 C A B C SIDE VIEW MILLIMETERS MIN MAX 0.63 0.57 0.17 0.24 0.41 REF 0.24 0.29 1.16 BSC 1.16 BSC 0.40 BSC 98AON50308E WLCSP8, 1.16X1.16 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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