EMI7403FCTBG

EMI7403 EMI Filter with ESD Protection for MicroSD Card Applications Product Description http://onsemi.com The EMI7403 is a combination EMI filter with integrated TVS diodes for use on Multimedia Card interfaces. This state−of−the−art device utilizes solid−state, silicon− avalanche technology for superior clamping performance and DC electrical characteristics. The EMI7403 has been optimized for protection of MicroSD interfaces in smart phones and other portable electronics. MARKING DIAGRAM WLCSP15 CASE 567FX Features • Provides ESD Protection to IEC61000−4−2: • • ±15 kV Contact Discharge Protection and Termination for 6 Lines + VCC These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Applications • MicroSD Interfaces • MMC Interfaces • Feature Phones, Smart Phones A1 Corner Indicator 2 3 4 A 4 3 2 = Specific Device Code = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping† EMI7403FCTBG WLCSP15 (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. PACKAGE / PINOUT DIAGRAMS 1 74 Y W G 74 YW G 1 A B 74 YW C D B C D Top View (Bumps Down View) © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 0 Bottom View (Bumps Up View) 1 Publication Order Number: EMI5106/D EMI7403 Figure 1. Electrical Schematic Table 1. PIN DESCRIPTIONS Pin Description Pin Description Pin Description Pin Description A1 data0 Internal B1 clk Internal C1 cmd Internal D1 data3 Internal A2 data1 Internal B2 VCC External D2 data2 Internal A3 SDdata1 External B3 GND C3 GND D3 SDdata2 External A4 SDdata0 External B4 SDclk External C4 SDcmd External D4 SDdata3 External http://onsemi.com 2 EMI7403 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Unit Storage Temperature Range −55 to +150 °C Operating Temperature Range −40 to +85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VRWM Parameter Test Conditions Reverse Working Voltage VBR Breakdown Voltage ILEAK Channel Leakage Current RCH Channel Resistance (R1 to R6) f3dB Cut-off Frequency Min (Note 3) IT = 1 mA; (Note 4) Stop Band Attenuation VESD In-system ESD Withstand Voltage a) Contact discharge per IEC 61000-4-2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000-4-2 standard, Level 1 (Internal Pins) Max 3.3 6.0 VIN = 3.3 V Fatten Typ 0.1 Unit V 9.0 V 0.5 mA 40 W 50 W Source and Load Termination 300 MHz @ 700 MHz @ 900 MHz 20 35 dB (Notes 1 and 2) ±15 kV ±2 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded. 2. These measurements performed with no external capacitor. 3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 4. VBR is measured at pulse test current IT. http://onsemi.com 3 EMI7403 RF CHARACTERISTICS m1 0 INSERTION LOSS (dB) −5 −10 −15 −20 −25 −30 −35 −40 −45 −50 1E+06 1E+07 1E+08 1E+09 1E+10 FREQUENCY (Hz) Figure 2. S21 Attenuation Simulation Interface Data Rate (Mbyte/s) Fundamental Frequency (MHz) EMI7403 Insertion Loss (dB) DDR50/SDR50 50 100 (m1) m1 = 3.27 http://onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 1.56x1.56 CASE 567FX ISSUE O SCALE 4:1 ÈÈ ÈÈ D PIN A1 REFERENCE 2X A B DATE 07 JUN 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E e 0.10 C 2X 0.10 C TOP VIEW A2 0.10 C GENERIC MARKING DIAGRAM* A 0.05 C NOTE 3 15X A1 0.05 C A B 0.03 C C SIDE VIEW e XX Y W G e D XX YW G SEATING PLANE e/2 b MILLIMETERS MIN MAX 0.47 0.53 0.185 0.205 0.305 REF 0.24 0.29 1.56 BSC 1.56 BSC 0.40 BSC e/2 C = Specific Device Code = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. B A 1 2 3 4 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 0.40 PITCH A1 PACKAGE OUTLINE 15X 0.23 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON81359E WLCSP15, 1.56X1.56 Electronic versions are uncontrolled except when accessed directly from the Document Repository. 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