NCP3136MNTXG

NCP3136 Integrated Synchronous Buck Converter 6A 3136 ALYWG G QFN16 CASE 485DA 3136 = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PINOUT DIAGRAM EN 1 NC 2 VIN High Efficiency in Both CCM and DCM Operation Frequency: 1.1 MHz Support MLCC Output Capacitor Small Footprint, 3 mm x 3 mm, 16−pin QFN Package 2.9 V to 5.5 V Wide Conversion Voltage Range Output Voltage Range from 0.6 V to 0.84 X VIN Automatic Power−Saving Mode Voltage Mode Control Support Pre−bias Start−up Functionality Output Discharge Operation Over−Temperature Protection Built−in Over−Voltage, Under−Voltage and Over−Current Protection Power Good Indicator This Device is Pb−Free and is RoHS Compliant 1 VIN • • • • • • • • • • • • • • MARKING DIAGRAM PGND Features www.onsemi.com PGND NCP3136 is a fully integrated synchronous buck converter for 3.3 V and 5 V step−down applications. It can provide up to 6.5 A instantaneous current. NCP3136 supports high efficiency, fast transient response and provides power good indicator. The control scheme includes two operation modes: FCCM and automatic CCM/DCM. In automatic CCM/DCM mode, the controller can smoothly switch between CCM and DCM, where converter runs at reduced switching frequency with much higher efficiency. NCP3136 is available in 3 mm x 3 mm QFN16 pin package. 16 15 14 13 12 VDD 11 AGND NCP3136 PGD 3 10 FB VBST 4 9 5 6 7 8 SW SW PS • 5 V Step Down Rail • 3.3 V Step Down Rail SW Applications COMP ORDERING INFORMATION Device NCP3136MNTXG Package Shipping† QFN16 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2017 August, 2019 − Rev. 3 1 Publication Order Number: NCP3136/D NCP3136 VIN BST UVLO NC OSC PS SS EN Ramp Control Logic & PWM Logic Mode Selection DRVH SWN COMP VREF FB + + E/A − Power Good UVP, OVP, UVLO, Overtemperature and Vout discharge PGD DRVL OCP AGND Figure 1. Block Diagram PIN DESCRIPTION Pin No. Symbol Description 1 EN Logic control to enabling the switcher. Internally pulled up to VDD with a 1.35 MW resistor. 2 NC Not connected. 3 PGD Open drain power good output. 4 BST Gate drive voltage for high side FET. Connect capacitor from this pin to SWN. 5,6,7 SWN Switch node between high−side MOSFET and low−side MOSFET. 8 PS 9 COMP 10 FB 11 AGND 12 VDD Power supply input for control circuitry. 13,14 VIN Power input for power conversion and gate driver supply. 15,16 PGND Mode configuration pin: Connecting to ground: Forced CCM Pulled high or floating (internal pulled high): Forced CCM Connect with 24.3 kW to GND: Automatic CCM/DCM Connect with 57.6 kW to GND: Automatic CCM/DCM Connect with 105 kW to GND: Automatic CCM/DCM Connect with 174 kW to GND: Automatic CCM/DCM Output of the error amplifier. Feedback pin. Connect to resistor divider to set up the desired output voltage. Analog ground Power ground www.onsemi.com 2 PGND VDD NCP3136 L1 Vin =2.9V~5.5V C5 C6 C4 13 14 VIN 12 VDD VIN 5 6 7 C7 Vin SW SW SW R7 VBST 4 C8 C9 11 AGND NCP3136 2 EN NC PGD 3 1 EN R5 8 PS PGD R3 FB 10 PGND PGND 15 16 COMP 9 C2 R4 C1 R1 R2 C3 Figure 2. Application Circuit www.onsemi.com 3 Vout NCP3136 ABSOLUTE MAXIMUM RATINGS Value Condition Min Max Unit VIN, PS −0.3 6.5 V VBST −0.3 17 VBST (with respect to SW) −0.3 6.5 EN, FB −0.3 VDD + 0.3 DC −1 6.5 Pulse < 20 ns, E = 5 mJ −3 10 PGD −0.3 6.5 COMP −0.3 VDD + 0.3 PGND −0.3 0.3 Operation ambient temperature TA −40 125 Storage temperature TS −55 150 Junction temperature TJ −40 150 Parameter Input Voltage Range Output Voltage Range SW V °C Thermal Characteristics RqJA 45.4 °C/W Electrostatic Discharge Human Body Model (HBM) 2000 V Charged Device Model (CDM) 2000 Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 300 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATION RATINGS Value Parameter Condition Input Voltage Range Min Typ Max Unit V VIN 2.9 5.5 VBST −0.1 13.5 VBST (with respect to SW) −0.1 6.0 EN, PS, FB −0.1 VDD VDD 2.9 5.5 SW −1 6.5 Output Voltage Range PGD −0.1 6.0 COMP −0.1 VDD PGND −0.1 0.1 −40 125 Junction temperature range, TJ V °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 NCP3136 ELECTRICAL CHARACTERISTICS (VDD = VIN = 3.3 V, TA = TJ = −40°C to +125°C. Typical values are at TA = 25°C, PGND = GND unless otherwise noted) Parameter SYMBOL Test Conditions Min VIN Nominal input voltage range 2.9 Typ Max Unit 5.5 V POWER SUPPLY VIN operation voltage VIN UVLO threshold Ramp up; EN = ‘HI’ VIN UVLO hysteresis 2.8 V 110 mV VOLTAGE MONITOR Pull−down voltage with 4 mA sink current Power good low voltage Power good high leakage current 60 200 mV −2.0 0 2.0 mA Power good threshold Feedback lower voltage limit 80 83 86 %Vref Power good threshold Feedback higher voltage limit 114 117 120 %Vref Power good high delay tPGDELAY 400 Output over-voltage protection threshold at FB Over-voltage blanking time TOVPDLY Time from FB higher than 20% of Vref to OVP fault Output under−voltage protection threshold at FB Under-voltage blanking time ms 114 117 120 %Vref 1.0 1.5 2.5 ms 80 83 86 %Vref TUVPDLY Time from FB lower than 20% of Vref to UVP fault 11 IVIN EN = ‘HI’, no switching 1.5 IVIN_SD EN = ‘LO’ ms SUPPLY CURRENT (TJ = +25°C) VIN quiescent current VIN shutdown supply current 3.5 mA 15 mA 606 mV FEEDBACK VOLTAGE & ERROR AMPLIFIER Reference voltage at FB VREF 594 600 Unity gain bandwidth (Note 1) 14 MHz Open loop gain (Note 1) 80 dB FB pin leakage current 100 Output sourcing and sinking current (Note 1) Ccomp = 20 pF Slew rate (Note 1) nA 5 mA 5 V/ms OVER CURRENT PROTECTION & ZERO CROSSING When Iout exceeds this threshold for 4 consecutive cycles, VIN = 3.3 V, VOUT = 1.5 V with 1 mH inductor, Fsw = 1.1 MHz, TA = 25°C Over−current limit on high−side FET Hiccup time duration thiccup Zero crossing comparator internal offset (Note 1) 7.6 Fsw = 1.1 MHz PGND−SWN, Automatic CCM/DCM mode 8.2 8.8 14.5 A ms −4.5 −3.0 −1.5 mV 1.1 1.18 1.30 V EN hysteresis 0.18 0.24 V EN input pull up resistor 1.2 LOGIC PINS:I/O VOLTAGE AND CURRENT EN high threshold voltage MW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Guaranteed by design, not production tested. www.onsemi.com 5 NCP3136 ELECTRICAL CHARACTERISTICS (VDD = VIN = 3.3 V, TA = TJ = −40°C to +125°C. Typical values are at TA = 25°C, PGND = GND unless otherwise noted) Parameter SYMBOL Test Conditions Min Typ Max Unit LOGIC PINS:I/O VOLTAGE AND CURRENT PS mode threshold voltage PS source current PSTHS IPS Level 1 to Level 2 0.05 Level 2 to Level 3 1.3 7 mA pull-up current when enabled 7 V mA INTERNAL BST DIODE VBST = 6.6 V, VIN = 3.3 V, TA = 25°C Reverse−bias leakage current 1 mA SOFT STOP Output discharge on−resistance EN = 0, VIN = 3.3 V, VOUT = 0.5 V 36 W Rising from VSS = 0 V to VSS = 0.6 V 1.5 ms EN = ‘HI’ 0.5 ms TIMERS: SOFT−START Soft−Start ramp−up time TSS Delay after EN asserting Switching Frequency Control FCCM mode Frequency setting = 1.1 MHz 0.99 1.10 1.21 MHz FCCM mode or Automatic CCM/DCM mode 100 140 ns 2.9 V< VIN < 6.0 V VIN/4 PWM Minimum OFF time PWM ramp amplitude (Note 1) Maximum duty cycle, FCCM mode or Automatic CCM/DCM mode FSW = 1.1 MHz 84% 89% 130 140 V THERMAL SHUTDOWN Thermal shutdown threshold (Note 1) Thermal shutdown hysteresis (Note 1) 40 150 °C °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Guaranteed by design, not production tested. www.onsemi.com 6 NCP3136 TYPICAL CHARACTERISTICS 98 96 96 94 3.3 V 2.5 V 92 1.8 V 90 1.5 V 88 1.2 V 86 VOUT = 1.0 V 82 1.5 V 88 1.2 V 86 0 1 2 3 4 VOUT = 1.0 V 82 80 5 0 1 2 3 4 5 LOAD CURRENT (A) LOAD CURRENT (A) Figure 3. Efficiency at Vin = 5.0 V FCCM Operation Mode Figure 4. Efficiency at Vin = 5.0 V Auto CCM/DCM Operation Mode 98 96 96 94 94 2.5 V 92 90 1.8 V 88 1.5 V 86 1.2 V EFFICIENCY (%) EFFICIENCY (%) 1.8 V 90 98 84 2.5 V 92 90 1.8 V 88 1.5 V 86 1.2 V 84 82 80 2.5 V 92 84 84 80 EFFICIENCY (%) EFFICIENCY (%) 94 3.3 V 82 VOUT = 1.0 V 0 1 2 3 4 80 5 VOUT = 1.0 V 0 1 2 3 4 LOAD CURRENT (A) LOAD CURRENT (A) Figure 5. Efficiency at Vin = 3.3 V FCCM Operation Mode Figure 6. Efficiency at Vin = 3.3 V Auto CCM/DCM Operation Mode www.onsemi.com 7 5 NCP3136 DETAILED DESCRIPTION Overview VDD Voltage NCP3136 is a low input voltage high performance synchronous buck converter with two integrated N−MOSFETs. NCP3136’s output voltage range is from 0.6 V to 0.84 x Vin and it has wide input voltage range from 2.9 V to 5.5 V. The features of NCP3136 include supporting pre−bias start−up to protect sensitive loads, cycle−by−cycle over−current limiting and short circuit protection, power good monitor, over voltage and under voltage protection, built in output discharge and thermal shutdown. NCP3136 provides two operation modes to fit various application requirements. The automatic CCM/DCM mode operation provides reduced power loss and increases the efficiency at light load. The adaptive power control architecture enables smooth transition between light load and heavy load while maintaining fast response to load transients. The VDD voltage is supplied from VIN via an intrenal resistor. Meanwhile, it is also ok to short the VDD pin and VIN pins externally. Reference Voltage The NCP3136 incorporates 600 mV reference voltage with 1.0% tolerance. Internal Soft−Start To limit the start−up inrush current, an internal soft start circuit is used to ramp up the reference voltage from 0 V to its final value linearly. The internal soft start time is 2.0 ms typically. Soft Stop Soft−Stop or discharge mode is always on during faults or disable. In this mode, disable (EN) causes the output to be discharged through an internal 40 W transistor inside of SW terminal. The time constant of soft−stop is a function of output capacitance and the resistance of the discharge transistor. Operation Mode In forced continuous conduction mode (FCCM), the high−side FET is ON during the on−time and the low−side FET is ON during the off−time. The switching is synchronized to an internal clock thus the switching frequency is fixed. In Automatic CCM/DCM mode, the high−side FET is ON during the on−time and low−side FET is ON during the off−time until the inductor current reaches zero. An internal zero−crossing comparator detects the zero crossing of the inductor current from positive to negative. When the inductor current reaches zero, the comparator sends a signal to the logic circuitry and turns off the low−side FET. When the load is increased, the inductor current is always positive and the zero−crossing comparator does not send any zero−crossing signal. The converter enters into continuous conduction mode (CCM) when no zero−crossing is detected for two consecutive PWM pulses. In CCM mode, the switching synchronizes to the internal clock and the switching frequency is fixed. Automatic Power Saving Mode In Automatic CCM/DCM mode when the load current decreases, the converter will enter power saving mode operation. During power saving mode, the low−side MOSFET will turn off when the inductor current reaches zero. So the converter skips switching and operates with reduced frequency, which minimizes the quiescent current and maintains high efficiency. Forced Continuous Conduction Mode When PS pin is floating or pulled high, NCP3136 is operating in forced continuous conduction mode in both light load and heavy load conditions. In this mode, the switching frequency remains constant over the entire load range, making it suitable for applications that need tight regulation of switching frequency at a cost of lower efficiency at light load. www.onsemi.com 8 NCP3136 PROTECTIONS Under Voltage Lockout (UVLO) This situation occurs for a number of reasons: the converter’s output capacitors may have residual charge on them or the converter’s output may be held up by a low current standby power supply. NCP3136 supports pre−bias start up by holding low−side FETs off until soft start ramp reaches the FB pin voltage. There is under-voltage lock out protection (UVLO) for VIN in NCP3136, which has a typical trip threshold voltage 2.8 V and trip hysteresis 130 mV for VIN. If UVLO is triggered, the device resets and waits for the voltage to rise up over the threshold voltage and restart the part. Please note this protection function DOES NOT trigger the fault counter to latch off the part. Thermal Shutdown The NCP3136 protects itself from over heating with an internal thermal monitoring circuit. When the die temperature goes beyond a threshold value 135°C, both the high−side and the low−side FETs turn off until the temperature falls 40°C below of the threshold value. Then the converter restarts. Over Voltage Protection (OVP) When feedback voltage is above 17% (typical) of nominal voltage for over 1.7 ms blanking time, an OV fault is set. In this case, the converter de−asserts the PGD signal and performs the over−voltage protection function. The top gate drive is turned off and the bottom gate drive is turned on to discharge the output. The bottom gate drive will be turned off until VFB drops below the UVP threshold. The device enters a high−impedance state. This protection is latched. Application Note For higher output voltage application cases (Vout = 3.3 V), choose the inductor value not to be lower than 1 mH to avoid over-current protection being triggered by inductor current ripple; For Vin = 5 V and Vout = 3.3 V case, add a voltage divider between Vin and EN to ensure that the part can start up without triggering UVP. Use Figure 7 as design reference for schematics. For other lower output voltage cases, it is not necessary to add this divider. Under Voltage Protection (UVP) Output under−voltage protection works in conjunction with the current protection described in the Over−current Protection sections. An UVP circuit monitors the feedback voltage to detect under−voltage event. The under−voltage limit is 17% (typical) below of nominal voltage at FB pin. If the feedback voltage is below this threshold over 11 ms, an UV fault is set and both the high−side and the low−side FETs turn off. After a hiccup delay, the part tries to restart. This protection behavior is hiccup. VIN = 5 V 10 kW EN Power Good Monitor (PGD) NCP3136 provides window comparator to monitor the output voltage at FB pin. When the output voltage is within ±17% of regulation voltage, the power good pin outputs a high signal. Otherwise, PGD stays low. The PGD pin is open drain 5 mA pull down output. During startup, PGD stays low until the feedback voltage is within the specified range for about 0.4 ms. If feedback voltage falls outside the tolerance band, the PG pin goes low after 10 ms delay. The PGD pin de−asserts as soon as the EN pin is pulled low or an under−voltage event on VDD is detected. 3.6 kW PGND Figure 7. Voltage divider between VIN and EN for start−up in VIN = 5 V and VOUT = 3.3 V case Layout Guidelines When laying out a power PCB for the NCP3136 there are several key points to consider. Use four vias to connect the thermal pad to power ground. Separate the power ground and analog ground planes; connect them together at a single point. Increase the thickness of PCB copper, it can help to lower the die temperature and improve the overall efficiency but meanwhile increase the cost of the board fabrication. Use wide traces for the nodes conducting high current such as VIN, VOUT, PGND and SW. Place feedback and compensation network components close to the IC. Keep FB, COMP away from noisy signals such as SW, BST. Place VIN and VDD decoupling capacitors as close to the IC as possible. Over Current Protection (OCP) NCP3136 provides high−side MOSFET current limiting. When the current through the high−side FET exceeds 7.5 A, the high−side FET turns off and the low−side FET turns on until next PWM cycle. An over−current counter is triggered and starts to increment each occurrence of an over−current event. Both the high−side and the low−side FETs turn off when the OC counter reaches four. The OC counter resets if the detected current is less than 7.5 A after an OC event. Pre−Bias Startup In some applications the controller will be required to start switching when its output capacitors are charged anywhere from slightly above 0 V to just below the regulation voltage. www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN16 3x3, 0.5P CASE 485DA ISSUE A 1 SCALE 2:1 ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ D PIN ONE REFERENCE 2X B A DATE 22 SEP 2015 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L L1 DETAIL A E ALTERNATE CONSTRUCTIONS 0.10 C ÉÉÉ ÇÇÇ A3 2X 0.10 C EXPOSED Cu TOP VIEW A DETAIL B 0.05 C ÉÉÉ ÉÉÉ ÇÇÇ MOLD CMPD A3 A1 DETAIL B A3 ALTERNATE CONSTRUCTIONS 0.05 C NOTE 4 SIDE VIEW A1 C SEATING PLANE D2 16X 5 L 8X 0.10 C A B 16X 1 b 0.10 C A B 0.05 C K XXXXX XXXXX ALYWG G L2 9 E2 NOTE 3 16 e e/2 BOTTOM VIEW XXXXX A L Y W G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED SOLDERING FOOTPRINT* 3.30 PACKAGE OUTLINE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 3.00 BSC 1.55 1.75 3.00 BSC 1.55 1.75 0.50 BSC 0.275 REF 0.30 0.50 0.00 0.15 0.09 REF GENERIC MARKING DIAGRAM* 0.10 C A B DETAIL A DIM A A1 A3 b D D2 E E2 e K L L1 L2 16X 0.61 1.78 1 1.78 3.30 16X 0.30 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON87551E QFN16, 3X3, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative