MC14007UBDR2G

MC14007UB Dual Complementary Pair Plus Inverter The MC14007UB multipurpose device consists of three N−Channel and three P−Channel enhancement mode devices packaged to provide access to each device. These versatile parts are useful in inverter circuits, pulse−shapers, linear amplifiers, high input impedance amplifiers, threshold detectors, transmission gating, and functional gating. http://onsemi.com Features • Diode Protection on All Inputs • Supply Voltage Range = 3.0 Vdc to 18 Vdc • Capable of Driving Two Low−power TTL Loads or One Low−power • • • • Schottky TTL Load Over the Rated Temperature Range Pin−for−Pin Replacement for CD4007A or CD4007UB This device has 2 outputs without ESD Protection. Antistatic precautions must be taken. NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable This Device is Pb−Free and is RoHS Compliant SOIC−14 D SUFFIX CASE 751A PIN ASSIGNMENT D−PB 1 14 VDD S−PB 2 13 D−PA GATEB 3 12 OUTC S−NB 4 11 S−PC D−NB 5 10 GATEC GATEA 6 9 S−NC VSS 7 8 D−NA MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol VDD Parameter Unit −0.5 to +18.0 V −0.5 to VDD +0.5 V Input or Output Current (DC or Transient) per Pin ± 10 mA PD Power Dissipation, per Package (Note 1) 500 mW TA Ambient Temperature Range −55 to +125 °C Tstg Storage Temperature Range −65 to +150 °C TL Lead Temperature (8 second Soldering) 260 °C Vin, Vout Iin, Iout DC Supply Voltage Range Value Input or Output Voltage Range (DC or Transient) July, 2014 − Rev. 11 MARKING DIAGRAM 14 14007UG AWLYWW 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Temperature Derating: “D/DW” Package: –7.0 mW/°C from 65°C 5o 125°C. © Semiconductor Components Industries, LLC, 2014 D = DRAIN S = SOURCE 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Indicator ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: MC14007UB/D MC14007UB A A 12 B 9 B 1 C 2 3 INPUT 4 5 VDD 14 C 11 INPUT 1 0 OUTPUT CONDITION 13 INPUT 6 A = C, B = OPEN A = B, C = OPEN 10 8 7 Substrates of P−Channel devices internally connected to VDD; substrates of N−Channel devices internally connected to VSS. VSS Figure 1. Typical Application: 2−Input Analog Multiplexer 14 13 2 1 11 6 12 7 8 3 4 5 10 VDD = PIN 14 VSS = PIN 7 Figure 2. Schematic http://onsemi.com 2 9 MC14007UB ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) −55°C Symbol Characteristic 25°C VDD Vdc Min Max Min Typ (Note 2) 125°C Max Min Max Unit VOL Output Voltage Vin = VDD or 0 “0” Level 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc VOH Vin = 0 or VDD “1” Level 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc 5.0 10 15 − − − 1.0 2.0 2.5 − − − 2.25 4.50 6.75 1.0 2.0 2.5 − − − 1.0 2.0 2.5 “1” Level 5.0 10 15 4.0 8.0 12.5 − − − 4.0 8.0 12.5 2.75 5.50 8.25 − − − 4.0 8.0 12.5 − − − Source 5.0 5.0 10 15 –3.0 –0.64 –1.6 –4.2 − − − − –2.4 –0.51 −1.3 −3.4 –5.0 –1.0 –2.5 –10 − − − − –1.7 −0.36 –0.9 −2.4 − − − − Sink 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 1.0 2.5 10 − − − 0.36 0.9 2.4 − − − mAdc VIL Input Voltage (VO = 4.5 Vdc) (VO = 9.0 Vdc) (VO = 13.5 Vdc) VIH (VO = 0.5 Vdc) (VO = 1.0 Vdc) (VO = 1.5 Vdc) IOH Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) IOL (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) “0” Level Vdc Vdc mAdc Iin Input Current 15 − ±0.1 − ±0.00001 ±0.1 − ±1.0 mAdc Cin Input Capacitance (Vin = 0) − − − − 5.0 7.5 − − pF IDD Quiescent Current (Per Package) 5.0 10 15 − − − 0.25 0.5 1.0 − − − 0.0005 0.0010 0.0015 0.25 0.5 1.0 − − − 7.5 15 30 mAdc Total Supply Current (Notes 3 and 4) (Dynamic plus Quiescent, Per Gate) (CL = 50 pF) 5.0 10 15 IT IT = (0.7 mA/kHz) f + IDD/6 IT = (1.4 mA/kHz) f + IDD/6 IT = (2.2 mA/kHz) f + IDD/6 mAdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25°C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL − 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.003. http://onsemi.com 3 MC14007UB SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25°C) VDD Vdc Min Typ (Note 6) Max Output Rise Time tTLH = (1.2 ns/pF) CL + 30 ns tTLH = (0.5 ns/pF) CL + 20 ns tTLH = (0.4 ns/pF) CL + 15 ns 5.0 10 15 − − − 90 45 35 180 90 70 Output Fall Time tTHL = (1.2 ns/pF) CL + 15 ns tTHL = (0.5 ns/pF) CL + 15 ns tTHL = (0.4 ns/pF) CL + 10 ns 5.0 10 15 − − − 75 40 30 150 80 60 Turn−Off Delay Time tPLH = (1.5 ns/pF) CL + 35 ns tPLH = (0.2 ns/pF) CL + 20 ns tPLH = (0.15 ns/pF) CL + 17.5 ns 5.0 10 15 − − − 60 30 25 125 75 55 Turn−On Delay Time tPHL = (1.0 ns/pF) CL + 10 ns tPHL = (0.3 ns/pF) CL + 15 ns tPHL = (0.2 ns/pF) CL + 15 ns 5.0 10 15 − − − 60 30 25 125 75 55 Symbol tTLH tTHL tPLH tPHL Characteristic Unit ns ns ns ns 5. The formulas given are for the typical characteristics only. Switching specifications are for device connected as an inverter. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD = -VGS VDD = VGS 14 IOH 7 14 VDS = VOH - VDD IOL VSS 7 All unused inputs connected to ground. a TA = -55°C b TA = +25°C c TA = +125°C -8.0 b a c b -12 b c -10 Vdc -16 -15 Vdc a a -20 -10 a VGS = 15 Vdc b c IOL , DRAIN CURRENT (mAdc) IOH , DRAIN CURRENT (mAdc) 20 VGS = -5.0 Vdc VSS All unused inputs connected to ground. 0 -4.0 VDS = VOL c 16 a 10 Vdc 12 b c a TA = -55°C b TA = +25°C c TA = +125°C 8.0 a 4.0 b 5.0 Vdc c 0 -8.0 -6.0 -4.0 VDS, DRAIN VOLTAGE (Vdc) -2.0 -0 0 Figure 3. Typical Output Source Characteristics 2.0 4.0 6.0 VDS, DRAIN VOLTAGE (Vdc) 8.0 Figure 4. Typical Output Sink Characteristics These typical curves are not guarantees, but are design aids. Caution: The maximum current rating is 10 mA per pin. http://onsemi.com 4 10 MC14007UB VDD 500mF PULSE GENERATOR 20 ns 0.01 mF CERAMIC ID VSS tPHL Vout 7 VDD 90% 50% 10% Vin 14 Vin 20 ns VSS tPLH CL VOH 90% 50% 10% Vout VOL tTHL tTLH Figure 5. Switching Time and Power Dissipation Test Circuit and Waveforms APPLICATIONS The MC14007UB dual pair plus inverter, which has access to all its elements offers a number of unique circuit applications. Figures 1, 6, and 7 are a few examples of the device flexibility. +VDD 2 VDD 14 1 13 OUT = A+B•C DISABLE3 11 INPUT10 11 12 10 12OUTPUT 2 B 1 8 OUTPUT 9 9 8 7 5 DISABLE6 3 7 C 4 INPUT DISABLE OUTPUT 1 0 X 0 0 1 0 1 OPEN 6 A Substrates of P−Channel devices internally connected to VDD; Substrates of N−Channel devices internally connected to VSS. X = Don’t Care Figure 7. AOI Functions Using Tree Logic Figure 6. 3−State Buffer http://onsemi.com 5 MC14007UB ORDERING INFORMATION Package Shipping† MC14007UBDG SOIC−14 (Pb−Free) 55 Units / Rail MC14007UBDR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel NLV14007UBDR2G* SOIC−14 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE L 14 1 SCALE 1:1 D DATE 03 FEB 2016 A B 14 8 A3 E H L 1 0.25 B M DETAIL A 7 13X M b 0.25 M C A S B S 0.10 X 45 _ M A1 e DETAIL A h A C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 6.50 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 14 14X 1.18 XXXXXXXXXG AWLYWW 1 1 1.27 PITCH XXXXX A WL Y WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42565B SOIC−14 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOIC−14 CASE 751A−03 ISSUE L DATE 03 FEB 2016 STYLE 1: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 6. NO CONNECTION 7. ANODE/CATHODE 8. ANODE/CATHODE 9. ANODE/CATHODE 10. NO CONNECTION 11. ANODE/CATHODE 12. ANODE/CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 2: CANCELLED STYLE 3: PIN 1. NO CONNECTION 2. ANODE 3. ANODE 4. NO CONNECTION 5. ANODE 6. NO CONNECTION 7. ANODE 8. ANODE 9. ANODE 10. NO CONNECTION 11. ANODE 12. ANODE 13. NO CONNECTION 14. COMMON CATHODE STYLE 4: PIN 1. NO CONNECTION 2. CATHODE 3. CATHODE 4. NO CONNECTION 5. CATHODE 6. NO CONNECTION 7. CATHODE 8. CATHODE 9. CATHODE 10. NO CONNECTION 11. CATHODE 12. CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 5: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. ANODE/CATHODE 5. ANODE/CATHODE 6. NO CONNECTION 7. COMMON ANODE 8. COMMON CATHODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. ANODE/CATHODE 12. ANODE/CATHODE 13. NO CONNECTION 14. COMMON ANODE STYLE 6: PIN 1. CATHODE 2. CATHODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE 7. CATHODE 8. ANODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE STYLE 7: PIN 1. ANODE/CATHODE 2. COMMON ANODE 3. COMMON CATHODE 4. ANODE/CATHODE 5. ANODE/CATHODE 6. ANODE/CATHODE 7. ANODE/CATHODE 8. ANODE/CATHODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. COMMON CATHODE 12. COMMON ANODE 13. ANODE/CATHODE 14. ANODE/CATHODE STYLE 8: PIN 1. COMMON CATHODE 2. ANODE/CATHODE 3. ANODE/CATHODE 4. NO CONNECTION 5. ANODE/CATHODE 6. ANODE/CATHODE 7. COMMON ANODE 8. COMMON ANODE 9. ANODE/CATHODE 10. ANODE/CATHODE 11. NO CONNECTION 12. ANODE/CATHODE 13. ANODE/CATHODE 14. COMMON CATHODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42565B SOIC−14 NB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative