HGTG12N60C3D

UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode 24 A, 600 V HGTG12N60C3D www.onsemi.com The HGTG12N60C3D is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The device has the high input impedance of a MOSFET and the low on−state conduction loss of a bipolar transistor. The much lower on−state voltage drop varies only moderately between 25°C and 150°C. The IGBT used is the development type TA49123. The diode used in anti parallel with the IGBT is the development type TA49061. This IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential Formerly Developmental Type TA49117. C G E E C G Features • • • • • • 24 A, 600 V at TC = 25°C Typical Fall Time 210 ns at TJ = 150°C Short Circuit Rating Low Conduction Loss Hyperfast Anti−Parallel Diode This is a Pb−Free Device TO−247−3LD SHORT LEAD CASE 340CK JEDEC STYLE MARKING DIAGRAM $Y&Z&3&K G12N60C3D $Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = Numeric Date Code &K = Lot Code G12N60C3D = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2001 April, 2020 − Rev. 2 1 Publication Order Number: HGTG12N60C3D/D HGTG12N60C3D ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise specified) Parameter Symbol HGTG12N60C3D Unit BVCES 600 V Collector Current Continuous At TC = 25°C At TC = 110°C IC25 IC110 24 12 A A Average Diode Forward Current at 110°C I(AVG) 15 A ICM 96 A Gate to Emitter Voltage Continuous VGES ±20 V Gate to Emitter Voltage Pulsed VGEM ±30 V Switching Safe Operating Area at TJ = 150°C SSOA 24 A at 600 V PD 104 W 0.83 W/°C TJ, TSTG −40 to 150 °C Maximum Lead Temperature for Soldering TL 260 °C Short Circuit Withstand Time (Note 2) at VGE = 15 V tSC 4 ms Short Circuit Withstand Time (Note 2) at VGE = 10 V tSC 13 ms Collector to Emitter Voltage Collector Current Pulsed (Note 1) Power Dissipation Total at TC = 25°C Power Dissipation Derating TC > 25°C Operating and Storage Junction Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360 V, TJ =125°C, RG = 25 W ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified) Parameter Symbol Collector to Emitter Breakdown Voltage BVCES IC = 250 mA, VGE = 0 V Emitter to Collector Breakdown Voltage BVECS IC = 10 mA, VGE = 0 V Collector to Emitter Leakage Current Collector to Emitter Saturation Voltage ICES VCE(SAT) Test Condition Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On−State Gate Charge Current Turn−On Delay Time Current Rise Time Current Turn−Off Delay Time Current Fall Time VGE(TH) IGES SSOA VGEP QG(ON) td(ON)I trI td(OFF)I tfI Typ Max Unit 600 − − V 15 25 − V VCE = BVCES TC = 25°C − − 250 mA VCE = BVCES TC = 150°C − − 2.0 mA IC = IC110, VGE = 15 V TC = 25°C − 1.65 2.0 V TC = 150°C − 1.85 2.2 V TC = 25°C − 1.80 2.2 V TC = 150°C − 2.0 2.4 V TC = 25°C 3.0 5.0 6.0 V − − ±100 nA VCE(PK) = 480 V 80 − − A VCE(PK) = 600 V 24 − − A IC = IC110, VCE = 0.5 BVCES − 7.6 − V IC = IC110, VCE = 0.5 BVCES VGE = 15 V − 48 55 nC VGE = 20 V − 62 71 nC − 14 − ns − 16 − ns − 270 400 ns − 210 275 ns IC = 15 A, VGE = 15 V Gate to Emitter Threshold Voltage Min IC = 250 mA, VCE = VGE VGE = ±20 V TJ = 150°C, VGE = 15 V, RG = 25 W, L = 100 mH TJ = 150°C, ICE = IC110, VCE(PK) = 0.8 BVCES, VGE = 15 V, RG = 25 W, L = 100 mH Turn−On Energy EON − 380 − mJ Turn−Off Energy (Note 3) EOFF − 900 − mJ Diode Forward Voltage VEC − 1.7 2.0 V IEC = 12 A www.onsemi.com 2 HGTG12N60C3D ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified) (continued) Parameter Symbol Diode Reverse Recovery Time trr Thermal Resistance RqJC Test Condition Min Typ Max Unit IEC = 12 A, dIEC/dt = 100 A/ms − 34 42 ns IEC = 1.0 A, dIEC/dt = 100 A/ms − 30 37 ns IGBT − − 1.2 °C/W Diode − − 1.5 °C/W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Turn−Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse, and ending at the point where the collector current equals zero (ICE = 0 A). The HGTG12N60C3D was tested per JEDEC Standard No. 24−1 Method for Measurement of Power Device Turn−Off Switching Loss. This test method produces the true total Turn−Off Energy Loss. Turn−On losses include diode losses. TYPICAL PERFORMANCE CURVES DUTY CYCLE < 0.5%, VCE = 10 V PULSE DURATION = 250 ms 70 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 80 60 50 TC = 150°C 40 TC = 25°C 30 TC = −40°C 20 10 0 4 6 8 10 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 50 40 TC = −40°C TC = 150°C 20 TC = 25°C 10 0 0 1 2 3 30 9.0 V 20 8.5 V 8.0 V 10 0 80 60 30 10.0 V 40 2 4 6 7.0 V 8 7.5 V 10 Figure 2. SATURATION CHARACTERISTICS PULSE DURATION = 250 ms DUTY CYCLE < 0.5%, VGE = 10 V 70 50 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 1. TRANSFER CHARACTERISTICS 80 60 0 14 12 VGE, GATE TO EMITTER VOLTAGE (V) PULSE DURATION = 250 ms, DUTY CYCLE < 0.5%, TC = 25°C 80 VGE = 15 V 12.0 V 70 4 60 40 TC = 150°C 30 20 10 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 3. COLLECTOR TO EMITTER ON−STATE VOLTAGE TC = 25°C TC = −40°C 50 0 5 PULSE DURATION = 250 ms DUTY CYCLE < 0.5%, VGE = 15 V 70 0 1 2 3 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 4. COLLECTOR TO EMITTER ON−STATE VOLTAGE www.onsemi.com 3 5 HGTG12N60C3D VGE = 15 V 20 15 10 5 0 25 50 75 100 125 150 20 100 15 80 10 60 5 10 td(OFF)I, TURN−OFF DELAY TIME (ns) td(ON)I, TURN−ON DELAY TIME (ns) TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V VGE = 10 V 20 VGE = 15 V 5 10 15 20 25 30 400 14 20 15 VGE = 15 V VGE = 10 V 200 100 5 10 15 20 25 30 ICE, COLLECTOR TO EMITTER CURRENT (A) Figure 8. TURN−OFF DELAY TIME vs. COLLECTOR TO EMITTER CURRENT 300 TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V VGE = 10 V tfI FALL TIME (ns) trI, TURN−ON RISE TIME (ns) 13 300 Figure 7. TURN−ON DELAY TIME vs. COLLECTOR TO EMITTER CURRENT 100 12 TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V ICE, COLLECTOR TO EMITTER CURRENT (A) 200 11 Figure 6. SHORT CIRCUIT WITHSTAND TIME 50 10 40 tSC VGE, GATE TO EMITTER VOLTAGE (V) Figure 5. MAXIMUM DC COLLECTOR CURRENT vs. CASE TEMPERATURE 30 120 ISC TC, CASE TEMPERATURE (°C) 100 140 VCE = 360 V, RG = 25 W, TJ = 125°C VGE = 15 V 10 TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V 200 VGE = 10 V or 15 V 100 90 5 5 10 15 20 25 80 30 5 ICE, COLLECTOR TO EMITTER CURRENT (A) 10 15 20 25 ICE, COLLECTOR TO EMITTER CURRENT (A) Figure 9. TURN−ON RISE TIME vs. COLLECTOR TO EMITTER CURRENT Figure 10. TURN−OFF FALL TIME vs. COLLECTOR TO EMITTER CURRENT www.onsemi.com 4 30 ISC, PEAK SHORT CIRCUIT CURRENT (A) 25 tSC, SHORT CIRCUIT WITHSTAND TIME (ms) ICE, DC COLLECTOR CURRENT (A) TYPICAL PERFORMANCE CURVES (continued) HGTG12N60C3D TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V 1.5 VGE = 10 V 1.0 VGE = 15 V 0.5 0 5 10 15 20 25 30 3.0 TJ = 150°C, RG = 25 W, L = 100 mH, VCE(PK) = 480 V 2.5 2.0 1.5 VGE = 10 V or 15 V 1.0 0.5 0 5 ICE, COLLECTOR TO EMITTER CURRENT (A) TJ = 150°C, TC = 75°C, RG = 25 W, L = 100 mH 100 VGE = 10 V 10 1 VGE = 15 V fMAX1 = 0.05 / (tD(OFF)I + tD(ON)I) fMAX2 = (PD − PC) / (EON + EOFF) PD = ALLOWABLE DISSIPATION PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) RqJC = 1.2°C/W 10 5 20 100 60 LIMITED BY CIRCUIT 40 20 0 C, CAPACITANCE (pF) VCE, COLLECTOR TO EMITTER VOLTAGE (V) C IES 1000 500 0 5 10 C OES 15 100 200 300 400 500 600 Figure 14. SWITCHING SAFE OPERATING AREA 1500 0 30 VCE(PK), COLLECTOR EMITTER VOLTAGE (V) FREQUENCY = 1 MHz C RES 25 80 0 30 Figure 13. OPERATING FREQUENCY vs. COLLECTOR TO EMITTER CURRENT 2000 20 TJ = 150°C, VGE = 15 V, RG = 25 W, L = 100 mH ICE, COLLECTOR TO EMITTER CURRENT (A) 2500 15 Figure 12. TURN−OFF ENERGY LOSS vs. COLLECTOR TO EMITTER CURRENT ICE, COLLECTOR TO EMITTER CURRENT (A) fMAX, OPERATING FREQUENCY (kHz) Figure 11. TURN−ON ENERGY LOSS vs. COLLECTOR TO EMITTER CURRENT 200 10 ICE, COLLECTOR TO EMITTER CURRENT (A) 20 VCE = 600 V 360 9 240 6 VCE = 400 V VCE = 200 V 120 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 0 10 20 30 3 40 50 QG, GATE CHARGE (nC) Figure 15. CAPACITANCE vs. COLLECTOR TO EMITTER VOLTAGE Figure 16. GATE CHARGE WAVEFORMS www.onsemi.com 5 15 12 480 0 25 IG(REF) = 1.276 mA, RL = 50 W,TC = 25°C 600 0 60 VGE, GATE TO EMITTER VOLTAGE (V) 2.0 EOFF, TURN−OFF ENERGY LOSS (mJ) EON, TURN−ON ENERGY LOSS (mJ) TYPICAL PERFORMANCE CURVES (continued) HGTG12N60C3D ZqJC, NORMALIZED THERMAL RESPONSE TYPICAL PERFORMANCE CURVES (continued) 100 0.5 0.2 t1 0.1 10 −1 PD 0.05 t2 0.02 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD x ZqJC x RqJC) + TC 0.01 SINGLE PULSE 10−2 10−5 10−4 10−3 10−2 10−1 100 101 t1, RECTANGULAR PULSE DURATION (s) Figure 17. IGBT NORMALIZED TRANSIENT THERMAL IMPEDANCE, JUNCTION TO CASE tr, RECOVERY TIMES (ns) IEC, FORWARD CURRENT (A) 50 40 30 100°C 20 150°C 25°C 10 0 0 0.5 1.0 1.5 2.0 2.5 trr 30 ta 20 tb 10 0 3.0 TC = 25°C, dIEC/dt = 100 A/ms 40 0 5 VEC, FORWARD VOLTAGE (V) 10 15 Figure 18. DIODE FORWARD CURRENT vs. FORWARD VOLTAGE DROP Figure 19. RECOVERY TIMES vs. FORWARD CURRENT TEST CIRCUIT AND WAVEFORMS 90% L = 100 mH RHRP1560 10% VGE EOFF EON VCE RG = 25 W 90% + − 20 IEC, FORWARD CURRENT (A) VDD = 480 V 10% ICE t d(OFF)I t fI t rI t d(ON)I Figure 20. INDUCTIVE SWITCHING TEST CIRCUIT Figure 21. SWITCHING TEST WAVEFORMS www.onsemi.com 6 HGTG12N60C3D OPERATING FREQUENCY INFORMATION Operating frequency information for a typical device (Figure 13) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 4, 7, 8, 11 and 12. The operating frequency plot (Figure 13) of a typical device shows fMAX1 or fMAX2 whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. fMAX1 is defined by fMAX1 = 0.05 / (tD(OFF)I + tD(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on−state time for a 50% duty factor. Other definitions are possible. tD(OFF)I and tD(ON)I are defined in Figure 21. Device turn−off delay can establish an additional frequency limiting condition for an application other than TJM. tD(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD − PC) / (EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM − TC) / RqJC. The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 13) and the conduction losses (PC) are approximated by PC = (VCE x ICE) / 2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn−on and EOFF is the integral of the instantaneous power loss during turn−off. All tail losses are included in the calculation for EOFF; i.e. the collector current equals zero (ICE = 0). HANDLING PRECAUTIONS FOR IGBTs Insulated Gate Bipolar Transistors are susceptible to gate−insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as “ECCOSORBDt LD26” or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means, for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating − Never exceed the gate−voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination − The gates of these devices are essentially capacitors. Circuits that leave the gate open−circuited or floating should be avoided. These conditions can result in turn−on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection − These devices do not have an internal monolithic Zener Diode from gate to emitter. If gate protection is required an external Zener is recommended. ORDERING INFORMATION Part Number HGTG12N60C3D NOTE: Package Brand Shipping TO−247 G12N60C3D 450 Units / Tube When ordering, use the entire part number. All brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders. www.onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−247−3LD SHORT LEAD CASE 340CK ISSUE A A DATE 31 JAN 2019 A E P1 P A2 D2 Q E2 S B D 1 2 D1 E1 2 3 L1 A1 L b4 c (3X) b 0.25 M (2X) b2 B A M DIM (2X) e GENERIC MARKING DIAGRAM* AYWWZZ XXXXXXX XXXXXXX XXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week ZZ = Assembly Lot Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON13851G TO−247−3LD SHORT LEAD A A1 A2 b b2 b4 c D D1 D2 E E1 E2 e L L1 P P1 Q S MILLIMETERS MIN NOM MAX 4.58 4.70 4.82 2.20 2.40 2.60 1.40 1.50 1.60 1.17 1.26 1.35 1.53 1.65 1.77 2.42 2.54 2.66 0.51 0.61 0.71 20.32 20.57 20.82 13.08 ~ ~ 0.51 0.93 1.35 15.37 15.62 15.87 12.81 ~ ~ 4.96 5.08 5.20 ~ 5.56 ~ 15.75 16.00 16.25 3.69 3.81 3.93 3.51 3.58 3.65 6.60 6.80 7.00 5.34 5.46 5.58 5.34 5.46 5.58 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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