FAN3122CMX

Gate Drivers, High-Speed, Low-Side, Single 9-A FAN3121, FAN3122 Description The FAN3121 and FAN3122 MOSFET drivers are designed to drive N−channel enhancement MOSFETs in low−side switching applications by providing high peak current pulses. The drivers are available with either TTL input thresholds (FAN312xT) or VDD−proportional CMOS input thresholds (FAN312xC). Internal circuitry provides an under−voltage lockout function by holding the output low until the supply voltage is within the operating range. FAN312x drivers incorporate the MillerDrive™ architecture for the final output stage. This bipolar / MOSFET combination provides the highest peak current during the Miller plateau stage of the MOSFET turn−on / turn−off process. The FAN3121 and FAN3122 drivers implement an enable function on pin 3 (EN), previously unused in the industry−standard pin−out. The pin is internally pulled up to VDD for active HIGH logic and can be left open for standard operation. The commercial FAN3121/22 is available in a 3x3 mm 8−lead thermally−enhanced MLP package or an 8−lead SOIC package with the option for an exposed pad. www.onsemi.com WDFN8 3x3, 0.65P CASE 511CD 1 8 SOIC8 CASE 751EB 1 MARKING DIAGRAM 8 XXXXX XXXXX ALYWG G 1 Features • • • • • • • • • • • • • • • XXXXX AYWWG G Industry−Standard Pin−out with Enable Input 4.5−V to 18−V Operating Range 11.4 A Peak Sink at VDD = 12 V 9.7−A Sink / 7.1−A Source at VOUT = 6 V Inverting Configuration (FAN3121) and Non−Inverting Configuration (FAN3122) Internal Resistors Turn Driver Off if No Inputs 23−ns / 19−ns Typical Rise/Fall Times (10 nF Load) 18 ns to 23 ns Typical Propagation Delay Time Choice of TTL or CMOS Input Thresholds MillerDrive Technology Available in Thermally Enhanced 3x3 mm 8−Lead MLP or 8−Lead SOIC Package (Pb−Free Finish) Rated from –40°C to +125°C These are Pb−Free Devices WDFN8 A L Y W G SOIC8 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. ORDERING INFORMATION See detailed ordering and shipping information on page 17 of this data sheet. Applications • • • • • Synchronous Rectifier Circuits High−Efficiency MOSFET Switching Switch−Mode Power Supplies DC−to−DC Converters Motor Control © Semiconductor Components Industries, LLC, 2019 July, 2020 − Rev. 2 1 Publication Order Number: FAN3121/D FAN3121, FAN3122 PIN CONFIGURATIONS VDD 1 8 VDD VDD 1 8 VDD IN 2 7 OUT IN 2 7 OUT EN 3 6 OUT EN 3 6 OUT GND 4 5 GND GND 4 5 GND Figure 1. FAN3121 Pin Configuration Figure 2. FAN3122 Pin Configuration PACKAGE OUTLINES 1 8 7 2 7 3 6 3 6 4 5 4 5 1 8 2 Figure 3. 3x3 mm MLP−8 (Top View) Figure 4. SOIC−8 (Top View) THERMAL CHARACTERISTICS (Note 1) QJL (Note 2) QJT (Note 3) QJA (Note 4) YJB (Note 5) YJT (Note 6) Unit 8−Lead 3x3 mm Molded Leadless Package (MLP) 1.2 64 42 2.8 0.7 °C/W 8−Pin Small Outline Integrated Circuit (SOIC) 38 29 87 41 2.3 °C/W Package 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL (QJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT (QJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top−side heatsink. 4. Theta_JA (QJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51−2, JESD51−5, and JESD51−7, as appropriate. 5. Psi_JB (YJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP−8 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOIC−8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT (YJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. www.onsemi.com 2 FAN3121, FAN3122 PIN DEFINITIONS FAN3121 FAN3122 Name 3 3 EN 4, 5 4, 5 GND 2 2 IN 6, 7 OUT Gate Drive Output. Held LOW unless required input is present and VDD is above the UVLO threshold. OUT Gate Drive Output (inverted from the input). Held LOW unless required input is present and VDD is above the UVLO threshold. VDD Supply Voltage. Provides power to the IC. 6, 7 1, 8 1, 8 Description Enable Input. Pull pin LOW to inhibit driver. EN has logic thresholds for both TTL and CMOS IN thresholds. Ground. Common ground reference for input and output circuits. Input. P1 Thermal Pad (MLP only). Exposed metal on the bottom of the package; it is recommended to connect externally on the PCB the Exposed Pad together with the Ground. NOT suitable for carrying current. VDD 1 8 VDD VDD 1 8 VDD IN 2 7 OUT IN 2 7 OUT EN 3 6 OUT EN 3 6 OUT GND 4 5 GND GND 4 5 GND Figure 5. FAN3121 Pin Assignments (Repeated) Figure 6. FAN3122 Pin Assignments (Repeated) OUTPUT LOGIC FAN3122 FAN3121 EN IN OUT EN IN OUT 0 0 0 0 0 (Note 7) 0 0 1 (Note 7) 0 0 1 0 1 (Note 7) 0 1 1 (Note 7) 0 (Note 7) 0 1 (Note 7) 1 (Note 7) 0 1 (Note 7) 1 1 7. Default input signal if no external connection is made. www.onsemi.com 3 FAN3121, FAN3122 BLOCK DIAGRAM VDD 1 Inverting (FAN3121) 100 kW 8 VDD 7 OUT (FAN3121) OUT (FAN3122) 6 OUT (FAN3121) OUT (FAN3122) 5 GND UVLO VDD_OK IN 2 100k 100 kW Non−Inverting (FAN3122) VDD EN GND 3 100 kW 4 Figure 7. Block Diagram ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VDD VDD to GND −0.3 20.0 V VEN EN to GND GND − 0.3 VDD + 0.3 V VIN IN to GND GND − 0.3 VDD + 0.3 V OUT to GND GND − 0.3 VDD + 0.3 V − +260 °C VOUT Parameter TL Lead Soldering Temperature (10 Seconds) TJ Junction Temperature −55 +150 °C TSTG Storage Temperature −65 +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.5 18.0 V Enable Voltage EN 0 VDD V VIN Input Voltage IN 0 VDD V TA Operating Ambient Temperature −40 +125 °C VDD Supply Voltage Range VEN Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 FAN3121, FAN3122 ELECTRICAL CHARACTERISTICS (VDD = 12 V and TJ = −40°C to +125°C unless otherwise noted. Currents are defined as positive into the device and negative out of the device.) Symbol Parameter Test Condition Min Typ Max Unit 4.5 − 18.0 V TTL − 0.65 0.90 mA CMOS (Note 8) − 0.58 0.85 SUPPLY VDD Operating Range IDD Supply Current, Inputs / EN Not Connected VON Device Turn−On Voltage (UVLO) 3.5 4.0 4.3 V VOFF Device Turn−Off Voltage (UVLO) 3.30 3.75 4.10 V INPUTS (TTL, FAN312XT) (Note 9) VIL_T INx Logic Low Threshold 0.8 1.0 − V VIH_T INx Logic High Threshold − 1.7 2.0 V 0.40 0.70 0.85 V VHYS_T TTL Logic Hysteresis Voltage FAN3121TMX, FAN3122TMX IIN+ Non−Inverting Input Current IN from 0 to VDD −1 − 175 mA IIN− Inverting Input Current IN from 0 to VDD −175 − 1 mA 30 38 − %VDD INPUTS (CMOS, FAN312xC) (Note 9) VIL_C INx Logic Low Threshold VIH_C INx Logic High Threshold − 55 70 %VDD CMOS Logic Hysteresis Voltage 12 17 24 %VDD VHYS_C FAN3121CMX, FAN3122CMX IIN+ Non−Inverting Input Current IN from 0 to VDD −1 − 175 mA IIN− Inverting Input Current IN from 0 to VDD −175 − 1 mA ENABLE (FAN3121, FAN3122) VENL Enable Logic Low Threshold EN from 5 V to 0 V 1.2 1.6 2.0 V VENH Enable Logic High Threshold EN from 0 V to 5 V 1.8 2.2 2.6 V VHYS_T TTL Logic Hysteresis Voltage 0.2 0.6 0.8 V Enable Pull−up Resistance 68 100 134 kW tD1, tD2 Propagation Delay, CMOS EN (Note 10) 8 17 27 ns tD1, tD2 Propagation Delay, TTL EN (Note 10) 14 21 33 ns RPU OUTPUTS OUT Current, Mid−Voltage, Sinking (Note 11) OUT at VDD / 2, CLOAD = 1.0 mF, f = 1 kHz − 9.7 − A ISOURCE OUT Current, Mid−Voltage, Sourcing (Note 11) OUT at VDD / 2, CLOAD = 1.0 mF, f = 1 kHz − 7.1 − A IPK_SINK OUT Current, Peak, Sinking (Note 11) CLOAD = 1.0 mF, f = 1 kHz − 11.4 − A OUT Current, Peak, Sourcing (Note 11) CLOAD = 1.0 mF, f = 1 kHz − 10.6 − A tRISE Output Rise Time (Note 10) CLOAD = 10 nF 18 23 29 ns tFALL Output Fall Time (Note 10) CLOAD = 10 nF 11 19 27 ns tD1, tD2 Output Propagation Delay, CMOS Inputs (Note 10) 0 – 12 VIN, 1 V/ns Slew Rate 9 18 28 ns tD1, tD2 Output Propagation Delay, TTL Inputs (Note 10) 0 – 5 VIN, 1 V/ns Slew Rate 9 23 35 ns 1500 − − mA ISINK IPK_SOURCE IRVS Output Reverse Current Withstand (Note 11) 8. Lower supply current due to inactive TTL circuitry. 9. EN inputs have modified TTL thresholds; refer to the ENABLE section. 10. See Timing Diagrams of Figure 8 and Figure 9. 11. Not tested in production. www.onsemi.com 5 FAN3121, FAN3122 TIMING DIAGRAMS Input or Enable Input V IH or V IL Enable VIH VIL t D1 t D1 t D2 t RISE t D2 t FALL t FALL 90% 90% Output Output 10% 10% Figure 8. Non−Inverting Figure 9. Inverting www.onsemi.com 6 t RISE FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) Figure 10. IDD (Static) vs. Supply Voltage (Note 12) Figure 11. IDD (Static) vs. Supply Voltage (Note 12) Figure 12. IDD (No−Load) vs. Frequency Figure 13. IDD (No−Load) vs. Frequency Figure 14. IDD (10 nF Load) vs. Frequency Figure 15. IDD (10 nF Load) vs. Frequency www.onsemi.com 7 FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) (continued) Figure 16. IDD (Static) vs. Temperature (Note 12) Figure 17. IDD (Static) vs. Temperature (Note 12) Figure 18. Input Thresholds vs. Supply Voltage Figure 19. Input Thresholds vs. Supply Voltage Figure 20. Input Thresholds % vs. Supply Voltage Figure 21. Enable Thresholds vs. Supply Voltage www.onsemi.com 8 FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) (continued) Figure 22. CMOS Input Thresholds vs. Temperature Figure 23. TTL Input Thresholds vs. Temperature Figure 24. TTL Input Thresholds vs. Temperature Figure 25. UVLO Thresholds vs. Temperature IN Fall to OUT Rise IN Rise to OUT Fall Figure 26. UVLO Hysteresis vs. Temperature Figure 27. Propagation Delay vs. Supply Voltage www.onsemi.com 9 FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) (continued) IN Fall to OUT Rise IN Rise to OUT Rise IN Rise to OUT Fall IN Fall to OUT Fall Figure 28. Propagation Delay vs. Supply Voltage Figure 29. Propagation Delay vs. Supply Voltage IN Rise to OUT Rise EN Rise to OUT Rise IN Fall to OUT Fall EN Fall to OUT Fall Figure 30. Propagation Delay vs. Supply Voltage Figure 31. Propagation Delay vs. Supply Voltage IN Rise to OUT Rise IN Rise to OUT Rise IN Fall to OUT Fall IN Fall to OUT Fall Figure 32. Propagation Delays vs. Temperature Figure 33. Propagation Delays vs. Temperature www.onsemi.com 10 FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) (continued) Figure 34. Propagation Delays vs. Temperature Figure 35. Propagation Delays vs. Temperature EN Rise to OUT Rise EN Fall to OUT Fall Figure 36. Propagation Delays vs. Temperature Figure 37. Fall Time vs. Supply Voltage Figure 38. Rise Time vs. Supply Voltage Figure 39. Rise and Fall Time vs. Temperature www.onsemi.com 11 FAN3121, FAN3122 TYPICAL PERFORMANCE CHARACTERISTICS (Typical characteristics are provided at 25°C and VDD = 12 V unless otherwise noted) (continued) Figure 40. Rise / Fall Waveforms with 10 nF Load Figure 41. Quasi−Static Source Current with VDD = 12 V (Note 13) Figure 42. Quasi−Static Sink Current with VDD = 12 V (Note 13) Figure 43. Quasi−Static Source Current with VDD = 8 V (Note 13) V DD (2) x 4.7 μF ceramic FAN3121/22 IN 1 kHz 470 mF Al. El. Current Probe LACROU AP015 I OUT 1 mF V OUT ceramic C LOAD 1 mF Figure 45. Quasi−Static IOUT / VOUT Test Circuit Figure 44. Quasi−Static Sink Current with VDD = 8 V (Note 13) 12. For any inverting inputs pulled LOW, non−inverting inputs pulled HIGH, or outputs driven HIGH; static IDD increases by the current flowing through the corresponding pull−up/down resistor, shown in Figure 7. 13. The initial spike in each current waveform is a measurement artifact caused by the stray inductance of the current−measurement loop. www.onsemi.com 12 FAN3121, FAN3122 APPLICATIONS INFORMATION The purpose of the Miller Drive architecture is to speed up switching by providing high current during the Miller plateau region when the gate−drain capacitance of the MOSFET is being charged or discharged as part of the turn−on / turn−off process. For applications with zero voltage switching during the MOSFET turn−on or turn−off interval, the driver supplies high peak current for fast switching, even though the Miller plateau is not present. This situation often occurs in synchronous rectifier applications because the body diode is generally conducting before the MOSFET is switched on. The output pin slew rate is determined by VDD voltage and the load on the output. It is not user adjustable, but a series resistor can be added if a slower rise or fall time at the MOSFET gate is needed. The FAN3121 and FAN3122 family offers versions in either TTL or CMOS input configuration. In the FAN3121T and FAN3122T, the input thresholds meet industry−standard TTL−logic thresholds independent of the VDD voltage, and there is a hysteresis voltage of approximately 0.7 V. These levels permit the inputs to be driven from a range of input logic signal levels for which a voltage over 2 V is considered logic HIGH. The driving signal for the TTL inputs should have fast rising and falling edges with a slew rate of 6 V/ms or faster, so the rise time from 0 to 3.3 V should be 550 ns or less. The FAN3121 and FAN3122 output can be enabled or disabled using the EN pin with a very rapid response time. If EN is not externally connected, an internal pull−up resistor enables the driver by default. The EN pin has logic thresholds for parts with either TTL or CMOS IN thresholds. In the FAN3121C and FAN3122C, the logic input thresholds are dependent on the VDD level and, with VDD of 12 V, the logic rising edge threshold is approximately 55% of VDD and the input falling edge threshold is approximately 38% of VDD. The CMOS input configuration offers a hysteresis voltage of approximately 17% of VDD. The CMOS inputs can be used with relatively slow edges (approaching DC) if good decoupling and bypass techniques are incorporated in the system design to prevent noise from violating the input voltage hysteresis window. This allows setting precise timing intervals by fitting an R−C circuit between the controlling signal and the IN pin of the driver. The slow rising edge at the IN pin of the driver introduces a delay between the controlling signal and the OUT pin of the driver. V Input stage DD V OUT Static Supply Current In the IDD (static) Typical Performance Characteristics, the curves are produced with all inputs / enables floating (OUT is LOW) and indicates the lowest static IDD current for the tested configuration. For other states, additional current flows through the 100 kW resistors on the inputs and outputs, as shown in the block diagram (see Figure 7). In these cases, the actual static IDD current is the value obtained from the curves, plus this additional current. Figure 46. Miller Drive Output Architecture Under−Voltage Lockout (UVLO) The FAN312x startup logic is optimized to drive ground−referenced N−channel MOSFETs with an under−voltage lockout (UVLO) function to ensure that the IC starts in an orderly fashion. When VDD is rising, yet below the 4.0 V operational level, this circuit holds the output low, regardless of the status of the input pins. After the part is active, the supply voltage must drop 0.25 V before the part shuts down. This hysteresis helps prevent chatter when low VDD supply voltages have noise from the power switching. This configuration is not suitable for driving high−side P−channel MOSFETs because the low output voltage of the driver would turn the P−channel MOSFET on with VDD below 4.0 V. MillerDrive Gate−Drive Technology FAN312x gate drivers incorporate the MillerDrive architecture shown in Figure 46. For the output stage, a combination of bipolar and MOS devices provide large currents over a wide range of supply voltage and temperature variations. The bipolar devices carry the bulk of the current as OUT swings between 1/3 to 2/3 VDD and the MOS devices pull the output to the HIGH or LOW rail. www.onsemi.com 13 FAN3121, FAN3122 V DD VDD Bypassing and Layout Considerations The FAN3121 and FAN3122 are available in either 8−lead SOIC or MLP packages. In either package, the VDD pins 1 and 8 and the GND pins 4 and 5 should be connected together on the PCB. In typical FAN312x gate−driver applications, high−current pulses are needed to charge and discharge the gate of a power MOSFET in time intervals of 50 ns or less. A bypass capacitor with low ESR and ESL should be connected directly between the VDD and GND pins to provide these large current pulses without causing unacceptable ripple on the VDD supply. To meet these requirements in a small size, a ceramic capacitor of 1 mF or larger is typically used, with a dielectric material such as X7R, to limit the change in capacitance over the temperature and / or voltage application ranges. Figure 47 shows the pulsed gate drive current path when the gate driver is supplying gate charge to turn the MOSFET on. The current is supplied from the local bypass capacitor CBYP and flows through the driver to the MOSFET gate and to ground. To reach the high peak currents possible with the FAN312x family, the resistance and inductance in the path should be minimized. The localized CBYP acts to contain the high peak current pulses within this driver−MOSFET circuit, preventing them from disturbing the sensitive analog circuitry in the PWM controller. V DD V DS C BYP FAN3121/2 PWM Figure 48. Current Path for MOSFET Turn−Off Operational Waveforms At power up, the FAN3121 inverting driver shown in Figure 49 holds the output LOW until the VDD voltage reaches the UVLO turn−on threshold, as indicated in Figure 50. This facilitates proper startup control of low−side N−channel MOSFETs. VDD IN OUT Figure 49. Inverting Configuration The OUT pulses’ magnitude follows VDD magnitude with the output polarity inverted from the input until steady−state VDD is reached. V DS C BYP FAN3121/2 V DD Turn−on threshold PWM IN− Figure 47. Current Path for MOSFET Turn−On Figure 48 shows the path the current takes when the gate driver turns the MOSFET off. Ideally, the driver shunts the current directly to the source of the MOSFET in a small circuit loop. For fast turn−off times, the resistance and inductance in this path should be minimized. IN+ (VDD) OUT Figure 50. Inverting Startup Waveforms www.onsemi.com 14 FAN3121, FAN3122 At power up, the FAN3122 non−inverting driver, shown in Figure 51, holds the output LOW until the VDD voltage reaches the UVLO turn−on threshold, as indicated in Figure 52. The OUT pulses magnitude follow VDD magnitude until steady−state VDD is reached. dynamic operating conditions, including pin pull−up / pull−down resistors, can be obtained using graphs in Typical Performance Characteristics to determine the current IDYNAMIC drawn from VDD under actual operating conditions: P DYMANIC + I DYNAMIC @ V DD VDD IN OUT Figure 51. Non−Inverting Driver V DD T J + P TOTAL @ Y JB ) T B Turn−on threshold IN+ OUT P GATE + 2 @ 70 nC @ 9 V @ 300 kHz + 0.378 W (eq. 5) P DYNAMIC + 2 mA @ 9 V + 18 mW (eq. 6) P TOTAL + 0.396 W (eq. 7) The SOIC−8 has a junction−to−board thermal characterization parameter of yJB = 42°C/W. In a system application, the localized temperature around the device is a function of the layout and construction of the PCB along with airflow across the surfaces. To ensure reliable operation, the maximum junction temperature of the device must be prevented from exceeding the maximum rating of 150°C; with 80% derating, TJ would be limited to 120°C. Rearranging Equation 4 determines the board temperature required to maintain the junction temperature below 120°C: Figure 52. Non−Inverting Startup Waveforms Thermal Guidelines Gate drivers used to switch MOSFETs and IGBTs at high frequencies can dissipate significant amounts of power. It is important to determine the driver power dissipation and the resulting junction temperature in the application to ensure that the part is operating within acceptable temperature limits. The total power dissipation in a gate driver is the sum of two components, PGATE and PDYNAMIC: (eq. 1) Gate Driving Loss: The most significant power loss results from supplying gate current (charge per unit time) to switch the load MOSFET on and off at the switching frequency. The power dissipation that results from driving a MOSFET at a specified gate−source voltage, VGS, with gate charge, QG, at switching frequency, fSW, is determined by: P GATE + Q G @ V GS @ f SW (eq. 4) where: TJ = driver junction temperature; yJB = (psi) thermal characterization parameter relating temperature rise to total power dissipation; and TB = board temperature in location as defined in the Thermal Characteristics table. In a full−bridge synchronous rectifier application, shown in Figure 53, each FAN3122 drives a parallel combination of two high−current MOSFETs, (such as FDMS8660S). The typical gate charge for each SR MOSFET is 70 nC with VGS = VDD = 9 V. At a switching frequency of 300 kHz, the total power dissipation is: IN− P TOTAL + P GATE ) P DYNAMIC (eq. 3) Once the power dissipated in the driver is determined, the driver junction rise with respect to circuit board can be evaluated using the following thermal equation, assuming yJB was determined for a similar thermal design (heat sinking and air flow): T B,MAX + T J * P TOTAL @ Y JB (eq. 8) T B,MAX + 120°C * 0.396 W @ 42°CńW + 104°C (eq. 9) For comparison, replace the SOIC−8 used in the previous example with the 3x3 mm MLP package with yJB = 2.8°C/W. The 3x3 mm MLP package can operate at a PCB temperature of 118°C, while maintaining the junction temperature below 120°C. This illustrates that the physically smaller MLP package with thermal pad offers a more conductive path to remove the heat from the driver. Consider tradeoffs between reducing overall circuit size with junction temperature reduction for increased reliability. (eq. 2) Dynamic Pre−drive / Shoot−through Current: A power loss resulting from internal current consumption under www.onsemi.com 15 FAN3121, FAN3122 Typical Application Diagrams V IN V OUT B2 A2 B1 A1 BIAS FAN3122 FAN3122 From A2 SR EN VDD 1 8 2 7 3 6 4 5 IN EN From A1 AGND VDD OUT OUT VDD 1 8 2 7 IN SR EN 3 EN 4 PGND 6 5 AGND Figure 53. Full−Bridge Synchronous Rectification VOUT VIN PWM FAN3121 VDD SR Enable Active HIGH IN EN AGND V BIAS 1 2 3 8 P1 (AGND) 4 7 6 5 VDD OUT OUT PGND Figure 54. Hybrid Synchronous Rectification in a Forward Converter www.onsemi.com 16 VDD OUT OUT PGND FAN3121, FAN3122 ORDERING INFORMATION Part Number FAN3121CMPX FAN3121CMX Logic Input Threshold Package Shipping† Inverting Channels + Enable CMOS 3x3 mm MLP−8 3.000 / Tape & Reel SOIC−8 2.500 / Tape & Reel 3x3 mm MLP−8 3.000 / Tape & Reel SOIC−8 2.500 / Tape & Reel CMOS 3x3 mm MLP−8 3.000 / Tape & Reel SOIC−8 2.500 / Tape & Reel TTL 3x3 mm MLP−8 3.000 / Tape & Reel SOIC−8 2.500 / Tape & Reel TTL FAN3121TMPX FAN3121TMX FAN3122CMPX FAN3122CMX Non−Inverting Channels + Enable FAN3122TMPX FAN3122TMX †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 17 FAN3121, FAN3122 Table 1. RELATED PRODUCTS Part Number Type Gate Drive (Note 14) (Sink/Src) Input Threshold Logic Package FAN3111C Single 1 A +1.1 A / −0.9 A CMOS Single Channel of Dual−Input / Single−Output SOT23−5, MLP6 FAN3111E Single 1 A +1.1 A / −0.9 A External Single Non−Inverting Channel with External Reference SOT23−5, MLP6 FAN3100C Single 2 A +2.5 A / −1.8 A CMOS Single Channel of Two−Input / One−Output SOT23−5, MLP6 FAN3100T Single 2 A +2.5 A / −1.8 A TTL Single Channel of Two−Input / One−Output SOT23−5, MLP6 FAN3180 Single 2 A +2.4 A / −1.6 A TTL Single Non−Inverting Channel + 3.3 V LDO SOT23−5 FAN3216T Dual 2 A +2.4 A / −1.6 A TTL Dual Inverting Channels SOIC8 FAN3217T Dual 2 A +2.4 A / −1.6 A TTL Dual Non−Inverting Channels SOIC8 FAN3226C Dual 2 A +2.4 A / −1.6 A CMOS Dual Inverting Channels + Dual Enable SOIC8, MLP8 FAN3226T Dual 2 A +2.4 A / −1.6 A TTL Dual Inverting Channels + Dual Enable SOIC8, MLP8 FAN3227C Dual 2 A +2.4 A / −1.6 A CMOS Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 FAN3227T Dual 2 A +2.4 A / −1.6 A TTL Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 FAN3228C Dual 2 A +2.4 A / −1.6 A CMOS Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3228T Dual 2A +2.4 A / −1.6 A TTL Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3229C Dual 2 A +2.4 A / −1.6 A CMOS Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3229T Dual 2 A +2.4 A / −1.6 A TTL Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3268T Dual 2 A +2.4 A / −1.6 A TTL 20 V Non−Inverting Channel (NMOS) and Inverting Channel (PMOS) + Dual Enables SOIC8 FAN3278T Dual 2 A +2.4 A / −1.6 A TTL 30 V Non−Inverting Channel (NMOS) and Inverting Channel (PMOS) + Dual Enables SOIC8 FAN3223C Dual 4 A +4.3 A / −2.8 A CMOS Dual Inverting Channels + Dual Enable SOIC8, MLP8 FAN3213T Dual 4 A +4.3 A / −2.8 A TTL Dual Inverting Channels SOIC8 FAN3214T Dual 4 A +4.3 A / −2.8 A TTL Dual Non−Inverting Channels SOIC8 FAN3223T Dual 4 A +4.3 A / −2.8 A TTL Dual Inverting Channels + Dual Enable SOIC8, MLP8 FAN3224C Dual 4 A +4.3 A / −2.8 A CMOS Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 FAN3224T Dual 4 A +4.3 A / −2.8 A TTL Dual Non−Inverting Channels + Dual Enable SOIC8, MLP8 FAN3225C Dual 4 A +4.3 A / −2.8 A CMOS Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3225T Dual 4 A +4.3 A / −2.8 A TTL Dual Channels of Two−Input / One−Output SOIC8, MLP8 FAN3121C Single 9 A +9.7 A / −7.1 A CMOS Single Inverting Channel + Enable SOIC8, MLP8 FAN3121T Single 9 A +9.7 A / −7.1 A TTL Single Inverting Channel + Enable SOIC8, MLP8 FAN3122C Single 9 A +9.7 A / −7.1 A CMOS Single Non−Inverting Channel + Enable SOIC8, MLP8 FAN3122T Single 9 A +9.7 A / −7.1 A TTL Single Non−Inverting Channel + Enable SOIC8, MLP8 FAN3240 Dual 12 A > +12.0 A TTL Dual−Coil Relay Driver, Timing Config. 0 SOIC8 FAN3241 Dual 12 A > +12.0 A TTL Dual−Coil Relay Driver, Timing Config. 1 SOIC8 14. Typical currents with OUT at 6 V and VDD = 12 V. 15. Thresholds proportional to an externally supplied reference voltage. MillerDrive is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 18 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN8 3x3, 0.65P CASE 511CD ISSUE O 1 SCALE 2:1 B A D DATE 29 APR 2014 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L L1 ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ PIN ONE REFERENCE 2X DETAIL A E ALTERNATE CONSTRUCTIONS 0.10 C 2X 0.10 C ÇÇÇ ÉÉÉ EXPOSED Cu TOP VIEW A DETAIL B 0.05 C DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉÉ ÇÇÇ ÇÇÇ A3 MOLD CMPD A1 DETAIL B ALTERNATE CONSTRUCTIONS 0.05 C A3 NOTE 4 SIDE VIEW DETAIL A 1 A1 D2 C 8X 4 SEATING PLANE GENERIC MARKING DIAGRAM* L XXXXX XXXXX ALYWG G E2 K 5 8 e/2 e 8X A L Y W G b 0.10 C A B BOTTOM VIEW 0.05 C = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED SOLDERING FOOTPRINT* 8X 2.31 PACKAGE OUTLINE MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 3.00 BSC 2.05 2.25 3.00 BSC 1.10 1.30 0.65 BSC 0.20 −−− 0.30 0.50 0.00 0.15 0.63 3.30 1.36 1 0.65 PITCH 8X 0.40 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON84944F WDFN8, 3X3, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC8 CASE 751EB ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON13735G SOIC8 DATE 24 AUG 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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