MOC3062TVM

6-Pin DIP Zero-Cross Triac Driver Optocoupler (600 Volt Peak) MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M www.onsemi.com Description The MOC306XM and MOC316XM devices consist of a GaAs infrared emitting diode optically coupled to a monolithic silicon detector performing the function of a zero voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 115/240 VAC lines, such as solid−state relays, industrial controls, motors, solenoids and consumer appliances, etc. Features • Simplifies Logic Control of 115/240 VAC Power • Zero Voltage Crossing to Minimize Conducted and Radiated Line • • • • Noise 600 V Peak Blocking Voltage Superior Static dv/dt ♦ 600 V/ms (MOC306xM) ♦ 1000 V/ms (MOC316xM) Safety and Regulatory Approvals ♦ UL1577, 4,170 VACRMS for 1 Minute ♦ DIN EN/IEC60747−5−5 These are Pb−Free Devices 1 PDIP6 8.51x6.35, 2.54P CASE 646BY 6 1 PDIP6 8.51x6.35, 2.54P CASE 646BZ 6 1 MARKING DIAGRAM ON MOC3061 V XYYQ MOC3061 = Device Number V = DIN EN/IEC60747−5−5 Option (only appears on component ordered with this option) X = One−Digit Year Code, e.g., ‘5’ YY = Two−Digit Work Week, Ranging from ‘01’ to ‘53’ Q = Assembly Package Code Applications • • • • • • • • PDIP6 8.51x6.35, 2.54P CASE 646BX 6 Solenoid/Valve Controls Static Power Switches Temperature Controls AC Motor Starters Lighting Controls AC Motor Drives E.M. Contactors Solid State Relays SCHEMATIC 6 MAIN TERM. ANODE 1 5 NC* CATHODE 2 N/C 3 ZERO CROSSING CIRCUIT 4 MAIN TERM. *DO NOT CONNECT (TRIAC SUBSTRATE) ORDERING INFORMATION See detailed ordering and shipping information on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2005 May, 2021 − Rev. 2 1 Publication Order Number: MOC3163M/D MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M SAFETY AND INSULATION RATINGS (As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.) Characteristics Parameter Installation Classifications per DIN VDE 0110/1.89 Table 1, For Rated Mains Voltage > 100 ms 12 IDRM, LEAKAGE CURRENT (nA) IFT, LED TRIGGER CURRENT (NORMALIZED) 1.3 1.0 0.8 10 8 6 4 2 0 VTM = 3 V NORMALIZED TO TA = 25°C 1 1000 100 10 1 0.1 −40 10 100 PWIN, LED TRIGGER PULSE WIDTH (ms) −20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) Figure 4. Leakage Current, IDRM vs. Temperature Figure 3. LED Current Required to Trigger vs. LED Pulse Width www.onsemi.com 4 MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M TYPICAL PERFORMANCE CURVES (Continued) 2.4 IDRM2, NORMALIZED 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 −40 −20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 400 200 0 −200 −400 −600 −800 −4 100 −3 −2 −1 0 1 2 3 VTM, ON−STATE VOLTAGE (VOLTS) 4 Figure 6. On−State Characteristics 3.2 1.20 2.8 1.15 2.4 1.10 VINH, NORMALIZED IH, HOLDING CURRENT (NORMALIZED) Figure 5. IDRM2, Leakage in Inhibit State vs. Temperature 2.0 1.6 1.2 0.8 0.4 0.0 −40 TA = 25°C 600 ITM, ON−STATE CURRENT (mA) 2.2 800 IF = RATED IF NORMALIZED TO TA = 25°C NORMALIZED TO TA = 25°C 1.05 1.00 0.95 0.90 0.85 −20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 0.80 −40 100 Figure 7. IH, Holding Current vs. Temperature −20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) Figure 8. Inhibit Voltage vs. Temperature www.onsemi.com 5 100 MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M APPLICATION INFORMATION Basic Applications The 39 W resistor and 0.01 mF capacitor are for snubbing of the triac and is often, but not always, necessary depending upon the particular triac and load used. Suggested method of firing two, back−to−back SCR’s with a ON Semiconductor triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 W.. NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. Typical circuit for use when hot line switching is required. In this circuit the “hot” side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 15 mA for the MOC3061M, 10 mA for the MOC3062M, or 5 mA for the MOC3063M. VCC Rin 1 2 3 6 MOC3061M MOC3062M MOC3063M 360 W HOT FKPF12N60 5 39 W 4 240 VAC 0.01 mF 360 W LOAD NEUTRAL Figure 9. Hot−Line Switching Application Circuit 115 VAC R1 1 VCC Rin D1 6 MOC3061M 2 5 MOC3062M MOC3063M 3 4 SCR SCR 360 W R2 D2 LOAD Figure 10. Inverse−Parallel SCR Driver Circuit www.onsemi.com 6 MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M 260 240 220 200 Max. Ramp−up Rate = 3°C/S Max. Ramp−down Rate = 6°C/S TP tP TL Tsmax Temperature (°C) 180 160 140 tL Preheat Area Tsmin ts 120 100 80 60 40 20 0 120 240 360 Time 25°C to Peak Time (seconds) Profile Freature Pb−Free Assembly Profile Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds Ramp−up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 seconds to 150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Figure 11. Reflow Profile www.onsemi.com 7 MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M ORDERING INFORMATION (Note 5) Package Shipping† DIP 6−Pin (Pb−Free) 50 Units / Tube MOC3061SM SMT 6−Pin (Lead Bend) (Pb−Free) 50 Units / Tube MOC3061SR2M SMT 6−Pin (Lead Bend) (Pb−Free) 1000 / Tape & Reel DIP 6−Pin, DIN EN/IEC60747−5−5 Option (Pb−Free) 50 Units / Tube MOC3061SVM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option (Pb−Free) 50 Units / Tube MOC3061SR2VM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option (Pb−Free) 1000 / Tape & Reel DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option (Pb−Free) 50 Units / Tube Part Number MOC3061M MOC3061VM MOC3061TVM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 5. The product orderable part number system listed in this table also applies to the MOC3062M, MOC3063M, MOC3162M, and MOC3163M product families. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP6 8.51x6.35, 2.54P CASE 646BX ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13449G PDIP6 8.51X6.35, 2.54P DATE 31 JUL 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP6 8.51x6.35, 2.54P CASE 646BY ISSUE A DATE 15 JUL 2019 A B DOCUMENT NUMBER: DESCRIPTION: 98AON13450G PDIP6 8.51x6.35, 2.54P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP6 8.51x6.35, 2.54P CASE 646BZ ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13451G PDIP6 8.51X6.35, 2.54P DATE 31 JUL 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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