MC100EP52D

MC10EP52, MC100EP52 3.3V / 5V ECL Differential Data and Clock D Flip-Flop Description The MC10EP/100EP52 is a differential data, differential clock D flip−flop. The device is pin and functionally equivalent to the EL52 device. Data enters the master portion of the flip−flop when the clock is LOW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. The differential clock inputs of the EP52 allow the device to also be used as a negative edge triggered device. The EP52 employs input clamping circuitry so that under open input conditions (pulled down to VEE) the outputs of the device will remain stable. The 100 Series contains temperature compensation. http://onsemi.com MARKING DIAGRAMS* 8 8 8 HEP52 ALYW G 1 SOIC−8 D SUFFIX CASE 751 1 KEP52 ALYW G 1 Features 8 8 1 TSSOP−8 DT SUFFIX CASE 948R 1 8 HP52 ALYWG G 1 DFN8 MN SUFFIX CASE 506AA H K 5T 3O 1 4 KP52 ALYWG G 3OMG G 330 ps Typical Propagation Delay Maximum Frequency u 4 GHz Typical PECL Mode: VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode: VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State Safety Clamp on Inputs Q Output Will Default LOW with Inputs Open or at VEE Pb−Free Packages are Available 5T MG G • • • • • • • • 1 4 = MC10 = MC100 = MC10 = MC100 A = Assembly Location L = Wafer Lot Y = Year W = Work Week M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 7 1 Publication Order Number: MC10EP52/D MC10EP52, MC100EP52 D D 1 8 D 2 7 Table 1. PIN DESCRIPTION VCC Q Flip-Flop CLK 3 6 Q CLK 4 5 VEE FUNCTION PIN CLK*, CLK* ECL Clock Inputs D*, D* ECL Data Input Q, Q ECL Data Outputs VCC Positive Supply VEE Negative Supply EP (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. * Pins will default LOW when left open. Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. TRUTH TABLE D CLK Q L H Z Z L H Z = LOW to HIGH Transition Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor ESD Protection N/A Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 TSSOP−8 DFN8 Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 4 kV > 200 V > 2 kV Pb Pkg Pb−Free Pkg Level 1 Level 1 Level 1 Level 1 Level 3 Level 1 UL 94 V−0 @ 0.125 in 155 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 2 MC10EP52, MC100EP52 Table 4. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder