NCV33272ADR2

MC33272A, MC33274A, NCV33272A, NCV33274A Single Supply, High Slew Rate, Low Input Offset Voltage Operational Amplifiers The MC33272/74 series of monolithic operational amplifiers are quality fabricated with innovative Bipolar design concepts. This dual and quad operational amplifier series incorporates Bipolar inputs along with a patented Zip−R−Trim element for input offset voltage reduction. The MC33272/74 series of operational amplifiers exhibits low input offset voltage and high gain bandwidth product. Dual−doublet frequency compensation is used to increase the slew rate while maintaining low input noise characteristics. Its all NPN output stage exhibits no deadband crossover distortion, large output voltage swing, and an excellent phase and gain margin. It also provides a low open loop high frequency output impedance with symmetrical source and sink AC frequency performance. Features http://onsemi.com MARKING DIAGRAMS DUAL 8 PDIP−8 P SUFFIX CASE 626 1 SOIC−8 D SUFFIX CASE 751 1 x = A for MC33272AD/DR2 = N for NCV33272ADR2 QUAD PDIP−14 P SUFFIX CASE 646 14 1 14 1 14 MC33274ADG AWLYWW 1 1 14 TSSOP−14 DTB SUFFIX CASE 948G 1 1 NCV3 3274 ALYWG G SOIC−14 D SUFFIX CASE 751A 14 NCV33274ADG AWLYWW 1 14 MC33274AP AWLYYWWG 1 8 8 1 33272 ALYWx G MC33272AP AWL YYWWG 8 • • • • • • • • • • • • • • • • • Input Offset Voltage Trimmed to 100 mV (Typ) Low Input Bias Current: 300 nA Low Input Offset Current: 3.0 nA High Input Resistance: 16 MW Low Noise: 18 nV/ √ Hz @ 1.0 kHz High Gain Bandwidth Product: 24 MHz @ 100 kHz High Slew Rate: 10 V/ms Power Bandwidth: 160 kHz Excellent Frequency Stability Unity Gain Stable: w/Capacitance Loads to 500 pF Large Output Voltage Swing: +14.1 V/ −14.6 V Low Total Harmonic Distortion: 0.003% Power Supply Drain Current: 2.15 mA per Amplifier Single or Split Supply Operation: +3.0 V to +36 V or ±1.5 V to ±18 V ESD Diodes Provide Added Protection to the Inputs Pb−Free Packages are Available NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes 14 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 11 1 Publication Order Number: MC33272A/D MC33272A, MC33274A, NCV33272A, NCV33274A PIN CONNECTIONS DUAL CASE 626/751 Output 1 Inputs 1 VEE 1 2 3 4 − + − + 8 7 6 5 QUAD CASE 646/751A/948G Output 1 Inputs 1 3 1 2 − + − + 14 13 VCC Output 2 Inputs 2 Output 4 Inputs 4 1 4 12 11 (Top View) VCC Inputs 2 4 5 6 + − + − VEE Inputs 3 Output 3 10 9 8 2 3 Output 2 7 (Top View) MAXIMUM RATINGS Rating Supply Voltage Input Differential Voltage Range Input Voltage Range Output Short Circuit Duration (Note 2) Maximum Junction Temperature Storage Temperature ESD Protection at Any Pin − Human Body Model − Machine Model Symbol VCC to VEE VIDR VIR tSC TJ Tstg Vesd Value +36 Note 1 Note 1 Indefinite +150 −60 to +150 2000 200 Note 2 −40 to +85 −40 to +125 Unit V V V sec °C °C V Maximum Power Dissipation Operating Temperature Range MC33272A, MC33274A NCV33272A, NCV33274A PD TA mW °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Either or both input voltages should not exceed VCC or VEE. 2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded (see Figure 2). http://onsemi.com 2 MC33272A, MC33274A, NCV33272A, NCV33274A DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, TA = 25°C, unless otherwise noted.) Characteristics Input Offset Voltage (RS = 10 W, VCM = 0 V, VO = 0 V) (VCC = +15 V, VEE = −15 V) TA = +25°C TA = −40° to +85°C TA = −40° to +125°C (NCV33272A) TA = −40° to +125°C (NCV33274A) (VCC = 5.0 V, VEE = 0) TA = +25°C Average Temperature Coefficient of Input Offset Voltage RS = 10 W, VCM = 0 V, VO = 0 V, TA = −40° to +125°C Input Bias Current (VCM = 0 V, VO = 0 V) TA = +25°C TA = Tlow to Thigh Input Offset Current (VCM = 0 V, VO = 0 V) TA = +25°C TA = Tlow to Thigh Common Mode Input Voltage Range (DVIO = 5.0 mV, VO = 0 V) TA = +25°C Large Signal Voltage Gain (VO = 0 V to 10 V, RL = 2.0 kW) TA = +25°C TA = Tlow to Thigh Output Voltage Swing (VID = ±1.0 V) (VCC = +15 V, VEE = −15 V) RL = 2.0 kW RL = 2.0 kW RL = 10 kW RL = 10 kW (VCC = 5.0 V, VEE = 0 V) RL = 2.0 kW RL = 2.0 kW Common Mode Rejection (Vin = +13.2 V to −15 V) Power Supply Rejection VCC/VEE = +15 V/ −15 V, +5.0 V/ −15 V, +15 V/ −5.0 V Output Short Circuit Current (VID = 1.0 V, Output to Ground) Source Sink Power Supply Current Per Amplifier (VO = 0 V) (VCC = +15 V, VEE = −15 V) TA = +25°C TA = Tlow to Thigh (VCC = 5.0 V, VEE = 0 V) TA = +25°C 3. MC33272A, MC33274A Tlow = −40°C NCV33272A, NCV33274A Tlow = −40°C Thigh = +85°C Thigh = +125°C 6 7 Figure 3 Symbol |VIO| − − − − − 3 4, 5 DVIO/DT − IIB − − |IIO| − − VICR VEE to (VCC −1.8) AVOL 90 86 8, 9, 12 VO + VO − VO + VO − VOL VOH CMR PSR 80 16 ISC +25 −25 105 +37 −37 − − − mA 13.4 − 13.4 − − 3.7 80 13.9 −13.9 14 −14.7 − − 100 − −13.5 − −14.1 0.2 5.0 − dB dB 100 − − − V dB 3.0 − 65 80 V 300 − 650 800 nA 2.0 − nA 0.1 − − − − 1.0 1.8 2.5 3.5 2.0 mV/°C Min Typ Max Unit mV 10, 11 13 14, 15 17 ICC − − − 2.15 − − 2.75 3.0 2.75 mA http://onsemi.com 3 MC33272A, MC33274A, NCV33272A, NCV33274A AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, TA = 25°C, unless otherwise noted.) Characteristics Slew Rate (Vin = −10 V to +10 V, RL = 2.0 kW, CL = 100 pF, AV = +1.0 V) Gain Bandwidth Product (f = 100 kHz) AC Voltage Gain (RL = 2.0 kW, VO = 0 V, f = 20 kHz) Unity Gain Bandwidth (Open Loop) Gain Margin (RL = 2.0 kW, CL = 0 pF) Phase Margin (RL = 2.0 kW, CL = 0 pF) Channel Separation (f = 20 Hz to 20 kHz) Power Bandwidth (VO = 20 Vpp, RL = 2.0 kW, THD ≤ 1.0%) Total Harmonic Distortion (RL = 2.0 kW, f = 20 Hz to 20 kHz, VO = 3.0 Vrms, AV = +1.0) Open Loop Output Impedance (VO = 0 V, f = 6.0 MHz) Differential Input Resistance (VCM = 0 V) Differential Input Capacitance (VCM = 0 V) Equivalent Input Noise Voltage (RS = 100 W, f = 1.0 kHz) Equivalent Input Noise Current (f = 1.0 kHz) 30 31 28 29 23, 24, 26 23, 25, 26 27 Figure 18, 33 19 20, 21, 22 Symbol SR GBW AVO BW Am fm CS BWP THD |ZO| Rin Cin en in Min 8.0 17 − − − − − − − − − − − − Typ 10 24 65 5.5 12 55 −120 160 0.003 35 16 3.0 18 0.5 Max − − − − − − − − − − − − − − Unit V/ms MHz dB MHz dB Deg dB kHz % W MW pF nV/ √ Hz pA/ √ Hz VCC Vin − + Vin + Sections B C D VO + VEE Figure 1. Equivalent Circuit Schematic (Each Amplifier) http://onsemi.com 4 MC33272A, MC33274A, NCV33272A, NCV33274A P D (MAX), MAXIMUM POWER DISSIPATION (mW) 2400 V IO , INPUT OFFSET VOLTAGE (mV) 2000 MC33272P & MC33274P 1600 1200 800 400 0 −60 −40 −20 0 20 40 60 80 100 120 140 160 180 MC33274D 5.0 3.0 1.0 2 −1.0 −3.0 −5.0 −55 3 1. VIO > 0 @ 25°C 2. VIO = 0 @ 25°C 3. VIO < 0 @ 25°C VCC = +15 V VEE = −15 V VCM = 0 V 1 1 3 2 MC33272D −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 2. Maximum Power Dissipation versus Temperature Figure 3. Input Offset Voltage versus Temperature for Typical Units 400 I IB, INPUT BIAS CURRENT (nA) I IB, INPUT BIAS CURRENT (nA) 350 300 250 200 150 100 50 0 −16 VCC = +15 V VEE = −15 V TA = 25°C 600 500 400 300 200 100 0 −55 VCC = +15 V VEE = −15 V VCM = 0 V −12 −8.0 −4.0 0 4.0 8.0 12 16 −25 0 25 50 75 100 125 VCM, COMMON MODE VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C) Figure 4. Input Bias Current versus Common Mode Voltage V ICR, INPUT COMMON MODE VOLTAGE RANGE (V) Figure 5. Input Bias Current versus Temperature VCC VCC A VOL, OPEN LOOP VOLTAGE GAIN (X 1.0 kV/V) 180 VCC −0.5 VCC −1.0 160 VCC −1.5 VCC −2.0 140 VCC = +15 V VEE = −15 V RL = 2.0 kW f = 10 Hz DVO = −10 V to +10 V −25 0 25 50 75 100 125 VEE +1.0 VEE −25 0 25 50 VEE +0.5 VEE −55 VCC = +5.0 V to +18 V VEE = −5.0 V to −18 V DVIO = 5.0 mV VO = 0 V 75 100 125 120 100 −55 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 6. Input Common Mode Voltage Range versus Temperature Figure 7. Open Loop Voltage Gain versus Temperature http://onsemi.com 5 MC33272A, MC33274A, NCV33272A, NCV33274A V sat , OUTPUT SATURATION VOLTAGE (V) 40 VO , OUTPUT VOLTAGE (Vpp ) TA = 25°C 30 RL = 10 kW 20 RL = 2.0 kW VCC VCC −1.0 TA = 125°C VCC −2.0 VEE +2.0 VEE +1.0 VEE Sink TA = 125°C VCC = +5.0 V to +18 V VEE = −5.0 V to −18 V 0 5.0 10 IL, LOAD CURRENT (±mA) 15 20 TA = 25°C TA = −55°C TA = 25°C Source TA = −55°C 10 0 0 5.0 10 15 20 VCC, VEE SUPPLY VOLTAGE (V) Figure 8. Split Supply Output Voltage Swing versus Supply Voltage Figure 9. Split Supply Output Saturation Voltage versus Load Current V sat , OUTPUT SATURATION VOLTAGE (V) TA = 125°C TA = 55°C VCC −4.0 VCC −8.0 VCC −12 +0.2 +0.1 Gnd 0 100 VCC VCC = +5.0 V to +18 V RL to Gnd VEE = Gnd V sat , OUTPUT SATURATION VOLTAGE (V) VCC 15 14.6 14.2 TA = 25°C TA = 55°C TA = 125°C 8.0 4.0 0 10 TA = 125°C TA = +25°C TA = −55°C 1.0 k 10 k 100 k 1.0 M TA = 25°C TA = −55°C TA = 125°C VCC = +15 V RL to VCC VEE = Gnd RFdbk = 100 kW 10 k 100 k 100 1.0 k RL , LOAD RESISTANCE TO GROUND (kW) RL, LOAD RESISTANCE TO VCC (W) Figure 10. Single Supply Output Saturation Voltage versus Load Resistance to Ground Figure 11. Single Supply Output Saturation Voltage versus Load Resistance to VCC CMR, COMMON MODE REJECTION (dB) 28 24 VO , OUTPUT VOLTAGE (Vpp ) 20 16 12 8 4 0 1.0 k VCC = +15 V VEE = −15 V RL = 2.0 kW AV = +1.0 THD = ≤1.0% TA = 25°C 10 k 100 k f, FREQUENCY (Hz) 1.0 M 1 0M 120 100 80 60 40 20 0 10 DVCM + CMR = 20Log DVCM D VO X ADM TA = 125°C TA = −55°C VCC = +15 V VEE = −15 V VCM = 0 V DVCM = ±1.5 V − ADM D VO 100 1.0 k 10 k 100 k 1.0 M f, FREQUENCY (Hz) Figure 12. Output Voltage versus Frequency Figure 13. Common Mode Rejection versus Frequency http://onsemi.com 6 MC33272A, MC33274A, NCV33272A, NCV33274A +PSR, POWER SUPPLY REJECTION (dB) −PSR, POWER SUPPLY REJECTION (dB) 120 TA = 125°C 100 80 60 40 20 0 − ADM + VEE +PSR = 20Log DVO/ADM DVCC VCC D VO 120 100 80 60 40 20 0 − ADM + VEE −PSR = 20Log DVO/ADM DVEE VCC D VO VCC = +15 V VEE = −15 V DVCC = ±1.5 V TA = −55°C DVCC = ±1.5 V VCC = +15 V VEE = −15 V TA = −55°C TA = 125°C 10 100 1.0 k 10 k 100 k 1 .0 M 10 100 1.0 k 10 k 100 k 1.0 M f, FREQUENCY (Hz) f, FREQUENCY (Hz) Figure 14. Positive Power Supply Rejection versus Frequency Figure 15. Negative Power Supply Rejection versus Frequency |I SC |, OUTPUT SHORT CIRCUIT CURRENT (mA) 60 50 Sink 40 Source 30 20 10 0 −55 Source I CC , SUPPLY CURRENT (mA) VCC = +15 V VEE = −15 V VID = ±1.0 V RL < 100 W Sink 11 10 9.0 8.0 7.0 6.0 5.0 4.0 −25 0 25 50 75 100 125 3.0 0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 TA = +125°C TA = +25°C TA = −55°C TA, AMBIENT TEMPERATURE (°C) VCC, |VEE| , SUPPLY VOLTAGE (V) Figure 16. Output Short Circuit Current versus Temperature Figure 17. Supply Current versus Supply Voltage GBW, GAIN BANDWIDTH PRODUCT (MHz) 1.15 SR, SLEW RATE (NORMALIZED) 1.1 1.05 1.0 0.95 0.9 0.85 −55 VCC = +15 V VEE = −15 V DVin = 20 V DVin − + VO 2.0 kW 100 pF 50 VCC = +15 V VEE = −15 V f = 100 kHz RL = 2.0 kW CL = 0 pF 40 30 20 10 0 −55 −25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) 100 125 −25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) 100 125 Figure 18. Normalized Slew Rate versus Temperature Figure 19. Gain Bandwidth Product versus Temperature http://onsemi.com 7 MC33272A, MC33274A, NCV33272A, NCV33274A 25 20 A V , VOLTAGE GAIN (dB) 15 10 5.0 0 −5.0 −10 −15 −20 −25 100 k 1.0 M 10 M VCC = +15 V VEE = −15 V RL = 2.0 kW TA = 25°C Phase Gain 80 120 140 160 180 200 220 240 260 280 100 M φ, EXCESS PHASE (DEGREES) 100 25 20 A V , VOLTAGE GAIN (dB) 15 10 5.0 0 TA = 25°C CL = 0 pF 1A 80 100 140 160 2A 180 200 220 240 φ, PHASE (DEGREES) φ m, PHASE MARGIN (DEGREES) 125 120 −5.0 1B −10 1A − Phase V = 18 V, V = −18 V CC EE −15 2A − Phase VCC = 1.5 V, VEE = −1.5 V 2B 1B − Gain VCC = 18 V, VEE = −18 V −20 2B − Gain V = 1.5 V, V = −1.5 V CC EE −25 100 k 1.0 M 10 M f, FREQUENCY (Hz) 100 M f, FREQUENCY (Hz) Figure 20. Voltage Gain and Phase versus Frequency Figure 21. Gain and Phase versus Frequency A VOL , OPEN LOOP VOLTAGE GAIN (dB) 20 10 0 2A 1B 2B 100 A m , OPEN LOOP GAIN MARGIN (dB) 120 1A 140 160 180 200 220 240 260 280 20 30 φ EXCESS PHASE (DEGREES) 12 Gain Margin 10 8.0 6.0 4.0 2.0 Phase Margin 0 1.0 10 100 VCC = +15 V VEE = −15 V VO = 0 V − 0 10 20 30 VO 2.0 kW CL VCC = +15 V VEE = −15 V −10 Vout = 0 V TA = 25°C 1A − Phase (RL = 2.0 kW) −20 2A − Phase (RL = 2.0 kW, CL = 300 pF) 1B − Gain (RL = 2.0 kW) 2B − Gain (RL = 2.0 kW, CL = 300 pF) −30 3.0 4.0 6.0 8.0 10 f, FREQUENCY (MHz) Vin + 40 50 1000 CL, OUTPUT LOAD CAPACITANCE (pF) Figure 22. Open Loop Voltage Gain and Phase versus Frequency Figure 23. Open Loop Gain Margin and Phase Margin versus Output Load Capacitance A m , OPEN LOOP GAIN MARGIN (dB) 12 10 8.0 6.0 4.0 2.0 0 −55 CL = 100 pF CL = 300 pF CL = 500 pF VCC = +15 V VEE = −15 V −25 0 25 50 75 100 125 φ m, PHASE MARGIN (DEGREES) CL = 10 pF 60 50 40 30 20 10 0 −55 −25 0 25 50 75 CL = 10 pF CL = 100 pF CL = 300 pF CL = 500 pF VCC = +15 V VEE = −15 V 100 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 24. Open Loop Gain Margin versus Temperature Figure 25. Phase Margin versus Temperature http://onsemi.com 8 MC33272A, MC33274A, NCV33272A, NCV33274A 15 12 A m , GAIN MARGIN (dB) Phase Margin 9.0 6.0 3.0 0 VCC = +15 V VEE = −15 V RT = R1+R2 VO = 0 V TA = 25°C Vin R1 R2 − + VO 50 40 30 20 10 0 10 k φ m , PHASE MARGIN (DEGREES) CS, CHANNEL SEPERATION (dB) Gain Margin 60 160 150 140 130 120 110 100 100 Driver Channel VCC = +15 V VEE = −15 V RL = 2.0 kW DVOD = 20 Vpp TA = 25°C 1.0 10 100 1.0 k 1.0 k 10 k f, FREQUENCY (Hz) 100 k 1.0 M RT, DIFFERENTIAL SOURCE RESISTANCE (W) Figure 26. Phase Margin and Gain Margin versus Differential Source Resistance Figure 27. Channel Separation versus Frequency THD, TOTAL HARMONIC DISTORTION (%) 1.0 50 |Z O |, OUTPUT IMPEDANCE (Ω ) AV = +1000 AV = +100 40 30 20 10 0 10 k AV = 1000 AV = 100 AV = 10 AV = 1.0 VCC = +15 V VEE = −15 V VO = 0 V TA = 25°C 0.1 AV = +10 0.01 AV = +1.0 VO = 2.0 Vpp TA = 25°C VCC = +15 V VEE = −15 V 10 k 100 k 0.001 10 100 1.0 k f, FREQUENCY (Hz) 100 k 1.0 M 10 M f, FREQUENCY (Hz) Figure 28. Total Harmonic Distortion versus Frequency Figure 29. Output Impedance versus Frequency e n , INPUT REFERRED NOISE VOLTAGE (nV/ √ Hz ) 50 + 40 30 20 10 0 VCC = +15 V VEE = −15 V TA = 25°C 10 100 1.0 k f, FREQUENCY (Hz) 10 k 100 k − VO i n , INPUT REFERRED NOISE CURRENT (pA/ √ Hz ) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 VCC = +15 V VEE = −15 V TA = 25°C 100 Input Noise Current Circuit RS + − VO Input Noise Voltage Test Circuit (RS = 10 kW) 1.0 k f, FREQUENCY (Hz) 10 k 100 k Figure 30. Input Referred Noise Voltage versus Frequency Figure 31. Input Referred Noise Current versus Frequency http://onsemi.com 9 MC33272A, MC33274A, NCV33272A, NCV33274A 60 PERCENT OVERSHOOT (%) 50 40 30 20 10 0 10 100 CL, LOAD CAPACITANCE (pF) 1000 VCC = +15 V VEE = −15 V RL = 2.0 kW TA = 25°C Figure 32. Percent Overshoot versus Load Capacitance V O, OUTPUT VOLTAGE (5.0 V/DIV) VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW CL = 100 pF TA = 25°C V O, OUTPUT VOLTAGE (5.0 V/DIV) CL = 100 pF VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW TA = 25°C t, TIME (2.0 ns/DIV) CL = f t, TIME (2.0 ms/DIV) Figure 33. Non−inverting Amplifier Slew Rate for the MC33274 Figure 34. Non−inverting Amplifier Overshoot for the MC33274 V O, OUTPUT VOLTAGE (50 mV/DIV) VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW CL = 300 pF TA = 25°C t, TIME (2.0 ms/DIV) V O, OUTPUT VOLTAGE (5.0 V/DIV) VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW CL = 300 pF TA = 25°C t, TIME (1.0 ms/DIV) Figure 35. Small Signal Transient Response for MC33274 Figure 36. Large Signal Transient Response for MC33274 http://onsemi.com 10 MC33272A, MC33274A, NCV33272A, NCV33274A ORDERING INFORMATION Device MC33272AD MC33272ADG MC33272ADR2 MC33272ADR2G MC33272AP MC33272APG NCV33272ADR2* NCV33272ADR2G* MC33274AD MC33274ADG MC33274ADR2 MC33274ADR2G MC33274AP MC33274APG NCV33274AD* NCV33274ADG* NCV33274ADR2* NCV33274ADR2G* NCV33274ADTBR2G* Package SOIC−8 SOIC−8 (Pb−Free) SOIC−8 SOIC−8 (Pb−Free) PDIP−8 PDIP−8 (Pb−Free) SOIC−8 SOIC−8 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14 (Pb−Free) 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail 2500 / Tape & Reel 55 Units / Rail 2500 / Tape & Reel 50 Units / Rail 2500 / Tape & Reel 98 Units / Rail Shipping † †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV prefix for automotive and other applications requiring site and control changes. http://onsemi.com 11 MC33272A, MC33274A, NCV33272A, NCV33274A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− A 8 5 B 1 S 4 0.25 (0.010) M Y M −Y− G K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 C −Z− H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 MC33272A, MC33274A, NCV33272A, NCV33274A PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 A F N −T− SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 13 MC33272A, MC33274A, NCV33272A, NCV33274A TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B − U− N F DETAIL E K K1 J J1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 0.15 (0.006) T U S SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 14X 14X 1.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ A −V− 0.65 PITCH DIMENSIONS: MILLIMETERS MC33272A, MC33274A, NCV33272A, NCV33274A PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H − A− 14 8 − B− P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C −T− SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 MC33272A, MC33274A, NCV33272A, NCV33274A PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE L − B− 1 4 DIM A B C D F G H J K L M N 8 5 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10 _ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 F NOTE 2 − A− L C −T− SEATING PLANE J N D K M M TA B H G 0.13 (0.005) M M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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