MM3Z10VT1G

MM3ZxxxT1G Series, SZMM3ZxxxT1G Series Zener Voltage Regulators 300 mW SOD−323 Surface Mount This series of Zener diodes is packaged in a SOD−323 surface mount package that has a power dissipation of 300 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com SOD−323 CASE 477 STYLE 1 Specification Features: • Standard Zener Breakdown Voltage Range − 2.4 V to 75 V • Steady State Power Rating of 300 mW • Small Body Outline Dimensions: • 1 Cathode 2 Anode MARKING DIAGRAM xx M • • • • 0.067” x 0.049” (1.7 mm x 1.25 mm) Low Body Height: 0.035” (0.9 mm) Package Weight: 4.507 mg/Unit ESD Rating of Class 3 (> 16 kV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free Devices* G G Mechanical Characteristics: CASE: Void-free, Transfer-Molded Plastic FINISH: All External Surfaces are Corrosion Resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: xx = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. 260°C for 10 Seconds LEADS: Plated with Pb−Sn or Sn Only (Pb−Free) POLARITY: Cathode Indicated by Polarity Band FLAMMABILITY RATING: UL 94 V−0 MOUNTING POSITION: Any ORDERING INFORMATION Device MAXIMUM RATINGS Rating Total Device Dissipation FR−4 Board, (Note 1) @ TA = 25°C Derate above 25°C Symbol Max Unit 300 2.4 mW mW/°C PD Thermal Resistance, Junction−to−Ambient RqJA 416 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. Package Shipping† MM3ZxxxT1G SOD−323 (Pb−Free) 3,000 / Tape & Reel SZMM3ZxxxT1G SOD−323 (Pb−Free) 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 11 1 Publication Order Number: MM3Z2V4T1/D MM3ZxxxT1G Series, SZMM3ZxxxT1G Series ELECTRICAL CHARACTERISTICS Symbol I Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF QVZ C IF VZ VR V IR VF IZT Maximum Temperature Coefficient of VZ Zener Voltage Regulator Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Zener Voltage (Note 2) Zener Impedance Device Marking @ IZT ZZT @ IZT Min Nom Max mA W MM3Z2V4T1G MM3Z2V7T1G MM3Z3V0T1G MM3Z3V3T1G MM3Z3V6T1G 00 01 02 05 06 2.2 2.5 2.8 3.1 3.4 2.4 2.7 3.0 3.3 3.6 2.6 2.9 3.2 3.5 3.8 5 5 5 5 5 MM3Z3V9T1G MM3Z4V3T1G MM3Z4V7T1G MM3Z5V1T1G MM3Z5V6T1G 07 08 09 0A 0C 3.7 4.0 4.4 4.8 5.2 3.9 4.3 4.7 5.1 5.6 4.1 4.6 5.0 5.4 6.0 MM3Z6V2T1G MM3Z6V8T1G MM3Z7V5T1G MM3Z8V2T1G MM3Z9V1T1G 0E 0F 0G 0H 0K 5.8 6.4 7.0 7.7 8.5 6.2 6.8 7.5 8.2 9.1 MM3Z10VT1G MM3Z11VT1G MM3Z12VT1G MM3Z13VT1G MM3Z15VT1G 0L 0M 0N 0P 0T 9.4 10.4 11.4 12.4 14.3 MM3Z16VT1G MM3Z18VT1G MM3Z20VT1G MM3Z22VT1G MM3Z24VT1G 0U 0W 0Z 10 11 MM3Z27VT1G MM3Z30VT1G MM3Z33VT1G MM3Z36VT1G MM3Z39VT1G VZ (Volts) Leakage Current ZZK @ IZK IR @ VR QVZ (mV/k) @ IZT C @ VR = 0 f = 1 MHz W mA mA Volts Min Max pF 100 100 100 95 90 1000 1000 1000 1000 1000 0.5 0.5 0.5 0.5 0.5 50 20 10 5 5 1.0 1.0 1.0 1.0 1.0 −3.5 −3.5 −3.5 −3.5 −3.5 0 0 0 0 0 450 450 450 450 450 5 5 5 5 5 90 90 80 60 40 1000 1000 800 500 200 0.5 0.5 0.5 0.5 0.5 3 3 3 2 1 1.0 1.0 2.0 2.0 2.0 −3.5 −3.5 −3.5 −2.7 −2.0 −2.5 0 0.2 1.2 2.5 450 450 260 225 200 6.6 7.2 7.9 8.7 9.6 5 5 5 5 5 10 15 15 15 15 100 160 160 160 160 0.5 0.5 0.5 0.5 0.5 3 2 1 0.7 0.2 4.0 4.0 5.0 5.0 7.0 0.4 1.2 2.5 3.2 3.8 3.7 4.5 5.3 6.2 7.0 185 155 140 135 130 10 11 12 13.25 15 10.6 11.6 12.7 14.1 15.8 5 5 5 5 5 20 20 25 30 30 160 160 80 80 80 0.5 0.5 0.5 0.5 0.5 0.1 0.1 0.1 0.1 0.05 8.0 8.0 8.0 8.0 10.5 4.5 5.4 6.0 7.0 9.2 8.0 9.0 10 11 13 130 130 130 120 110 15.3 16.8 18.8 20.8 22.8 16.2 18 20 22 24.2 17.1 19.1 21.2 23.3 25.6 5 5 5 5 5 40 45 55 55 70 80 80 100 100 120 0.5 0.5 0.5 0.5 0.5 0.05 0.05 0.05 0.05 0.05 11.2 12.6 14.0 15.4 16.8 10.4 12.4 14.4 16.4 18.4 14 16 18 20 22 105 100 85 85 80 12 14 18 19 20 25.1 28 31 34 37 27 30 33 36 39 28.9 32 35 38 41 2 2 2 2 2 80 80 80 90 130 300 300 300 500 500 0.5 0.5 0.5 0.5 0.5 0.05 0.05 0.05 0.05 0.05 18.9 21.0 23.2 25.2 27.3 21.4 24.4 27.4 30.4 33.4 25.3 29.4 33.4 37.4 41.2 70 70 70 70 45 MM3Z43VT1G MM3Z47VT1G MM3Z51VT1G MM3Z56VT1G 21 1A 1C 1D 40 44 48 52 43 47 51 56 46 50 54 60 2 2 2 2 150 170 180 200 500 500 500 500 0.5 0.5 0.5 0.5 0.05 0.05 0.05 0.05 30.1 32.9 35.7 39.2 37.6 42.0 46.6 52.2 46.6 51.8 57.2 63.8 40 40 40 40 MM3Z62VT1G MM3Z68VT1G MM3Z75VT1G 2A 1F 1G 58 64 70 62 68 75 66 72 79 2 2 2 215 240 255 500 500 500 0.5 0.5 0.5 0.05 0.05 0.05 43.4 47.6 52.5 58.9 65.6 73.4 71.8 79.8 88.6 35 35 35 Device* *Includes SZ-prefix devices where applicable. 2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C. http://onsemi.com 2 MM3ZxxxT1G Series, SZMM3ZxxxT1G Series TYPICAL CHARACTERISTICS 1000 TJ = 25°C IZ(AC) = 0.1 IZ(DC) f = 1 kHz IF, FORWARD CURRENT (mA) Z ZT , DYNAMIC IMPEDANCE ( Ω ) 1000 100 100 IZ = 1 mA 5 mA 10 150°C 10 75°C 3.0 10 VZ, NOMINAL ZENER VOLTAGE 80 0.4 Figure 1. Effect of Zener Voltage on Zener Impedance 0°C 0.5 0.6 0.7 0.8 0.9 1.0 VF, FORWARD VOLTAGE (V) IR, LEAKAGE CURRENT ( μ A) 0 V BIAS 100 1 V BIAS BIAS AT 50% OF VZ NOM 10 100 10 1.0 +150°C 0.1 0.01 0.001 + 25°C 0.0001 −55°C 0.00001 1.0 4.0 10 VZ, NOMINAL ZENER VOLTAGE (V) 70 0 Figure 3. Typical Capacitance 10 20 30 40 50 60 VZ, NOMINAL ZENER VOLTAGE (V) 100 TA = 25°C IZ , ZENER CURRENT (mA) TA = 25°C 10 1.0 0.1 10 1 0.1 0.01 0 2.0 4.0 6.0 8.0 VZ, ZENER VOLTAGE (V) 70 Figure 4. Typical Leakage Current 100 I Z , ZENER CURRENT (mA) 1.2 1000 TA = 25°C 0.01 1.1 Figure 2. Typical Forward Voltage 1000 C, CAPACITANCE (pF) 25°C 1.0 1.0 10 12 10 30 50 70 VZ, ZENER VOLTAGE (V) 90 Figure 6. Zener Voltage versus Zener Current (12 V to 75 V) Figure 5. Zener Voltage versus Zener Current (VZ Up to 12 V) http://onsemi.com 3 MM3ZxxxT1G Series, SZMM3ZxxxT1G Series TYPICAL CHARACTERISTICS 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 TEMPERATURE (°C) 125 Figure 7. Steady State Power Derating http://onsemi.com 4 150 MM3ZxxxT1G Series, SZMM3ZxxxT1G Series PACKAGE DIMENSIONS SOD−323 CASE 477−02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. HE D b 1 2 E MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 A3 A C NOTE 3 L A1 NOTE 5 INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000 STYLE 1: PIN 1. CATHODE 2. ANODE SOLDERING FOOTPRINT* 0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MM3Z2V4T1/D