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FSL156MRIN
Green-Mode Power Switch (FPS™)
Features
Description
Advanced Soft Burst Mode for Low Standby Power
and Low Audible Noise
Random Frequency Fluctuation (RFF) for Low EMI
Low Operating Current (0.4mA) in Burst Mode
The FSL156MRIN is an integrated Pulse Width
Modulation (PWM) controller and SenseFET specifically
designed for offline Switched Mode Power Supplies
(SMPS) with minimal external components. The PWM
controller includes an integrated fixed-frequency
oscillator, Line-Over Voltage Protection (LOVP), UnderVoltage Lockout (UVLO), Leading-Edge Blanking (LEB),
optimized gate driver, internal soft-start, temperaturecompensated precise current sources for loop
compensation, and self-protection circuitry. Compared
with a discrete MOSFET and PWM controller solution,
the FSL156MRIN reduces total cost, component count,
size, and weight; while simultaneously increasing
efficiency, productivity, and system reliability. This
device provides a basic platform suited for cost-effective
design of a flyback converter.
Pulse-by-Pulse Current Limit
Overload Protection (OLP), Over-Voltage
Protection (OVP), Abnormal Over-Current
Protection (AOCP), Internal Thermal Shutdown
(TSD) with Hysteresis, Output-Short Protection
(OSP), and Under-Voltage Lockout (UVLO) with
Hysteresis , Line Over Voltage Protection (LOVP)
Internal Startup Circuit
Internal High-Voltage SenseFET: 650V
Built-in Soft-Start: 15ms
Auto-Restart Mode
Applications
Power Supply for Home Appliances, LCD Monitors,
STBs, and DVD Players
Ordering Information
(1)
Part Number Package
FSL156MRIN
8-DIP
Operating Current
RDS(ON)
Junction
Limit
(Max.)
Temperature (Typ.)
-40°C ~ +125°C
1.6A
2.2
Output Power Table(2)
230VAC ±15%
Adapter(3)
26W
85-265VAC
Open
Open
Adapter(3)
Frame(4)
Frame(4)
40W
20W
30W
Notes:
1. Lead-free package per JEDEC J-STD-020B.
2. The junction temperature can limit the maximum output power.
3. Typical continuous power in a non-ventilated enclosed adapter measured at 50C ambient temperature.
4. Maximum practical continuous power in an open-frame design at 50C ambient temperature.
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
FSL156MRIN — Green-Mode Power Switch (FPS™)
April 2018
FSL156MRIN — Green-Mode Power Switch (FPS™)
Application Circuit
VO
AC
IN
VSTR
VIN
Drain
GND
FB
Figure 1.
VCC
Typical Application Circuit
Internal Block Diagram
Figure 2.
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
Internal Block Diagram
www.onsemi.com
2
FSL156MRIN — Green-Mode Power Switch (FPS™)
Pin Configuration
1. GND
8. Drain
2. VCC
7. Drain
FSL156MRIN
3. FB
6. Drain
4. VIN
5. VSTR
Figure 3.
Pin Assignments (Top View)
Pin Definitions
Pin #
Name
1
GND
Ground. This pin is the control ground and the SenseFET source.
2
VCC
Power Supply. This pin is the positive supply input, which provides the internal operating
current for both startup and steady-state operation.
FB
Feedback. This pin is internally connected to the inverting input of the PWM comparator.
The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor
should be placed between this pin and GND. If the voltage of this pin reaches 7V, the
overload protection triggers, which shuts down the FPS.
VIN
Line Over-Voltage Input. This pin is the input pin of line voltage. The voltage, which is
divided by resistors, is the input of this pin. If this pin voltage is higher than VINH voltage, the
LOVP triggers, which shuts down the FPS. Do not leave this pin floating. If LOVP is not used,
this pin should be directly connected to the GND.
3
4
5
Description
VSTR
Startup. This pin is connected directly, or through a resistor, to the high-voltage DC link.
At startup, the internal high-voltage current source supplies internal bias and charges the
external capacitor connected to the VCC pin. Once VCC reaches 12V, the internal current
source (ICH) is disabled.
Drain
SenseFET Drain. High-voltage power SenseFET drain connection.
6
7
8
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VSTR
VSTR Pin Voltage
650
V
VDS
Drain Pin Voltage
650
V
VCC
VCC Pin Voltage
26
V
VFB
Feedback Pin Voltage
-0.3
10.0
V
VIN
VIN Pin Voltage
-0.3
10.0
V
IDM
Drain Current Pulsed
4
A
IDS
Continuous Switching Drain Current(5)
EAS
Single-Pulsed Avalanche Energy(6)
PD
TJ
Total Power Dissipation (TC=25C)
TC=25C
1.90
TC=100C
1.27
190
mJ
1.5
W
150
C
-40
+125
C
-55
+150
C
(7)
Maximum Junction Temperature
Operating Junction Temperature
(8)
TSTG
Storage Temperature
ESD
Electrostatic Discharge Human Body Model, JESD22-A114
Capability
Charged Device Model, JESD22-C101
A
4.5
2.0
kV
Notes:
5. Repetitive peak switching current when the inductive load is assumed: limited by maximum duty (DMAX=0.73) and
junction temperature (see Figure 4).
6. L=45mH, starting TJ=25C.
7. Infinite cooling condition (refer to the SEMI G30-88).
8. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
Figure 4.
Repetitive Peak Switching Current
Thermal Impedance
TA=25°C unless otherwise specified.
Symbol
θJA
ΨJL
Parameter
Junction-to-Ambient Thermal Impedance
Junction-to-Lead Thermal Impedance
(9)
(10)
Value
Unit
85
°C/W
11
°C/W
Notes:
9. JEDEC recommended environment, JESD51-2, and test board, JESD51-10, with minimum land pattern.
10. Measured on drain pin #7, close to the plastic interface.
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
4
FSL156MRIN — Green-Mode Power Switch (FPS™)
Absolute Maximum Ratings
TJ = 25C unless otherwise specified.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
SenseFET Section
BVDSS
Drain-Source Breakdown Voltage
VCC=0V, ID=250A
IDSS
Zero-Gate-Voltage Drain Current
VDS=520V, TA=125C
Drain-Source On-State Resistance
VGS=10V, ID=1A
1.8
RDS(ON)
(11)
650
V
250
µA
2.2
Ω
CISS
Input Capacitance
VDS=25V, VGS=0V, f=1MHz
515
pF
COSS
Output Capacitance(11)
VDS=25V, VGS=0V, f=1MHz
75
pF
Rise Time
VDS=325V, ID=4A, RG=25Ω
26
ns
tr
Fall Time
VDS=325V, ID=4A, RG=25Ω
25
ns
td(on)
tf
Turn-On Delay
VDS=325V, ID=4A, RG=25Ω
14
ns
td(off)
Turn-Off Delay
VDS=325V, ID=4A, RG=25Ω
32
ns
Control Section
Switching Frequency(11)
VCC=14V, VFB=4V
Switching Frequency Variation(11)
-25C < TJ < 125C
DMAX
Maximum Duty Ratio
VCC=14V, VFB=4V
DMIN
Minimum Duty Ratio
VCC=14V, VFB=0V
fS
fS
IFB
VSTART
VSTOP
tSS
VRECOMM
Feedback Source Current
UVLO Threshold Voltage
Internal Soft-Start Time
VFB=0
61
61
65
67
73
kHz
±5
±10
%
67
73
%
0
%
115
µA
90
VFB=0V, VCC Sweep
11
12
13
V
After Turn-on, VFB =0V
7.0
7.5
8.0
V
VSTR=40V, VCC Sweep
Recommended VCC Range
15
13
ms
23
V
V
Burst Mode Section
VBURH
VBURL
Burst-Mode Voltage
VCC=14V, VFB Sweep
0.45
0.50
0.55
0.30
0.35
0.40
Hys
150
V
mV
Protection Section
ILIM
Peak Drain Current Limit
di/dt=300mA/s
1.45
1.60
1.75
A
VSD
Shutdown Feedback Voltage
VCC=14V, VFB Sweep
6.45
7.00
7.55
V
Shutdown Delay Current
VCC=14V, VFB=4V
1.2
2.0
2.8
µA
IDELAY
tLEB
Leading-Edge Blanking Time(11,12)
VOVP
Over-Voltage Protection
VCC Sweep
23.0
24.5
26.0
V
VINH
Line Over-Voltage Protection
Threshold Voltage
VCC=14V, VIN Sweep
1.87
1.95
2.03
V
VINHYS
Line Over-Voltage Protection
Hysteresis
VCC=14V, VIN Sweep
tOSP
VOSP
tOSP_FB
TSD
THYS
Output-Short
Protection(11)
Threshold Time
Threshold VFB
VFB Blanking Time
Thermal Shutdown Temperature(11)
300
ns
0.06
V
OSP Triggered when
tONVOSP
(Lasts Longer than tOSP_FB)
0.7
1.0
1.3
µs
1.8
2.0
2.2
V
2.0
2.5
3.0
µs
Shutdown Temperature
125
135
145
Hysteresis
60
C
C
Continued on the following page…
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
5
FSL156MRIN — Green-Mode Power Switch (FPS™)
Electrical Characteristics
TJ = 25C unless otherwise specified.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Total Device Section
IOP
Operating Supply Current,
(Control Part in Burst Mode)
VCC=14V, VFB=0V
0.3
0.4
0.5
mA
IOPS
Operating Switching Current,
(Control Part and SenseFET Part)
VCC=14V, VFB=2V
1.1
1.5
1.9
mA
Start Current
VCC=11V (Before VCC
Reaches VSTART)
85
120
155
µA
Startup Charging Current
VCC=VFB=0V, VSTR=40V
0.7
1.0
1.3
mA
Minimum VSTR Supply Voltage
VCC=VFB=0V, VSTR Sweep
ISTART
ICH
VSTR
26
V
Notes:
11. These parameters are guaranteed; not 100% tested in production.
12. tLEB includes gate turn-on time.
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
6
FSL156MRIN — Green-Mode Power Switch (FPS™)
Electrical Characteristics (Continued)
1.20
1.20
1.15
1.15
1.10
1.10
1.05
1.05
Normalized
Normalized
Characteristic graphs are normalized at TA=25°C.
1.00
0.95
0.90
0.85
0'C
Operating Supply Current (IOP) vs. TA
Figure 6.
1.20
1.20
1.15
1.15
1.10
1.10
1.05
1.05
1.00
0.95
0.90
0.85
0'C
Operating Switching Current (IOPS) vs. TA
1.00
0.95
0.90
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
0'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Startup Charging Current (ICH) vs. TA
Figure 8.
1.20
1.30
1.15
1.20
1.10
1.10
1.05
Normalized
1.40
1.00
0.90
0.80
0.70
Peak Drain Current Limit (ILIM) vs. TA
1.00
0.95
0.90
0.85
0.60
‐40'C ‐20'C
0'C
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Figure 9.
25'C 50'C 75'C 90'C 110'C 120'C 125'C
0.85
0.80
‐40'C ‐20'C
Figure 7.
0'C
Temperature [ °C]
Normalized
Normalized
0.90
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Normalized
0.95
0.85
0.80
‐40'C ‐20'C
Figure 5.
1.00
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Feedback Source Current (IFB) vs. TA
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
0'C
Figure 10. Shutdown Delay Current (IDELAY) vs. TA
www.onsemi.com
7
FSL156MRIN — Green-Mode Power Switch (FPS™)
Typical Performance Characteristics
1.20
1.20
1.15
1.15
1.10
1.10
1.05
1.05
Normalized
Normalized
Characteristic graphs are normalized at TA=25°C.
1.00
0.95
0.90
0.85
0.80
‐40'C ‐20'C
0.95
0.90
0.85
0'C
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
1.15
1.15
1.10
1.10
1.05
1.05
Normalized
1.20
1.00
0.95
0.90
0.85
1.00
0.95
0.90
0.85
0'C
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
0'C
Temperature [ °C]
Figure 14. Over-Voltage Protection (VOVP) vs. TA
1.20
1.20
1.15
1.15
1.10
1.10
1.05
1.05
Normalized
Normalized
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Figure 13. Shutdown Feedback Voltage (VSD) vs. TA
1.00
0.95
0.90
0.85
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Figure 12. UVLO Threshold Voltage (VSTOP) vs. TA
1.20
0.80
‐40'C ‐20'C
0'C
Temperature [ °C]
Figure 11. UVLO Threshold Voltage (VSTART) vs. TA
Normalized
1.00
1.00
0.95
0.90
0.85
0'C
0.80
‐40'C ‐20'C
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
25'C 50'C 75'C 90'C 110'C 120'C 125'C
Temperature [ °C]
Figure 15. Switching Frequency (fS) vs. TA
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
0'C
Figure 16. Maximum Duty Ratio (DMAX) vs. TA
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8
FSL156MRIN — Green-Mode Power Switch (FPS™)
Typical Performance Characteristics
1.20
1.20
1.15
1.15
1.10
1.10
1.05
1.05
Normalized
Normalized
Characteristic graphs are normalized at TA=25°C.
1.00
0.95
1.00
0.95
0.90
0.90
0.85
0.85
0.80
‐40'C ‐25'C
0'C
25'C
50'C
75'C
0.80
‐40'C ‐25'C
90'C 110'C 120'C 125'C
25'C
50'C
75'C
90'C 110'C 120'C 125'C
Temperature [ °C]
Temperature [ °C]
Figure 17. Line OVP (VINH) vs. TA
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
0'C
Figure 18. Hysteresis of LOVP (VINHYS) vs. TA
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9
FSL156MRIN — Green-Mode Power Switch (FPS™)
Typical Performance Characteristics
3. Feedback Control: This device employs CurrentMode control, as shown in Figure 20. An opto-coupler
(such as the FOD817) and shunt regulator (such as the
KA431) are typically used to implement the feedback
network. Comparing the feedback voltage with the
voltage across the RSENSE resistor makes it possible to
control the switching duty cycle. When the reference pin
voltage of the shunt regulator exceeds the internal
reference voltage of 2.5V, the opto-coupler LED current
increases, pulling down the feedback voltage and
reducing drain current. This typically occurs when the
input voltage is increased or the output load is decreased.
1. Startup: At startup, an internal high-voltage current
source supplies the internal bias and charges the
external capacitor (CVCC) connected to the VCC pin, as
illustrated in Figure 19. When VCC reaches 12V, the
FSL156MRIN begins switching and the internal highvoltage current source is disabled. Normal switching
operation continues and the power is supplied from the
auxiliary transformer winding unless VCC goes below the
stop voltage of 7.5V.
3.1 Pulse-by-Pulse Current Limit: Because CurrentMode control is employed, the peak current through
the SenseFET is limited by the inverting input of PWM
comparator (VFB*), as shown in Figure 20. Assuming
that the 90μA current source flows only through the
internal resistor (3R + R =25kΩ), the cathode voltage
of diode D2 is about 2.8V. Since D1 is blocked when
the feedback voltage (VFB) exceeds 2.8V, the
maximum voltage of the cathode of D2 is clamped at
this voltage. Therefore, the peak value of the current
through the SenseFET is limited.
3.2 Leading-Edge Blanking (LEB): At the instant the
internal SenseFET is turned on, a high-current spike
usually occurs through the SenseFET, caused by
primary-side capacitance and secondary-side rectifier
reverse recovery. Excessive voltage across the RSENSE
resistor leads to incorrect feedback operation in
Current-Mode PWM control. To counter this effect, the
LEB circuit inhibits the PWM comparator for tLEB
(300ns) after the SenseFET is turned on.
Figure 19. Startup Block
2. Soft-Start: The internal soft-start circuit increases
PWM comparator inverting input voltage, together with
the SenseFET current, slowly after startup. The typical
soft-start time is 15ms. The pulse width to the power
switching device is progressively increased to establish
the correct working conditions for the transformers,
inductors, and capacitors. The voltage on the output
capacitors is progressively increased to smoothly
establish the required output voltage. This helps prevent
transformer saturation and reduces stress on the
secondary diode during startup.
Figure 20. Pulse Width Modulation Circuit
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
10
FSL156MRIN — Green-Mode Power Switch (FPS™)
Functional Description
B
increasing until it reaches 7.0V, when the switching
operation is terminated, as shown in Figure 22. The
delay for shutdown is the time required to charge CFB
from 2.5V to 7.0V with 2.0µA. A 25 ~ 50ms delay is
typical for most applications. This protection is
implemented as auto-restart.
B
Figure 22. Overload Protection
4.2 Abnormal Over-Current Protection (AOCP):
When the secondary rectifier diodes or the
transformer pins are shorted, a steep current with
extremely high di/dt can flow through the SenseFET
during the minimum turn-on time. Even though the
FSL156MRIN has overload protection, it is not
enough to protect the FSL156MRIN in that abnormal
case; due to the severe current stress imposed on the
SenseFET until OLP is triggered. The internal AOCP
circuit is shown in Figure 23. When the gate turn-on
signal is applied to the power SenseFET, the AOCP
block is enabled and monitors the current through the
sensing resistor. The voltage across the resistor is
compared with a preset AOCP level. If the sensingresistor voltage is greater than the AOCP level, the
set signal is applied to the S-R latch, resulting in the
shutdown of the SMPS.
Figure 21. Auto-Restart Protection Waveforms
4.1 Overload Protection (OLP): Overload is defined
as the load current exceeding its normal level due to
an unexpected abnormal event. In this situation, the
protection circuit should trigger to protect the SMPS.
However, even when the SMPS is in normal
operation, the overload protection circuit can be
triggered during the load transition. To avoid this
undesired operation, the overload protection circuit is
designed to trigger only after a specified time to
determine whether it is a transient situation or a true
overload situation. Because of the pulse-by-pulse
current-limit capability, the maximum peak current
through the SenseFET is limited and, therefore, the
maximum input power is restricted with a given input
voltage. If the output consumes more than this
maximum power, the output voltage (VOUT) decreases
below the set voltage. This reduces the current
through the opto-coupler LED, which also reduces the
opto-coupler transistor current, increasing the
feedback voltage (VFB). If VFB exceeds 2.5V, D1 is
blocked and the 2.0µA current source starts to charge
CFB slowly up. In this condition, VFB continues
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
Figure 23. Abnormal Over-Current Protection
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11
FSL156MRIN — Green-Mode Power Switch (FPS™)
4. Protection Circuits: The FSL156MRIN has several
self-protective functions, such as Overload Protection
(OLP), Abnormal Over-Current Protection (AOCP),
Output-Short Protection (OSP), Over-Voltage Protection
(OVP), and Thermal Shutdown (TSD). All the
protections are implemented as auto-restart. Once the
fault condition is detected, switching is terminated and
the SenseFET remains off. This causes VCC to fall.
When VCC falls to the Under-Voltage Lockout (UVLO)
stop voltage of 7.5V, the protection is reset and the
startup circuit charges the VCC capacitor. When VCC
reaches the start voltage of 12.0V, normal operation
resumes. If the fault condition is not removed, the
SenseFET remains off and VCC drops to stop voltage
again. In this manner, the auto-restart can alternately
enable and disable the switching of the power
SenseFET until the fault condition is eliminated.
Because these protection circuits are fully integrated
into the IC without external components, reliability is
improved without increasing cost.
Figure 25. Line Over-Voltage Protection
5. Soft Burst Mode: To minimize power dissipation in
Standby Mode, the FSL156MRIN enters Burst-Mode
operation. As the load decreases, the feedback voltage
decreases. As shown in Figure 22, the device
automatically enters Burst Mode when the feedback
voltage drops below VBURL (350mV). At this point,
switching stops and the output voltages start to drop at
a rate dependent on standby current load. This causes
the feedback voltage to rise. Once it passes VBURH
(500mV), switching resumes. The feedback voltage then
falls and the process repeats. Burst Mode alternately
enables and disables SenseFET switching, reducing
switching loss in Standby Mode.
Figure 24. Output-Short Protection
4.4 Over-Voltage Protection (OVP): If the
secondary-side feedback circuit malfunctions or a
solder defect causes an opening in the feedback path,
the current through the opto-coupler transistor
becomes almost zero. Then VFB climbs up in a similar
manner to the overload situation, forcing the preset
maximum current to be supplied to the SMPS until the
overload protection is triggered. Because more
energy than required is provided to the output, the
output voltage may exceed the rated voltage before
the overload protection is triggered, resulting in the
breakdown of the devices in the secondary side. To
prevent this situation, an OVP circuit is employed. In
general, the VCC is proportional to the output voltage
and the FSL156MRIN uses VCC instead of directly
monitoring the output voltage. If VCC exceeds 24.5V,
an OVP circuit is triggered, resulting in the termination
of the switching operation. To avoid undesired
activation of OVP during normal operation, VCC should
be designed to be below 24.5V.
4.5 Thermal Shutdown (TSD): The SenseFET and
the control IC on a die in one package makes it easier
for the control IC to detect the temperature of the
SenseFET. If the temperature exceeds ~135C, the
thermal shutdown is triggered and stops operation.
The FSL156MRIN operates in Auto-Restart Mode
until the temperature decreases to around 75C,
when normal operation resumes.
Figure 26. Burst-Mode Operation
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
12
FSL156MRIN — Green-Mode Power Switch (FPS™)
4.6 Line Over-Voltage Protection (LOVP): If the line
input voltage is increased to an unwanted level, high
line input voltage creates high-voltage stress on the
entire system. To protect from this abnormal condition,
LOVP is included. It is comprised of detecting VIN using
divided resistors. When VIN is higher than 1.95V, this
condition is recognized as an abnormal error and PWM
switching shuts down until VIN decreases to around
1.89V (60mV hysteresis).
4.3. Output-Short Protection (OSP): If the output is
shorted, steep current with extremely high di/dt can
flow through the SenseFET during the minimum turnon time. Such a steep current creates high-voltage
stress on the drain of the SenseFET when turned off.
To protect the device from this abnormal condition,
OSP is included. It is comprised of detecting VFB and
SenseFET turn-on time. When the VFB is higher than
2.0V and the SenseFET turn-on time is lower than
1.0μs, this condition is recognized as an abnormal
error and PWM switching shuts down until VCC
reaches VSTART again. An abnormal condition output
short is shown in Figure 24.
Figure 27. Random Frequency Fluctuation
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
FSL156MRIN — Green-Mode Power Switch (FPS™)
6. Random Frequency Fluctuation (RFF): Fluctuating
switching frequency of an SMPS can reduce EMI by
spreading the energy over a wide frequency range. The
amount of EMI reduction is directly related to the
switching frequency variation, which is limited internally.
The switching frequency is determined randomly by
external feedback voltage and an internal free-running
oscillator at every switching instant. RFF effectively
scatters EMI noise around typical switching frequency
(67kHz) and can reduce the cost of the input filter
included to meet the EMI requirements (e.g. EN55022).
www.onsemi.com
13
FSL156MRIN — Green-Mode Power Switch (FPS™)
Package Dimensions
9.83
9.00
6.67
6.096
8.255
7.61
3.683
3.20
5.08 MAX
7.62
0.33 MIN
3.60
3.00
(0.56)
2.54
0.56
0.355
0.356
0.20
9.957
7.87
1.65
1.27
7.62
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO
JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994
E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.
Figure 28. 8-Lead, MDIP, JEDEC MS-001, .300" Wide
© 2012 Semiconductor Components Industries, LLC.
FSL156MRIN • Rev. 2
www.onsemi.com
14
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