MOC81133S

6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 PACKAGE SCHEMATIC ANODE 1 6 6 N/C 6 CATHODE 2 1 5 COLLECTOR 1 N/C 3 4 EMITTER 6 1 DESCRIPTION The MOC811X series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not bonded to an external pin for improved noise immunity FEATURES • High isolation voltage 5300 VAC RMS—1 minute • High BVCEO minimum 70 Volts • Current transfer ratio in selected groups: MOC8111: 20% min. MOC8112: 50% min. MOC8113: 100% min. • Maximum switching time in saturation specified • Underwriters Laboratory (UL) recognized (File #E90700) • VDE recognized (File #94766) APPLICATIONS • • • • • Power Supply Regulators Digital Logic Inputs Microprocessor Inputs Appliance Sensor Systems Industrial Controls © 2004 Fairchild Semiconductor Corporation Page 1 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 ABSOLUTE MAXIMUM RATINGS (TA =25°C Unless otherwise specified) Parameter Symbol Value Unit INPUT LED Forward Current – Continuous Forward Current – Peak (PW = 1µs, 300pps) Reverse Voltage LED Power Dissipation @ TA = 25°C IF 90 mA IF(pk) 3 A VR 6 Volts 135 mW 1.8 mW/°C 200 mW 2.67 mW/°C 260 mW 3.5 mW/°C PD Derate above 25°C OUTPUT TRANSISTOR Detector Power Dissipation @ TA = 25°C PD Derate above 25°C TOTAL DEVICE Total Device Power Dissipation @ TA = 25°C PD Derate above 25°C Ambient Operating Temperature Range TOPR -55 to +100 °C Storage Temperature Range TSTG -55 to +150 °C TSOL 260 °C Lead Soldering Temperature (1/16” from case, 10 sec. duration) © 2004 Fairchild Semiconductor Corporation Page 2 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device VF All VR All Min Typ Max 1.35 1.65 1.15 1.50 Unit EMITTER IF = 60 mA Input Forward Voltage IF = 10 mA Reverse Voltage IR = 10 µA VF = 0 V, f = 1.0 MHz 6.0 15 V V 50 CJ All VR = 3.0 V IR All Breakdow Voltage Collector to Emitter IC = 1.0 mA, IF = 0 BVCEO All 70 V Breakdow Voltage Emitter to Collector IE = 100 µA, IF = 0 BVECO All 7 V Leakage Current Collector to Emitter VCE = 10 V, IF = 0 ICEO All 5 Capacitance Collector to Emitter VCE = 0 V, f = 1 MHz CCE All 8 Capacitance VF = 1 V, f = 1.0 MHz Reverse Leakage Current pF 65 .35 10 µA DETECTOR 50 V pF ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance © 2004 Fairchild Semiconductor Corporation Test Conditions Symbol Min f = 60 Hz, t = 1 min. VISO 5300 VI-O = 500 VDC RISO 1011 VI-O = 0, f = 1 MHz CISO Page 3 of 10 Typ Max Units VRMS Ω 0.5 pF 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified) DC CHARACTERISTICS Output/Input Current Transfer Ratio Test Conditions IF = 10 mA, VCE = 5V Symbol CTR Device Min MOC8111 20 MOC8112 50 MOC8113 100 Collector-Emitter Saturation Voltage IF = 10 mA, IC = 2.5 mA VCE(SAT) All AC CHARACTERISTICSØ Test Conditions Symbol Device RL = 100 Ω, IC = 2 mA, VCC = 10 V See Figure 7 ton toff Typ Max Units % 0.27 0.4 V Typ Max Units All 6.0 10 µS All 5.5 10 µS MOC8111 3.0 5.5 MOC812, MOC8113 4.2 8.0 Min Non-Saturated Switching Times Turn-On Time Turn-Off Time Saturated Switching Times Turn-On Time Rise-Time Turn-Off Time Fall-Time IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V IF = 20 mA, VCE = 0.4 V IF = 10 mA, VCE = 0.4 V © 2004 Fairchild Semiconductor Corporation ton tr toff tf Page 4 of 10 MOC8111 2.0 4.0 MOC812, MOC8113 3.0 6.0 MOC8111 18 34 MOC812, MOC8113 23 39 MOC8111 11 20 MOC812, MOC8113 14 24 µS µS µS µS 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Normalized CTR vs. Forward Current 1.8 1.4 TA = 25°C VCE = 5.0 V Normalized to IF = 10 mA 1.2 1.6 1.0 NORMALIZED CTR VF - FORWARD VOLTAGE (V) 1.7 1.5 TA = -55°C 1.4 1.3 1.2 0.8 0.6 0.4 TA = 25°C 0.2 1.1 TA = 100°C 1.0 0.0 1 10 100 0 5 IF - LED FORWARD CURRENT (mA) NORMALIZED CTR IF = 5 mA 1.2 IF = 10 mA 1.0 0.8 IF = 20 mA 0.4 -75 Normalized to IF = 10 mA TA = 25°C -50 -25 0 25 50 75 TA - AMBIENT TEMPERATURE (°C) © 2004 Fairchild Semiconductor Corporation 100 125 VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1.6 0.6 15 20 IF - FORWARD CURRENT (mA) Fig. 3 Normalized CTR vs. Ambient Temperature 1.4 10 Page 5 of 10 Fig. 4 Collector Emitter Saturation Voltage vs Collector Current 100 10 1 IF = 2.5 mA 0.1 IF = 20 mA 0.01 IF = 5 mA IF = 10 mA TA = 25°C 0.001 0.01 0.1 1 10 IC - COLLECTOR CURRENT (mA) 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 TYPICAL PERFORMANCE CURVES (continued) Fig. 5 Switching Speed vs. Load Resistor Fig. 6 Dark current vs. Ambient Temperature. 1000 ICEO - COLLECTOR-EMITTER DARK CURRENT (µA) 1e+1 SWITCHING SPEED - (µs) IF = 10 mA VCC = 10 V TA = 25°C 100 Toff Tf 10 Ton 1 Tr 0.1 VCE = 10V 1e+0 1e-1 1e-2 1e-3 1e-4 1e-5 1e-6 0.1 1 10 100 R-LOAD RESISTOR (kΩ) © 2004 Fairchild Semiconductor Corporation 0 25 50 75 100 125 TA - AMBIENT TEMPERATURE (°C) Page 6 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 Package Dimensions (Through Hole) MOC8113 Package Dimensions (Surface Mount) 0.350 (8.89) 0.330 (8.38) PIN 1 ID. 3 2 PIN 1 ID. 1 0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 4 0.070 (1.78) 0.045 (1.14) 5 6 0.300 (7.62) TYP 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.154 (3.90) 0.100 (2.54) 0.016 (0.41) 0.008 (0.20) 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0° to 15° 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.300 (7.62) TYP Lead Coplanarity : 0.004 (0.10) MAX 0.100 (2.54) TYP Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.270 (6.86) 0.240 (6.10) 0.060 (1.52) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.415 (10.54) 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0° to 15° 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) © 2004 Fairchild Semiconductor Corporation Page 7 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 ORDERING INFORMATION1 Option Example Part Number Description MOC8111 Through Hole MOC8111S Surface Mount Lead Bend SD MOC8111SD Surface Mount; Tape and Reel W MOC8111W 0.4" Lead Spacing MOC8111300 VDE 0884 MOC8111300W VDE 0884, 0.4" Lead Spacing No Suffix S 300 300W 3S 3SD MOC81113S VDE 0884, Surface Mount MOC81113SD VDE 0884, Surface Mount, Tape and Reel MARKING INFORMATION 1 MOC8111 2 V XX YY K 6 3 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 Two digit year code, e.g., ‘03’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code © 2004 Fairchild Semiconductor Corporation Page 8 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 Carrier Tape Specifications 12.0 ± 0.1 4.85 ± 0.20 4.0 ± 0.1 4.0 ± 0.1 0.30 ± 0.05 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 13.2 ± 0.2 9.55 ± 0.20 10.30 ± 0.20 0.1 MAX 16.0 ± 0.3 Ø1.6 ± 0.1 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile (Black Package, No Suffix) Temperature (°C) 300 215°C, 10–30 s 250 225 C peak 200 150 Time above 183°C, 60–150 sec 100 50 Ramp up = 3C/sec • Peak reflow temperature: 225°C (package surface temperature) • Time of temperature higher than 183°C for 60–150 seconds • One time soldering reflow is recommended 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) © 2004 Fairchild Semiconductor Corporation Page 9 of 10 6/9/04 6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION) MOC8111 MOC8112 MOC8113 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2004 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 10 of 10 6/9/04