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FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4 )
Analog Switch with Negative Swing Audio Capability
Features
0.4 Ω Typical On Resistance (R ON) for +3.0 V Supply
0.25 Ω Ma ximum RON Flatness for +3.0 V Supply
-3 db Bandwidth: > 50 MHz
Low-ICCT Current Over an Expanded Control Input
Range
Packaged in 10-Lead MicroPak™, UMLP, and
WLCSP
Power-Off Protection on Common Ports
Broad VCC Operating Range: 1.65 to 4.5 V
Noise Immunity Termination Resistors in FSA2269TS
Applications
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Description
The FSA2269 is a high-performance, dual Single-Pole
Double-Throw (SPDT) analog switch with negative swing
audio capability. The FSA2269 features ultra-low R ON of
0.4 (typical) at 3.0 V VCC. The FSA2269 operates over
a wide VCC range of 1.65 V to 4.5 V, is fabricated with
sub-micron CMOS technology to achieve fast switching
speeds, and is designed for break-before-make
operation. The select input is TTL-level compatible.
The FSA2269 features very low quiescent current even
when the control voltage is lower than the VCC supply.
This feature suits mobile handset applications by
allowing direct interface with baseband processor
general-purpose I/Os with minimal battery consumption.
The FSA2269TS includes termination resistors that
improve noise immunity during overshoot excursions,
off-isolation coupling, or “pop-minimization.”
Ordering Information
Part Number
Top Mark
Package Description
FSA2269L10X
HL
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
FSA2269UMX
HP
10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
FSA2269TSL10X
HU
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
FSA2269TSUMX
HT
10-Lead, Quad Ultrathin Molded Leadless Package(UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
FSA2269UCX
N9
12-Ball, Wafer-Level Chip Scale Package (WLCSP),1.2 x 1.6 mm, 0.4 mm Pitch
Analog Symbols
1B0
1A
1B1
10k
3µs
tON
S1
GND
2B0
2A
2B1
3µs
tON
S2
10k
GND
Figure 1. FSA2269
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
Figure 2. FSA2269TS (with Slow Turn On)
www.f airchildsemi.com
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
July 2013
2B1
2B0 1B1
2
1
3
GND
4
2A
5
Vcc
10
7
1
9
1A
1B1
2
8
S1
2B0
3
7
S2
2B1
4
6
2A
10 1B0
9
6
1B0
8
VCC
1A
5
S2 S1
GND
Figure 3. 10-Pin UMLP (Top Through View)
Figure 4. 10-Pin MicroPak™ (Top Through View)
Figure 5. 12-Ball WLCSP (Bump Side View)
Figure 6. 12-Ball WLCSP (Top Side View)
Pin Descriptions
Pin # UMLP
Pin #
Micropak
WLCSP
Name
1
2
B1
1B1
Data Ports
2
3
D3
2B0
Data Ports
3
4
B3
2B1
Data Ports
4
5
B2, C2
GND
Ground
5
6
C3
2A
Data Ports
6
7
A3
S2
Switch Select Pins
7
8
A1
S1
Switch Select Pins
8
9
C1
1A
Data Ports
9
10
D2
VCC
Supply Voltage
10
1
D1
1B0
Data Ports
Description
Truth Table
Control Input, Sn
Function
LOW Logic Level
nB0 connected to nA (FSA2269/2269TS); nB1 terminated to GND (FSA2269TS only)
HIGH Logic Level
nB1 connected to nA (FSA2269/2269TS); nB0 terminated to GND (FSA2269TS only)
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
2
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Pin Configuration
Stresses exceeding the absolute maximum ratings may damage the device. Functional operation above the
recommended operating conditions is not implied. In addition, extended exposure to stresses above the
recommended operating conditions may affect device reliability. Absolute maximum ratings are stress ratings only.
Symbol
VCC
VSW
VCNTRL
ISW
ISWPEAK
TSTG
Parameter
Supply Voltage
Switch I/O Voltage
(1)
Control Input Voltage (1)
1B0, 1B1, 2B0, 2B1, 1A, 2 A Pins
S1, S2
Peak Switch Current
Unit
-0.5
5.5
V
VCC -4.6
5.5
V
-0.5
VCC +0.3
V
350
mA
Pulsed at 1ms Duration, 50
MH z
Figure 13
THD
f=20 Hz to
20 kHz,
Total Harmonic
RL=32 ,
Distortion
VIN=2 VPP
VBIAS=0 V
1.65 to 4.50
.06
%
Figure 19
Unit
Figure
Q
Notes:
7. Guaranteed by characterization, not production tested.
Capacitance
Symbol
CIN
Parameter
Conditions
VCC (V)
TA=+25°C
Min.
Typ.
Max.
Control Pin Input Capacitance
f=1 MH z
0
2.5
pF
Figure 17
COFF
B Port Off Capacitance
f=1 MH z
3.3
30
pF
Figure 17
CON
A Port On Capacitance
f=1 MH z
3.3
120
pF
Figure 18
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
7
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
AC Electrical Characteristics (Continued)
VON
I A(OFF)
NC
A
nBn
nA
V IN
V IN
Select
I ON
GND
Select
V Sel =
R ON = VON / ION
GND
VSel =
GND
0 or Vcc
**Each switch port is tested separately.
Figure 7. On Resistance
Figure 8. Off Leakage
nBn
I A(ON)
NC
0 orVcc
nA
V IN
A
GND
CL
RS
V IN
RL
V OUT
GND
Select
GND
VSel =
V Sel
0 or Vcc
GND
Figure 9. On Leakage
RL and C L are functions of the application
environment (see AC/DC tables).
CL includes test ficutre and stray capacitance.
Figure 10. Test Circuit Load
tRISE = 2.5ns
tFALL = 2.5ns
VCC
90%
Input - VSel
10%
GND
90%
VCC /2
VCC /2
10%
VOH
90%
90%
Output - VOUT
VOL
tON
tOFF
Figure 11. Turn-On / Turn-Off Waveforms
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
8
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Test Diagrams
tRISE = 2.5ns
nB n
nA
Vcc
V IN
GND
V OUT
CL
V IN
90%
V cc/2
Input - VSel
RL
10%
0V
GND
GND
V OUT
RS
0.9*V out
0.9*V out
V Sel
GND
tD
RL and CL are functions of the application
environment (see AC/DC tables).
CL includes test fixture and stray capacitance.
Figure 12. Break-Before-Make Interval Timing
Network Analyzer
RS
V IN
VS
GND
GND
VSel
GND
VOU T
GND
RT
R L and CL are functions of the application
environment (see AC/DC tables).
L
C L includes
test fixture and stray capacitance.
GND
Figure 13. Bandwidth
Network Analyzer
RS
VSel
VS
GND
RT
GND
GND
VOUT
GND
GND
RS and RT are functions of the application
environment (see AC/DC tables).
RT
GND
Off-Isolation
= 20 Log (VOUT / VIN )
Figure 14. Channel Off Isolation
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
9
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Test Diagrams (Continued)
Figure 15. Adjacent Channel Crosstalk
Figure 16. Charge Injection Test
nBn
Capacitance
Meter
VSel =
f = 1MHz
nBn
Capacitance
Meter
nSn
0 or Vcc
nSn
V Sel =
f = 1MHz
nBn
0 orV cc
nBn
Figure 17. Channel Off Capacitance
Figure 18. Channel On Capacitance
Audio Analyzer
RS
V IN
VS
GND
GND
V CNTRL
GND
VSel =
V OUT
GND
0 or Vcc
RT
GND
RS and RT are functions of the application
environment (see AC Tables for specific values).
Figure 19. Total Harmonic Distortion
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
10
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Test Diagrams (Continued)
0.10 C
2.10
2X
A
1.62
B
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
(0.11)
0.56
1.12
1.60
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
0.10 C
2X
TOP VIEW
(0.35) 10X
(0.25) 10X
0.50
RECOMMENDED LAND PATTERN
0.55 MAX
0.05 C
0.05 C
0.05
0.00
(0.20)
C
0.35
0.25
SIDE VIEW
(0.15)
D
0.65
0.55
DETAIL A
0.35
0.25
(0.36)
0.35
0.25
DETAIL A 2X SCALE
4
1
0.56
5
10
(0.29)
0.35 9X
0.25
6
9
0.50
0.25 9X
0.15
1.62
0.10
0.05
C A B
C
ALL FEATURES
BOTTOM VIEW
NOTES:
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
IS NOT INTENDED TO BE SOLDERED AND
HAS A BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev5.
Figure 20. 10-Lead MicroPak™
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions ,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
11
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Physical Dimensions
1.40
0.10 C
A
B
2X
(9X)
1.70
0.563
0.663
1.80
1
PIN#1 IDENT
2.10
0.10 C
TOP VIEW
0.40
2X
(10X) 0.225
0.55 MAX.
0.10 C
RECOMMENDED
LAND PATTERN
(0.15)
1.45
0.08 C
SEATING C
PLANE
0.05
0.00
0.55
SIDE VIEW
0.40
1.85
0.35
(9X)
0.45
3
(10X) 0.225
6
DETAIL A
OPTIONAL MINIMIAL
TOE LAND PATTERN
0.40
1
NOTES:
PIN#1 IDENT
10
BOTTOM VIEW
0.55
0.45
0.25
0.15
9X
0.45
45°
DETAIL A
SCALE : 2X
Figure 21.
A. PACKAGE DOES NOT CONFORM TO
ANY JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
0.15
(10X)
0.25
0.10 C A B
0.05 C
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
PACKAGE
EDGE
E. DRAWING FILENAME: MKT-UMLP10Arev5.
F. FAIRCHILD SEMICONDUCTOR.
LEAD
OPTION 2
LEAD
OPTION 1
SCALE : 2X
SCALE : 2X
10-Lead, Quad Ultrathin Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specif ically the warranty therein, whic h covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
12
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Physical Dimensions (Continued)
0.03 C
E
2X
F
A
0.80
(Ø0.200)
Cu Pad
B
1.20
(Ø0.300)
Solder Mask
0.40
PIN 1 AREA
D
0.40
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
0.625
0.547
0.05 C
C
SEATING PLANE
D
SIDE VIEWS
0.005
0.80
Ø0.260±0.02
12X
0.40
1.20
C A B
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
D
C
B
A
0.40
NOTES:
(Y)±0.018
F
1 2 3
(X)±0.018
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC012ACrev1.
Product-Specific Dimensions
Product
D
E
X
Y
FSA2269UCX
1.560 mm
1.160 mm
0.180 mm
0.180 mm
Figure 22. 12-Ball, Wafer Level Chip-Scale Package (WLCSP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
www.f airchildsemi.com
13
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
Physical Dimensions (Continued)
FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
14
www.f airchildsemi.com
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS • Rev. 1.1.5
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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