DATA SHEET
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LDO Regulator - Ultra-Low
Noise, High PSRR, RF and
Analog Circuits
WLCSP4
CASE 567JZ
450 mA
MARKING DIAGRAM
NCP148
A1
The NCP148 is a linear regulator capable of supplying 450 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP148 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The NCP148
offers soft−start function with optimized slew rate control to use in
camera module. The device is designed to work with a 1 mF input and a
1 mF output ceramic capacitor. It is available in ultra−small 0.35P,
0.64 mm x 0.64 mm Chip Scale Package (CSP).
X
M
= Specific Device Code
= Date Code
PIN CONNECTIONS
IN
Features
•
•
•
•
•
•
•
•
•
•
•
•
X
Operating Input Voltage Range: 1.9 V to 5.5 V
Available in Fixed Voltage Option: 1.8 V to 5.14 V
Optimized Start−up Slew Rate for Camera Sensor
±2% Accuracy Over Load/Temperature
Low Quiescent Current Typ. 55 mA
Standby Current: Typ. 0.1 mA
Very Low Dropout: 150 mV at 450 mA
Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz
Ultra Low Noise: 10 mVRMS
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in WLCSP4 0.64 mm x 0.64 mm x 0.33 mm CASE 567JZ
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
OUT
A1
A2
B1
B2
EN
GND
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of
this data sheet.
Typical Applications
•
•
•
•
Camera Modules
Battery−powered Equipment
Smartphones, Tablets
Cameras, DVRs, STB and Camcorders
VOUT
VIN
IN
OUT
NCP148
CIN
1 mF
Ceramic
EN
COUT
1 mF
Ceramic
ON
OFF
GND
Figure 1. Typical Application Schematics
© Semiconductor Components Industries, LLC, 2017
November, 2021 − Rev. 3
1
Publication Order Number:
NCP148/D
NCP148
IN
EN
ENABLE
THERMAL
LOGIC
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
DRIVER WITH
SOFT−START
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
A1
IN
A2
OUT
B1
EN
Description
Input voltage supply pin
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
B2
GND
Common ground connection
−
EPAD
Expose pad should be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 to 6
V
Output Voltage
VOUT
−0.3 to VIN + 0.3, max. 6
V
Chip Enable Input
VCE
−0.3 to 6
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
Input Voltage (Note 1)
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, CSP4 (Note 3)
Thermal Resistance, Junction−to−Air
Symbol
Value
Unit
RqJA
108
°C/W
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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2
NCP148
ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).
Parameter
Test Conditions
Symbol
Min
VIN
VIN = VOUT(NOM) + 1 V
0 mA ≤ IOUT ≤ 450 mA
VOUT
Line Regulation
VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V
LineReg
0.02
%/V
Load Regulation
IOUT = 1 mA to 450 mA
LoadReg
0.001
%/mA
Operating Input Voltage
Output Voltage Accuracy
Dropout Voltage (Note 5)
IOUT = 450 mA
Max
Unit
1.9
5.5
V
−2
+2
%
VOUT(NOM) = 1.8 V
VOUT(NOM) = 2.5 V
VOUT(NOM) = 2.7 V
VDO
VOUT(NOM) = 2.8 V
300
450
190
315
180
300
175
290
VOUT = 90% VOUT(NOM)
ICL
Short Circuit Current
VOUT = 0 V
ISC
690
Quiescent Current
IOUT = 0 mA
IQ
55
65
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 4.8 V
IDIS
0.01
1
mA
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
VEN = 4.8 V
IEN
0.2
f = 100 Hz
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
91
98
82
48
dB
IOUT = 1 mA
IOUT = 250 mA
VN
14
10
mVRMS
Temperature rising
TSDH
160
°C
Temperature falling
TSDL
140
°C
VEN < 0.4 V, Version A only
RDIS
280
W
EN Pull Down Current
Power Supply Rejection Ratio
Output Voltage Noise
Thermal Shutdown Threshold
Active output discharge resistance
Line transient (Note 6)
IOUT = 20 mA
f = 10 Hz to 100 kHz
VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +
1.6 V) in 30 ms, IOUT = 1 mA
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +
1 V) in 30 ms, IOUT = 1 mA
Load transient (Note 6)
IOUT = 1 mA to 450 mA in 10 ms
IOUT = 450 mA to 1mA in 10 ms
700
mV
Output Current Limit
EN Pin Threshold Voltage
450
Typ
mA
1.2
0.4
0.5
V
mA
−1
TranLINE
mV
+1
TranLOAD
−40
+40
mV
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Guaranteed by design.
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NCP148
TYPICAL CHARACTERISTICS
1.820
2.830
IOUT = 10 mA
1.810
1.805
IOUT = 450 mA
1.800
1.795
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
1.790
1.785
1.780
−40 −20
0
20
40
60
80
100
2.820
2.815
IOUT = 10 mA
2.810
IOUT = 450 mA
2.805
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
2.800
2.795
2.790
−40 −20
140
120
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature −
VOUT = 1.8 V
Figure 4. Output Voltage vs. Temperature −
VOUT = 2.8 V
0.010
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
REGLINE, LINE REGULATION (%/V)
REGLINE, LINE REGULATION (%/V)
0.010
0.009
0.009
0.008
0.008
0.007
0.007
0.006
0.006
0.005
0.005
0.004
0.004
0.003
0.003
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.002
0.001
0
−40 −20
0
20
40
60
80
100
0.002
0.001
0
−40 −20
140
120
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Line Regulation vs. Temperature −
VOUT = 1.8 V
Figure 6. Line Regulation vs. Temperature −
VOUT = 2.8 V
8
REGLOAD, LOAD REGULATION (mA/mA)
REGLOAD, LOAD REGULATION (mA/mA)
2.825
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
1.815
7
6
5
4
3
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
2
1
0
−40 −20
0
20
40
60
80
100
120
140
8
7
6
5
4
3
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
2
1
0
−40 −20
0
20
40
60
80
100
120
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Load Regulation vs. Temperature −
VOUT = 1.8 V
Figure 8. Load Regulation vs. Temperature −
VOUT = 2.8 V
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140
NCP148
TYPICAL CHARACTERISTICS
1.6
1.4
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
1.6
TJ = 125°C
1.2
TJ = 25°C
1.0
0.8
TJ = −40°C
0.6
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0.0
0
50
100
150
200
250
300
350
400
1.4
1.2
TJ = 25°C
1.0
0.8
TJ = −40°C
0.6
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0.0
450
TJ = 125°C
0
50
TJ, JUNCTION TEMPERATURE (°C)
240
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
TJ = 125°C
TJ = 25°C
250
TJ = −40°C
150
100
50
0
0
50
100
150
200
250
300
350
400
180
350
400
450
TJ = 125°C
TJ = 25°C
120
TJ = −40°C
90
60
30
0
450
0
50
100
150
200
250
300
350
400
450
IOUT, OUTPUT CURRENT (mA)
Figure 12. Dropout Voltage vs. Load Current −
VOUT = 2.8 V
240
400
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 450 mA
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
300
150
Figure 11. Dropout Voltage vs. Load Current −
VOUT = 1.8 V
320
250
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
210
IOUT, OUTPUT CURRENT (mA)
360
200
Figure 10. Ground Current vs. Load Current −
VOUT = 2.7 V
400
200
150
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Ground Current vs. Load Current −
VOUT = 1.8 V
VOUT = 1.8 V
350 CIN = 1 mF
COUT = 1 mF
300
100
280
240
200
160
120
80
IOUT = 0 mA
40
0
−40 −20
0
20
40
60
80
100
120
210
180
150
120
90
IOUT = 0 mA
60
30
0
−40 −20
140
IOUT = 450 mA
VOUT = 2.8V
CIN = 1 mF
COUT = 1 mF
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Dropout Voltage vs. Temperature −
VOUT = 1.8 V
Figure 14. Dropout Voltage vs. Temperature −
VOUT = 2.8 V
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NCP148
TYPICAL CHARACTERISTICS
ISC, SHORT CIRCUIT CURRENT (mA)
750
730
720
710
700
690
680
VIN = 3.8 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
670
660
VEN, ENABLE VOLTAGE THRESHOLD (V)
650
−40
−20
0
20
40
60
80
100
120
140
690
680
670
660
650
640
630
610
600
−40
0.9
0.45
0.8
0.7
OFF −> ON
0.6
ON −> OFF
0.5
0.4
0.3
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
0.2
0.1
0
−40 −20
0
20
40
60
80
100
120
20
40
60
80
100
120
140
0.40
0.35
0.30
0.25
0.20
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
0.15
0.10
0.05
0
−40 −20
140
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 17. Enable Threshold Voltage vs.
Temperature
Figure 18. Enable Current vs. Temperature
300
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
RDIS, DISCHARGE RESISTIVITY (W)
70
0
Figure 16. Short Circuit Current vs.
Temperature
0.50
90
−20
Figure 15. Current Limit vs. Temperature
1.0
80
VIN = 3.8 V
VOUT = 0 V (SHORT)
CIN = 1 mF
COUT = 1 mF
620
TJ, JUNCTION TEMPERATURE (°C)
100
IDIS, DISABLE CURRENT (nA)
700
TJ, JUNCTION TEMPERATURE (°C)
IEN, ENABLE CURRENT (nA)
ICL, CURRENT LIMIT (mA)
740
60
50
40
30
20
10
0
−40 −20
0
20
40
60
80
100
120 140
290
280
270
260
250
240
230
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
220
210
200
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Disable Current vs. Temperature
Figure 20. Discharge Resistivity vs.
Temperature
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NCP148
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (nV/√Hz)
10K
IOUT = 450 mA
1K
IOUT = 250 mA
RMS Output Noise (mV)
IOUT = 10 mA
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
14.62
14.10
10 mA
11.12
10.48
250 mA
10.37
9.82
450 mA
10.22
9.62
IOUT = 1 mA
100
10
1
10
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF MLCC (1206)
COUT = 1 mF MLCC (1206)
100
1K
10K
100K
1M
FREQUENCY (Hz)
Figure 21. Output Voltage Noise Spectral Density − VOUT = 1.8 V
OUTPUT VOLTAGE NOISE (nV/√Hz)
10K
IOUT = 450 mA
IOUT = 250 mA
1K
RMS Output Noise (mV)
IOUT = 10 mA
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
16.90
15.79
10 mA
12.64
11.13
250 mA
11.96
10.64
450 mA
11.50
10.40
IOUT = 1 mA
100
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF MLCC (1206)
COUT = 1 mF MLCC (1206)
10
1
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
Figure 22. Output Voltage Noise Spectral Density − VOUT = 2.8 V
IOUT = 10 mA
100
IOUT = 20 mA
120
VIN = 2.3 V+100mVpp
VOUT = 1.8 V
COUT = 1 mF MLCC 1206
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
120
80
60
40
20
0
10
IOUT = 100 mA
IOUT = 250 mA
IOUT = 450 mA
100
1K
10K
100K
1M
IOUT = 10 mA
100
VIN = 3.8 V+100mVpp
VOUT = 2.8 V
COUT = 1 mF MLCC 1206
80
60
IOUT = 100 mA
40
IOUT = 250 mA
20
IOUT = 450 mA
0
10
10M
IOUT = 20 mA
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 23. PSRR for Various Output Currents,
VOUT = 1.8 V
Figure 24. PSRR for Various Output Currents,
VOUT = 2.8 V
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NCP148
TYPICAL CHARACTERISTICS
100
VIN
Unstable
Operation
VOUT
1 V/div
ESR (W)
10
1
0.1
Stable
Operation
0
50
100 150 200 250 300 350 400 450 500
4 ms/div
IOUT, OUTPUT CURRENT (mA)
VEN
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
IINPUT
200 mA/div
500 mV/div
Figure 26. Turn−on/off − slow rising VIN
VEN
IINPUT
500 mV/div
10 mA/div 500 mV/div
500 mV/div
Figure 25. Stability vs. ESR
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
200 ms/div
500 ms/div
Figure 27. Enable Turn−on Response −
COUT = 1 mF, IOUT = 10 mA
Figure 28. Enable Turn−on Response −
COUT = 1 mF, IOUT = 450 mA
500 mV/div
4.8 V
VIN
2.8 V
10 mV/div
10 mV/div
500 mV/div
3.8 V
VOUT
VOUT = 1.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC), COUT = 1 mF (MLCC)
20 ms/div
VIN
3.8 V
VOUT
VOUT = 2.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC), COUT = 1 mF (MLCC)
20 ms/div
Figure 30. Line Transient Response −
VOUT = 2.8 V
Figure 29. Line Transient Response −
VOUT = 1.8 V
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NCP148
200 mA/div
VOUT
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
tFALL = 1 ms
VOUT
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div
Figure 31. Load Transient Response −
1 mA to 450 mA − VOUT = 1.8 V
Figure 32. Load Transient Response −
450 mA to 1 mA − VOUT = 1.8 V
200 mA/div
2 ms/div
50 mV/div
tRISE = 1 ms
IOUT
VOUT
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
tFALL = 1 ms
VOUT
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
5 ms/div
20 ms/div
Figure 33. Load Transient Response −
1 mA to 450 mA − VOUT = 2.7 V
Figure 34. Load Transient Response −
450 mA to 1 mA − VOUT = 2.7 V
Short Circuit Event
200 mA/div
50 mV/div
tRISE = 1 ms
IOUT
VIN = 5.5 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
500 mV/div
50 mV/div
200 mA/div
50 mV/div
200 mA/div
TYPICAL CHARACTERISTICS
VEN
IOUT
Thermal
Shutdown
Overheating
1 V/div
1 V/div
VOUT
VOUT
TSD cycling
COUT = 4.7 mF
COUT = 1 mF
10 ms/div
400 ms/div
Figure 35. Short Circuit and Thermal
Shutdown
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
Figure 36. Enable Turn−Off (Active Discharge)
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NCP148
APPLICATIONS INFORMATION
General
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The NCP148 is an ultra−low noise 450 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP148 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP148 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
The NCP148 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is 1.2 V the device is guaranteed to
be enabled. The NCP148 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN. After device is enabled by EN pin soft start
feature ensure that maximal Vout slew rate will be slower
than 30 mV/ms. The soft start function also protects powered
device before possible damage by large inrush current.
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
Output Decoupling (COUT)
The NCP148 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP148 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 37.
Output Current Limit
Output Current is internally limited within the IC to a
typical 700 mA. The NCP148 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Figure 37. Capacity vs DC Bias Voltage
Power Dissipation
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 Ω. Larger
output capacitors and lower ESR could improve the load
As power dissipated in the NCP148 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
www.onsemi.com
10
NCP148
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP148 can handle
is given by:
ƪ125oC * T Aƫ
P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ
(eq. 1)
q JA
160
1.6
PD(MAX), TA = 25°C, 2 oz Cu
150
PD(MAX), TA = 25°C, 1 oz Cu
140
1.4
1.2
130
1.0
120
0.8
qJA, 1 oz Cu
110
0.6
0.4
100
qJA, 2 oz Cu
90
80
(eq. 2)
0
100
200
300
400
500
0.2
600
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
P D(MAX) +
The power dissipated by the NCP148 for given
application conditions can be calculated from the following
equations:
0
700
PCB COPPER AREA (mm2)
Figure 38. qJA and PD (MAX) vs. Copper Area (CSP4)
Reverse Current
PCB Layout Recommendations
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
Power Supply Rejection Ratio
The NCP148 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
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11
NCP148
ORDERING INFORMATION
Device
Nominal Output Voltage
NCP148AFCT180T2G
Description
Marking
Rotation
1.8 V
T
270°
NCP148AFCT250T2G
2.5 V
V
0°
NCP148AFCT255T2G
2.55 V
4
180°
NCP148AFCT260T2G
2.6 V
V
90°
NCP148AFCT270T2G
2.7 V
Y
0°
NCP148AFCT280T2G
2.8 V
6
0°
NCP148AFCT285T2G
2.85 V
4
0°
NCP148AFCT320T2G
3.2 V
T
0°
450 mA, Active
Discharge
Package
Shipping
567JZ
5000 /
Tape &
Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64x0.33
CASE 567JZ
ISSUE B
DATE 16 MAY 2022
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON85781F
WLCSP4, 0.64X0.64x0.33
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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