CS8126
5.0 V, 750 mA Low
Dropout Linear Regulator
with Delayed RESET
The CS8126 is a low dropout, high current 5.0 V linear regulator. It
is an improved replacement for the CS8156. Improvements include
higher accuracy, tighter saturation control, better supply rejection, and
enhanced RESET circuitry. Familiar PNP regulator features such as
reverse battery protection, overvoltage shutdown, thermal shutdown,
and current limit make the CS8126 suitable for use in automotive and
battery operated equipment. Additional on−chip filtering has been
included to enhance rejection of high frequency transients on all
external leads.
An active microprocessor RESET function is included on−chip with
externally programmable delay time. During power−up, or after
detection of any error in the regulated output, the RESET lead will
remain in the low state for the duration of the delay. Types of errors
include short circuit, low input voltage, overvoltage shutdown,
thermal shutdown, or others that cause the output to become
unregulated. This function is independent of the input voltage and will
function correctly with an output voltage as low as 1.0 V. Hysteresis is
included in both the reset and Delay comparators for enhanced noise
immunity. A latching discharge circuit is used to discharge the Delay
capacitor, even when triggered by a relatively short fault condition.
This circuit improves upon the commonly used SCR structure by
providing full capacitor discharge (0.2 V type).
Note: The CS8126 is lead compatible with the LM2927 and
LM2926.
Features
•
•
•
•
•
•
Low Dropout Voltage (0.6 V at 0.5 A)
3.0% Output Accuracy
Active RESET
External RESET Delay for Reset
Protection Circuitry
− Reverse Battery Protection
− +60 V, −50 V Peak Transient Voltage
− Short Circuit Protection
− Internal Thermal Overload Protection
These are Pb−Free Devices
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 18
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MARKING
DIAGRAM
1
D2PAK−7
DPS SUFFIX
CASE 936AB
CS
8126
AWLYWWG
7
Pin 1. VIN
2. VOUT
3. VOUT(SENSE)
4. GND
5. Delay
6. RESET
7. NC
A
W
Y
WW
G
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Device
ORDERING INFORMATION
Device
Package
Shipping†
CS8126−1YDPS7G
D2PAK−7
(Pb−Free)
50 Units / Rail
CS8126−1YDPSR7G D2PAK−7
(Pb−Free)
750/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
1
Publication Order Number:
CS8126/D
CS8126
VIN
Over Voltage
Shutdown
VOUT
Regulated Supply
for Circuit Bias
Pre−Regulator
Bandgap
Reference
−
Error
Amp
Anti−Saturation
and
Current Limit
+
VOUT(SENSE)
Charge
Current
Generator
Thermal
Shutdown
Delay
Latching
Discharge
Q
S
R
−
−
+
Reset
Comparator
+
VDischarge
+
−
GND
Figure 1. Block Diagram
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2
Delay
Comparator
RESET
CS8126
MAXIMUM RATINGS*
Rating
Value
Unit
Internally Limited
−
−50, 60
V
Internally Limited
−
4.0
kV
Package Thermal Resistance:
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
2.1
10−50**
°C/W
°C/W
Junction Temperature Range
−40 to +150
°C
Storage Temperature Range
−55 to +150
°C
260 peak
230 peak
°C
°C
Power Dissipation
Peak Transient Voltage (46 V Load Dump)
Output Current
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1)
Reflow (SMD styles only) (Note 2)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
**Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
ELECTRICAL CHARACTERISTICS (TA = −40°C to +125°C, TJ = −40°C to +150°C, VIN = 6.0 to 26 V,
IO = 5.0 to 500 mA, RRESET = 4.7 kW to VCC , unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
−
4.85
5.00
5.15
V
Output Stage (VOUT)
Output Voltage
Dropout Voltage
IOUT1 = 500 mA
−
0.35
0.60
V
Supply Current
IOUT ≤ 10 mA
IOUT ≤ 100 mA
IOUT ≤ 500 mA
−
−
−
2.0
6.0
55
7.0
12
100
mA
mA
mA
Line Regulation
VIN = 6.0 to 26 V, IOUT = 50 mA
−
5.0
50
mV
Load Regulation
IOUT = 50 to 500 mA, VIN = 14 V
−
10
50
mV
Ripple Rejection
f = 120 Hz, VIN = 7.0 to 17 V, IOUT = 250 mA
54
75
−
dB
Current Limit
−
0.75
1.20
−
A
Overvoltage Shutdown
−
32
−
40
V
−
95
−
V
−15
−30
−
V
−
−80
−
V
150
180
210
°C
Maximum Line Transient
VOUT ≤ 5.5 V
Reverse Polarity Input Voltage DC
VOUT ≥ −0.6 V, 10 W Load
Reverse Polarity Input Voltage Transient
1.0% Duty Cycle, T < 100 ms, 10 W Load
Thermal Shutdown
Note 3
3. Guaranteed By Design
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3
CS8126
ELECTRICAL CHARACTERISTICS (continued) (TA = −40°C to +125°C, TJ = −40°C to +150°C, VIN = 6.0 to 26 V,
IO = 5.0 to 500 mA, RRESET = 4.7 kW to VCC , unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
RESET and Delay Functions
Delay Charge Current
VDelay = 2.0 V
5.0
10
15
mA
RESET Threshold
VOUT Increasing, VRT(ON)
VOUT Decreasing, VRT(OFF)
4.65
4.50
4.90
4.70
VOUT − 0.01
VOUT − 0.15
V
V
RESET Hysteresis
VRH = VRT(ON) − VRT(OFF)
150
200
250
mV
Delay Threshold
Charge, VDC(HI)
Discharge, VDC(LO)
3.25
2.85
3.50
3.10
3.75
3.35
V
V
200
400
800
mV
Delay Hysteresis
−
RESET Output Voltage Low
1.0 V < VOUT < VRTL, 3.0 kW to VOUT
−
0.1
0.4
V
RESET Output Leakage Current
VOUT > VRT(ON)
−
0
10
mA
Delay Capacitor Discharge Voltage
Discharge Latched “ON”, VOUT > VRT
−
0.2
0.5
V
Delay Time
CDelay = 0.1 mF*. Note 4
16
32
48
ms
* Delay Time +
CDelay
VDelayThreshold Charge
+ CDelay
ICharge
3.2
4. Assumes Ideal Capacitor
PACKAGE LEAD DESCRIPTION
PACKAGE LEAD #
LEAD SYMBOL
FUNCTION
1
VIN
2
VOUT
Regulated 5.0 V output.
4
GND
Ground connection.
5
Delay
Timing capacitor for RESET function.
6
RESET
3
VOUT(SENSE)
7
NC
Unregulated supply voltage to IC.
CMOS/TTL compatible output lead. RESET goes low after detection of any error in the
regulated output or during power up.
Remote sensing of output voltage.
No Connection.
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4
CS8126
TYPICAL PERFORMANCE CHARACTERISTICS
RLOAD = 25 W
55
50
45
ICQ (mA)
ICQ (mA)
35
30
25°C
25
20
15
5.0
0
0
1.0
2.0
3.0
5.0
6.0
7.0
8.0
9.0
10
RLOAD = NO LOAD
0
1.0
2.0
3.0
7.0
8.0
4.5
4.0
3.5
3.5
3.0
125°C
2.5
2.0
−40°C
1.5
10
3.0
2.5
2.0
RLOAD = 10
0.5
25°C
2.0
9.0
RLOAD = 6.67
1.0
1.0
10
RLOAD = NO LOAD
1.5
1.0
0.5
9.0
Room Temp.
4.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
0
10
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
VIN (V)
VIN (V)
Figure 4. VOUT vs. VIN Over Temperature
Figure 5. VOUT vs. VIN Over RLOAD
6.0
VIN 6.0−26 V
80
6.0
5.5
5.0
100
5.0
Figure 3. ICQ vs. VIN Over RLOAD
RLOAD = 25 W
0
4.0
Figure 2. ICQ vs. VIN Over Temperature
4.5
TEMP = −40°C
4.0
40
Load Regulation (mV)
60
TEMP = 25°C
20
TEMP = 40°C
0
−20
−40
TEMP = 125°C
−60
2.0
0
−2.0
TEMP = 25°C
−4.0
VIN = 14 V
−6.0
TEMP = 125°C
−8.0
−10
−80
−100
RLOAD = 25
VIN (V)
VOUT (V)
VOUT (V)
4.0
10
0
5.0
0
RLOAD = 10
50
40
VIN (V)
5.5
Line Regulation (mV)
70
60
30
20
−40°C
10
RLOAD = 6.67
100
90
80
125°C
40
Room Temp.
120
110
−12
0
100
200
300
400
500
600
700
−14
800
0
100
200
300
400
500
600
700
Output Current (mA)
Output Current (mA)
Figure 6. Line Regulation vs. Output
Current Over Temperature
Figure 7. Load Regulation vs. Output
Current Over Temperature
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5
800
CS8126
900
100
800
90
25°C
700
600
Quiescent Current (mA)
Dropout Voltage (mV)
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
125°C
500
400
300
−40°C
200
100
0
0
100
200
300
25°C
VIN = 14 V
70
−40°C
60
50
40
30
20
400
500
600
700
0
800
100
200
300
400
500
600
700
Output Current (mA)
Figure 8. Dropout Voltage vs. Output
Current Over Temperature
Figure 9. Quiescent Current vs. Output
Current Over Temperature
800
103
COUT
C
10mF,
mF,ESR = 1
OUT ==10
&
ESR
0.1=mF,
1 &ESR
0.1 =mF,
0 ESR = 0
70
102
101
50
100
40
ESR (W)
60
COUT = 10 mF, ESR = 1.0 W
30
COUT = 47/68 mF
Stable Region
10−1
COUT = 47 mF
10−2
20
COUT = 10 mF, ESR = 10 W
10
100
0
Output Current (mA)
80
Rejection (dB)
80
10
90
0
125°C
101
102
103
104
105
106
COUT = 68 mF
10−3
107
10−4
108
100
101
102
Freq. (Hz)
Output Current (mA)
Figure 10. Ripple Rejection
Figure 11. Output Capacitor ESR
103
RESET CIRCUIT WAVEFORM
VOUT
VRT(ON)
VRT(OFF)
(1) = No Delay Capacitor
(2) = With Delay Capacitor
(3) = Max:RESET Voltage (1.0 V)
VRH
(1)
RESET
(2)
(3)
VRL
tDelay
Delay
VDC(HI)
VDC(LO)
VDH
VDIS
(2)
Figure 12. RESET Circuit Waveform
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6
CS8126
CIRCUIT DESCRIPTION
voltage is above VRT(ON). Otherwise, the Delay lead sinks
current to ground (used to discharge the delay capacitor).
The discharge current is latched ON when the output voltage
falls below VRT(OFF). The Delay capacitor is fully
discharged anytime the output voltage falls out of
regulation, even for a short period of time. This feature
ensures a controlled RESET pulse is generated following
detection of an error condition. The circuit allows the
RESET output transistor to go to the OFF (open) state only
when the voltage on the Delay lead is higher than VDC(H1).
The Delay time for the RESET function is calculated from
the formula:
The CS8126 RESET function, has hysteresis on both the
Reset and Delay comparators, a latching Delay capacitor
discharge circuit, and operates down to 1.0 V.
The RESET circuit output is an open collector type with
ON and OFF parameters as specified. The RESET output
NPN transistor is controlled by the two circuits described
(see Block Diagram).
Low Voltage Inhibit Circuit
This circuit monitors output voltage, and when the output
voltage falls below VRT(OFF), causes the RESET output
transistor to be in the ON (saturation) state. When the output
voltage rises above VRT(ON), this circuit permits the RESET
output transistor to go into the OFF state if allowed by the
RESET Delay circuit.
Delay time +
CDelay
VDelayThreshold
ICharge
Delay time + CDelay
RESET Delay Circuit
VOUT
VIN
RRST
4.7 kW
CS8126
Delay
0.1 mF
105
If CDelay = 0.1 mF, Delay time (ms) = 32 ms ± 50%: i.e.
16 ms to 48 ms. The tolerance of the capacitor must be taken
into account to calculate the total variation in the delay time.
This circuit provides a programmable (by external
capacitor) delay on the RESET output lead. The Delay lead
provides source current to the external delay capacitor only
when the “Low Voltage Inhibit” circuit indicates that output
C1 *
100 nF
3.2
C2**
10 mF to 100 mF
RESET
Delay
GND
* C1 is required if the regulator is far from the power source filter.
** C2 is required for stability.
Figure 13. Application Diagram
APPLICATION NOTES
Stability Considerations
temperatures (−25°C to −40°C), both the value and ESR of
the capacitor will vary considerably. The capacitor
manufacturers data sheet usually provides this information.
The value for the output capacitor C2 shown in the test and
applications circuit should work for most applications,
however it is not necessarily the optimized solution.
To determine an acceptable value for C2 for a particular
application, start with a tantalum capacitor of the
recommended value and work towards a less expensive
alternative part.
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: start−up
delay, load transient response and loop stability.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. A tantalum or
aluminum electrolytic capacitor is best, since a film or
ceramic capacitor with almost zero ESR, can cause
instability. The aluminum electrolytic capacitor is the least
expensive solution, but, if the circuit operates at low
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7
CS8126
Step 1: Place the completed circuit with a tantalum
capacitor of the recommended value in an environmental
chamber at the lowest specified operating temperature and
monitor the outputs with an oscilloscope. A decade box
connected in series with the capacitor will simulate the
higher ESR of an aluminum capacitor. Leave the decade box
outside the chamber, the small resistance added by the
longer leads is negligible.
Step 2: With the input voltage at its maximum value,
increase the load current slowly from zero to full load while
observing the output for any oscillations. If no oscillations
are observed, the capacitor is large enough to ensure a stable
design under steady state conditions.
Step 3: Increase the ESR of the capacitor from zero using the
decade box and vary the load current until oscillations
appear. Record the values of load current and ESR that cause
the greatest oscillation. This represents the worst case load
conditions for the regulator at low temperature.
Step 4: Maintain the worst case load conditions set in step
3 and vary the input voltage until the oscillations increase.
This point represents the worst case input voltage
conditions.
Step 5: If the capacitor is adequate, repeat steps 3 and 4 with
the next smaller valued capacitor. A smaller capacitor will
usually cost less and occupy less board space. If the output
oscillates within the range of expected operating conditions,
repeat steps 3 and 4 with the next larger standard capacitor
value.
Step 6: Test the load transient response by switching in
various loads at several frequencies to simulate its real
working environment. Vary the ESR to reduce ringing.
Step 7: Raise the temperature to the highest specified
operating temperature. Vary the load current as instructed in
step 5 to test for any oscillations.
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
RQJA +
(2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
IIN
IOUT
VIN
SMART
REGULATOR®
VOUT
Control
Features
IQ
Figure 14. Single Output Regulator With Key
Performance Parameters Labeled
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA.
Once the minimum capacitor value with the maximum
ESR is found, a safety factor should be added to allow for the
tolerance of the capacitor and any variations in regulator
performance. Most good quality aluminum electrolytic
capacitors have a tolerance of ± 20% so the minimum value
found should be increased by at least 50% to allow for this
tolerance plus the variation which will occur at low
temperatures. The ESR of the capacitor should be less than
50% of the maximum allowable ESR found in step 3 above.
RQJA + RQJC ) RQCS ) RQSA
(3)
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
Calculating Power Dissipation in a Single Output
Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 14) is:
PD(max) + NJVIN(max) * VOUT(min)NjIOUT(max) ) VIN(max)IQ
150° C * TA
PD
(1)
SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK−7 (SHORT LEAD)
CASE 936AB−01
ISSUE B
DATE 08 SEP 2009
A
1
SCALE 1:1
E
L1
B
A
0.10
A
E/2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
SEATING
PLANE
M
B A
M
E1
c2
D1
D
7X
H
DETAIL C
e
b
0.13
M
B A
VIEW A−A
c
A
M
B
H
SEATING
PLANE
A1
RECOMMENDED
SOLDERING FOOTPRINT*
L
0.424
INCHES
MIN
MAX
0.170
0.180
0.000
0.010
0.026
0.036
0.017
0.026
0.045
0.055
0.325
0.368
0.270
−−−
0.380
0.420
0.245
−−−
0.050 BSC
0.539
0.579
0.058
0.078
−−−
0.066
0.010 BSC
0°
8°
MILLIMETERS
MIN
MAX
4.32
4.57
0.00
0.25
0.66
0.91
0.43
0.66
1.14
1.40
8.25
9.53
6.86
−−−
9.65
10.67
6.22
−−−
1.27 BSC
13.69
14.71
1.47
1.98
−−−
1.68
0.25 BSC
0°
8°
GENERIC
MARKING DIAGRAM*
M
L3
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L3
M
GAUGE
PLANE
XX
XXXXXXXXX
AWLYWWG
DETAIL C
0.310
0.584
1
XXXXX
A
WL
Y
WW
G
0.136
7X
0.050
PITCH
0.040
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON14119D
D2PAK−7 (SHORT LEAD)
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative