LMV393DMR2G

LMV331, LMV393, LMV339 Single, Dual, Quad General Purpose, Low Voltage Comparators The LMV331 is a CMOS single channel, general purpose, low voltage comparator. The LMV393 and LMV339 are dual and quad channel versions, respectively. The LMV331/393/339 are specified for 2.7 V to 5 V performance, have excellent input common−mode range, low quiescent current, and are available in several space saving packages. The LMV331 is available in a 5−pin SC−70, a TSOP−5, and a ULLGA8 package. The LMV393 is available in a 8−pin Micro8t, SOIC−8, and a UDFN8 package, and the LMV339 is available in a SOIC−14 and a TSSOP−14 package. The LMV331/393/339 are cost effective solutions for applications where space saving, low voltage operation, and low power are the primary specifications in circuit design for portable applications. Features http://onsemi.com 1 5 1 TSOP−5 CASE 483 SC−70 CASE 419A 1 ULLGA8 CASE 613AG 1 • • • • • • • • • • • Guaranteed 2.7 V and 5 V Performance Input Common−mode Voltage Range Extends to Ground Open Drain Output for Wired−OR Applications Low Quiescent Current: 60 mA/channel TYP @ 5 V Low Saturation Voltage 200 mV TYP @ 5 V Propagation Delay 200 ns TYP @ 5 V These are Pb−Free Devices Battery Monitors Notebooks and PDA’s General Purpose Portable Devices General Purpose Low Voltage Applications +VCC Micro8 CASE 846A 8 8 1 SOIC−8 CASE 751 1 UDFN8 CASE 517AJ Typical Applications 1 SOIC−14 CASE 751A 1 TSSOP−14 CASE 948G ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. R1 VIN − RPULL−UP VO VCC VO VT2 VT1 VIN V+ + RLOAD 0 R3 R2 Figure 2. Hysteresis Curve Figure 1. Inverting Comparator with Hysteresis © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 3 1 Publication Order Number: LMV331/D LMV331, LMV393, LMV339 MARKING DIAGRAMS SC−70 CASE 419A 5 CCAMG G 1 CCA = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Micro8 CASE 846A 8 V393 AYWG G 1 A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) SOIC−14 CASE 751A 14 LMV339 AWLYWWG 1 A WL Y WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package A L Y W G 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package 14 LMV 339 ALYWG G A L Y W G 3CAAYWG G CAMG G TSOP−5 CASE 483 UDFN8 CASE 517AJ CA = Specific Device Code A = Assembly Location M = Date Code Y = Year G = Pb−Free Package W = Work Week (Note: Microdot may be in either location) G = Pb−Free Package (Note: Microdot may be in either location) SOIC−8 CASE 751 8 V393 ALYW G G ULLGA8 CASE 613AG 1 XXMG 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package XX = Specific Device Code M = Date Code G = Pb−Free Package TSSOP−14 CASE 948G (Note: Microdot may be in either location) PACKAGE PINOUTS SC−70/TSOP−5 +IN GND −IN 1 2 3 5 Micro8 / SOIC−8 / UDFN8 VCC Output A 1 2 8 7 6 5 SOIC−14 / TSSOP−14 Output 2 Output 1 VCC − Input 1 + Input 1 − Input 2 1 2 3 4 5 6 7 14 13 12 VCC Output B Inputs B Output 3 Output 4 GND + Input 4 − Input 4 + Input 3 − Input 3 + − 4 OUTPUT Inputs A GND 3 4 − + − + (Top Views) IN− IN+ VCC−/GND 1 ULLGA8 NC 8 7 (Top Views) OUT NC VCC+ NC − No Internal Connection * 1 ) *2 ) 4 ) * ) * 11 10 9 8 2 6 3 + Input 2 3 4 5 (Top Views) NC (Top Views) http://onsemi.com 2 LMV331, LMV393, LMV339 MAXIMUM RATINGS Symbol VS VIDR TJ Tstg TL VESD Voltage on any Pin (referred to V− pin) Input Differential Voltage Range Maximum Junction Temperature Storage Temperature Range Mounting Temperature (Infrared or Convection (1/16″ From Case for 30 Seconds)) ESD Tolerance (Note 1) Machine Model Human Body Model Rating Value 5.5 ±Supply Voltage 150 −65 to 150 260 100 1000 Unit V V °C °C °C V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC qJA Parameter Supply Voltage Temperature Range (Note 2) Thermal Resistance SC−70 TSOP−5 ULLGA8 Micro8 SOIC−8 UDFN8 SOIC−14 TSSOP−14 Value 2.7 to 5.0 280 333 340 238 212 350 156 190 Unit V °C/W 1. Human Body Model, applicable std. MIL−STD−883, Method 3015.7. Machine Model, applicable std. JESD22−A115−A (ESD MM std. of JEDEC) Field−Induced Charge−Device Model, applicable std. JESD22−C101−C (ESD FICDM std. of JEDEC). 2. The maximum power dissipation is a function of TJ(MAX), qJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA)/qJA. All numbers apply for packages soldered directly onto a PC board. http://onsemi.com 3 LMV331, LMV393, LMV339 2.7 V DC ELECTRICAL CHARACTERISTICS (All limits are guaranteed for TA = 25°C, V+ = 2.7 V, V− = 0 V, VCM = 1.35 V unless otherwise noted.) Parameter Input Offset Voltage Input Offset Voltage Average Drift Input Bias Current (Note 3) Input Offset Current (Note 3) Input Voltage Range Saturation Voltage Output Sink Current Supply Current LMV331 LMV393 LMV339 Symbol VIO TC VIO IB IIO VCM VSAT IO ICC ISINK ≤ 1 mA VO ≤ 1.5 V 5 Condition Min Typ 1.7 5