NCP600
LDO Regulator - High
Performance, Low-Power,
Enable
The NCP600 provides 150 mA of output current at fixed voltage
options, or an adjustable output voltage from 5.0 V down to 1.25 V. It
is designed for portable battery powered applications and offers high
performance features such as low power operation, fast enable
response time, and low dropout.
The device is designed to be used with low cost ceramic capacitors
and is packaged in the TSOP−5 and DFN6, 2x2.2 packages.
Features
•
•
5
TSOP−5
SN SUFFIX
CASE 483
1
Adjustable, 1.3 V, 1.5 V, 1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V, 3.5 V, 5.0 V
Ultra−Low Dropout Voltage of 150 mV at 150 mA
Adjustable Output by External Resistors from 5.0 V down to 1.25 V
Fast Enable Turn−on Time of 15 ms
Wide Supply Voltage Range Operating Range
Excellent Line and Load Regulation
High Accuracy up to 1.5% Output Voltage Tolerance over All
Operating Conditions
Typical Noise Voltage of 50 mVrms without a Bypass Capacitor
Pb−Free Package is Available
Typical Applications
•
•
•
•
MARKING
DIAGRAMS
5
• Output Voltage Options:
•
•
•
•
•
•
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SMPS Post−Regulation
Hand−held Instrumentation
Noise Sensitive Circuits – VCO, RF Stages, etc.
Camcorders and Cameras
6
1
6 PIN DFN, 2x2.2
MN SUFFIX
CASE 506BA
xxxAYWG
G
1
ÉÉ
ÉÉ
XXMG
G
XX
= Specific Device Code
xxx
= Specific Device Code
M
= Date Code
A
= Assembly Location
Y
= Year
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 13 of this data sheet.
VOUT
VIN
Fixed Voltage Only
Driver w/
Current Limit
GND
+
-
+
1.25 V
−
Thermal
Shutdown
ADJ
Adjustable Version Only
ENABLE
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2013
September, 2019 − Rev. 11
1
Publication Order Number:
NCP600/D
NCP600
PIN CONNECTIONS
Vin
1
GND
2
ENABLE
3
5
Vout 1
Vout
6 Vin
GND 2
GND
5 GND
NC 3
4 ADJ/NC*
4 ENABLE
(Top View)
* ADJ − Adjustable Version
* NC − Fixed Voltage Version
(Top View)
Figure 2. Pin Connections − TSOP5
Figure 3. Pin Connections − DFN6
PIN FUNCTION DESCRIPTION
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
Pin No.
DFN6
3
2, 5, EPAD
4
6
1
TSOP−5
Pin Name
4
ADJ/NC
2
GND
3
ENABLE
Description
Output Voltage Adjust Input (Adjustable Version), No Connection (Fixed Voltage Versions)
(Note 1)
Power Supply Ground; Device Substrate
The Enable Input places the device into low−power standby when pulled to logic low
(< 0.4 V). Connect to Vin if the function is not used.
1
Vin
Positive Power Supply Input
5
Vout
Regulated Output Voltage
1. True no connect. Printed circuit board traces are allowable.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Vin
−0.3 to 6.5
V
Vout, ENABLE, ADJ
−0.3 to 6.5 (or Vin + 0.3)
Whichever is Lower
V
TJ(max)
150
°C
Input Voltage Range (Note 2)
Output, Enable, Adjustable Voltage Range
Maximum Junction Temperature
Storage Temperature Range
TSTG
−65 to 150
°C
ESD Capability, Human Body Model (Note 3)
ESDHBM
3500
V
ESD Capability, Machine Model (Note 3)
ESDMM
200
V
MSL
MSL1/260
−
Moisture Sensitivity Level
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Characteristics, DFN6, 2x2.2 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
RqJA
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
RqJA
Value
Unit
°C/W
122
°C/W
215
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2, 1 oz copper thickness.
OPERATING RANGES (Note 6)
Rating
Symbol
Min
Max
Unit
Operating Input Voltage (Note 7)
Vin
1.75 V
6
V
Adjustable Output Voltage (Adjustable Version Only)
Vout
1.25
5.0
V
Output Current
Iout
0
150
mA
Ambient Temperature
TA
−40
125
°C
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
7. Minimum Vin = 1.75 V or (Vout + VDO), whichever is higher.
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NCP600
ELECTRICAL CHARACTERISTICS (Vin = 1.750 V, Vout = 1.250 V, Cin = Cout =1.0 mF, for typical values TA = 25°C, for min/max
values TA = −40°C to 125°C, unless otherwise specified.) (Note 8)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
1.231
(−1.5%)
1.250
1.269
(+1.5%)
V
−
−
−
62
55
38
−
−
−
Regulator Output (Adjustable Voltage Version)
Vout
Iout = 1.0 mA to 150 mA
Vin = 1.75 V to 6.0 V,
Vout = ADJ
Power Supply Ripple Rejection
(Vin = Vout + 1.0 V + 0.5 Vp−p)
PSRR
Iout = 1.0 mA to 150 mA
f = 120 Hz
f = 1.0 kHz
f = 10 kHz
Line Regulation
Regline
Vin = 1.750 V to 6.0 V,
Iout = 1.0 mA
−
1.0
10
mV
Load Regulation
Regload
Iout = 1.0 mA to 150 mA
−
2.0
15
mV
−
50
−
mVrms
300
550
800
mA
−
−
−
−
−
−
175
175
150
125
100
75
250
250
225
175
150
125
Output Voltage
Output Noise Voltage (Note 9)
Vn
f = 10 Hz to 100 kHz
Output Short Circuit Current
Isc
Vout = 0 V
Dropout Voltage
1.25 V
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V to 5.0 V
VDO
Measured at: Vout – 2.0%,
Iout = 150 mA
dB
mV
Regulator Output (Fixed Voltage Version) (Vin = Vout + 0.5 V, Cin = Cout =1.0 mF, for typical values TA = 25°C, for min/max values TA =
−40°C to 125°C; unless otherwise noted.) (Notes 8)
Output Voltage
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
3.5 V
5.0 V
Vout
Iout = 1.0 mA to 150 mA
Vin = (Vout + 0.5 V) to 6.0 V
Power Supply Ripple Rejection (Note 9)
(Vin = Vout + 1.0 V + 0.5 Vp−p)
PSRR
Iout = 1.0 mA to 150 mA
f = 120 Hz
f = 1.0 kHz
f = 10 kHz
Line Regulation
Regline
Vin = 1.750 V to 6.0 V,
Iout = 1.0 mA
Load Regulation
1.3 V to 1.5 V
1.8 V
2.5 V to 5.0 V
Regload
Iout = 1.0 mA to 150 mA
Output Noise Voltage (Note 9)
Vn
f = 10 Hz to 100 kHz
Output Short Circuit Current
Isc
Vout = 0 V
Dropout Voltage
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V to 5.0 V
VDO
Measured at: Vout – 2.0%
1.274
1.470
1.764
2.450
2.744
2.940
3.234
3.430
4.900
(−2%)
1.326
1.530
1.836
2.550
2.856
3.060
3.366
3.570
5.100
(+2%)
−
−
−
62
55
38
−
−
−
−
1.0
10
−
−
−
2.0
2.0
2.0
20
25
30
V
dB
mV
mV
−
50
−
mVrms
300
550
800
mA
−
−
−
−
−
175
150
125
85
75
250
225
175
175
125
mV
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Values based on design and/or characterization.
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NCP600
ELECTRICAL CHARACTERISTICS (Vin = Vout + 0.5 V, For Typical Values TA = 25°C, For Min/Max Values TA = −40°C to
125°C, unless otherwise specified.) (Note 10)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
−
0.01
1.0
mA
−
−
−
−
−
100
135
135
140
145
135
150
170
175
180
General
Disable Current
IDIS
ENABLE = 0 V, Vin = 6 V
TA = −40°C to 85°C
Ground Current
1.25 V (Adjustable)
1.3 V
1.5 V
1.8 V to 3.0 V
3.3 V to 5.0 V
IGND
ENABLE = 0.9 V,
Iout = 1.0 mA to 150 mA
Thermal Shutdown Temperature (Note 11)
TSD
−
175
−
°C
Thermal Shutdown Hysteresis (Note 11)
TSH
−
10
−
°C
ADJ Input Bias Current
IADJ
−0.75
−
0.75
mA
mA
Chip Enable
ENABLE Input Threshold Voltage
Vth(EN)
V
Voltage Increasing, Logic High
0.9
−
−
Voltage Decreasing, Logic Low
−
−
0.4
−
3.0
100
−
−
−
15
15
30
25
25
50
Enable Input Bias Current (Note 11)
IEN
nA
Timing
Output Turn On Time (Note 11)
1.25 V
1.3 V to 3.5 V
5.0 V
tEN
ENABLE = 0 V to Vin
ms
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Values based on design and/or characterization.
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NCP600
VIN
VIN
CIN
VOUT
VOUT
NCP600
(adjustable)
ADJ
EN
COUT
GND
Figure 4. Typical Application Circuit for Vout = 1.25 V
(Adjustable Version)
VOUT
NCP600
(adjustable)
VIN
VIN
CIN
VOUT
R1
ADJ
EN
COUT
R2
GND
Figure 5. Typical Application Circuit for Adjustable Vout
VIN
VIN
CIN
VOUT
NCP600
(fixed)
EN
GND
Figure 6. Typical Application Circuit
(Fixed Voltage Version)
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VOUT
COUT
NCP600
TYPICAL CHARACTERISTICS
1.256
1.260
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
1.260
Iout = 1.0 mA
1.252
Iout = 150 mA
1.248
Vin = Vout + 0.5 V
Vout = ADJ
1.244
1.240
−40 −20
0
20
40
60
80
−15
10
35
60
85
110 125
Figure 7. Output Voltage vs. Temperature
(Vin = Vout + 0.5 V)
Figure 8. Output Voltage vs. Temperature
(Vin = 6.0 V)
1.500
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Iout = 1.0 mA
1.490
Iout = 150 mA
1.485
1.480
−15
10
35
60
85
Iout = 1.0 mA
1.495
1.490
Iout = 150 mA
1.485
1.480
1.475
−40
110 125
−15
10
35
60
85
110 125
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 9. Output Voltage vs. Temperature
(1.5 V Fixed Output, Vin = 2 V)
Figure 10. Output Voltage vs. Temperature
(1.5 V Fixed Output, Vin = 6 V)
3.005
3.005
Iout = 1.0 mA
3.000
2.995
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Vin = 6.0 V
Vout = ADJ
1.244
TA, AMBIENT TEMPERATURE (°C)
1.495
Iout = 150 mA
2.990
2.985
2.980
2.975
−40
Iout = 150 mA
1.248
TA, AMBIENT TEMPERATURE (°C)
1.500
1.475
−40
Iout = 1.0 mA
1.252
1.240
−40
120
100
1.256
−15
10
35
60
85
110 125
Iout = 1.0 mA
3.000
2.995
2.990
Iout = 150 mA
2.985
2.980
2.975
2.970
−40
TA, AMBIENT TEMPERATURE (°C)
−15
10
35
60
85
110 125
TA, AMBIENT TEMPERATURE (°C)
Figure 11. Output Voltage vs. Temperature
(3.0 V Fixed Output, Vin = 3.5 V)
Figure 12. Output Voltage vs. Temperature
(3.0 V Fixed Output, Vin = 6 V)
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NCP600
TYPICAL CHARACTERISTICS
5.000
Iout = 1.0 mA
4.995
4.990
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
5.000
Iout = 150 mA
4.985
4.980
4.975
4.970
4.965
−40
−15
10
35
60
110 125
85
Iout = 1.0 mA
4.995
4.990
4.985
Iout = 150 mA
4.980
4.975
4.970
4.965
−40
−15
TA, AMBIENT TEMPERATURE (°C)
85
110 125
250
VDO, DROPOUT VOLTAGE (mV)
Vout = ADJ
Iout = 150 mA
200
150
100
Iout = 50 mA
50
Iout = 1.0 mA
0
−40 −20
0
20
40
60
80
100
Iout = 150 mA
Vout = 1.25 V
200
1.50 V
1.80 V
150
2.80 V
100
3.00 V
50
5.00 V
0
−40 −20
120
0
20
40
60
80
100
120
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 15. Dropout Voltage vs. Temperature
(Over Current Range)
Figure 16. Dropout Voltage vs. Temperature
(Over Output Voltage)
800
6.0
5.5
5.0
Iout = 0 mA
Cout = 1.0 mF
TA = 25°C
ENABLE = Vin
4.5
4.0
Vth(EN), ENABLE THRESHOLD (mV)
VDO, DROPOUT VOLTAGE (mV)
60
Figure 14. Output Voltage vs. Temperature
(5.0 V Fixed Output, Vin = 6 V)
250
Vout, OUTPUT VOLTAGE (V)
35
TA, AMBIENT TEMPERATURE (°C)
Figure 13. Output Voltage vs. Temperature
(5.0 V Fixed Output, Vin = 5.5 V)
5.0 V
3.3 V
3.0 V
3.5
3.0
2.80 V
2.5
2.0
1.80 V
1.5 V
1.5
1.0
0.5
0
10
1.25 V
0
1.0
2.0
3.0
4.0
5.0
6.0
750
Enable Increasing
700
Enable Decreasing
650
Vin = 5.5 V
600
−40
−15
10
35
60
85
110 125
Vin, INPUT VOLTAGE (V)
TA, AMBIENT TEMPERATURE (°C)
Figure 17. Output Voltage vs. Input Voltage
Figure 18. Enable Threshold vs. Temperature
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NCP600
6.0
4.0
3.0
2.0
ENABLE = 0 V
1.0
0
−40
−15
10
35
60
110
114
Vout = 1.25 V
Iout = 1.0 mA
106
Iout = 150 mA
98
ENABLE = 0.9 V
−20
0
20
40
60
80
100
5.0 V
3.3 V
1.8 V
1.25 V
60
40
20
1.0
2.0
3.0
120
106
3.0 V
1.5 V
4.0
104
103
102
101
100
Vout = ADJ
Vin = 1.75 V
99
98
6.0
5.0
105
0
25
50
75
100
125
150
Vin, INPUT VOLTAGE (V)
Iout, OUTPUT CURRENT (mA)
Figure 21. Ground Current vs. Input Voltage
Figure 22. Ground Current vs. Output Current
IADJ, ADJ INPUT BIAS CURRENT (nA)
0
122
Figure 20. Ground Current (Run Mode) vs.
Temperature
80
0
130
90
−40
125
Iout = 150 mA
Vout = 5.0 V
138
Figure 19. Ground Current (Sleep Mode) vs.
Temperature
140
100
146
TA, AMBIENT TEMPERATURE (°C)
2.8 V
120
85
Iout = 1.0 mA
TA, AMBIENT TEMPERATURE (°C)
160
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
154
5.0
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
TYPICAL CHARACTERISTICS
400
300
200
100
0
−40
−20
0
20
40
60
80
100
120
TA, AMBIENT TEMPERATURE (°C)
Figure 23. ADJ Input Bias Current vs. Temperature
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NCP600
700
650
ILIM, CURRENT LIMIT (mA)
ISC, OUTPUT SHORT CIRCUIT CURRENT (mA)
TYPICAL CHARACTERISTICS
600
550
500
450
−40 −20
0
20
40
60
80
100
600
500
400
300
200
100
0
120
3.0
5.0
4.0
Figure 24. Output Short Circuit Current vs.
Temperature
Figure 25. Current Limit vs. Input Voltage
6.0
5.0
Regload, LOAD REGULATION (mV)
3.0
2.0
1.0
Vin = (Vout + 0.5 V) to 6.0 V
Iout = 1.0 mA
0
20
40
60
80
100
120
4.0
3.0
2.0
1.0
Iout = 1.0 mA to 150 mA
0
−40
−15
10
35
60
85
110 125
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 26. Line Regulation vs. Temperature
Figure 27. Load Regulation vs. Temperature
45
80
40
70
1.25 V
60
35
5.0 V
PSRR (dB)
Regline, LINE REGULATION (mV)
2.0
Vin, INPUT VOLTAGE (V)
0
−40 −20
ton, OUTPUT TURN ON TIME (mS)
1.0
TA, AMBIENT TEMPERATURE (°C)
4.0
30
25
3.0 V
20
15
0
1.5 V
0
40
5.0 V
30
Vin = Vout + 1.0 V
Vripple = 0.5 Vp−p
Cout = 1.0 mF
Iout = 1.0 mA to 150 mA
20
1.25 V (ADJ)
10
−40 −20
3.3 V
50
10
20
40
60
80
100
0
120
0.1
1.0
10
100
TA, AMBIENT TEMPERATURE (°C)
f, FREQUENCY (kHz)
Figure 28. Output Turn On Time vs.
Temperature
Figure 29. Power Supply Ripple Rejection vs.
Frequency
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NCP600
TYPICAL CHARACTERISTICS
OUTPUT CAPACITOR ESR (W)
10
Unstable Region
Vout = 5.0 V
Vout = 1.25 V
1.0
Stable Region
0.1
0.01
Cout = 1.0 mF to 10 mF
TA = −40°C to 125°C
Vin = up to 6.0 V
0
25
50
75
100
125
150
Iout, OUTPUT CURRENT (mA)
Figure 30. Output Stability with Output
Capacitor ESR over Output Current
Vout = 1.25 V
Figure 31. Load Transient Response (1.0 mF)
Vout = 1.25 V
Figure 32. Load Transient Response (10 mF)
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NCP600
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in output load
current at a constant temperature.
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation or by using pulse techniques such that the
average junction temperature is not significantly affected.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 2% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Output Noise Voltage
Load Transient Response
This is the integrated value of the output noise over a
specified frequency range. Input voltage and output load
current are kept constant during the measurement. Results
are expressed in mVrms or nV/√Hz.
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between no−load and full−load conditions.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Disable and Ground Current
Ground Current (IGND) is the current that flows through
the ground pin when the regulator operates with a load on its
output. This consists of internal IC operation, bias, etc. It is
actually the difference between the input current (measured
through the LDO input pin) and the output load current. If
the regulator has an input pin that reduces its internal bias
and shuts off the output (enable/disable function), this term
is called the disable current (IDIS).
Maximum Package Power Dissipation
The power dissipation level at which the junction
temperature reaches its maximum operating value.
APPLICATIONS INFORMATION
output, there is no resistor divider. If the part is enabled
under no−load conditions, leakage current through the pass
transistor at junction temperatures above 85°C can approach
several microamps, especially as junction temperature
approaches 150°C. If this leakage current is not directed into
a load, the output voltage will rise up to a level
approximately 20 mV above nominal.
The NCP600 contains an overshoot clamp circuit to
improve transient response during a load current step
release. When output voltage exceeds the nominal by
approximately 20 mV, this circuit becomes active and
clamps the output from further voltage increase. Tying the
ENABLE pin to Vin will ensure that the part is active
whenever the supply voltage is present, thus guaranteeing
that the clamp circuit is active whenever leakage current is
present.
When the NCP600 adjustable regulator is disabled, the
overshoot clamp circuit becomes inactive and the pass
transistor leakage will charge any capacitance on Vout. If no
load is present, the output can charge up to within a few
millivolts of Vin. In most applications, the load will present
some impedance to Vout such that the output voltage will be
inherently clamped at a safe level. A minimum load of
10 mA is recommended.
The NCP600 series regulator is self−protected with
internal thermal shutdown and internal current limit. Typical
application circuits are shown in Figures 4 and 5.
Input Decoupling (Cin)
A ceramic or tantalum 1.0 mF capacitor is recommended
and should be connected close to the NCP600 package.
Higher capacitance and lower ESR will improve the overall
line transient response.
Output Decoupling (Cout)
The NCP600 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. The minimum output decoupling value is
1.0 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response. Figure 30 shows the stability region for a range of
operating conditions and ESR values.
No−Load Regulation Considerations
The NCP600 adjustable regulator will operate properly
under conditions where the only load current is through the
resistor divider that sets the output voltage. However, in the
case where the NCP600 is configured to provide a 1.250 V
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11
NCP600
Noise Decoupling
PD(MAX) +
The NCP600 is a low noise regulator and needs no
external noise reduction capacitor. Unlike other low noise
regulators which require an external capacitor and have slow
startup times, the NCP600 operates without a noise
reduction capacitor, has a typical 15 ms start up delay and
achieves a 50 mVrms overall noise level between 10 Hz and
100 kHz.
P D [ V inǒI GND @ I outǓ ) I outǒV in * V outǓ
The enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet. The turn−on/turn−off transient
voltage being supplied to the enable pin should exceed a
slew rate of 10 mV/ms to ensure correct operation. If the
enable function is not to be used then the pin should be
connected to Vin.
RthJA, THERMAL RESISTANCE JUNCTION−TO−AMBIENT (°C/W)
V in(MAX) [
1)
R2 ^
Ǔ
R2
) ǒI ADJ
R 1Ǔ
out
1.25
*1
I outǓ
(eq. 5)
I out ) I GND
300
250
TSOP−5 (1 oz)
200
(eq. 1)
DFN6 2x2.2 (1 oz)
150
(eq. 2)
Input bias current IADJ is typically less than 150 nA.
Choose R2 arbitrarily to minimize errors due to the bias
current and to minimize noise contribution to the output
voltage. Use Equation 2 to find the required value for R1.
Thermal
As power in the NCP600 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCP600 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCP600 can handle is given by:
TSOP−5 (2 oz)
DFN6 2x2.2 (2 oz)
100
R1
V
P D(MAX) ) ǒV out
350
The output voltage can be adjusted from 1 times
(Figure 4) to 4 times (Figure 5) the typical 1.250 V
regulation voltage via the use of resistors between the output
and the ADJ input. The output voltage and resistors are
chosen using Equation 1 and Equation 2.
ǒ
(eq. 4)
or
Output Voltage Adjust
V out + 1.250
(eq. 3)
Since TJ is not recommended to exceed 125°C (TJ(MAX)),
then the NCP600 in a DFN6 package can dissipate up to
870 mW when the ambient temperature (TA) is 25°C, and
PCB area is 640 mm2 and larger, see Figure 33.
The power dissipated by the NCP600 can be calculated
from the following equations:
Enable Operation
R1
TJ(MAX) * TA
RqJA
50
0
0
100
200
300
400
500
PCB COPPER AREA (mm2)
600
700
Figure 33. RthJA vs. PCB Copper Area
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP600, and
make traces as short as possible.
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12
NCP600
DEVICE ORDERING INFORMATION
Marking Code
Version
NCP600SNADJT1G
Device
LIO
ADJ
NCP600SN130T1G
LJZ
1.3 V
NCP600SN150T1G
LID
1.5 V
NCP600SN180T1G
LIE
1.8 V
ACM
2.5 V
NCP600SN280T1G
LIH
2.8 V
NCP600SN300T1G
LIJ
3.0 V
NCP600SN330T1G
LIK
3.3 V
NCP600SN350T1G
LJR
3.5 V
NCP600SN500T1G
LIN
5.0 V
NCP600MN130R2G
L2
1.3 V
NCP600SN250T1G
Package
Shipping*
TSOP−5
(Pb−Free)
3000 / Tape & Reel
DFN6
(Pb−Free)
3000 / Tape & Reel
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
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13
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN6, 2x2.2, 0.65P
CASE 506BA−01
ISSUE A
6
DATE 07 JUL 2008
1
SCALE 4:1
A
B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
L1
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
2X
0.10 C
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
TOP VIEW
ÉÉ
ÉÉ
ÉÉ
EXPOSED Cu
2X
0.10 C
A
0.10 C
DIM
A
A1
b
D
D2
E
E2
e
K
L
L1
A3
MOLD CMPD
A1
ÇÇ
ÉÉ
DETAIL B
DETAIL B
ALTERNATE
CONSTRUCTIONS
7X
0.08 C
SIDE VIEW
C
A1
L
SEATING
PLANE
e
6X
3
1
1
L1
6
4
6X
BOTTOM VIEW
XX MG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
E2
K
GENERIC
MARKING DIAGRAM*
D2
DETAIL A
6X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20
0.30
2.00 BSC
1.10
1.30
2.20 BSC
0.70
0.90
0.65 BSC
0.20
−−−
0.25
0.35
0.00
0.10
*This information is generic. Please refer
to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
b
0.10 C A B
0.05 C
SOLDERING FOOTPRINT*
NOTE 3
1.36
PACKAGE
OUTLINE
6X
0.58
2.50
0.96
1
6X
0.35
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON23023D
6 PIN DFN, 2.0X2.2, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
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