PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
PACKAGE
H11C5
SCHEMATIC
ANODE 1
6
H11C6
6 GATE
6
CATHODE 2
5 ANODE
1
N/C 3
1
4 CATHODE
6
1
DESCRIPTION
The H11C series consists of a gallium-arsenide infrared emitting diode optically coupled with a light activated silicon controlled
rectifier in a dual-in-line package
FEATURES
•
•
•
•
•
High efficiency, low degradation, liquid epitaxial LED
Underwriters Laboratory (UL) recognized fl File #E90700
VDE recognized (File #94766) – ordering option .300. (e.g., H11C1.300)
200V/400V Peak blocking voltage
High isolation voltage - 5300V AC (RMS)
APPLICATIONS
•
•
•
•
•
•
•
•
•
Low power logic circuits
Telecommunications equipment
Portable electronics
Solid state relays
Interfacing coupling systems of different potentials and impedances.
10 A, T2L compatible, solid state relay
25 W logic indicator lamp driver
200 V symmetrical transistor coupler (H11C1, H11C2, H11C3)
400 V symmetrical transistor coupler (H11C4, H11C5, H11C6)
© 2003 Fairchild Semiconductor Corporation
Page 1 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
Parameter
H11C4
Symbol
H11C5
Device
Value
H11C6
Units
TOTAL DEVICE
Storage Temperature
TSTG
All
-55 to +150
°C
Operating Temperature
TOPR
All
-55 to +100
°C
Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
EMITTER
Continuous Forward Current
IF
All
60
mA
Reverse Voltage
VR
All
6
V
IF(pk)
All
3.0
A
PD
All
100
mW
1.33
mW/°C
PD
All
400
mW
5.3
mW/°C
PD
All
VGR
Forward Current - Peak (1 µs pulse, 300 pps)
LED Power Dissipation
Derate above 25°C
DETECTOR
Power Dissipation (ambient)
Derate linearly above 25°C ambient
Power Dissipation (case)
Derate linearly above 25°C case
Peak Reverse Gate Voltage
RMS On-State Current
1
W
13.3
mW/°C
All
6
V
IDM (RMS)
All
300
mA
Peak On-State Current (100 µS, 1% duty cycle)
IDM (Peak)
All
10
A
Surge Current (10ms)
IDM (Surge)
All
5
A
Peak Forward Voltage
VDM
H11C1, H11C2, H11C3
200
V
Peak Forward Voltage
VDM
H11C4, H11C5, H11C6
400
V
© 2003 Fairchild Semiconductor Corporation
Page 2 of 11
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Device
IF = 10 mA
VF
All
VR = 3 V
IR
All
VF = 0 V, f = 1.0 MHz
CJ
All
Min
Typ*
Max
Unit
1.2
1.5
V
10
µA
EMITTER
Input Forward
Voltage
Reverse Leakage
Current
Capacitance
50
pF
DETECTOR
Off-State Voltage
Reverse Voltage
RGK = 10kΩ, TA = 100°C, ID = 50µA
RGK = 10kΩ, TA = 100°C, ID = 150µA
RGK = 10kΩ,TA = 100°C, IR = 50µA
Reverse Current
VRM
RGK = 10kΩ,TA = 100°C, IR = 150µA
On-State Voltage
Off-State Current
VDM
ITM = 300 mA
VTM
VDM = 200V, TA = 100°C, IF = 0 mA,
RGK = 10kΩ
H11C1, H11C2, H11C3
200
H11C4, H11C5, H11C6
400
H11C1, H11C2, H11C3
200
H11C4, H11C5, H11C6
400
All
V
V
1.2
1.3
V
H11C1, H11C2, H11C3
50
µA
H11C4, H11C5, H11C6
150
H11C1, H11C2, H11C3
50
H11C4, H11C5, H11C6
150
IDM
VDM = 400V, TA = 100°C, IF = 0 mA,
RGK = 10kΩ
VRM = 200 V, TA = 100 °C, IF = 0 mA,
RGK = 10kΩ
IRM
VRM = 400 V, TA = 100 °C, IF = 0 mA,
RGK = 10kΩ
µA
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
Characteristics
Test Conditions
Symbol
VAK = 50 V, RGK = 10 kΩ
Input Current to Trigger
IFT
VAK = 100 V, RGK = 27 kΩ
Coupled dv/dt, input to
output (figure 8)
dv/dt
Device
Min
Typ*
Max
H11C1,H11C2,
H11C4, H11C5
20
H11C3, H11C6
30
H11C1,H11C2,
H11C4, H11C5
11
H11C3, H11C6
14
ALL
500
Units
mA
V/µS
*Typical values at TA = 25°C
© 2003 Fairchild Semiconductor Corporation
Page 3 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ISOLATION CHARACTERISTICS
Characteristic
Test Conditions
Symbol
Min
Isolation Voltage
(t = 1 min.) (note 1)
VISO
5300
(note 1) (VI-O = 500 VDC)
RISO
1011
(note 1) (f = 1 MHz, VI-O = 0)
CI-O
Isolation Resistance
Isolation Capacitance
Typ*
Max
Units
V
Ω
0.8
pF
*Typical values at TA = 25°C
Note
1. For this test, LED pins 1 and 2 are common, and SCR pins 4, 5 and 6 are common.
© 2003 Fairchild Semiconductor Corporation
Page 4 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
Figure 1. LED Forward Current vs. Forward Voltage
H11C6
Figure 2. Trigger Current vs Anode-Cathode Voltage
100
100
10
TA = 25˚C
TA = -40˚C
TA = 100˚C
1
0.1
0.0
R GK = 300 ohm
IFT , NORMALIZED TRIGGER CURRENT
FORWARD CURRENT - IF (mA)
H11C5
10
R GK = 1K
R GK = 10K
1
R GK = 27K
RGK = 56K
NORMALIZED TO
VAK = 50V
R GK = 10K
TA = 25oC
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1
10
100
VAK, ANODE-CATHODE VOLTAGE (V)
FORWARD VOLTAGE - VF (V)
Figure 3. Input Trigger Current vs. Temperature
Figure 4. Off-State Current vs. Temperature
R GK = 300 ohm
10
R GK = 1K
R GK = 10K
1
R GK = 27K
R GK = 56K
NORMALIZED TO
TA = 25 oC
R GK = 10K
VAK = 50V
0.1
-60
-40
-20
0
20
40
60
TA, AMBIENT TEMPERATURE ( oC)
80
100
I DM , OFF-STATE FORWARD CURRENT, NORMALIZED
IFT , INPUT TRIGGER CURRENT, NORMALIZED
1000
100
VAK = 400V
10
VAK = 200V
VAK = 50V
1
NORMALIZED TO
TA = 25oC
VAK = 50V
0.1
0
20
40
60
80
100
o
T A, AMBIENT TEMPERATURE ( C)
© 2003 Fairchild Semiconductor Corporation
Page 5 of 11
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Figure 6. On-State Characteristics
1000
Figure 5. Forward Blocking Voltage, VDM vs. Temperature
700
R GK = 10K, 20K
ON-STATE CURRENT - ITM (mA)
V DM , FORWARD BLOCKING VOLTAGE (V)
650
600
550
R GK = 50K
500
R GK = 100K
450
100
˚
TA = 25 C
˚
TA = 100 C
10
400
350
300
0
20
40
60
80
100
1
0.0
o
TA , AMBIENT TEMPERATURE ( C)
0.5
1.0
1.5
2.0
2.5
3.0
ON-STATE VOLTAGE - VTM (V)
Figure 7. Holding Current, IH vs. Temperature
10000
IH , HOLDING CURRENT (µA)
RGK = 300 ohm
RGK = 1K
1000
RGK = 10K
100
RGK = 27K
RGK = 56K
10
-60
-40
-20
0
20
40
60
80
100
o
T A, AMBIENT TEMPERATURE ( C)
© 2003 Fairchild Semiconductor Corporation
Page 6 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
TYPICAL APPLICATIONS
10A, T2L COMPATIBLE, SOLID
STATE RELAY
LOAD
47 Ω
Use of the H11C4 for high sensitivity, 5300 V isolation capability,
provides this highly reliable solid
state relay design. This design is
compatible with 74, 74S and 74H
series T2L logic systems inputs
and 120V AC (H11C1, H11C2,
H11C3) or 220V AC (H11C4,
H11C5, H11C6) loads up to 10A.
470 Ω
100 Ω
+5V
"CONTACT"
120 VAC (H11C1, H11C2, H11C3)
220 VAC (H11C4, H11C5, H11C6)
H11CX
"COIL"
SC146D
0.1 µF
56K
47 Ω
IN5060 (4)
25W, LOGIC INDICATOR LAMP DRIVER
INDICATOR
LAMP
The high surge capability and non-reactive input characteristics of the H11C allow it to directly couple, without buffers,
T2L and DTL logic to indicator alarm devices, without danger
of introducing noise and logic glitches.
470 Ω
+5V
H11CX
100 Ω
LOGIC
INPUT
120 VAC (H11C1, H11C2, H11C3)
220 VAC (H11C4, H11C5, H11C6)
0.1 µF
56K
200V/400V SYMMETRICAL TRANSISTOR COUPLER
Use of the high voltage PNP portion of the H11C provides a 400V transistor capable of
conducting positive and negative signals with current transfer ratios of over 1%. This function
is useful in remote instrumentation, high voltage power supplies and test equipment. Care
should be taken not to exceed the H11C 400mW power dissipation rating when used at high
voltages.
H11CX
INPUT
OUTPUT
+100 VAC
Vp = 800 Volts
tp = .010 Seconds
f = 25 Hertz
TA = 25 °C
100 Ω
H11C4
+
H
Vp
Vp
.63 Vp
tp
dv / dt
EXPONENTIAL
RAMP GEN.
10 KΩ
OSCILLOSCOPE
Fig. 8 Coupled dv/dt - Test Circuit
© 2003 Fairchild Semiconductor Corporation
Page 7 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
Package Dimensions (Through Hole)
H11C5
H11C6
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
3
2
PIN 1
ID.
1
0.270 (6.86)
0.240 (6.10)
SEATING PLANE
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
0.070 (1.78)
0.045 (1.14)
5
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.115 (2.92)
0.200 (5.08)
0.165 (4.18)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.016 (0.40)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.300 (7.62)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.100 (2.54)
TYP
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
SEATING PLANE
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.004 (0.10)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.400 (10.16)
TYP
Note
All dimensions are in inches (millimeters)
© 2003 Fairchild Semiconductor Corporation
Page 8 of 11
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ORDERING INFORMATION
Option
Order Entry Identifier
Description
.S
Surface Mount Lead Bend
SD
.SD
Surface Mount; Tape and Reel
W
.W
0.4" Lead Spacing
.300
VDE 0884
.300W
VDE 0884, 0.4" Lead Spacing
S
300
300W
3S
3SD
.3S
VDE 0884, Surface Mount
.3SD
VDE 0884, Surface Mount, Tape and Reel
MARKING INFORMATION
1
H11C1
2
V XX YY K
6
3
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
Two digit year code, e.g., ‘03’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
© 2003 Fairchild Semiconductor Corporation
Page 9 of 11
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Carrier Tape Specifications
12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1
Ø1.55 ± 0.05
4.0 ± 0.1
0.30 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
13.2 ± 0.2
9.55 ± 0.20
Ø1.6 ± 0.1
10.30 ± 0.20
0.1 MAX
16.0 ± 0.3
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (Black Package, No Suffix)
Temperature (°C)
300
215°C, 10–30 s
250
225 C peak
200
150
Time above 183°C, 60–150 sec
100
50
Ramp up = 3C/sec
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 10 of 11
3/19/03
PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 11 of 11
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