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CS8156YTVA5G

CS8156YTVA5G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO220-5

  • 描述:

    IC REG LDO 12V/5V TO220-5

  • 数据手册
  • 价格&库存
CS8156YTVA5G 数据手册
CS8156 12 V, 5.0 V Low Dropout Dual Regulator with ENABLE The CS8156 is a low dropout 12 V/5.0 V dual output linear regulator. The 12 V ±5.0% output sources 750 mA and the 5.0 V ±2.0% output sources 100 mA. The on board ENABLE function controls the regulator’s two outputs. When the ENABLE lead is low, the regulator is placed in SLEEP mode. Both outputs are disabled and the regulator draws only 200 nA of quiescent current. The regulator is protected against overvoltage conditions. Both outputs are protected against short circuit and thermal runaway conditions. The CS8156 is packaged in a 5 lead TO−220 with copper tab. The copper tab can be connected to a heat sink if necessary. Features http://onsemi.com TO−220 FIVE LEAD T SUFFIX CASE 314D 1 5 TO−220 FIVE LEAD TVA SUFFIX CASE 314K 1 • Two Regulated Outputs − 12 V ±5.0%; 750 mA − 5.0 V ±2.0%; 100 mA • Very Low SLEEP Mode Current Drain 200 nA • Fault Protection − Reverse Battery − +60 V, −50 V Peak Transient Voltage − Short Circuit − Thermal Shutdown • CMOS Compatible ENABLE • Pb−Free Packages are Available 1 TO−220 FIVE LEAD THA SUFFIX CASE 314A 5 PIN CONNECTIONS AND MARKING DIAGRAM CS 8156 AWLYWWG Tab = GND Pin 1. VIN 2. VOUT1 3. GND 4. ENABLE 5. VOUT2 1 CS8156 A WL Y WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 8 1 Publication Order Number: CS8156/D CS8156 VOUT2, 5.0 V VIN Anti−saturation and Current Limit ENABLE − + + − Pre−Regulator VOUT1, 12 V Overvoltage Shutdown Anti−saturation and Current Limit Bandgap Reference + − GND Thermal Shutdown Figure 1. Block Diagram ABSOLUTE MAXIMUM RATINGS* Rating Value Unit −0.5 to 26 60 V V Internally Limited − Operating Temperature Range −40 to +125 °C Junction Temperature Range −40 to +150 °C Storage Temperature Range −65 to +150 °C 260 peak °C Input Voltage: Operating Range Peak Transient Voltage (Note 1) Internal Power Dissipation Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 2) 1. Load Dump = 46 V 2. 10 second maximum. *The maximum package power dissipation must be observed. http://onsemi.com 2 CS8156 ELECTRICAL CHARACTERISTICS for VOUT: (VIN = 14.5 V, IOUT1 = 5.0 mA, IOUT2 = 5.0 mA, −40°C ≤ TJ ≤ +150°C, −40°C ≤ TC ≤ +125°C; unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit Output Voltage, (VOUT1) 13 V ≤ VIN ≤ 16 V, IOUT1 ≤ 750 mA 11.2 12.0 12.8 V Dropout Voltage IOUT1 = 500 mA IOUT1 = 750 mA − 0.4 0.6 0.6 1.0 V V Line Regulation 13 V ≤ VIN ≤ 16 V, 5.0 mA ≤ IOUT1 < 100 mA − 15 80 mV Load Regulation 5.0 mA ≤ IOUT1 ≤ 500 mA − 15 80 mV Quiescent Current IOUT1 ≤ 500 mA, No Load on Standby IOUT1 ≤ 750 mA, No Load on Standby − − 45 100 125 250 mA mA Quiescent Current (Sleep Mode) ENABLE = Low − 0.2 50 µA Ripple Rejection f = 120 Hz, IOUT = 5.0 mA, VIN = 1.5 VPP at 15.5 VDC 42 70 − dB − 0.75 1.20 2.50 A Output Stage (VOUT1) Current Limit Maximum Line Transient VOUT1 ≤ 13 V 60 90 − V Reverse Polarity Input Voltage, DC VOUT1 ≥ −0.6 V, 10 Ω Load −18 −30 − V Reverse Polarity Input Voltage, Transient 1.0% Duty Cycle, t = 100 ms, VOUT ≥ −6.0 V, 10 Ω Load −50 −80 − V Output Noise Voltage 10 Hz − 100 kHz − − 500 µVrms Output Impedance 500 mA DC and 10 mA rms, 100Hz − 0.2 1.0 Ω 28 34 45 V 4.90 5.00 5.10 V Overvoltage Shutdown − Standby Output (VOUT2) Output Voltage, (VOUT2) 9.0 V ≤ VIN ≤ 16 V, 1.0 mA ≤ IOUT2 ≤ 100 mA Dropout Voltage IOUT2 ≤ 100 mA − − 0.60 V Line Regulation 6.0 V ≤ VIN ≤ 26 V, 1.0 mA ≤ IOUT ≤ 100 mA − 5.0 50 mV Load Regulation 1.0 mA ≤ IOUT2 ≤ 100 mA; 9.0 V ≤ VIN ≤ 16 V − 5.0 50 mV Ripple Rejection f = 120 Hz; IOUT = 100 mA, VIN = 1.5 VPP at 14.5 VDC 42 70 − dB − 100 200 − mA Current Limit ENABLE Function (ENABLE) Input ENABLE Threshold VOUT1 Off VOUT1 On − 2.00 1.25 1.25 0.80 − V V Input ENABLE Current VENABLE ≤ VTHRESHOLD −10 0 10 µA PACKAGE PIN DESCRIPTION PACKAGE LEAD # 5 Lead TO−220 LEAD SYMBOL 1 VIN 2 VOUT1 3 GND 4 ENABLE 5 VOUT2 FUNCTION Supply voltage, usually direct from battery. Regulated output 12 V, 750 mA (typ). Ground connection. CMOS compatible input lead; switches outputs on and off. When ENABLE is high VOUT1 and VOUT2 are active. Regulated output 5.0 V, 100 mA (typ). http://onsemi.com 3 CS8156 TYPICAL PERFORMANCE CHARACTERISTICS 2000 1600 Output Voltage (V) Dropout Voltage (mV) 1800 1400 1200 1000 800 600 400 200 0 0 50 100 150 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 −1.0 −2.0 RL = 10 Ω 200 −40 −20 0 20 40 IOUT (mA) Input Voltage (V) Figure 2. Dropout Voltage vs. IOUT2 Figure 3. VOUT1 vs. Input Voltage 12.15 60 5.030 12.10 5.020 5.010 12.00 VOUT2 (V) VOUT1 (V) 12.05 11.95 11.90 5.000 4.990 11.85 4.980 11.80 11.75 0 20 40 60 80 4.970 100 120 140 160 −40 −20 0 20 40 60 80 100 120 140 160 Temp (°C) Temp (°C) Figure 4. VOUT1 vs. Temperature Figure 5. VOUT2 vs. Temperature 100 5.0 80 4.0 IENABLE (mA) IENABLE (µA) −40 −20 60 40 20 3.0 2.0 1.0 0 0 1.0 2.0 3.0 4.0 0 5.0 VENABLE (V) 0 5.0 10 15 20 VENABLE (V) Figure 6. ENABLE Current vs. ENABLE Voltage Figure 7. ENABLE Current vs. ENABLE Voltage http://onsemi.com 4 25 CS8156 TYPICAL PERFORMANCE CHARACTERISTICS (continued) 10 10 0 −10 −20 3.0 2.0 1.0 0 0 10 20 30 40 50 −5.0 −10 3.0 2.0 1.0 0 60 0 20 30 40 50 60 Figure 8. Line Transient Response (VOUT1) Figure 9. Line Transient Response (VOUT2) 150 100 100 50 0 −50 −100 Standby Load Current (mA) 0.8 0.6 0.4 0.2 50 0 −50 −100 −150 0 20 15 10 5.0 0 0 10 20 30 40 50 60 0 10 20 30 40 50 Time (µs) Time (µs) Figure 10. Load Transient Response (VOUT1) Figure 11. Load Transient Response (VOUT2) 20 18 Infinite Heat Sink 16 Quiescent Current (mA) Power Dissipation (W) 10 Time (µs) −150 Load Current (A) 0 150 14 12 10 8.0 10°C/W Heat Sink 6.0 4.0 No Heat Sink 2.0 0 0 IOUT2 = 100 mA 5.0 Time (µs) Standby Output Voltage Deviation (mV) Output Voltage Deviation (mV) Output Voltage Deviation (mV) IOUT1 = 500 mA Input Voltage Chnage (V) Input Voltage Change (V) Output Voltage Deviation (mV) 20 10 20 30 40 50 60 70 80 90 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 60 No Load on 5.0 V 125°C VIN = 14 V 25°C −40°C 0 100 200 300 400 500 600 700 Ambient Temperature (°C) Output Current (mA) Figure 12. Maximum Power Dissipation (TO−220) Figure 13. Quiescent Current vs. Output Current for VOUT2 http://onsemi.com 5 800 CS8156 TYPICAL PERFORMANCE CHARACTERISTICS (continued) 22 2.0 18 16 Line Regulation (mV) Quiescent Current (mA) 3.0 No Load on 5.0 V 20 VIN = 14 V 14 12 10 8.0 −40°C 6.0 4.0 25°C −40°C −1.0 125°C −2.0 −3.0 VIN = 6.0−26 V −4.0 −6.0 0 20 40 60 80 100 120 140 0 80 100 120 140 Figure 15. Line Regulation vs. Output Current for VOUT2 25°C Line Regulation (mV) −4.0 −6.0 −8.0 −10 −12 125°C VIN = 14 V −18 20 40 60 80 100 120 25 20 15 10 5.0 0 −5.0 −10 −15 −20 −25 −30 −35 −40 140 125°C 25°C VIN = 13−26V −40°C 0 100 200 300 400 500 600 700 Output Current (mA) Output Current (mA) Figure 16. Load Regulation vs. Output Current fo VOUT2 Figure 17. Line Regulation vs. Output Current for VOUT1 0 −5.0 Load Regulation (mV) 0 60 Figure 14. Quiescent Current vs. Output Current for VOUT1 −2.0 −16 40 Output Current (mA) −40°C −14 20 Output Current (mA) 0 Load Regulation (mV) 25°C 0 −5.0 125°C 2.0 0 1.0 −40°C −10 25°C −15 −20 125°C −25 −30 VIN = 14 V −35 −40 0 100 200 300 400 500 600 700 Output Current (mA) Figure 18. Load Regulation vs. Output Current for VOUT1 http://onsemi.com 6 800 800 CS8156 DEFINITION OF TERMS Dropout Voltage − The input−output voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at 14 V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage − The DC voltage applied to the input terminals with respect to ground. Input Output Differential − The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will operate. Line Regulation − The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation − The change in output voltage for a change in load current at constant chip temperature. Long Term Stability − Output voltage stability under accelerated life−test conditions after 1000 hours with maximum rated voltage and junction temperature. Output Noise Voltage − The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Quiescent Current − The part of the positive input current that does not contribute to the positive load current, i.e., the regulator ground lead current. Ripple Rejection − The ratio of the peak−to−peak input ripple voltage to the peak−to−peak output ripple voltage. Temperature Stability of VOUT − The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme. 60 V VIN 14 V ENABLE 2.0 V 0.8 V 34 V 26 V 14V 3.0 V 12 V 12 V 12 V 12 V 12 V 2.4 V VOUT1 0V 0V 0V 5.0 V VOUT2 5.0 V 2.4 V 0V Turn On Load Dump Low VIN Line Noise, Etc. VOUT1 Short Circuit VOUT2 Short Circuit VOUT1 Thermal Shutdown Turn Off Figure 19. Typical Circuit Waveform APPLICATION NOTES Stability Considerations recommended value and work towards a less expensive alternative part for each output. Step 1: Place the completed circuit with a tantalum capacitor of the recommended value in an environmental chamber at the lowest specified operating temperature and monitor the outputs with an oscilloscope. A decade box connected in series with the capacitor C2 will simulate the higher ESR of an aluminum capacitor. Leave the decade box outside the chamber, the small resistance added by the longer leads is negligible. Step 2: With the input voltage at its maximum value, increase the load current slowly from zero to full load while observing the output for any oscillations. If no oscillations are observed, the capacitor is large enough to ensure a stable design under steady state conditions. Step 3: Increase the ESR of the capacitor from zero using the decade box and vary the load current until oscillations The output or compensation capacitor helps determine three main characteristics of a linear regulator: start−up delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the cheapest solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturers data sheet usually provides this information. The value for the output capacitors C2 and C3 shown in the test and applications circuit should work for most applications, however it is not necessarily the best solution. To determine acceptable values for C2 and C3 for a particular application, start with a tantalum capacitor of the http://onsemi.com 7 CS8156 appear. Record the values of load current and ESR that cause the greatest oscillation. This represents the worst case load conditions for the regulator at low temperature. Step 4: Maintain the worst case load conditions set in step 3 and vary the input voltage until the oscillations increase. This point represents the worst case input voltage conditions. Step 5: If the capacitor is adequate, repeat steps 3 and 4 with the next smaller valued capacitor. A smaller capacitor will usually cost less and occupy less board space. If the output oscillates within the range of expected operating conditions, repeat steps 3 and 4 with the next larger standard capacitor value. Step 6: Test the load transient response by switching in various loads at several frequencies to simulate its real working environment. Vary the ESR to reduce ringing. Step 7: Raise the temperature to the highest specified operating temperature. Vary the load current as instructed in step 5 to test for any oscillations. Once the minimum capacitor value with the maximum ESR is found for each output, a safety factor should be added to allow for the tolerance of the capacitor and any variations in regulator performance. Most good quality aluminum electrolytic capacitors have a tolerance of ±20% so the minimum value found should be increased by at least 50% to allow for this tolerance plus the variation which will occur at low temperatures. The ESR of the capacitors should be less than 50% of the maximum allowable ESR found in step 3 above. Repeat steps 1 through 7 with C3, the capacitor on the other output. The value of RΘJA can be compared with those in the package section of the data sheet. Those packages with RΘJA’s less than the calculated value in equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. IIN IOUT1 Smart Regulator VIN VOUT1 IOUT2 Control Features VOUT2 IQ Figure 20. Dual Output Regulator With Key Performance Parameters Labeled. Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RΘJA: RQJA + RQJC ) RQCS ) RQSA (3) where: RΘJC = the junction−to−case thermal resistance, RΘCS = the case−to−heatsink thermal resistance, and RΘSA = the heatsink−to−ambient thermal resistance. Calculating Power Dissipation in a Dual Output Linear Regulator The maximum power dissipation for a dual output regulator (Figure 20) is RΘJC appears in the package section of the data sheet. Like RΘJA, it too is a function of package type. RΘCS and RΘSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. PD(max) + NJVIN(max) * VOUT1(min)NjIOUT1(max) ) NJVIN(max) * VOUT2(min)NjIOUT2(max) ) VIN(max)IQ (1) where: VIN(max) is the maximum input voltage, VOUT1(min) is the minimum output voltage from VOUT1, VOUT2(min) is the minimum output voltage from VOUT2, IOUT1(max) is the maximum output current, for the application, IOUT2(max) is the maximum output current, for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). C1* 0.1 µF VIN CS8156 VOUT1 + ENABLE GND VOUT2 + C2** 22 µF C3** 22 µF Once the value of PD(max) is known, the maximum permissible value of RΘJA can be calculated: RQJA + 150°C * TA PD * C1 is required if the regulator is far from power supply filter. ** C2, C3 required for stability. (2) Figure 21. Test & Application Circuit http://onsemi.com 8 CS8156 ORDERING INFORMATION Package Shipping † CS8156YT5 TO−220 FIVE LEAD STRAIGHT 50 Units/Rail CS8156YT5G TO−220 FIVE LEAD STRAIGHT (Pb−Free) 50 Units/Rail CS8156YTVA5 TO−220 FIVE LEAD VERTICAL 50 Units/Rail CS8156YTVA5G TO−220 FIVE LEAD VERTICAL (Pb−Free) 50 Units/Rail CS8156YTHA5 TO−220 FIVE LEAD HORIZONTAL 50 Units/Rail CS8156YTHA5G TO−220 FIVE LEAD HORIZONTAL (Pb−Free) 50 Units/Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 CS8156 PACKAGE DIMENSIONS TO−220 FIVE LEAD T SUFFIX CASE 314D−04 ISSUE E −T− −Q− SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C B E A U L K J H G D DIM A B C D E G H J K L Q U 1234 5 5 PL 0.356 (0.014) M T Q M INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.990 1.045 0.320 0.365 0.140 0.153 0.105 0.117 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.146 26.543 8.128 9.271 3.556 3.886 2.667 2.972 TO−220 FIVE LEAD TVA SUFFIX CASE 314K−01 ISSUE O −T− SEATING PLANE C B −Q− E W A U F L 1 2 3 4 K 5 M D 0.356 (0.014) M J 5 PL T Q M G S R http://onsemi.com 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. DIM A B C D E F G J K L M Q R S U W INCHES MIN MAX 0.560 0.590 0.385 0.415 0.160 0.190 0.027 0.037 0.045 0.055 0.530 0.545 0.067 BSC 0.014 0.022 0.785 0.800 0.321 0.337 0.063 0.078 0.146 0.156 0.271 0.321 0.146 0.196 0.460 0.475 5° MILLIMETERS MIN MAX 14.22 14.99 9.78 10.54 4.06 4.83 0.69 0.94 1.14 1.40 13.46 13.84 1.70 BSC 0.36 0.56 19.94 20.32 8.15 8.56 1.60 1.98 3.71 3.96 6.88 8.15 3.71 4.98 11.68 12.07 5° CS8156 TO−220 FIVE LEAD THA SUFFIX CASE 314A−03 ISSUE E −T− B −P− Q C E OPTIONAL CHAMFER A U F L G 5X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. SEATING PLANE DIM A B C D E F G J K L Q S U K 5X J S D 0.014 (0.356) M T P M INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 PACKAGE THERMAL DATA Parameter TO−220 FIVE LEAD Unit RΘJC Typical 2.0 °C/W RΘJA Typical 50 °C/W ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: orderlit@onsemi.com http://onsemi.com 11 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. CS8156/D
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