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NCS2564DTBGEVB

NCS2564DTBGEVB

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    -

  • 描述:

    BOARD EVAL FOR NCS2564 VID DVR

  • 数据手册
  • 价格&库存
NCS2564DTBGEVB 数据手册
NCS2564 Four-Channel Video Driver with Selectable SD / HD Reconstruction Filters The NCS2564 is a 4−channel high speed video driver with 6th order Butterworth Reconstruction filters on each channel. A first set of 3−channel has selectable Standard Definition (SD) / High Definition (HD) filters, one per channel. A fourth channel offers an extra filter driver for driving CVBS−type video signal. The NCS2564 is in fact a combination of a triple SD/HD video driver plus a single CVBS video driver. It is designed to be compatible with Digital−to−Analog Converters (DAC) embedded in most video processors. To further reduce power consumption, 2 enable pins are provided one for the triple driver and another one for the single driver. One pin allows selecting the filter frequency of the triple driver. All channels can accept DC− or AC−coupled signals. In case of AC−coupled inputs, the internal clamps are enabled. The outputs can drive both AC and DC coupled 150 W loads. Features • 3−Channel with per Channel a Selectable Sixth−Order Butterworth • • • • • • • • • • • • 8/34 MHz Filter One CVBS Driver Including 6th Order Butterworth 8 MHz Filter Transparent Clamp Internal Fixed Gain: 6 dB $0.2 Integrated Level Shifter AC− or DC−Coupled Inputs and Outputs Low Quiescent Current Shutdown Current 42 mA Typical (Disabled) Each channel Capable to Drive 2 by 150 W Loads Wide Operating Supply Voltage Range: +4.7 V to +5.3 V 8 kV ESD Protection (IEC61000−4−2 Compatible) TSSOP−14 Package These are Pb−Free Devices Typical Application April, 2011 − Rev. 6 MARKING DIAGRAM 14 14 1 TSSOP−14 TBD SUFFIX CASE 948G 1 NCS 2564 ALYWG G NCS2564 = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package PINOUT CVBS_IN 1 14 CVBS_OUT CVBS_EN 2 13 GND VCC 3 12 GND 4 11 SD/HD_EN SD/HD_IN1 5 10 SD/HD_OUT1 SD/HD_IN2 6 9 SD/HD_OUT2 SD/HD_IN3 7 8 SD/HD_OUT3 SD/HD (Top View) ORDERING INFORMATION Device NCS2564DTBR2G Package Shipping† TSSOP−14 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. • Set Top Box Decoder • DVD Player / Recorder • HDTV © Semiconductor Components Industries, LLC, 2011 http://onsemi.com 1 Publication Order Number: NCS2564/D NCS2564 CVBS_IN 1 6dB Transparent Clamp 14 CVBS_OUT 13 GND 12 GND 11 SD/HD_EN 6dB 10 SD/HD_OUT1 6dB 9 SD/HD_OUT2 6dB 8 SD/HD_OUT3 6th Order, 8 MHz Filter CVBS_EN 2 250 kW GND VCC 3 SD/HD 4 SD/HD_IN1 5 250 kW Transparent Clamp 6th Order, Selectable 8/34 MHz Filter SD/HD_IN2 6 Transparent Clamp 6th Order, Selectable 8/34 MHz Filter SD/HD_IN3 7 Transparent Clamp 6th Order, Selectable 8/34 MHz Filter Figure 1. NCS2564 Block Diagram http://onsemi.com 2 NCS2564 PIN DESCRIPTION Pin No. Name Type 1 CVBS_IN Input Video Input for Video Signal featuring a frequency bandwidth compatible with NTSC / PAL / SECAM Video (8 MHz) − CVBS Channel Description 2 CVBS_EN Input CVBS Channel Enable /Disable Function: Low = Enable, High = Disable. When left open the default state is Enable. 3 VCC Power 4 SD/HD Input Pin of selection enabling the Standard Definition or High Definition Filters (8 MHz / 34 MHz) for channels SD/HD − when Low SD filters are selected, when High HD filters are selected. 5 SD/HD_IN1 Input Selectable SD or HD Video Input 1 − SD/HD Channel 1 6 SD/HD_IN2 Input Selectable SD or HD Video Input 2 − SD/HD Channel 2 7 SD/HD_IN3 Input Selectable SD or HD Video Input 3 − SD/HD Channel 3 8 SD/HD_OUT3 Output SD/HD Video Output 3 − SD/HD Channel 3 9 SD/HD_OUT2 Output SD/HD Video Output 2 − SD/HD Channel 2 10 SD/HD_OUT1 Output SD/HD Video Output 1 − SD/HD Channel 1 11 SD/HD_EN Input 12 GND Ground Ground 13 GND Ground Ground 14 CVBS_OUT Output CVBS Video Output – CVBS Channel Power Supply / 4.7 V to 5.3 V SD/HD Channel Enable/Disable Function: Low = Enable, High = Disable. When left open the default state is Enable. http://onsemi.com 3 NCS2564 MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltages VCC −0.3 v VCC v 5.5 Vdc I/O Voltage Range VIO −0.3 v VI v VCC Vdc Input Differential Voltage Range VID −0.3 v VI v VCC Vdc Output Current (Indefinitely) per Channel IO 40 mA Maximum Junction Temperature (Note 1) TJ 150 °C Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Range Tstg −60 to +150 °C Thermal Resistance, Junction−to−Air RqJA 125 °C/W ESD Protection Voltage (IEC61000−4−2) Vesd >8000 V ESD HBM − Human Body Model HBM 4000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. 1800 The maximum power that can be safely dissipated is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 150°C. If the maximum is exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the device in the “overheated” condition for an extended period can result in device burnout. To ensure proper operation, it is important to observe the derating curves. 1600 POWER DISSIPATION (mV) Maximum Power Dissipation 1400 1200 1000 800 600 400 200 0 −40 −30−20−10 0 10 20 30 40 50 60 70 80 90100 TEMPERATURE (°C) Figure 2. Power Dissipation vs Temperature http://onsemi.com 4 NCS2564 DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, Rsource = 37.5 W, TA = 25°C, inputs AC−coupled with 0.1 mF, all outputs AC−coupled with 220 mF into 150 W referenced to 400 kHz; unless otherwise specified) Symbol Characteristics Conditions Min Typ Max Unit 4.7 5.0 5.3 V 40 50 55 70 mA 42 60 mA POWER SUPPLY VCC Supply Voltage Range ICC Supply Current ISD Shutdown Current (CVBS_EN and SD/HD_EN High) SD Channels Selected + Cvbs HD Channels Selected + Cvbs DC PERFORMANCE Vi Input Common Mode Voltage Range GND 1.4 VPP VIL Input Low Level for the Control Pins (2, 4, 11) 0 0.8 V VIH Input High Level for the Control Pins (2, 4, 11) 2.4 VCC V Rpd Pulldown Resistors on Pins CVBS_EN and SD/HD_EN 250 kW OUTPUT CHARACTERISTICS VOH Output Voltage High Level 2.8 V VOL Output Voltage Low Level 200 mV IO Output Current 40 mA AC ELECTRICAL CHARACTERISTICS FOR STANDARD DEFINITION CHANNELS (pin numbers (1, 14) (5, 10), (6, 9), (7, 8)) (VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, inputs AC−coupled with 0.1 mF, all outputs AC−coupled with 220 mF into 150 W referenced to 400 kHz; unless otherwise specified, SD/HD = Low) Characteristics Symbol Conditions Min Typ Max Unit Vin = 1 V − All SD Channels 5.8 6.0 6.2 dB −1 dB −3 dB 5.5 6.5 7.2 8.0 @ 27 MHz 43 50 dB AVSD Voltage Gain BWSD Low Pass Filter Bandwidth (Note 3) ARSD Stop−band Attenuation (Notes 3 and 4) dGSD Differential Gain Error 0.7 % dFSD Differential Phase Error 0.7 ° THD Total Harmonic Distortion Vout = 1.4 VPP @ 3.58 MHz 0.35 % XSD Channel−to−Channel Crosstalk @ 1 MHz and Vin = 1.4 VPP −57 dB SNRSD Signal−to−Noise Ratio NTC−7 Test Signal, 100 kHz to 4.2 MHz (Note 2) 72 dB DtSD Propagation Delay @ 4.5 MHz 70 ns DGDSD Group Delay Variation 100 kHz to 8 MHz 20 ns 2. SNR = 20 x log (714 mV / RMS noise) 3. 100% of Tested ICs fit the bandwidth and attenuation tolerance at 25°C. 4. Guaranteed by characterization. http://onsemi.com 5 MHz NCS2564 AC ELECTRICAL CHARACTERISTICS FOR HIGH DEFINITION CHANNELS (pin numbers (5, 10) (6, 9), (7, 8)) (VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, inputs AC−coupled with 0.1 mF, all outputs AC−coupled with 220 mF into 150 W referenced to 400 kHz; unless otherwise specified, SD/HD = High) Min Typ Max Unit AVHD Voltage Gain Characteristics Vin = 1 V − All HD Channels 5.8 6.0 6.2 dB BWHD Low Pass Filter Bandwidth −1 dB (Note 6) −3 dB (Note 7) 26 30 31 34 MHz ARHD Stop−band Attenuation @ 44.25 MHz (Note 7) @ 74.25 MHz (Note 6) 33 15 42 dB THDHD Total Harmonic Distortion Vout = 1.4 VPP @ 10 MHz Vout = 1.4 VPP @ 15 MHz Vout = 1.4 VPP @ 20 MHz 0.4 0.6 0.8 % XHD Channel−to−Channel Crosstalk @ 1 MHz and Vin = 1.4 VPP −60 dB SNRHD Signal−to−Noise Ratio White Signal, 100 kHz to 30 MHz, (Note 5) 72 dB DtHD Propagation Delay 25 ns DGDHD Group Delay Variation from 100 kHz to 30 MHz 10 ns Symbol Conditions 5. SNR = 20 x log (714 mV / RMS noise) 6. Guaranteed by Characterization. 7. 100% of Tested ICs fit the bandwidth and attenuation tolerance at 25°C. http://onsemi.com 6 NCS2564 TYPICAL CHARACTERISTICS 30 30 20 20 10 10 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 0 −10 −20 −30 −1 dB @ 6.7 MHz −3 dB @ 8.1 MHz −53 dB @ 27 MHz −40 −50 −70 100k 1M −30 −1 dB @ 31 MHz −3 dB @ 33 MHz −16 dB @ 44.25 MHz −37 dB @ 74.25 MHz −40 −50 10M −70 100k 100M 1M 10M 100M FREQUENCY (Hz) FREQUENCY (Hz) Figure 3. SD Normalized Frequency Response Figure 4. HD Normalized Frequency Response 0.4 1.4 0.35 1.2 0.226 dB @ 3.6 MHz 0.3 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) −20 −60 −60 0.25 0.2 0.15 0.1 0.5 0 −0.1 100k 1M 1.0 0.8 0.6 0.4 0.2 0 −0.4 100k 10M Figure 5. SD Passband Flatness Figure 6. HD Passband Flatness 30M −20 −25 −51.8 dB @ 6.85 MHz −30 −55 −35 −60 −40 GAIN (dB) −50 −79 dB @ 50 kHz −50 −55 −80 −60 −85 −65 100k 1M −70 20 10M −37.6 dB @ 25 MHz −45 −75 −90 20k 10M FREQUENCY (Hz) −45 −70 1M FREQUENCY (Hz) −40 −65 1.035 dB @ 18.7 MHz −0.2 −0.5 GAIN (dB) 0 −10 −67 dB @ 50 kHz 100k 1M 10M 50M FREQUENCY (Hz) FREQUENCY (Hz) Figure 7. SD Channel−to−Channel Crosstalk Figure 8. HD Channel−to−Channel Crosstalk http://onsemi.com 7 NCS2564 TYPICAL CHARACTERISTICS 30 15 20 10 10 5 GROUP DELAY (ns) GROUP DELAY (ns) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 0 −10 20.7 ns @ 7 MHz −20 −30 −40 −50 −60 0 −5 9.1 ns @ 24.1 MHz −10 −15 −20 −25 −30 −70 400k 1M 10M −35 400k 20M 1M 10M 100M FREQUENCY (Hz) FREQUENCY (Hz) Figure 9. SD Normalized Group Delay Figure 10. HD Normalized Group Delay Output 0.7 VPP 25 ns 70 ns Output 0.7 VPP Input Figure 11. SD Propagation Delay Input Input Figure 12. HD Propagation Delay Input Output Output 200 mV 200 mV Figure 13. SD Small Signal Response Figure 14. HD Small Signal Response http://onsemi.com 8 NCS2564 TYPICAL CHARACTERISTICS VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified Output Input Output Input 1 VPP 1 VPP Figure 15. SD Large Signal Response Figure 16. HD Large Signal Response 0 −10 −20 PSRR (dB) −30 −40 −50 −60 −70 −80 −90 −100 20 100k 1M FREQUENCY (Hz) 10M Figure 17. SD and HD VCC PSRR vs. Frequency http://onsemi.com 9 50M NCS2564 TYPICAL CHARACTERISTICS 20 60 10 50 0 40 −10 30 −20 20 −30 10 −40 0 −50 −10 −60 −20 −70 −30 −80 400k 1M −40 50M 10M (Hz) NORMALIZED GROUP DELAY (ns) NORMALIZED GAIN (dB) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 20 35 10 30 0 25 −10 20 −20 15 −30 10 −40 5 −50 0 −60 −5 −70 −10 −80 400k −15 1M (Hz) 10M NORMALIZED GROUP DELAY (ns) NORMALIZED GAIN (dB) Figure 18. SD Frequency Response and Group Delay 100M Figure 19. HD Frequency Response and Group Delay 0.9 0.9 0.75 0.76 0.77 0.68 0.7 0.6 0.5 0..4 0.31 0.3 0.8 DIFFERENTIAL PHASE (°) DIFFERENTIAL GAIN (%) 0.8 0.2 0.1 0 0.75 0.7 0.65 0.6 0.5 0..4 0.36 0.3 0.2 0.14 0.07 0.1 0 1 2 3 4 5 0 6 1 2 3 4 5 HARMONIC HARMONIC Figure 20. SD Differential Gain Figure 21. SD Differential Phase http://onsemi.com 10 6 NCS2564 APPLICATIONS INFORMATION required as compared to discrete approached implemented The NCS2564 quad video driver has been optimized for with stand alone op amps. An internal level shifter is Standard and High Definition video applications covering employed shifting up the output voltage by adding an offset the requirements of the standards Composite video (CVBS), of 200 mV. This prevents sync pulse clipping and allows S−Video, Component Video (480i/525i, 576i/625i, 720p/1080i) and related (RGB). The three SD/HD channels DC−coupled output to the 150 W video load. In addition, the have selectable filters (8 MHz and 34 MHz) for covering NCS2564 integrates a 6th order Butterworth filter for each. either standard definition−like video applications or High This allows rejection of the aliases or unwanted Definition video applications. These frequencies are over-sampling effects produced by the video DAC. selectable using the pin SD/HD. Similarly for the case of DVD recorders which use an ADC, In the regular mode of operation each channel provides an this anti−aliasing filter (reconstruction filter) will avoid internal voltage−to−voltage gain of 2 from input to output. picture quality issue and will aide filtration of parasitic This effectively reduces the number of external components signals caused by EMI interference. +5V 10 mF 0.1 mF 1 Rs 2 CVBS EN Video Processor 3 4 SD/HD SEL 0.1 mF Y/G Pb / B Pr / R Rs Rs Rs 0.1 mF 0.1 mF 5 6 7 CVBS_IN CVBS_OUT CVBS_EN GND VCC GND SD/HD NCS2564 0.1 mF CVBS SD/HD_EN 14 SD/HD IN3 SD/HD OUT3 220 mF 75 W Cable 75 W CVBS 13 12 11 SD/HD IN1 SD/HD OUT1 10 SD/HD IN2 SD/HD OUT2 75 W 9 8 75 W 220 mF 75 W Cable 75 W 220 mF 75 W Cable 75 W 75 W 220 mF 75 W Cable 75 W TV Y/G Pb / B Pr / R 75 W SD/HD EN Figure 22. AC−Coupled Configuration at the Input and Output some cases it may be necessary to increase the nominal 220 mF capacitor value. A built−in diode−like clamp is used into the chip for each channel to support the AC−coupled mode of operation. The clamp is active when the input signal goes below 0 V. The built−in clamp and level shifter allow the device to operate in different configuration modes depending on the DAC output signal level and the input common mode voltage of the video driver. When the configuration is DC−Coupled at the Inputs and Outputs the 0.1 mF and 220 mF coupling capacitors are no longer used, and the clamps are in that case inactive; this configuration provides a low cost solution which can be implemented with few external components (Figure 23). The input is AC−coupled when either the input−signal amplitude goes over the range 0 V to 1.4 V or the video source requires such a coupling. In some circumstances it may be necessary to auto−bias signals with the addition of a pullup and pulldown resistors or only pullup resistor (Typical 7.5 MW combined with the internal 800 kW pulldown) making the clamp inactive. The output AC−coupling configuration is advantageous for eliminating DC ground loop with the drawback of making the device more sensitive to video line or field tilt issues in the case of a too low output coupling capacitor. In Shutdown Mode If the enable pins are left open by default the circuit will be enabled. The Enable pin offers a shutdown function, so the NCS2564 can consequently be disabled when not used. The NCS2564’s quiescent current reduces to 42 mA typical during shutdown mode. DC−Coupled Output The outputs of the NCS2564 can be DC−coupled to a 150 W load (Figure 23). This has the advantage of eliminating the AC−coupling capacitors at the output by reducing the number of external components and saving space on the board. This can be a key advantage for some applications with limited space. The problems of field tilt effects on the video signal are also eliminated providing the best video quality with optimal dynamic or peak−to−peak amplitude of the video signal allowing operating thanks to the built−in level shifter without risk of signal clipping. In this coupling configuration the average output voltage is higher than 0 V and the power consumption can be a little higher than with an AC−coupled configuration. http://onsemi.com 11 NCS2564 +5V 10 mF 0.1 mF 1 Rs 2 CVBS EN Video Processor 3 4 SD/HD SEL Y/G Pb / B Pr / R 5 Rs 6 Rs 7 Rs CVBS_IN CVBS_OUT CVBS_EN GND VCC GND NCS2564 CVBS SD/HD SD/HD_EN 14 SD/HD IN3 SD/HD OUT3 75 W CVBS 13 12 11 SD/HD IN1 SD/HD OUT1 10 SD/HD IN2 SD/HD OUT2 75 W Cable 75 W 9 8 75 W 75 W Cable 75 W 75 W Cable 75 W 75 W 75 W Cable 75 W TV Y/G Pb / B Pr / R 75 W SD/HD EN Figure 23. DC−Coupled Input and Output Configuration +5V 10 mF 75 W 220 mF 75 W Cable Other Display 0.1 mF 1 Rs 2 CVBS EN Video Processor 3 4 SD/HD SEL Y/G Pb / B Pr / R Rs 5 6 Rs Rs 7 CVBS_IN CVBS_OUT CVBS_EN VCC SD/HD NCS2564 CVBS 75 W GND GND SD/HD_EN 14 13 SD/HD IN3 SD/HD OUT3 75 W 220 mF 75 W Cable 75 W CVBS1 12 11 SD/HD IN1 SD/HD OUT1 10 SD/HD IN2 SD/HD OUT2 9 8 75 W 220 mF 75 W Cable 75 W 220 mF 75 W Cable 75 W 220 mF 75 W Cable 75 W TV Y/G Pb / B 75 W Pr / R 75 W SD/HD EN Figure 24. Typical Application http://onsemi.com 12 CVBS2 NCS2564 +5V 10 mF 75 W CVBS 1 Rs 2 CVBS EN Video Processor 3 4 SD/HD SEL 0.1 mF Y/G Pb / B Pr / R Rs Rs Rs 0.1 mF 0.1 mF 75 W 75 W Cable CVBS1 0.1 mF 5 6 7 CVBS_IN CVBS_OUT CVBS_EN GND VCC GND 14 13 75 W 220 mF 75 W 75 W Cable CVBS2 12 SD/HD NCS2564 0.1 mF 220 mF SD/HD_EN SD/HD IN1 SD/HD OUT1 SD/HD IN2 SD/HD OUT2 SD/HD IN3 SD/HD OUT3 11 10 9 8 SD/HD EN 75 W 220 mF 75 W 220 mF 75 W 220 mF 75 W Cable 75 W Cable 75 W Cable Y / G1 TV 75 W Pb / B1 75 W Pr / R1 75 W 75 W 75 W 75 W 220 mF 220 mF 220 mF 75 W Cable 75 W Cable 75 W Cable Y / G2 TV 75 W Pb / B2 75 W 75 W Figure 25. NCS2564 Driving 2 SCARTS Simultaneously http://onsemi.com 13 Pr / R2 NCS2564 Video Driving Capability ESD Protection With an output current capability of 40 mA the NCS2564 was designed to be able to drive at least 2 video display loads in parallel. This type of application is illustrated Figure 24. Figure 26 (multiburst) and Figure 27 (linearity) show that the video signal can efficiently drive a 75 W equivalent load and not degrade the video performance. All the device pins are protected against electrostatic discharge at a level of 4 kV HBM and 8 kV according to IEC61000−4−2. This feature has been considered with a particular attention with ESD structure able to sustain the typical values requested by the systems like Set Top Boxes or Blue−Ray players. This parameter is particularly important for video driver which usually constitutes the last stage in the video chain before the video output connector. The IEC61000−4−2 standard has been used to test our devices in the real application environment. Test methodology can be provided on request. Figure 26. Multiburst Test with Two 150  Loads Figure 27. Linearity Test with Two 150  Loads http://onsemi.com 14 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−14 WB CASE 948G ISSUE C 14 DATE 17 FEB 2016 1 SCALE 2:1 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S DETAIL E K A −V− K1 J J1 ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE H G D DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ GENERIC MARKING DIAGRAM* 14 SOLDERING FOOTPRINT XXXX XXXX ALYWG G 7.06 1 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: 98ASH70246A DESCRIPTION: TSSOP−14 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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