NC7SV00L6X

DATA SHEET www.onsemi.com TinyLogic ULP-A 2-Input NAND Gate MARKING DIAGRAMS NC7SV00 SIP6 1.45X1.0 MicroPak CASE 127EB The NC7SV00 is a single 2−Input NAND Gate in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. Pin 1 Features • • • • • • • CCKK XYZ Designed for 0.9 V to 3.6 V VCC Operation 1.5 ns tPD at 3.3 V (Typ) Inputs/Outputs Over−Voltage Tolerant up to 3.6 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.3 V Available in SC−88A and MicroPak™ Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant UDFN6 MicroPak2TM CASE 517DP CCKK XYZ Pin 1 CC KK XY Z = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code = Assembly Plant Code SC−88A CASE 419AC A 1 B 2 GND 5 4 3 VCC A 1 6 VCC B 2 5 NC GND Y 3 XXX = Specific Devic Code M = Date Code G = Pb−Free Package 4 Y MicroPak SC−88A ORDERING INFORMATION See detailed ordering, marking and shipping information on page 6 of this data sheet. Figure 1. Pinout Diagrams (Top Views) A & B XXXMG G Y Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin SC−88A MicroPak Input Output 1 A A A B Y 2 B B L L H 3 GND GND L H H 4 Y Y H L H 5 VCC N.C. H H L 6 − VCC N.C. = No Connect © Semiconductor Components Industries, LLC, 2002 June, 2022 − Rev. 3 1 Publication Order Number: NC7SV00/D NC7SV00 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +4.3 V VIN DC Input Voltage −0.5 to +4.3 V −0.5 to VCC + 0.5 −0.5 to +4.3 −0.5 to +4.3 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Characteristics DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±50 mA ICC or IGND TSTG −65 to +150 °C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88A MicroPak 377 154 °C/W PD Power Dissipation in Still Air SC−88A MicroPak 332 812 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 4000 2000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 2 NC7SV00 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Min Max Unit 0.9 3.6 V 0 3.6 V 0 0 0 VCC 3.6 3.6 −40 +85 °C 0 10 ns/V Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol VIH VIL VOH Parameter Condition High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VCC (V) TA = −405C to +855C Min Typ Max Min Max Unit V 0.9 − 0.5 − − − 1.1 to 1.3 0.65 x VCC − − 0.65 x VCC − 1.4 to 1.6 0.65 x VCC − − 0.65 x VCC − 1.65 to 1.95 0.65 x VCC − − 0.65 x VCC − 2.3 to