MAX809 Series,
MAX810 Series
Very Low Supply Current
3-Pin Microprocessor
Reset Monitors
The MAX809 and MAX810 are cost−effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
The reset output is driven active within 10 msec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
timeout period which is trimmed by the factory after VCC rises above
the reset threshold. The MAX810 has an active−high RESET output
while the MAX809 has an active−low RESET output. Both devices
are available in SOT−23 and SC−70 packages.
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 0.5 mA (VCC = 3.2 V) makes these
devices suitable for battery powered applications.
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MARKING
DIAGRAM
3
3
xxx MG
G
SOT−23
(TO−236)
CASE 318
1
1
2
SC−70
(SOT−323)
CASE 419
xx MG
G
Features
1
• Precision VCC Monitor for 1.5 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V
•
•
•
•
•
•
•
•
•
Supplies
Precision Monitoring Voltages from 1.2 V to 4.9 V Available
in 100 mV Steps
Four Guaranteed Minimum Power−On Reset Pulse Width Available
(1 ms, 20 ms, 100 ms, and 140 ms)
RESET Output Guaranteed to VCC = 1.0 V.
Low Supply Current
Compatible with Hot Plug Applications
VCC Transient Immunity
No External Components
Wide Operating Temperature: −40°C to 105°C
These Devices are Pb−Free and are RoHS Compliant
xxx
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
GND
1
3
RESET
RESET
Typical Applications
•
•
•
•
2
VCC
2
SOT−23/SC−70
(Top View)
Computers
Embedded Systems
Battery Powered Equipment
Critical Microprocessor Power Supply Monitoring
NOTE:
RESET is for MAX809
RESET is for MAX810
ORDERING INFORMATION
VCC
VCC
MAX809/810
RESET
RESET
GND
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
VCC
PROCESSOR
DEVICE MARKING INFORMATION
RESET
INPUT
See general marking information in the device marking
section on page 10 of this data sheet.
GND
This document contains information on some products that
are still under development. ON Semiconductor reserves the
right to change or discontinue these products without notice.
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 2016
November, 2017 − Rev. 28
1
Publication Order Number:
MAX809S/D
MAX809 Series, MAX810 Series
3
VCC
Timeout
Counter
VCC
Oscillator
2
RESET
Vref
1 GND
Figure 2. MAX809 Series Complementary Active−Low Output
3
VCC
Timeout
Counter
VCC
Oscillator
2
RESET
Vref
1 GND
Figure 3. MAX810 Series Complementary Active−High Output
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2
MAX809 Series, MAX810 Series
PIN DESCRIPTION
Pin No.
Symbol
1
GND
Description
2
RESET (MAX809)
RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
2
RESET (MAX810)
RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
3
VCC
Ground
Supply Voltage (Typ)
ABSOLUTE MAXIMUM RATINGS
Rating
Power Supply Voltage (VCC to GND)
Symbol
Value
Unit
VCC
−0.3 to 6.0
V
−0.3 to (VCC + 0.3)
V
20
mA
RESET Output Voltage (CMOS)
Input Current, VCC
Output Current, RESET
20
mA
dV/dt (VCC)
100
V/msec
RqJA
301
314
°C/W
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (Soldering, 10 Seconds)
Tsol
+260
°C
Thermal Resistance, Junction−to−Air (Note 1)
SOT−23
SC−70
ESD Protection
Human Body Model (HBM): Following Specification JESD22−A114
Machine Model (MM): Following Specification JESD22−A115
Latchup Current Maximum Rating: Following Specification JESD78 Class II
Positive
Negative
V
2000
200
ILatchup
mA
200
200
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component
characterization.
2. The maximum package power dissipation limit must not be exceeded.
TJ(max) * TA
with TJ(max) = 150°C
PD +
RqJA
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3
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS TA = −40°C to +105°C unless otherwise noted. Typical values are at TA = +25°C. (Note 3)
Symbol
Characteristic
VCC Range
TA = 0°C to +70°C
TA = −40°C to +105°C (Note 4)
Min
Typ
Max
1.0
1.2
−
−
5.5
5.5
Unit
V
Supply Current
VCC = 3.3 V
TA = −40°C to +85°C
TA = 85°C to +105°C (Note 5)
VCC = 5.5 V
TA = −40°C to +85°C
TA = 85°C to +105°C (Note 5)
ICC
Reset Threshold (Vin Decreasing) (Note 6)
VTH
mA
−
−
0.5
−
1.2
2.0
−
−
0.8
−
1.8
2.5
V
MAX809SN490
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.83
4.78
4.66
4.9
−
−
4.97
5.02
5.14
MAX8xxLTR, MAX8xxSQ463
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.56
4.50
4.40
4.63
−
−
4.70
4.75
4.86
MAX809HTR
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.48
4.43
4.32
4.55
4.62
4.67
4.78
MAX8xxMTR, MAX8xxSQ438
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
4.31
4.27
4.16
4.38
4.45
4.49
4.60
MAX809JTR, MAX8xxSQ400
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
3.94
3.90
3.80
4.00
−
−
4.06
4.10
4.20
MAX8xxTTR, MAX809SQ308
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
3.04
3.00
2.92
3.08
−
−
3.11
3.16
3.24
MAX8xxSTR, MAX8xxSQ293
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.89
2.85
2.78
2.93
−
−
2.96
3.00
3.08
MAX8xxRTR, MAX8xxSQ263
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.59
2.56
2.49
2.63
−
−
2.66
2.70
2.77
MAX809SN232, MAX809SQ232
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
2.28
2.25
2.21
2.32
−
−
2.35
2.38
2.45
MAX809SN160
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
1.58
1.56
1.52
1.60
−
−
1.62
1.64
1.68
MAX809SN120, MAX8xxSQ120
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C (Note 5)
1.18
1.17
1.14
1.20
−
−
1.22
1.23
1.26
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
4. For NCV automotive devices, this temperature range is TA = −40°C to +125°C.
5. For NCV automotive devices, this temperature range is TA = +85°C to +125°C.
6. Contact your ON Semiconductor sales representative for other threshold voltage options.
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4
MAX809 Series, MAX810 Series
ELECTRICAL CHARACTERISTICS (continued) TA = −40°C to +105°C unless otherwise noted. Typical values are at
TA = +25°C. (Note 7)
Symbol
Min
Typ
Max
Unit
Detector Voltage Threshold Temperature Coefficient
−
30
−
ppm/°C
VCC to Reset Delay VCC = VTH to (VTH − 100 mV)
−
10
−
msec
1.0
20
100
140
−
−
−
−
3.3
66
330
460
Characteristic
Reset Active TimeOut Period (Note 8)
MAX8xxSN(Q)293D1
MAX8xxSN(Q)293D2
MAX8xxSN(Q)293D3
MAX8xxSN(Q)293
tRP
msec
RESET Output Voltage Low (No Load) (MAX809)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL
−
−
0.3
V
RESET Output Voltage High (No Load) (MAX809)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH
0.8 VCC
−
−
V
RESET Output Voltage High (No Load) (MAX810)
VCC = VTH − 0.2 V
1.6 V v VTH v 2.4 V, ISOURCE = 200 mA
2.5 V v VTH v 4.9 V, ISOURCE = 500 mA
VOH
0.8 VCC
−
−
V
RESET Output Voltage Low (No Load) (MAX810)
VCC = VTH + 0.2 V
1.6 V v VTH v 2.0 V, ISINK = 0.5 mA
2.1 V v VTH v 4.0 V, ISINK = 1.2 mA
4.1 V v VTH v 4.9 V, ISINK = 3.2 mA
VOL
−
−
0.3
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
8. Contact your ON Semiconductor sales representative for timeout options availability for other threshold voltage options.
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5
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
0.6
0.35
VTH = 4.9 V
0.5
0.30
85°C
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
VTH = 1.2 V
0.4
25°C
0.3
−40°C
0.2
0.1
85°C
0.25
0.20
25°C
0.15
−40°C
0.10
0.05
0
0
0.5
1.5
2.5
3.5
5.5
4.5
0.5
6.5
1.5
85°C
0.30
SUPPLY CURRENT (mA)
NORMALIZED THRESHOLD VOLTAGE
VTH = 2.93 V
0.25
25°C
0.20
0.15
−40°C
0.10
0.05
0
2.5
3.5
4.5
5.5
6.5
Figure 5. Supply Current vs. Supply Voltage
0.35
1.5
3.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 4. Supply Current vs. Supply Voltage
0.5
2.5
4.5
5.5
6.5
1.002
1.001
1.000
0.999
VTH = 4.9 V
0.998
0.997
0.996
VTH = 1.2 V
0.995
0.994
−50
−25
SUPPLY VOLTAGE (V)
0
25
50
75
100
TEMPERATURE (°C)
Figure 6. Supply Current vs. Supply Voltage
Figure 7. Normalized Reset Threshold Voltage
vs. Temperature
0.40
0.40
0.32
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
MAX809L/M, VCC = 5.0 V
MAX809R/S/T, VCC = 3.3 V
0.24
0.16
0.08
0
−50
MAX809L/M/R/S/T, VCC = 1.0 V
0.32
MAX810L/M, VCC = 5.0 V
0.24
MAX810R/S/T, VCC = 3.3 V
0.16
MAX810L/M/R/S/T, VCC = 1.0 V
0.08
0
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. Supply Current vs. Temperature
(No Load, MAX809)
Figure 9. Supply Current vs. Temperature (No
Load, MAX810)
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6
MAX809 Series, MAX810 Series
TYPICAL OPERATING CHARACTERISTICS
80
OUTPUT VOLTAGE VCC−VOH (mV)
OUTPUT VOLTAGE VCC (mV)
30
VTH = 4.90 V
ISINK = 500 mA
RESET ASSERTED
25
20
85°C
15
25°C
10
−40°C
5.0
70
VTH = 4.63 V
ISOURCE = 100 mA
RESET ASSERTED
60
50
85°C
40
25°C
30
−40°C
20
10
0
0
0.5 1.0
2.0
1.5
2.5
3.0
3.5
4.0
4.5
0.5
5.0
1.0
POWER−DOWN RESET DELAY (msec)
75
VOD = 20 mV
50
VOD = 100 mV
25
VOD = 200 mV
0
25
75
50
3.5
4.0
4.5
100
125
VOD = VCC−VTH
VOD = 10 mV
300
VOD = 20 mV
200
100
VOD = 100 mV
VOD = 200 mV
0
−50
−25
0
25
50
75
100
TEMPERATURE (°C)
Figure 12. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 1.2 V)
Figure 13. Power−Down Reset Delay vs.
Temperature and Overdrive (VTH = 4.9 V)
1.3
1.2
1.1
1.0
0.9
0.8
0.7
−50
5.0
400
TEMPERATURE (°C)
NORMALIZED POWER−UP RESET TIMEOUT
POWER−DOWN RESET DELAY (msec)
VOD = VCC−VTH
100
−25
3.0
Figure 11. Output Voltage High vs. Supply
Voltage
125
0
−50
2.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 10. Output Voltage Low vs. Supply
Voltage
VOD = 10 mV
2.0
1.5
−25
0
25
50
75
TEMPERATURE (°C)
Figure 14. Normalized Power−Up Reset vs.
Temperature
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7
100
125
MAX809 Series, MAX810 Series
Detail Operation Description
The MAX809/810 series microprocessor reset
supervisory circuits are designed to monitor the power
supplies in digital systems and provide a reset signal to the
processor without any external components. Figure 2 shows
the timing diagram and a typical application below. Initially
consider that input voltage VCC is at a nominal level greater
than the voltage detector upper threshold (VTH). And the
If there is an input power interruption and VCC becomes
significantly deficient, it will fall below the lower detector
threshold (VTH−). This event causes the RESET output to be
in the low state for the MAX809, or in the high state for the
NCP810 devices. After completion of the power
interruption, VCC will rise to its nominal level and become
greater than the VTH. This sequence activates the internal
oscillator circuitry and digital counter to count. After the
count of the timeout period, the reset output will revert back
to the original state.
RESET (RESET) output voltage (Pin 2) will be in the high
state for MAX809, or in the low state for MAX 810 devices.
Input Voltage
VCC
VTH+
VTH–
VCC
Reset Output
MAX809, NCP803
Reset Output
MAX810
VTH–
0V
VCC
VTH–
0V
tRP
Figure 15. Timing Waveforms
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8
MAX809 Series, MAX810 Series
APPLICATIONS INFORMATION
VCC Transient Rejection
maintained valid to VCC = 0 V, a pull−down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 17). This
resistor value, though not critical, should be chosen such that
it does not appreciably load RESET under normal operation
(100 kW will be suitable for most applications).
The MAX809 provides accurate VCC monitoring and
reset timing during power−up, power−down, and
brownout/sag conditions, and rejects negative−going
transients (glitches) on the power supply line. Figure 16
shows the maximum transient duration vs. maximum
negative excursion (overdrive) for glitch rejection. Any
combination of duration and overdrive which lies under the
curve will not generate a reset signal. Combinations above
the curve are detected as a brownout or power−down.
Typically, transient that goes 100 mV below the reset
threshold and lasts 5.0 ms or less will not cause a reset pulse.
Transient immunity can be improved by adding a capacitor
in close proximity to the VCC pin of the MAX809.
VCC
VCC
MAX809/810
RESET
RESET
VCC
R1
100 k
GND
VTH
Overdrive
Figure 17. Ensuring RESET Valid to VCC = 0 V
Processors With Bidirectional I/O Pins
MAXIMUM TRANSIENT DURATION (msec)
Duration
Some Microprocessor’s have bidirectional reset pins.
Depending on the current drive capability of the processor
pin, an indeterminate logic level may result if there is a logic
conflict. This can be avoided by adding a 4.7 kW resistor in
series with the output of the MAX809 (Figure 18). If there
are other components in the system which require a reset
signal, they should be buffered so as not to load the reset line.
If the other components are required to follow the reset I/O
of the Microprocessor, the buffer should be connected as
shown with the solid line.
300
250
200
VTH = 4.9 V
150
VTH = 2.93 V
100
VTH = 1.2 V
50
BUFFER
0
10
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
VCC
60
110
160
210
260
310
360 410
RESET COMPARATOR OVERDRIVE (mV)
VCC
VCC
MAX809/810
Figure 16. Maximum Transient Duration vs.
Overdrive for Glitch Rejection at 25°C
4.7 k
RESET
RESET
RESET Signal Integrity During Power−Down
GND
The MAX809 RESET output is valid to VCC = 1.0 V.
Below this voltage the output becomes an “open circuit” and
does not sink current. This means CMOS logic inputs to the
Microprocessor will be floating at an undetermined voltage.
Most digital systems are completely shutdown well above
this voltage. However, in situations where RESET must be
Microprocessor
RESET
GND
Figure 18. Interfacing to Bidirectional Reset I/O
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9
MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number
VTH* (V)
Timeout* (ms)
Description
MAX809SN160T1G
1.60
140−460
SAA
MAX809SN232T1G
2.32
140−460
SQP
MAX809RTRG
2.63
140−460
SPS
NCV809RTRG
2.63
140−460
RPA
MAX809STRG
2.93
140−460
SPT
NCV809STRG
2.93
140−460
SUC
MAX809TTRG
3.08
140−460
SPU
MAX809JTRG
4.00
140−460
SPR
MAX809MTRG
4.38
140−460
SPV
NCV809MTRG
4.38
140−460
TAT
MAX809HTRG
4.55
140−460
SBD
MAX809LTRG
4.63
140−460
SPW
NCV809LTRG
4.63
140−460
STA
MAX809SN490T1G
4.90
140−460
SBH
MAX809SN120T1G
1.20
140−460
SSO
MAX809SN293D1T1G
2.93
1−3.3
MAX809SN293D2T1G
2.93
NCV809SN293D2T1G
MAX809SN293D3T1G
Package
Shipping†
SOT23−3
(Pb−Free)
3000 / Tape & Reel
SC70−3
(Pb−Free)
3000 / Tape & Reel
SSP
Push−Pull RESET
NCV809SN293D1T1G*
Marking
ACT
20−66
SSQ
2.93
20−66
ACE
2.93
100−330
SSR
MAX809SQ120T1G
1.20
140−460
ZD
MAX809SQ232T1G
2.32
140−460
ZE
MAX809SQ263T1G
2.63
140−460
ZF
MAX809SQ293T1G
2.93
140−460
ZG
MAX809SQ308T1G
3.08
140−460
ZH
MAX809SQ400T1G
4.00
140−460
SZ
MAX809SQ438T1G
4.38
140−460
ZI
MAX809SQ463T1G
4.63
140−460
ZJ
MAX809SQ293D1T1G
2.93
1−3.3
ZK
MAX809SQ293D2T1G
2.93
20−66
ZL
MAX809SQ293D3T1G
2.93
100−330
ZM
NCV809SQ293T1G*
(In Development)
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10
MAX809 Series, MAX810 Series
ORDERING, MARKING AND THRESHOLD INFORMATION
Part Number
VTH** (V)
Timeout** (ms)
Description
MAX810RTRG
2.63
140−460
SPX
MAX810STRG
2.93
140−460
SPY
MAX810TTRG
3.08
140−460
SPZ
MAX810MTRG
4.38
140−460
SQA
MAX810LTRG
4.63
140−460
SQB
MAX810SN120T1G
1.20
140−460
SSS
MAX810SN293D1T1G
2.93
1−3.3
SST
MAX810SN293D2T1G
2.93
20−66
SSU
MAX810SN293D3T1G
2.93
100−330
SSZ
MAX810SQ120T1G
1.20
140−460
MAX810SQ263T1G
2.63
140−460
ZO
MAX810SQ270T1G
2.70
20−66
ZB
MAX810SQ293T1G
2.93
140−460
ZP
MAX810SQ400T1G
4.00
20−66
ZC
MAX810SQ438T1G
4.38
140−460
ZQ
MAX810SQ463T1G
4.63
140−460
ZR
MAX810SQ293D1T1G
2.93
1−3.3
ZS
MAX810SQ293D2T1G
2.93
20−66
ZT
MAX810SQ293D3T1G
2.93
100−330
ZU
Push−Pull RESET
Marking
Package
Shipping†
SOT23−3
(Pb−Free)
3000 / Tape & Reel
SC70−3
(Pb−Free)
3000 / Tape & Reel
ZN
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Contact your ON Semiconductor sales representative for other threshold voltage options.
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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AS
DATE 30 JAN 2018
SCALE 4:1
D
0.25
3
E
1
2
T
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
HE
T
L
3X b
L1
VIEW C
e
TOP VIEW
A
A1
SIDE VIEW
SEE VIEW C
c
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10 °
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10°
GENERIC
MARKING DIAGRAM*
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT
XXXMG
G
1
3X
2.90
3X
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
0.90
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.95
PITCH
0.80
DIMENSIONS: MILLIMETERS
STYLE 1 THRU 5:
CANCELLED
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 7:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 11:
STYLE 12:
PIN 1. ANODE
PIN 1. CATHODE
2. CATHODE
2. CATHODE
3. CATHODE−ANODE
3. ANODE
STYLE 15:
PIN 1. GATE
2. CATHODE
3. ANODE
STYLE 16:
PIN 1. ANODE
2. CATHODE
3. CATHODE
STYLE 17:
PIN 1. NO CONNECTION
2. ANODE
3. CATHODE
STYLE 18:
STYLE 19:
STYLE 20:
PIN 1. NO CONNECTION PIN 1. CATHODE
PIN 1. CATHODE
2. CATHODE
2. ANODE
2. ANODE
3. GATE
3. ANODE
3. CATHODE−ANODE
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 22:
PIN 1. RETURN
2. OUTPUT
3. INPUT
STYLE 23:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 24:
PIN 1. GATE
2. DRAIN
3. SOURCE
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
STYLE 28:
PIN 1. ANODE
2. ANODE
3. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42226B
SOT−23 (TO−236)
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
STYLE 13:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 25:
PIN 1. ANODE
2. CATHODE
3. GATE
STYLE 14:
PIN 1. CATHODE
2. GATE
3. ANODE
STYLE 26:
PIN 1. CATHODE
2. ANODE
3. NO CONNECTION
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419
ISSUE R
DATE 11 OCT 2022
SCALE 4:1
GENERIC
MARKING DIAGRAM
XX MG
G
1
XX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLE 1:
CANCELLED
STYLE 6:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
DOCUMENT NUMBER:
DESCRIPTION:
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 7:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 8:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. CATHODE-ANODE
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. ANODE-CATHODE
98ASB42819B
SC−70 (SOT−323)
STYLE 11:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
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