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NCP58300
3.0A, Very Low-Dropout
(VLDO) Fast Transient
Response Regulator series
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MARKING
DIAGRAMS
TAB
5
D2PAK
CASE 936A
Features
•
Applications
•
•
•
•
•
•
Consumer and Industrial Equipment Point of Regulation
Servers and Networking Equipment
FPGA, DSP and Logic Power supplies
Switching Power Supply Post Regulation
Battery Chargers
Functional Replacement for Industry Standard MIC29300,
MIC39300, MIC37300
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 1
1
TAB
3
D2PAK3
CASE 936
y
58300−xx
AWLYWWG
1
xx
y
z
A
WL
Y
WW
G
GND
1
VOUT
Output Current in Excess of 3.0 A
370 mV Typical Dropout Voltage at 3.0 A
Adjustable and Fixed Output Voltage Options
Low Ground Current
Fast Transient Response
Stable with Tantalum Output Capacitor
Logic Compatible Enable and Error Flag Pins
Current Limit, Reverse Current and Thermal Shutdown Protection
Operation up to 13.5 V Input Voltage
Adjustable Device Output Voltage Range from 1.24 V to 12.9 V
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
1
VIN
•
•
•
•
•
•
•
•
•
•
•
y
5830z−xx
AWLYWWG
1
EN
VIN
GND
VOUT
FLG/ADJ
The NCP58300 series are high precision, very low dropout
(VLDO), low ground current positive voltage regulators that are
capable of providing an output current in excess of 3.0 A with a typical
dropout voltage lower than 370 mV at 3.0 A load current. The devices
are stable with tantalum output capacitors. This series consists initially
of an Adjustable output voltage version, with fixed voltage versions
planned in the future.
The NCP58300 series can withstand up to 18 V max input voltage.
Internal protection features consist of output current limiting, built−in
thermal shutdown and reverse output current protection. Logic level
enable and error flag pins are available on the 5−pin version.
The NCP58302 is an Adjustable voltage Device and is offered in
D2PAK−5 package.
= Voltage Version
= P (NCP), V (NCV)
= 1 (Fix Voltage), 2 (Adj)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Publication Order Number:
NCP58300/D
NCP58300
TYPICAL APPLICATIONS
VIN = 3.0 V
+
CIN
NCP58301
VIN
VOUT
EN
FLG
VOUT = 2.5 V
100k
+
+
COUT
10 mF, Tantalum
GND
NCP58302
VIN
CIN
+
ADJ
R1
R2
+
COUT
10 mF, Tantalum
VOUT = 2.5 V
VOUT
CIN
EN
1.3 V
Figure 2. Adjustable Regulator
NCP58300
VIN
VOUT
GND
Figure 1. Fixed 2.5 Regulator with Error Flag
VIN = 3.0 V
VIN
+
COUT
10 mF, Tantalum
GND
Figure 3. Fixed 2.5 Regulator in D2PAK−3 Package
PIN FUNCTION DESCRIPTION
Pin Number
D2PAK−5
Pin Number
D2PAK−3
Pin Name
1
−
EN
Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low =
shutdown.
2
1
VIN
Input voltage which supplies both the internal circuitry and the current to the output
load
3
2
GND
Ground
TAB
TAB
TAB
TAB is connected to ground.
4
3
VOUT
5 (Fixed)
−
FLG
Error Flag Open collector output.
Active−low indicates an output fault condition.
5 (Adj)
−
ADJ
Adjustable Regulator Feedback Input.
Connect to output voltage resistor divider central node.
Pin Function
Linear Regulator Output.
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2
NCP58300
ABSOLUTE MAXIMUM RATINGS
Value
Unit
VIN
Symbol
Supply Voltage
Rating
0 to 18
V
VEN
Enable Input Voltage
0 to 18
V
VFLG
Error Flag open collector output Max. voltage
0 to 18
V
VOUT – VIN
Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1)
0 to 6.5
V
PD
Power Dissipation (Notes 2 and 5)
Internally Limited
TJ
Junction Temperature
–40 v TJ v +125
°C
TS
Storage Temperature
–65 v TJ v +150
°C
2000
200
V
ESD Rating (Notes 3 and 4)
Human Body Model
Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: All voltages are referenced to GND pin unless otherwise noted.
1. The ENABLE pin input voltage must be ≤ 0.8 V or VIN must be connected to ground potential.
2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout.
3. Devices are ESD sensitive. Handling precautions recommended..
4. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C)
ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C)
This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78.
5. This protection is not guaranteed outside the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS (Note 6)
Symbol
Rating
Value
Unit
13.5
V
VIN
Maximum Supply Voltage
VEN
Enable Input Voltage
0 to 13.5
V
VFLG
Error Flag Open Collector Voltage
0 to 13.5
V
TJ
Junction Temperature
–40 v TJ v +125
°C
6. The device is not guaranteed to function outside it’s Recommended operating conditions.
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3
NCP58300
ELECTRICAL CHARACTERISTICS
TJ = 25°C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40°C < TJ < +125°C, unless noted.
Conditions
Parameter
Output Voltage Accuracy
Min
Typ
Max
Unit
IL = 10 mA
−1
+1
%
10 mA < IOUT < 3.0 A , VOUT nominal + 1 v VIN v 13.5 V
−2
+2
%
0.5
%
Output Voltage Line Regulation
VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA
0.06
Output Voltage Load Regulation
IL = 10 mA to 3.0 A , VIN = VOUT nominal + 5.0 V
0.2
1
%
DVo / DT
Output Voltage Temperature Coefficient (Note 9)
20
100
ppm/°C
VIN – VOUT Dropout Voltage
(Note 7)
IL = 100 mA
80
175
mV
IL = 1.5 A
250
IL = 3.0 A
370
600
mV
IL = 1.5 A, VIN = VOUT nominal + 1.0 V
25
50
mA
Ground Pin Current (Note 8)
mV
IL = 3.0 A
50
mA
Ground Pin Current at Dropout
VIN = VOUT − 0.5V , IL = 10 mA
1.7
mA
Ground Pin Current in Shutdown
VEN v 0.4 V
2.0
Overload Protection Current Limit
VOUT = 0 V, VIN = VOUT nominal + 1.0 V
4.5
A
Output Noise Voltage (10 Hz to
100 kHz), IL = 100 mA
COUT = 10 mF
COUT = 33 mF
400
260
mV
(rms)
Output Leakage Current Iflg(leak)
Voh = 13.5 V
0.01
1
2
mA
Output Low Voltage VFLG(LO)
Device set for 5 V, VIN = 4.5 V, IFLG = 250 mA
220
300
400
mV
Upper Threshold Voltage
Device set for 5 V (Note 11)
Upper Threshold Voltage
Device set for 5 V (Note 11)
75
Hysteresis
Device set for 5 V (Note 11)
15
10
30
mA
FLAG OUTPUT
40
25
60
mV
95
140
mV
mV
ENABLE INPUT
Enable Input Signal Levels
Regulator enable
V
2.4
Regulator shutdown
Enable pin Input Current
Regulator Output Current in Shutdown
VEN + 0.8 V
0.8
V
2
4
mA
VEN + 13.5 V
100
600
750
mA
VEN ≤ 0.8 V and VIN ≤ 13.5 V, VOUT = 0 V
10
500
mA
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4
NCP58300
ELECTRICAL CHARACTERISTICS
TJ = 25°C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40°C < TJ < +125°C, unless noted.
Parameter
Conditions
Min
Typ
Max
Unit
1.228
1.215
1.240
1.252
1.265
V
REFERENCE NCP58302 ONLY
Reference Voltage
Adjust Pin Bias Current
Reference Voltage Temperature
Coefficient
50
(Note 10)
Adjust Pin Bias Current Temperature Coefficient
120
nA
20
ppm/°C
0.1
nA/°C
7. VDO = VIN – VOUT when VOUT decreases to 99% of its nominal output voltage with VIN = VOUT + 1 V.
8. IIN = IGND + IOUT.
9. Output Voltage Temperature Coefficient is defined as worst case voltage change divided by the total temperature range. Guaranteed by
design.
10. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a 4 W pulse for T = 10 ms.
11. Comparator thresholds are expressed in terms of a voltage differential at the Adjust terminal below the nominal reference voltage measured
at 6V input. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = VOUT/VREF = (R1 + R2)/R2.
For example, at a programmed output voltage of 5 V, the Error output is guaranteed to go low when the output drops by
95 mV x 5 V/1.240 V = 384 mV. Thresholds remain constant as a percent of VOUT as VOUT is varied, with the dropout warning occurring at
typically 5% below nominal, 7.7% guaranteed.
Package
Conditions / PCB Footprint
Thermal Resistance
D2PAK–3, Junction−to−Case
RqJC = 2.0°C/W
D2PAK–5, Junction−to−Case
RqJC = 2.0°C/W
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5
NCP58300
TYPICAL CHARACTERISTICS
0.40
0.8
0.35
0.7
DROPOUT VOLTAGE (V)
DROPOUT VOLTAGE (V)
TJ = 25°C if not otherwise noted
0.30
0.25
0.20
0.15
0.10
IOUT = 3 A
0.6
0.5
0.4
0.3
0.2
0.1
0.05
0.00
0.0
0.5
1.0
1.5
2.0
2.5
0
−60
3.0
−30
0
Figure 4. Dropout Voltage vs. Output Current
4.0
IOUT = 10 mA
3.0
IOUT = 3 A
1.0
0.0
0
1
2
3
4
INPUT VOLTAGE (V)
5
150
30
20
VOUTnom = 1.24 V
10
0
6
0
1
2
OUTPUT CURRENT (A)
3
Figure 7. Ground Current vs. Output Current
125
4
VOUTnom = 3.3 V
RLOAD = 100 W
GROUND CURRENT (mA)
GROUND CURRENT (mA)
120
40
Figure 6. Dropout Characteristics
3
2
1
0
90
50
VOUTnom = 3.3 V
VENABLE = VIN
2.0
60
Figure 5. Dropout Voltage vs. Temperature
GROUND CURRENT (mA)
OUTPUT VOLTAGE (V)
5.0
30
TEMPERATURE (°C)
OUTPUT CURRENT (A)
0
2
4
6
8
100
75
50
25
0
10
VOUTnom = 3.3 V
IOUT = 3 A
0
SUPPLY VOLTAGE (V)
2
4
6
8
SUPPLY VOLTAGE (V)
Figure 8. Ground Current vs. Supply Voltage
Figure 9. Ground Current vs. Supply Voltage
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6
10
NCP58300
TYPICAL CHARACTERISTICS
TJ = 25°C if not otherwise noted
8.0
GROUND CURRENT (mA)
GROUND CURRENT (mA)
2.0
1.5
IOUT = 10 mA
1.0
0.5
0
−60
−30
0
30
60
90
TEMPERATURE (°C)
120
6.0
4.0
2.0
0
−60
150
IOUT = 250 mA
Figure 10. Ground Current vs. Temperature
−30
0
30
60
90
TEMPERATURE (°C)
3.40
VOUTnom = 3.3 V
OUTPUT VOLTAGE (V)
3.38
GROUND CURRENT (mA)
150
Figure 11. Ground Current vs. Temperature
80
60
40
120
IOUT = 3 A
20
3.36
3.34
3.32
DEVICE 1
3.30
3.28
3.26
DEVICE 2
DEVICE 3
3.24
3.22
0
−60
−30
0
30
60
90
TEMPERATURE (°C)
120
3.20
−60
150
30
60
90
120
150
Figure 13. Output Voltage vs. Temperature
8
2
VOUT = 0 V
VIN = 6 V
7
GROUND CURRENT (mA)
SHORT CIRCUIT CURRENT (A)
0
TEMPERATURE (°C)
Figure 12. Ground Current vs. Temperature
6
5
4
3
2
1
0
−60
−30
−30
0
30
60
90
120
1.5
1
RLOAD = 100 W
0.5
0
−0.5
−30
150
−20
−10
0
10
20
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 14. Short Circuit Current vs.
Temperature
Figure 15. Ground Current vs. Input Voltage
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7
30
NCP58300
TYPICAL CHARACTERISTICS
TJ = 25°C if not otherwise noted
50
15
12
ADJUST PIN CURRENT (nA)
ENABLE CURRENT (mA)
18
VEN = 5 V
9
6
3
0
−60
VEN = 2 V
−30
0
30
60
90
120
40
IOUT = 10 mA
30
20
10
0
−60
150
−30
0
30
60
90
120
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 16. Enable Current vs. Temperature
Figure 17. Adjust Pin Current vs. Temperature
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8
NCP58300
APPLICATIONS INFORMATION
Output Capacitor and Stability
The NCP58300 series requires an output capacitor for
stable operation. The NCP58300 series is designed to
operate with tantalum output capacitors. The recommended
output capacitance value is 10 mF or greater. Higher value
helps to improve transient response and noise reduction.
The value of output capacitor is dependent upon the output
current; lower currents allow smaller capacitors.
When NCP58300 is disabled and (VOUT – VIN) voltage
difference is less than 6.5 V in the application, the output
structure of these regulators is able to withstand output
voltage (backup battery as example) to be applied without
reverse current flow. Of course the additional current
flowing through the internal Feedback resistor divider at the
NCP58300 Fix voltage versions needs to be included in the
backup battery discharging calculations.
Input Capacitor
Adjustable Voltage Design
An input capacitor of 0.1 mF or greater is recommended
when the device is more than 4 inches away from the bulk
supply capacitance, or when the supply is a battery. Small,
surface−mount chip capacitors can be used for the
bypassing. The capacitor should be place within 1 inch of the
device for optimal performance. Larger values will help to
improve ripple rejection by bypassing the input of the
regulator, further improving the integrity of the output
voltage.
The NCP/NCV58302 Adjustable voltage Device Output
voltage is set by the ratio of two external resistors as shown
in Figure 18.The device maintains the voltage at the ADJ pin
at 1.24 V referenced to ground. The current in R2 is then
equal to1.24 V / R2, and the current in R1 is the current in
R2 plus the ADJ pin bias current. The ADJ pin bias current
flows from VOUT through R1 into the ADJ pin.
NCP58302
VIN
VIN
Minimum Load Current
VOUT
VOUT
+
The NCP58300 regulator is specified between finite
loads. A 7 mA minimum load current is necessary for proper
operation.
CIN
+
R1
EN
COUT
10 mF,
Tantalum
ADJ
GND
Error Flag
R2
Some NCP58300 series members feature an error flag
circuit that monitors the output voltage and signals an error
condition when the voltage is 5% below the nominal output
voltage. The error flag is an open−collector output that can
sink up to 10 mA during a VOUT fault condition. The FLG
output is overload protected when a short circuit of the
pullup load resistor occurs in the application. This is
guaranteed in the full range of FLG output voltage Max
ratings (see Max Ratings table).
ǒ
Ǔ
R1
) I ADJ @ R1
R2
Figure 18. Adjustable Voltage Operation
V OUT + 1.24 V @ 1 )
For the R2 resistor value up to 15 kW the IADJ current
impact can be neglected and the R1 resistor value can be
calculated y:
Enable Input
R1 + R2
Some NCP58300 series members also feature an enable
input for on/off control of the device. It’s shutdown state
draws “zero” current from input voltage supply (only
microamperes of leakage). The enable input is TTL/CMOS
compatible for simple logic interface, but can be connected
up to VIN.
ǒ
V OUT
1.24
Ǔ
*1
(eq. 1)
Where VOUT is the desired nominal output voltage.
Thermal Considerations
The power handling capability of the device is limited by
the maximum rated junction temperature (125°C). The PD
total power dissipated by the device has two components,
Input to output voltage differential multiplied by Output
current and Input voltage multiplied by GND pin current.
Overcurrent and Reverse Output Current Protection
The NCP58300 regulator is fully protected from damage
due to output current overload conditions. When NCP58300
output is overloaded, Output Current limiting is provided.
This limiting is linear; output current during overload
conditions is constant. The device is also capable to
withstand power−on or enable start−up with output shorted
to ground for the full Recommended Operating Conditions
range. These features are advantageous for powering
FPGAs and other ICs having current consumption higher
than nominal during their startup.
Thermal shutdown disables the NCP58300 device when
the die temperature exceeds the maximum safe operating
temperature.
P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND
(eq. 2)
The GND pin current value can be found in Electrical
Characteristics table and in Typical Characteristics graphs.
The Junction temperature TJ is
T J + T A ) P D @ R qJA
(eq. 3)
where TA is ambient temperature and RθJA is the Junction to
Ambient Thermal Resistance of the NCP/NCV58300
device mounted on the specific PCB.
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9
NCP58300
ORDERING INFORMATION
Device
NCP58302DSADJR4G
Output
Current
3.0 A
Output
Voltage
ADJ
Junction Temp. Range
Package
Shipping†
−40°C to +125°C
D2PAK−5
800 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NCP58300
PACKAGE DIMENSIONS
D2PAK 5
CASE 936A−02
ISSUE D
TERMINAL 6
−T−
OPTIONAL
CHAMFER
A
U
U1
E
S
K
B
V
V1
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING
SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR
GATE PROTRUSIONS. MOLD FLASH AND GATE
PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM.
1 2 3 4 5
M
D
0.010 (0.254)
G
M
P
N
T
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
U1
V1
L
R
C
SOLDERING FOOTPRINT*
8.38
0.33
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
0.297
0.305
0.038
0.046
1.702
0.067
10.66
0.42
16.02
0.63
3.05
0.12
SCALE 3:1
1.016
0.04
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
MILLIMETERS
MIN
MAX
9.804
10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691
14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
7.544
7.747
0.965
1.168
NCP58300
PACKAGE DIMENSIONS
D2PAK
CASE 936−03
ISSUE C
−T−
K
OPTIONAL
CHAMFER
A
TERMINAL 4
E
U
S
B
F
V
H
1
2
3
M
J
D
0.010 (0.254) M T
L
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
P
N
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
R
SOLDERING FOOTPRINT*
C
10.49
8.38
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
_
5 REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
_
5 REF
2.946 REF
5.080 MIN
6.350 MIN
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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