GTLP18T612MTDX

Revised July 2002 GTLP18T612 18-Bit LVTTL/GTLP Universal Bus Transceiver General Description Features The GTLP18T612 is an 18-bit universal bus transceiver which provides LVTTL to GTLP signal level translation. It allows for transparent, latched and clocked modes of data transfer. The device provides a high speed interface for cards operating at LVTTL logic levels and a backplane operating at GTLP logic levels. High speed backplane operation is a direct result of GTLP’s reduced output swing (< 1V), reduced input threshold levels and output edge rate control. The edge rate control minimizes bus settling time. GTLP is a Fairchild Semiconductor derivative of the Gunning Transistor logic (GTL) JEDEC standard JESD8-3. ■ Bidirectional interface between GTLP and LVTTL logic levels Fairchild’s GTLP has internal edge-rate control and is Process, Voltage, and Temperature (PVT) compensated. Its function is similar to BTL or GTL but with different output levels and receiver thresholds. GTLP output LOW level is less than 0.5V, the output HIGH is 1.5V and the receiver threshold is 1.0V. ■ Designed with edge rate control circuitry to reduce output noise on the GTLP port ■ VREF pin provides external supply reference voltage for receiver threshold adjustibility ■ Special PVT compensation circuitry to provide consistent performance over variations of process, supply voltage and temperature ■ TTL compatible driver and control inputs ■ Designed using Fairchild advanced BiCMOS technology ■ Bushold data inputs on A port to eliminate the need for external pull-up resistors for unused inputs ■ Power up/down and power off high impedance for live insertion ■ Open drain on GTLP to support wired-or connection ■ Flow through pinout optimizes PCB layout ■ D-type flip-flop, latch and transparent data paths ■ A Port source/sink −24mA/+24mA ■ B Port sink +50mA ■ Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number GTLP18T612G (Note 1)(Note 2) Package Number BGA54A GTLP18T612MEA (Note 2) MS56A GTLP18T612MTD (Note 2) MTD56 Package Description 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 1: Ordering code “G” indicates Trays. Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. © 2002 Fairchild Semiconductor Corporation DS500169 www.fairchildsemi.com GTLP18T612 18-Bit LVTTL/GTLP Universal Bus Transceiver May 1999 GTLP18T612 Connection Diagrams Pin Descriptions Pin Assignments for SSOP and TSSOP Pin Names Description OEAB A-to-B Output Enable (Active LOW) (LVTTL Level) OEBA B-to-A Output Enable (Active LOW) (LVTTL Level) CEAB A-to-B Clock/LE Enable (Active LOW) (LVTTL Level) CEBA B-to-A Clock/LE Enable (Active LOW) (LVTTL Level) LEAB A-to-B Latch Enable (Transparent HIGH) (LVTTL Level) LEBA B-to-A Latch Enable (Transparent HIGH) (LVTTL Level) VREF GTLP Input Threshold Reference Voltage CLKAB A-to-B Clock (LVTTL Level) CLKBA B-to-A Clock (LVTTL Level) A1–A18 A-to-B Data Inputs or B-to-A 3-STATE Outputs B1–B18 B-to-A Data Inputs or A-to-B Open Drain Outputs FBGA Pin Assignments Pin Assignments for FBGA (Top Thru View) www.fairchildsemi.com 2 1 2 A A2 A1 OEAB CLKAB 3 4 5 6 B2 B1 B A4 A3 LEAB C A6 A5 VCC CEAB B4 B3 VCC B6 D A8 A7 B5 GND GND B8 E A10 B7 A9 GND GND B10 F B9 A12 A11 GND GND B12 B11 G A14 A13 VCC VREF B14 B13 H A16 A15 OEBA CEBA B16 B15 J A18 A17 LEBA CLKBA B18 B17 Truth Table The GTLP18T612 is an 18 bit registered transceiver containing D-type flip-flop, latch and transparent modes of operation for the data path. Data flow in each direction is controlled by the clock enables (CEAB and CEBA), latch enables (LEAB and LEBA), clock (CLKAB and CLKBA) and output enables (OEAB and OEBA). The clock enables (CEAB and CEBA) and the output enables (OEAB and OEBA) control the 18 bits of data for the A-to-B and B-to-A directions respectively. (Note 3) For A-to-B data flow, when CEAB is LOW, the device operates on the LOW-to-HIGH transition of CLKAB for the flipflop and on the HIGH-to-LOW transition of LEAB for the latch path. That is, if CEAB is LOW and LEAB is LOW the A data is latched regardless as to the state of CLKAB (HIGH or LOW) and if LEAB is HIGH the device is in transparent mode. When OEAB is LOW the outputs are active. When OEAB is HIGH the outputs are HIGH impedance. The data flow of B-to-A is similar except that CEBA, OEBA, LEBA, and CLKBA are used. Inputs Output CEAB OEAB LEAB CLKAB A B Z Mode X H X X X L L L H X B0 (Note 4) Storage L L L L X B0 (Note 5) of A Data X L H X L L X L H X H H L L L ↑ L L L L L ↑ H H Latched Transparent Clocked Storage of A Data H L L X X B0 (Note 5) Clock Inhibit Note 3: A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA, LEBA, CLKBA, and CEBA. Note 4: Output level before the indicated steady state input conditions were established, provided that CLKAB was HIGH before LEAB went LOW. Note 5: Output level before the indicated steady-state input conditions were established. Logic Diagram 3 www.fairchildsemi.com GTLP18T612 Functional Description GTLP18T612 Absolute Maximum Ratings(Note 6) Supply Voltage (VCC ) −0.5V to +4.6V DC Input Voltage (VI) −0.5V to +4.6V Recommended Operating Conditions (Note 8) Supply Voltage VCC /VCCQ DC Output Voltage (VO) 3.15V to 3.45V Bus Termination Voltage (VTT) −0.5V to +4.6V Outputs 3-STATE −0.5V to VCC + 0.5V Outputs Active (Note 7) DC Output Sink Current into GTLP 1.47V to 1.53V VREF 0.98V to 1.02V Input Voltage (VI) A Port IOL 48 mA DC Output Source Current from A Port IOH on A Port and Control Pins 0.0V to 3.45V on B Port 0.0V to 3.45V −48 mA HIGH Level Output Current (IOH) 100 mA LOW Level Output Current (IOL) DC Output Sink Current into −24 mA A Port B Port in the LOW State, IOL DC Input Diode Current (IIK) +24 mA A Port VI < 0V −50 mA +50 mA B Port DC Output Diode Current (IOK) −40°C to +85°C Operating Temperature (TA) VO < 0V −50 mA VO > VCC +50 mA Note 6: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions in not implied. >2000V ESD Performance −65°C to +150 °C Storage Temperature (TSTG) Note 7: IO Absolute Maximum Rating must be observed. Note 8: Unused inputs must be held HIGH or LOW. DC Electrical Characteristics Over Recommended Operating Free-Air Temperature Range, VREF = 1.0V (unless otherwise noted). Symbol VIH VIL Test Conditions Min Typ B Port VREF +0.05 Others 2.0 B Port 0.0 VTT VREF − 0.05 Others VREF 0.8 GTLP (Note 10) 1.0 GTL 0.8 VCC = 3.15V VIK VOH A Port II = −18 mA VCC, VCCQ = Min to Max (Note 11) IOH = −100 µA VCC = 3.15V VOL A Port B Port II 2.4 IOH = -24mA 2.0 0.2 VCC = 3.15V IOL = 40 mA 0.40 IOL = 50 mA 0.55 Control Pins VCC = Min to Max (Note 11) VI = 3.45V or 0V ±5 VCC = 3.45V VI = 0V −10 VI = 3.45 10 A Port A Port VCC = 3.45V VCC = 3.45V B Port A or B Ports (VCC/VCCQ) www.fairchildsemi.com 5 VI = 0 −5 VI = 0.8V B Port A Port VI = VCC VI or VO = 0 to 3.45V VCC = 3.15V 30 75 VI = 2.0V −75 VO = 3.45 10 VO = 1.5V 5 VO = 0V −10 VO = 0.55V −5 VCC = 3.45V Outputs HIGH 30 40 IO = 0 Outputs LOW 30 40 VI = VCC or GND Outputs Disabled 30 45 4 V V V 0.5 A Port and Control Pins VCC = 0 ICC IOH = −8 mA IOL = 24mA IOFF IOZL −1.2 VCC, VCCQ = Min to Max (Note 11) IOL = 100 µA II(hold) V VCC –0.2 VCC = 3.15V VCC = 3.45V Units V A Port B Port IOZH Max (Note 9) V V µA µA µA µA µA µA µA mA Symbol (Continued) Test Conditions Min Typ Max Units 2 mA (Note 9) ∆ICC A Port and VCC = 3.45V, (Note 12) Control Pins A or Control Inputs at VCC or GND Ci Control Pins VI = VCC or 0 6 A Port VI = VCC or 0 7.5 B Port VI = VCC or 0 9.0 One Input at 2.7V 0 pF Note 9: All typical values are at VCC = 3.3V, VCCQ = 3.3V, and TA = 25°C. Note 10: GTLP VREF and VTT are specified to 2% tolerance since signal integrity and noise margin can be significantly degraded if these supplies are noisy. In addition, VTT and Rterm can be adjusted beyond the recommended operating conditions to accommodate backplane impedances other than 50Ω, but must remain within the boundaries of the DC Absolute Maximum ratings. Similarly VREF can be adjusted to optimize noise margin. Note 11: For conditions shown as Min or Max, use the appropriate value specified under recommended operating conditions. Note 12: This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. AC Operating Requirements Over recommended ranges of supply voltage and operating free-air temperature, VREF = 1.0V (unless otherwise noted). Symbol fMAX Maximum Clock Frequency tWIDTH Pulse Duration tSU tHOLD Setup Time Hold Time Test Conditions Min 175 LEAB or LEBA HIGH 3.0 CLKAB or CLKBA HIGH or LOW 3.0 A before CLKAB↑ 1.1 B before CLKBA↑ 3.0 A before LEAB 1.1 B before LEBA 2.7 CEAB before CLKAB↑ 1.2 CEBA before CLKBA↑ 1.4 A after CLKAB↑ 0.0 B after CLKBA↑ 0.0 A after LEAB 0.8 B after LEBA 0.0 CEAB after CLKAB↑ 1.0 CEBA after CLKBA↑ 1.9 5 Max Unit MHz ns ns ns www.fairchildsemi.com GTLP18T612 DC Electrical Characteristics GTLP18T612 AC Electrical Characteristics Over recommended range of supply voltage and operating free-air temperature, VREF = 1.0V (unless otherwise noted). CL = 30 pF for B Port and CL = 50 pF for A Port. Symbol tPLH From To (Input) (Output) Min A B tPHL tPLH LEAB B tPHL CLKAB tPLH B tPHL tPLH OEAB B tPHL tRISE Transition Time, B Outputs (20% to 80%) tFALL Transition Time, B Outputs (20% to 80%) tPLH 4.1 6.3 1.0 2.7 4.4 2.2 4.2 6.3 1.0 2.4 4.2 2.2 4.4 6.5 1.0 2.5 4.4 2.0 3.8 5.6 1.0 2.6 4.3 ns ns ns ns ns 1.8 1.8 3.8 5.8 LEBA A 0.3 2.2 4.6 0.4 2.4 4.6 CLKBA A 0.5 2.4 4.6 0.6 2.6 4.6 0.3 2.7 5.2 0.3 2.5 5.2 OEBA Unit 2.1 A tPHL tPZH, tPZL 2.1 B tPHL tPLH Max 3.1 tPHL tPLH Typ (Note 13) A tPHZ, tPLZ 3.8 5.8 ns ns ns ns Note 13: All typical values are at VCC = 3.3V, and TA = 25°C. Extended Electrical Characteristics Over recommended ranges of supply voltage and operating free-air temperature VREF = 1.0V (unless otherwise noted). CL = 30 pF for B Port and CL = 50 pF for A Port. Symbol tOSLH (Note 14) From To (Input) (Output) Min (Note 13) A B tOSHL (Note 14) tPV(HL) (Note 15)(Note 16) tOSLH (Note 14) tOSLH (Note 14) tPV (Note 15) Unit 0.8 1.0 ns 0.3 0.5 ns B CLKAB B CLKAB B B A 0.7 0.6 1.0 ns B A 0.7 1.1 ns 1.5 ns 1.0 ns tOSHL (Note 14) tOST (Note 14) Max A tOSHL (Note 14) tPV(HL) (Note 15)(Note 16) Typ 0.8 ns 0.9 1.0 ns 0.3 0.5 ns 0.8 ns 1.0 ns B A CLKAB A 0.5 0.6 1.0 ns tOST (Note 14) CLKAB A 1.1 1.2 ns tPV (Note 15) CLKAB A 1.5 ns tOSLH (Note 14) tOSHL (Note 14) Note 14: tOSHL/tOSLH and tOST - Output to output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs within the same packaged device. The specifications are given for specific worst case VCC and temperature and apply to any outputs switching in the same direction either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH) or in opposite directions both HL and LH (tOST). This parameter is guaranteed by design and statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the device. Note 15: tPV - Part to part skew is defined as the absolute value of the difference between the actual propagation delay for all outputs from device to device. The parameter is specified for a specific worst case VCC and temperature. This parameter is guaranteed by design and statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the device. Note 16: Due to the open drain structure on GTLP outputs tOST and t PV(LH) in the A-to-B direction are not specified. Skew on these paths is dependent on the VTT and RT values on the backplane. www.fairchildsemi.com 6 Test Circuit for A Outputs Test Test Circuit for B Outputs S tPLH/tPHL Open tPLZ/tPZL 6V Note B: For B Port, CL = 30 pF is used for worst case. tPHZ/tPZH GND Note A: CL includes probes and Jig capacitance. Voltage Waveform - Propagation Delay Times Voltage Waveform - Setup and Hold Times Voltage Waveform - Pulse Width Voltage Waveform - Enable and Disable times Output Waveform 1 is for an output with internal conditions such that the output is LOW except when disabled by the control output. Output Waveform 2 is for an output with internal conditions such that the output is HIGH except when disabled by the control output. Input and Measure Conditions A or LVTTL Pins B or GTLP Pins VinHIGH 3.0 1.5 VinLOW 0.0 0.0 VM 1.5 1.0 VX VOL + 0.3V N/A VY VOH − 0.3V N/A All input pulses have the following characteristics: Frequency = 10MHz, tRISE = tFALL = 2 ns (10% to 90%), Z O = 50Ω. The outputs are measured one at a time with one transition per measurement. 7 www.fairchildsemi.com GTLP18T612 Test Circuits and Timing Waveforms GTLP18T612 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A www.fairchildsemi.com 8 GTLP18T612 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS56A 9 www.fairchildsemi.com GTLP18T612 18-Bit LVTTL/GTLP Universal Bus Transceiver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD56 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 10