NCS29001
LED Backlight Driver
The NCS29001 is an integrated LED driver used in LCD display
backlighting applications. A configurable bill of materials allows the
designer to create a highly efficient solution for a variety of LCD
screen sizes. The NCS29001 uses a boost type converter to deliver
constant current in a string of LEDs. High accuracy PWM dimming is
supported for a frequency up to 500 Hz . The integrated soft start
function provides excellent control during the power up sequence to
avoid current overshoot. The device protects against output
overvoltage, open / short LED, and thermal overload. The NCS29001
is offered in the cost effective SOIC−14 package.
MARKING
DIAGRAM
14
14
1
Features
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SOIC−14 NB
CASE 751A
8.5 V to 18 V Input Voltage Range
±1% Vref Voltage Accuracy to set LED Current
PWM Controlled Dimming
Soft Start Limits In−Rush Current
Open Feedback Protection
Open LED Protection
Short LED Protection
LED String Cathode Short to ground Protection
Max Duty Cycle Above 90%
SOIC−14 Package
This is a Pb−Free Device
NCS29001G
AWLYWW
1
NCS29001= Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
PIN CONNECTIONS
Typical Application
• TFT−LCD TV Panels
• LCD Monitor Panels
VIN
1
14
GATE
Vref
2
13
CS
GND
3
12
PGND
NCS29001
PWMin
4
11
PWMout
RT
5
10
FBN
FBP
6
9
COMP
STBY
7
8
OVP
ORDERING INFORMATION
See detailed ordering and shipping information on page 15 of
this data sheet.
© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. 1
1
Publication Order Number:
NCS29001/D
NCS29001
Figure 1. Block Diagram
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NCS29001
PINOUT ASSIGNMENT
VIN
1
14
GATE
Vref
2
13
CS
GND
3
12
PGND
PWMin
4
11
PMWout
RT
5
10
FBN
FBP
6
9
COMP
STBY
7
8
OVP
NCS29001
Figure 2. NSC29001 Pinout
PIN DESCRIPTION
Pin #
Symbol
Type
1
VIN
Input
2
VREF
Output
5 V / 10 mA reference voltage. Small 1.0 mF low ESR bypass capacitor required from VREF to
GND.
3
GND
Ground
Analog ground.
4
PWMin
Output
PWM dimming control input.
5
RT
Output
The resistor connected between RT and GND sets the switching frequency
6
FBP
Input
The reference voltage for the feedback (FBN). Reference level can be adjusted from 0.5 V up to
3.0 V using an external voltage divider.
7
STBY
Input
The converter enters in standby mode when STBY is floating or pulled high. When STBY goes
from low to high the circuit will discharge the capacitors on the COMP pin and keep PWMout high
to discharge the output capacitor. STBY must remain high for 50 ms before the part enters
standby mode.
8
OVP
Output
This pin provides the overvoltage protection for the converter. When the voltage at this pin
exceeds 1.2 V, the boost converter stops immediately and the device enters standby mode.
Loop compensation pin
9
COMP
Power
10
FBN
Input
Description
VIN supply input. Small 1.0 mF low ESR bypass capacitor required from VIN to GND.
Feedback pin and LED cathode connection. External resistor from FBN to GND sets the LED
current.
11
PWMout
Output
PWM dimming output driver.
12
PGND
Ground
Power ground.
13
CS
Power
This pin is used to sense the drain current of the external power MOSFET. It includes a built−in
blanking time.
14
GATE
Output
This pin is the output GATE driver for an external N−channel power MOSFET
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NCS29001
ATTRIBUTES
Characteristics
Values
ESD protection (all pins)
Human Body Model (HBM) (Note 1)
Machine Model (MM)
2 kV
150 V
Moisture sensitivity (Note 2)
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
ABSOLUTE MAXIMUM RATINGS
Rating
VMIN
VMAX
Unit
VIN
−0.3
30
V
PWMin
−0.3
5.5
V
STBY
−0.3
5.5
V
FBP
−0.3
5.5
V
FBN
−0.3
5.5
V
OVP
−0.3
5.5
V
CS
−0.3
5.5
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
OPERATING CONDITIONS (TA = +25°C)
Rating
VIN
Min
Typ
Max
Unit
8.5
12
18
V
1
V
VIL_PWMin: PWMin input low voltage
VIH_PWMin: PWMin input high voltage
2
FBP
V
0.5
VIL_STBY: STBY input low voltage
3.0
V
1
V
VIH_STBY: STBY input high voltage
2
RT clock frequency resistor (Note 3)
20
140
kW
Fdim dimming frequency (5 V amplitude)
100
300
Hz
3
95
%
Ddim dimming duty−cycle
V
NOTE: With respect to the GND pin.
3. Choose RT to keep clock frequency between 100 kHz and 500 kHz.
THERMAL RATINGS
Parameter
Junction to ambient thermal impedance (Note 4)
Symbol
Rating
Unit
RqJA
150
°C/W
Maximum Junction Temperature (Note 5)
TJ
+150
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage temperature
Tstg
−65 to +150
°C
4. Power dissipation must be considered to ensure maximum junction temperature (qJA) is not exceeded.
5. Thermal Pad attached to PCB, 0 lfm airflow, and 76 mm x 76 mm copper area.
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NCS29001
ELECTRICAL SPECIFICATIONS VIN = 12 V, TAMB = –40°C to 85°C; typical values are at 25°C
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VIN = 12 V; PWMin = 5 V; no load,
STBY = 5 V
5
mA
PWMin = GND
Ambient temperature 25°C
STBY = 5 V
12
uA
8.5
V
VIN (VIN Pin)
IVIN
ISHUTDOWN
UVLO
Operating Supply Current
Shutdown Mode Supply Current
Under Voltage Lockout
Threshold
DUVLO
UVLO Hysteresis
Tstartup
Startup time
VIN Rising
7.5
8
475
Time from standby falling edge to
steady−state Vboost operation with 30%
dimming pattern − (Note 6)
mV
100
ms
5
5.05
V
0.08
0.20
%
VREF (VREF Pin)
Vref voltage
REF bypassed with a 1 mF capacitor to
GND
Line_Reg
Line Regulation
VIN = 8.5 V to 24 V at I_REF = 10 mA
Load_Reg
Load Regulation
0 mA < I_REF < 10 mA at VIN = 12 V
0.6
mV/mA
ICC (Vref)
Iref output current
VREF bypassed with a 1 mF capacitor
to GND
10
mA
10
15
V
VREF
4.95
GATE (GATE, RT Pins)
VOH_GATE
GATE output high voltage
ISOURCE
GATE short circuit current
0.33
0.45
A
ISINK
GATE sinking current
0.33
0.45
A
TRISE
GATE output rise time
Output voltage rise−time @ CL = 1 nF,
10−90% of output signal (Note 6)
−
40
ns
TFALL
GATE output fall time
Output voltage fall−time @ CL = 1 nF,
90−10% of output signal (Note 6)
−
20
ns
ROH
Source resistance
13
W
ROL
Sink resistance
6.0
W
95
%
DLSS_MAX
FOSC
VIN = 12 V
Maximum Duty Cycle
(Note 6)
7.5
93
Boost Switching Frequency
range
100
500
kHz
±DFOSC
Frequency Accuracy
−10
+10
%
VRT
RT pin output voltage
0.85
1
1.15
V
7.5
10
15
V
0.98
1
1.02
%
PWM DIMMING (PWMin, PWMout Pins)
VOH_PWMout
PWMout output high voltage
DD_DIM
PWMout/PWMin Duty cycle
Tolerance
VIN = 12 V
TRISE
PWMout output rise time
Output voltage rise−time @ CL = 1 nF,
10−90% of output signal
−
−
2
us
TFALL
PWMout output fall time
Output voltage fall−time @ CL = 1 nF,
90−10% of output signal
−
−
2
us
PWMout short circuit current
15
20
mA
ISINK
PWMout sinking current
15
20
mA
ROH
Source resistance
270
W
ROL
Sink resistance
230
W
ISOURCE
6. Guaranteed by characterization and design
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NCS29001
ELECTRICAL SPECIFICATIONS VIN = 12 V, TAMB = –40°C to 85°C; typical values are at 25°C
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Reference voltage threshold for
current clamp monitoring OCP
comparator
0.5
0.6
V
Slope compensation ramp
130
CURRENT SENSE (CS Pin)
VCS
IRAMP
A/s
PROTECTION (OVP, FBP, FBN Pins)
VOVP
Output Overvoltage Protection
on OVP pin
VSCP
Short Circuit Protection on OVP
pin
60
75
mV
VUVPfb
Output Undervoltage Protection
on FBN
60
75
mV
140
150
TSD
DTSD
1.2
1.3
160
V
Thermal Shutdown
(Note 6)
TSD hytheresis
(Note 6)
15
°C
(Note 6)
50
ms
°C
STANDBY (STBY Pin)
Standby mode delay
TSTANDBY
6. Guaranteed by characterization and design
APPLICATION DIAGRAM
VINInductor
D1
L
VIN
VINIC
COUT
NCS29001
Q1
1
VIN
GATE
14
2
Vref
CS
13
3
GND
PGND
12
4
PWMin
PWMout
11
5
RT
FBN
10
6
FBP
COMP
9
7
STBY
OVP
8
ROVP1
Rsc
Rref1
RT
ROVP2
RCS
Q1
Q2
Rcomp
Rref2
Backlight O
Standby
Ccomp
Ccomp2
Figure 3. Application Schematic
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NCS29001
APPLICATION CONDITIONS
Symbol
Min
Typ
Max
Unit
VIN pin voltage
8.5
12
18
V
VINInductor
Inductor input voltage
8.5
80
VOUT
Output voltage range
50
240
VINIC
h
DςΟΥΤ
Parameter
Condition
VOUT/VINInductor Max = 5
VINInductor = 8.5 to 24 V | VOUT = 50 to 80 V
VINInductor = 24 to 50 V | VOUT = 80 to 130 V
VINInductor = 50 to 80 V | VOUT = 130 to 240 V
Peak efficiency
VINIC = 12 V, VOUT = 130 V, IOUT = 200 mA
VINIC = 12 V, VOUT = 240 V, IOUT = 200 mA
Output Voltage Accuracy
including voltage ripple, from −40°C to 85°C,
VINIC = 8.5 V to 18 V
95
95
−2
V
%
2
%
POWER UP SEQUENCE
Standby
VIN
UVLO
PWMin
Vcomp
PWMout
GATE
Figure 4. Soft Start Power Up from Standby
For the device to begin the soft start sequence the VIN pin voltage needs to be above the UVLO threshold and the OVP pin
voltage needs to be above the VSCP threshold. From standby mode soft start will begin when STBY pin goes low and PWMin
pin goes high and lasts for a fixed number of clock cycles. This ensures that smooth start up if the device is powered on from
standby with a PWM input.
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NCS29001
STANDBY ON AND OFF SEQUENCE
Discharging the
output capacitor
Vout
Standby
VIN
UVLO
Vin IC
PWMin
Vfb & I(LED)
PWMout
GATE
Figure 5. Entering Standby Mode
The STBY pin contains an internal 5 MW pull−up resistor to VREF. This resistor limits current consumption when the device
is in standby mode and also ensures the device will remain in standby if the STBY pin is left floating.
When the STBY goes high the boost converter will stop switching and the PWMout pin will switch, or remain high for 50 ms.
This allows the output capacitor to discharge and the LED current to fall to zero. The device will be in a low power standby
mode and can begin soft start from the next enable sequence.
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NCS29001
VCC > UVLO
POR
STBY falling
edge?
Control logic,
V1,V2,V4,Vref
Oscilator enabled
Y
STBY rising
edge?
N
STBY,10 uA
SCP&D1 Open?
PWM Hi
Soft Start,
charging Rc,Cc
throug Iss
OVP
N
Y
N
PWMO high
Y
VFBN surpass
VFBP?
FUVP?
Y, Fault1
Y
N
Delay 100uS Max
during Soft start,
and reduced delay
time for normal
operation
OTA take
control
PWM Dimming
0
0
0
>=1
N
0
Fault 2
DRV goes low immediately,
PWMDout goes low
immediately
DRV goes low immediately,
PWMDout keeps high
discharging the output
capacitor,
Cc being discharged,
Delay 50 ms
STBY rising
edge?
DRV grouded, PWMO
grounded
Y
Figure 6. Power Up State Machine
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‘
NCS29001
SOFT START WITH PWM INPUT
Figure 7 below shows an example of a soft start when the device is powered up from standby with a PWM input. The PWM
signal here is at 100 Hz with a duty cycle of 30%. In this case the LED reaches 100% of its programmed value in 100 ms. This
time can be decreased if the PWM signal runs at a higher duty cycle.
Soft start with PWM dimming active
100ms with 30% dimming duty cycle,
100Hz
Vfbn & LED
current
PWMin and PWMout
LED current reaches 100%
when Vfbn crosses Vfbp
Vfbp
Vcomp is kept during
dimming off
Back light LED brightness gradually
rise to the set value
Figure 7. Soft Start with PWM Input
GATE AND PWMOUT PIN DRIVER CIRCUIT
Since external transistors are required for the boost converter and PWM dimming functions, the device contains an internal
10 V regulator to drive the gate of these transistors. In the case of the PWM transistor this also functions as a level translator
for the PWMin input pin. When selecting external components it is important that the transistor has enough gate drive to ensure
low RDS(on) for the expected current.
It should be noted that the internal 10 V regulator will start to drop when the VIN voltage is sufficiently low. When the VIN
voltage is 8.5 V the gate drivers will be limited to around 7.7 V.
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NCS29001
VREF REFERENCE VOLTAGE
The device contains an accurate 5 V reference that can supply up to 10 mA and can be accessed through the VREF pin. It
can be used to program the LED feedback voltage by using a resistor divider on the FBP pin. This reference is only active when
STBY = low. When the device is in standby mode the VREF pin voltage will drop to 4.2 V typical with a minimum of 3.5 V.
The VREF will return to 5 V immediately when STBY is driven high.
MINIMUM ON & OFF TIME
If the steady state duty cycle and switching frequency combine to generate short Ton times (low VOUT/VIN converter ratio),
the converter will skip some cycles to regulate VOUT which will increase output voltage ripple. The timing limit is set by the
intrinsic loop propagation delay and the switching frequency will be limited by the minimum ON time and OFF time.
THE INDUCTOR SELECTION
For a given application, it is necessary to know the input voltage at the inductor (VININDUCTOR), the output current (IOUT)
set by RFBN and the voltage on the FBP pin, and the switching frequency (Fsw). The inductor can be chosen using the formula
below:
L max t
ǒ Ǔ
V IN
1
2
I OUT
F sw
2
ǒVOUT * VINǓ
V OUT
(eq. 1)
The minimal inductor value is determined with the desired peak current flowing through the inductor. Using the chosen
inductor value the steady state duty cycle and peak inductor current can be calculated:
D+
Ǹ2
L
(eq. 2)
V IN
And the inductor peak current is now:
I peak +
ǒVOUT * VINǓ
I OUT
F sw
V IN
L
D
F sw
+
Ǹ
2
I OUT
(V OUT * V IN)
L
F sw
(eq. 3)
THE CURRENT SENSE RESISTOR
Set a current limit between 2 and 2.5 times the peak inductor current to account for inductor tolerance:
I limit + 2.5
I peak
(eq. 4)
The current limit reference fixed on the over-current protection comparator is VCS = 0.5 V and the resistance can be calculated
using following the equation:
R CS +
V CS
2.5
I peak
(eq. 5)
SLOPE COMPENSATION
After the current sense resistor is calculated additional calculations are needed for the external slope compensation ramp. Using
the RSENSE value the typical slope of the compensation ramp can be calculated:
Mramp +
V OUT * V IN
1
R SENSE
2
L
(eq. 6)
Using the typical value for , the external compensation resistor can be calculated as follows:
R SC +
M RAMP
(eq. 7)
I RAMP
The slope compensation ramp has an offset current, , which is used to calculate the peak ramp current and finally the adjusted
current sense resistor.
I RAMP,peak + I OFF ) D
R CS +
V CS * R CS
I RAMP
R SW
I RAMP,peak
I limit ) I RAMP,peak
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(eq. 8)
(eq. 9)
NCS29001
OUTPUT CAPACITOR and OUTPUT VOLTAGE RIPPLE
Calculating the output voltage ripple will size the output capacitor value. The output voltage ripple equation below takes
into account the parasitic impedance (ESR) of this output capacitor:
DV COUT +
DV COUT +
C OUT
ǒ
I OUT
C OUT
ǒ1 * D 2Ǔ
I OUT
F sw
F sw
) ESR
I peak
1*
L
Ǔ
F sw
V OUT * V IN
) ESR
Without taking into account the ESR, the output capacitor becomes:
C OUT u
ǒ
I OUT
F sw
DV OUT
I peak
1*
(eq. 10)
I OUT
L
I OUT
Ǔ
F sw
V OUT * V IN
(eq. 11)
(eq. 12)
If the ESR value of the selected output capacitor is high, the voltage ripple will increase. The error due to the ESR can be
estimated follow the equation below:
DV OUTESR + ESR
I peak
(eq. 13)
SIZING THE COMP PIN CAPACITOR
The transistor Q1 is turned ON (reset of the duty cycle) when the Vf of the output current amplifier reaches the control output
voltage Vc. The control voltage Vc is simply a reduced voltage out of the follower servicing the voltage on the COMP pin.
In steady state, at DTsw, the voltage at the current amplifier output is represented by the equation below:
V C + I peak
R CS
Gi
(eq. 14)
V comp + V C ) V OS
(eq. 15)
Vcomp = COMP pin output voltage
Vc = Voltage Control of the transconductance amplifier
Vos = voltage offset of the transconductance amplifier
Vf +
i+C
dv
dt
V IN
D
R CS
L
F sw
å C comp +
i EA
Gi
t rise
V comp
+
(eq. 16)
i EA
t rise
(eq. 17)
V c ) V os
iEA = 4 mA error amplifier output current capability
trise = soft start time
Vos = 0.9 V voltage offset due to the follower
So
C comp t
C comp + 0.7
i EA
t rise
i EA
V
(eq. 18)
V C ) V OS
IN
30 ms
D
R
L
F sw
CS
G
L
) V OS
(eq. 19)
During the soft start and with the dimming function activated, the COMP pin voltage is rising during 30 ms within the 100 ms
soft start time so Vcomp holds for another during 70 ms afterwards. Attention needs to be brought to the DC voltage rating. As
the capacitor value decreases and the DC voltage increases, the value chosen needs to be
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NCS29001
SIZING THE Rcomp RESISTOR for the LOOP STABILITY
Combining Equations 2 and 16 gives the following expression for IOUT:
Vf
I OUT +
2
L
F sw
ǒVOUT * VINǓ
2
ǒR CS
G iǓ
(eq. 20)
2
To obtain the small signal equation, partial derivates of the output current are calculated with respect to the control voltage Vc
and the output voltage VOUT.
I
∂ OUT
∂ V OUT
∂ I OUT
∂ V OUT
+
VC
2
L
ǒVOUT * VINǓ
2
F sw
ǒV OUT * VINǓ
VC
+
L
ǒR CS
F sw
2
ǒR CS
G iǓ
2
+
(eq. 21)
2
G iǓ
I OUT
V OUT * V IN
(eq. 22)
From the AC model below the control to output transfer function can be calculated:
Figure 8. Control to Output Transfer Function
H(s) +
V OUT(s)
V C(s)
+
V OUT(s)
I OUT(s)
I (s)
V C(s)
H(s) + Z OUT(s)
ǒESR )
Z OUT(s) +
ǒESR )
1
sC
OUT
1
sC
OUT
Ǔ
I OUT(s)
(eq. 24)
V C(s)
R eq
Ǔ)R
(eq. 23)
1)s
+ R eq
C OUT
C OUTǒESR ) R eqǓ
1)s
eq
ESR
(eq. 25)
Where
R eq +
R1 +
1
I
(s)
OUT
V
+
2
R ac
R1
R ac
R1
ǒVOUT * VINǓ
Vc
2
2
F sw
ǒR cs
G iǓ
2
L
(s)
+
V OUT * V IN
I OUT
OUT
The dynamic resistance rAC(LED) is evaluated using the LED specification.
R AC + R sense ) r AC(LED)
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nb LED
(eq. 27)
(eq. 26)
NCS29001
Theory
The control to output transfer function is expressed following the formula below:
s
1 ) wz
H(s) + H 0
(eq. 28)
1 ) ss
p
Where
∂ I OUT
Ho +
∂V
R eq +
C
Ho +
Ǹ
2
VC
L
ǒV OUT * V INǓ
I OUT
L
ǒR CS
F sw
G IǓ
2
(eq. 29)
R1
(eq. 30)
R AC ) R 1
Gi
R CS
R1
R AC ) R 1
R AC
1
ǒV OUT * V INǓ
fp +
R AC
F sw
1
ǒESR ) R eqǓ
2p
(eq. 31)
C OUT
There is also a right half plane zero:
fz +
1
ESR
2p
(eq. 32)
C OUT
As the boost converter also operates in DCM, there is also a right half plane zero regulated to high frequency:
f rhpz +
2
f sw
2p
D
(eq. 33)
Type II compensation is used to compensate the two dominant poles fp of the control to output transfer function.
The compensator zero has to be placer at the fp frequency of the transfer function.
fp +
2p
1
(ESR ) R eq)
R comp +
C OUT
+ fz +
(ESR ) R eq)
2p
1
R comp
(eq. 34)
C comp
C OUT
(eq. 35)
C comp
The dominant pole is expressed following the equation:
f p1 +
1
R EA
2p
(eq. 36)
C comp
COMP
−
+
9
equivalent
gm
Rcomp
Type II
Compensation
Cbw =
Cpad+Comp2
Ccomp
Cpad
Ccomp2
With Cpad=10pF
Figure 9. Slope Compensation Network
The natural second pole is expressed following the equation:
f p2 +
2p
1
R comp
C bw
(eq. 37)
The zero is expressed following the equation:
fz +
1
2p
R comp
C comp
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(eq. 38)
NCS29001
OSCILLATOR FREQUENCY SETTING
The simplified equation to set the switching frequency using resistor RT:
f sw +
13750
RT ) 5
(eq. 39)
Where:
RT is expressed in kW.
fsw us expressed in kHz
FBP OPTIONS
The FBP pin is used to program the feedback voltage that sets the LED current. Typically a resistor divider is used from VREF
to set the voltage between 0.5 V and 3.0 V. Additionally, to save component costs, the feedback voltage can be programmed
with internal 0.8 V (±1.5%) by tying the FBP pin to ground.
FAULT DETECTION:
• Overvoltage Protection: A resistor divider from VOUT can be used to set the overvoltage protection on the OVP pin.
•
•
•
When the OVP pin rises above 1.2 V the converter will shut off immediately and PWMout will be held high for 50 ms
to discharge the output capacitor. After this time the device will enter standby mode requires a high to low transition on
the STBY pin to restart.
Short Circuit Protection: A resistor divider from VOUT can be used to set the short circuit protection on the OVP pin.
When the OVP pin drops below 75 mV the converter will shut off immediately and enter standby mode. A high to low
transition on the STBY pin is required to restart the device.
Under Voltage Lockout (UVLO): The converter will immediately shut off and enter standby when the VIN pin voltage
drops below 7.5 V. When the UVLO condition is cleared, a high to low transition on the STBY pin is required to restart
the device.
Temperature Shutdown: When the internal die temperature reaches 150°C, the device will behave the same as in the
overvoltage condition.
Layout Guidance
In switching converters it is important to use wide, short traces for components in the main switching path. Resistor RCS,
which is in the main switching path through transistor Q1, should be connected to power ground (PGND). Compensation
network components, resistor dividers, and bypass capacitors should be referenced to quiet ground (GND). Bypass capacitors
should be connected as close to the IC as possible.
ORDERING INFORMATION
Device
NCS29001DR2G
Package
Shipping†
SOIC−14
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
15
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
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