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MC10EP89DG

MC10EP89DG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC8

  • 描述:

    IC DRIVER 1/0 8SOIC

  • 数据手册
  • 价格&库存
MC10EP89DG 数据手册
3.3 V/5 V ECL Coaxial Cable Driver MC10EP89 Description Features • • • • • • • • • 310 ps Typical Propagation Delay Maximum Frequency > 2 GHz Typical 1.6 V (5 V) and 1.4 V (3.3 V) VOUTpp Swing PECL Mode Operating Range: VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State Safety Clamp on Inputs Q Output Will Default LOW with Inputs Open or at VEE These Devices are Pb−Free, Halogen Free and are RoHS Compliant www.onsemi.com 8 8 1 1 SOIC−8 D SUFFIX CASE 751 TSSOP−8 DT SUFFIX CASE 948R DFN8 MN SUFFIX CASE 506AA MARKING DIAGRAMS* 8 8 1 HEP89 ALYWG G 1 A L Y W D G HP89 ALYWG G 5V DG G The MC10EP89 is a differential fanout gate specifically designed to drive coaxial cables. The device is especially useful in digital video broadcasting applications; for this application, since the system is polarity free, each output can be used as an independent driver. The driver produces swings 70% larger than a standard ECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize signal loss. The 1.6 V (5 V) and 1.4 V (3.3 V) swing allow for termination at both ends of the cable, while maintaining a 800 mV (5 V) and 700 mV (3.3 V) swing at the receiving end of the cable. Because of the larger output swings, the device cannot be terminated into the standard VCC−2.0 V. All of the DC parameters are tested with a 50 W to VCC−3.0 V load. The driver accepts a standard differential ECL input and can run off of the digital video broadcast standard −5.0 V supply. 1 4 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device Package Shipping† MC10EP89DG SOIC−8 (Pb−Free) 98 Units / Tube MC10EP89DTG TSSOP−8 (Pb−Free) 100 Units / Tube MC10EP89DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10EP89MNR4G DFN8 (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2008 April, 2021 − Rev. 8 1 Publication Order Number: MC10EP89/D MC10EP89 Q0 Q0 1 2 8 7 Table 1. PIN DESCRIPTION VCC D Q1 3 6 D Q1 4 5 VEE PIN FUNCTION D*, D* ECL Data Inputs Q0, Q1, Q0, Q1 ECL Data Outputs VCC Positive Supply VEE Negative Supply * Pins will default LOW when left open. Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb−Free Pkg SOIC−8 TSSOP−8 DFN8 Level 1 Level 3 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL−94 V−0 @ 0.125 in Transistor Count 152 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. www.onsemi.com 2 MC10EP89 Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 Condition 2 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 SOIC 8 SOIC 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 TSSOP 8 TSSOP 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder (Pb−Free) 2 220 340 Within Device Skew Q, Q Device to Device Skew (Note 15) 5.0 Cycle−to−Cycle Jitter (See Figure 2 Fmax/JITTER) Input Voltage Swing (Differential Configuration) Q, Q Typ 85°C Max Min Typ >2 280 Output Rise/Fall Times (20% − 80%) Min 250 Max >2 310 370 20 120 5.0 0.5
MC10EP89DG 价格&库存

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