NCV7430D20R2G

NCV7430 Automotive LIN RGB LED Driver The NCV7430 is a single−chip RGB driver intended for dedicated multicolor LED applications. The RGB LED driver contains a LIN interface (slave) for parametric programming of LED color and intensity. The device receives instructions through the LIN bus and subsequently drives the LEDs independently. The NCV7430 acts as a slave on the LIN bus and the master can request specific status information (parameter values and error flags). The LIN address of the NCV7430 can be programmed in the internal memory of the device. The NCV7430 is fully compatible with automotive requirements. PRODUCT FEATURES • 3 Independent LED Current Regulators • LED Currents Adjustable with External Resistors • Power Dissipation Option with External Ballast Transistor • LED Modulation Controller for 3 LEDs • Full LED Calibration Support Internal LED Color Calibration via Matrix Calculation Intensity Control (linear or logarithmic) Dimming and Color Transition (linear) Function with Programmable Transition Time LIN Physical Layer according to LIN 2.1/ SAE J2602 OTP−programmable Device Node Number OTP−programmable Group Address Diagnostics and Status Information LIN Bus Short Circuit Protection to Supply and Ground 1 14 2 13 3 12 VBB 4 LIN 5 LED2C 11 TST1 10 GND LED2R 6 Overcurrent Detection Short Circuit Detection to GND and VBB Open LED Detection High Temperature Warning and Shutdown Retry Mode on Error Detection LED3C LED1C VBIAS 9 LED1R TST2 7 8 LED3R GND ORDERING INFORMATION Power Saving • Sleep Mode Supply Current 10 mA • Compliant with 14 V Automotive Systems Package Shipping† NCV7430D20G SOIC−14 (Pb−Free) 55 Units / Tube NCV7430D20R2G SOIC−14 (Pb−Free) 3000 / Tape & Reel Device EMI Compatibility • LIN Bus Integrated Slope Control • EMC Reduced LED Modulation Mode Quality • NCV Prefix for Automotive and Other Applications Requiring • 1 ANODE Protection and Diagnostics • • • • • NCV7430−0 AWLYWWG PIN CONNECTIONS LIN Interface • • • • • 14 1 NCV7430 ♦ 14 NCV7430 = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package Controller with One−Time−Programmable Memory (OTP) ♦ MARKING DIAGRAM SOIC−14 D2 SUFFIX CASE 751A LED Driver ♦ www.onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant © Semiconductor Components Industries, LLC, 2015 June, 2017 − Rev. 10 1 Publication Order Number: NCV7430/D NCV7430 BLOCK DIAGRAM VBB LIN Communication and Programming LIN Optional Ballast Control Error Detection VBIAS LEDxC LEDxR ANODE LED1C LED2C LED3C modulator 325 mV GND GND LED1R 325 mV 325 mV LED2R LED3R Figure 1. Simple Block Diagram ANODE ERROR NCV7430 LED1 Modulator Analog Error Handler LIN ANODE BUS Interface LED1C Vref1 Vref2 OPEN ERROR TST1 OPA D Current−reg− −Fet LED1R Main Control Processor, Registers OTP memory TST2 LED2 LED2C Vref Temp sense LED2R Oscillator LED3 VBIAS LED3C Voltage Regulator VBB LED3R VRef GND GND Figure 2. Detailed Block Diagram www.onsemi.com 2 NCV7430 MRA4003T3G D1 VBAT C2 10 nF Optional C1 100 nF VBB Optional 3 1 13 NCV7430 12 LIN bus LIN NJD2873T4G* Q1 ANODE LED1C R LED2C G LED3C 14 LED3R 8 LED2R 10 LED1R 9 4 11 6 TST1 TST2 C3 470 R1 VBIAS ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ 2 5 GND B 7 GND R 1 Rsense G 2 C4 1 nF B 3 10 ohm for 30 mA Figure 3. Typical Application with Ballast Transistor MRA4003T3G D1 VBAT C2 10 nF 100 nF C1 VBB Optional 3 1 13 NCV7430 12 LIN bus LIN ANODE LED1C R LED2C G LED3C 14 LED3R 8 LED2R 10 LED1R 9 4 11 C3 ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ 2 VBIAS 6 TST1 TST2 5 GND 7 GND Rsense B R 1 G 2 B 3 10 ohm for 30 mA Figure 4. Typical Application without Ballast Transistor NOTES: C1 must be close to pins VBB and GND C2 and C3 is placed for EMC reasons; value depends on EMC requirements of the application R1 and Q1 and reverse polarity protection D1 and C2 are optional. When Q1 is not used, connect VBB to the ANODE pin. VBIAS output is kept open in this case. Rsense_1, Rsense_2 and Rsense_3 have to be calculated for LED current settings. “R”, “G”, “B” designators refer to the ON Semiconductor evaluation board software associations. * For lower power applications, a PZT3904T1G device can be substituted. RGB LED, OSRAM MULTILED LRTB GVSG or DOMINANT Multi DomiLED D6RTB−PJG Table 1. OPERATING RANGES Parameter Min Max Unit VBB Supply voltage +5.5 +18 V TJ Operating temperature range −40 +125 °C www.onsemi.com 3 NCV7430 Table 2. PIN FUNCTION DESCRIPTION (14 LEAD SON Package) Pin # Label Pin Description 1 ANODE 2 VBIAS 3 VBB VBB (14 V) Supply Voltage 4 LIN LIN−bus connection 5 GND Supply GND 6 TST2 Test pin (ground pin) 7 GND Supply GND 8 LED3R Current program resistor to ground for LED3C 9 LED1R Current program resistor to ground for LED1C 10 LED2R Current program resistor to ground for LED2C 11 TST1 12 LED2C Channel 2 regulated current output to LED cathode 13 LED1C Channel 1 regulated current output to LED cathode 14 LED3C Channel 3 regulated current output to LED cathode Anode input for LED fault detection Bias output for ballast transistor Test pin (float pin) (Note 1) 1. Floating pin 11 eliminates the possibility of a short to ground of the adjacent pin (LED2C). Table 3. MAXIMUM RATINGS Parameter VBB Vlin VVBIAS IBIAS Min Max Unit Supply voltage −0.3 +43 (Note 2) V Supply voltage −0.3 28 (Note 3) V Bus input voltage (LIN) −45 +45 V Ballast Transistor Drive Voltage Pin (VBIAS) −0.3 VANODE V − 10 mA Ballast Output Drive (VBIAS) VANODE LED Fault Sense Pin (ANODE) voltage −0.3 VBB V VLEDC LED Current Pin (LEDxC) voltage (Note 7) −0.3 VBB V VLEDR Program Current Pin (LEDxR) voltage (Note 4) −0.3 3.6 V Junction temperature range (Note 5) −50 +175 °C − 260 peak °C TJ Tflw Peak Reflow Soldering Temperature: Pb−Free 60 to 150 seconds at 217°C (Note 6) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. For limited time: t < 0.5 s. 3. t < 3 minutes 4. VLEDR cannot exceed VLEDC. 5. The circuit functionality is not fully guaranteed outside operating temperature range. 6. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and Application Note AND8003/D. 7. Capacitive loading on LEDxC pins is limited to < 200 pF for proper functionality. Table 4. ATTRIBUTES Characteristics ESD Capability (Note 8) Value > ± 4 kV > ± 2 kV > ± 200 V Human Body Model (LIN Pin) Human Body Model (All Remaining Pins) Machine Model Moisture Sensitivity Level (Note 6) MSL 2 Storage Temperature −55°C to 150°C Package Thermal Resistance Junction−to−Ambient (RqJA) (2S2P) (Note 9) Junction−to−Pin (RyJL) (Pins 4 & 11) 100°K/W 53°K/W Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 8. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 kW) and MM according to AEC−Q100: EIA−JESD22−A115−A. 9. Simulated conform JEDEC JESD51 www.onsemi.com 4 NCV7430 Table 5. ELECTRICAL CHARACTERISTICS (5.5 V < VBB < 18 V, −40°C < TJ < 125°C, Rsense = 10 W TWPROG = TWPROG2 = 0, unless otherwise specified). Symbol Pin(s) Characteristic Conditions Min Typ Max Unit LED1C Single LED current in normal operation VBB = 14 V For individual LED driven − − 32 mA All LED currents in normal operation VBB = 14 V For all LEDs driven − − 96 mA 28 2.8 30.5 3.05 32 3.2 LED DRIVER ILEDmax LED2C ILEDmaxTotal LED3C ILEDxC LED current IMSabs Absolute error on LED current Uncalibrated Max ON Duty Cycle RSENSE = 10 W RSENSE = 100 W mA Calibrated VBB = 14 V, 3 mA < ILEDxC < 30 mA RSENSE = 10 W RSENSE = 100 W % −1 −3 − − 1 3 VVref1 Reference voltage for current regulators (High) state VBB = 14 V − 325 − mV VVref2 Reference voltage for current regulators (Low) state VBB = 14 V − 20 − mV Dominant state, driver off Vlinbus = 0 V, VBB = 8 V & 18 V −1 − − mA Ibus_off Recessive state, driver off Vlinbus = Vbat, VBB = 8 V & 18 V − − 20 mA Ibus_lim Current limitation VBB = 8 V & 18 V 40 75 200 mA Rslave Pull−up resistance VBB = 8 V & 18 V 20 30 47 kW Receiver dominant state VBB = 8 V & 18 V 0 − 0.4 * VBB V Vbus_rec Receiver recessive state VBB = 8 V & 18 V 0.6 * VBB − VBB V Vbus_hys Receiver hysteresis VBB = 8 V & 18 V 0.05 * VBB − 0.175 * VBB V LIN wake−up threshold VBB = 8 V & 18 V VBB − 1.1 − VBB − 3.3 V 107 115 123 °C − 10 − 147 155 163 °C − −6.25 − % per step 7.3 − 8.3 V 5.40 5.8 6.0 V LIN TRANSMITTER Ibus_off LIN LIN RECEIVER Vbus_dom LIN Vrec_th_wake THERMAL WARNING & SHUTDOWN Ttw Ttwhyst Ttsd Thermal warning (Notes 10, 11) Thermal warning hysteresis Thermal shutdown (Note 10) THERMAL CONTROL TH_Ired_step LED Drive Current change at Thermal Warning VBIAS OUTPUT Vbias Output voltage VBB = 14 V, Ibias = 5 mA VBB SUPPLY VBB_UV VBB Undervoltage for LIN Communication Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 10. Parameter guaranteed by trimming in production test. 11. No more than 2000 cumulative hours in life time above Tw. www.onsemi.com 5 NCV7430 Table 5. ELECTRICAL CHARACTERISTICS (5.5 V < VBB < 18 V, −40°C < TJ < 125°C, Rsense = 10 W TWPROG = TWPROG2 = 0, unless otherwise specified). Symbol Pin(s) Characteristic Conditions Min Typ Max Unit − 0.2 0.4 V Rising Vbb − − 4.4 V Falling Vbb 1.9 − − 13 − 16 V VBB SUPPLY VBB_UV_hys VBB Undervoltage Hysteresis for LIN Communication PORH_Vbb VbbOTP Ibat Ibat_sleep Power−on Reset for output drive capability VBB Supply voltage for OTP zapping Total current consumption Unloaded outputs VBB = 18 V, LEDs OFF − 5.0 7.0 mA Sleep mode current consumption VBB = 13.5 V, TJ = 85°C − 10 20 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 10. Parameter guaranteed by trimming in production test. 11. No more than 2000 cumulative hours in life time above Tw. www.onsemi.com 6 NCV7430 AC PARAMETERS The AC parameters are guaranteed for temperature and VBB in the operating range unless otherwise specified. The LIN transmitter and receiver physical layer parameters are compliant to LIN rev. 2.0 & 2.1. Table 6. AC CHARACTERISTICS Symbol Pin(s) Parameter Test Conditions Min Typ Max Unit POWER−UP AND WAKE−UP Power−up time tpu tLIN_Wake tWake tSleep_to_Normal Guaranteed by design − − 10 ms LIN Dominant Wake−up pulse filter time Sleep mode − 80 150 ms Reaction time after valid Wake−up pulse Sleep mode − 0.3 1 ms tLIN_Wake > 150 ms Guaranteed by design − 3 10 ms VBB = 14 V 1.8 2 2.2 MHz Sleep mode to Normal mode transition time INTERNAL OSCILLATOR fosc Frequency of internal oscillator LIN TRANSMITTER CHARACTERISTICS ACCORDING TO LIN v2.0 & v2.1 D1 LIN D2 Duty cycle 1 = (tBus_rec(min) / (2 x tBit)) x 100 See Figure 5 THRec(max) = 0.744 x VBB THDom(max) = 0.581 x VBB; 7.0 V < VBB < 18 V; tBit = 50 ms 39.6 − − % Duty cycle 2 = (tBus_rec(max) / (2 x tBit)) x 100 See Figure 5 THRec(min) = 0.422 x VBB THDom(min) = 0.284 x VBB; 7.6 V < VBB < 18 V; tBit = 50 ms − − 58.1 % LED modulation frequency for MODFREQ = 0 117 122 127 Hz LED modulation frequency for MODFREQ = 1 234 244 254 − 1 − ms − 1 − ms 0.8 1 1.5 ms − 10 − s 2.7 3 3.3 s − 20 − LED DRIVERS fLEDmodulation LEDx tbrise Turn−on transient time tbfall Turn−off transient time ILED settling Between 10% and 90% Settling time of Current regulators Between 10% and 90% full scale THERMAL CONTROL tTH_timeout Timeout for current reduction after TW ERROR RETRY CONTROL tretryinterval Nnumberofretries Intervaltime between retries Number of retries before LEDs are switched off definitely www.onsemi.com 7 NCV7430 tBUS_dom(max) LIN tBUS_rec(min) THRec(max) Thresholds of receiving node 1 THDom(max) THRec(min) Thresholds of receiving node 2 THDom(min) tBUS_dom(min) t tBUS_rec(max) Figure 5. Timing for AC Characteristics According to LIN 2.0 and LIN 2.1 LIN Detection of Remote Wake−Up VBB recessive > tLIN_Wake (150 μs) 60% VBB 40% VBB dominant t tWake tSleep_to_Normal Sleep mode Init Normal mode Figure 6. Timing for Wake Up from Sleep Mode via LIN Bus Transitions LIN Timing LIN Frames must be Sent in a Regular Manner Precise color settings for RGB LEDs is achieved using independent current modulators. The three LED modulation controllers have eleven bit resolution with a choice of base frequencies of 122 Hz or 244 Hz. The internal oscillator is adapted to an accurate frequency based on the reception of multiple LIN synchronization fields. Although the NCV7430 is functional without LIN communication, the timing specifications cannot be guaranteed without periodic error−free LIN frame inputs. System Operation The programmability of the NCV7430 is achieved via a LIN bus interface. The device is operated in slave mode and accepts lighting instruction commands from a bus master. The physical node address of a slave can be programmed in OTP “address bits ADx” at address 0x03: For multi node operation the NCV7430 accepts broadcast commands. With the broadcast command and four additional “GROUP_ID” bits programming of up to 16 different slave clusters can be done. In this approach each slave belongs to a specific cluster (GROUP). Detailed Operating Description General The NCV7430 is an automotive 3 channel LED driver suitable for use in a broad range of applications. Although designed to drive an RGB LED, it can easily be used to drive 3 independent LEDs. Each LED is driven by a constant current source externally programmed for maximum current using external resistors. www.onsemi.com 8 NCV7430 Current Sources NOTE: For the Set_Color_Short and Set_Intensity commands the GROUP_ID bits are split. The lower two bits are used to assign the NCV7430 to one of four groups for the color setting, while the upper two bits are used to assign the device to one of four groups for the intensity setting. The NCV7430 has three independent analog current sources driving the LEDs. The currents are programmed by a fixed 325 mV voltage reference at the LEDxR pin. The delta current through the resistor resulting from Vref1 − Vref2, equals the LED drive current at the LEDxC. Each maximum LED current (DC = Max ON) can be adjusted to a typical value up to 30.5 mA. The external resistor can be calculated as follows: Power−up The NCV7430 powers up in an active mode. Reference the “Sleep Mode” section for low power standby conditions. The device has a VBB Power−on Reset Level of 4.4 V, (max) for output drive capability. Operation of the device is guaranteed above the 4.4 V level. All integrated circuit activity will remain off prior to breaching the 4.4 V level. All output current sources (LEDxC), current programming pins (LEDxR), error dection pin (ANODE), ballast drive pin (VBIAS), and LIN communication pin (LIN) will be high impedance below 4.4 V. The device becomes fully operational above 4.4 V with the default parameters copied from OTP and will operate up to 18 V. The bit in OTP determines if the LEDs are enabled or disabled on power−up. The VBB Reset bit at Byte 4, Bit 4 in the Get_Full_Status In frame response 1 gets set to a one on Power−up and goes to “0” after the first Get_Full_Status command. The minimum Power−on Reset Threshold is 1.9 V. The output drive is guaranteed to be inactive at or below this threshold. NOTE: While LIN is operational for voltages at the minimum battery voltage level of 5.75 V (typ) (VBB Undervoltage), the LIN conformance is only guaranteed for a battery voltage higher than 8 V. There is additional sensing of VBB with VBB Undervoltage detection (5.75 V) and is recorded at Byte 4, Bit 5 of the Get_Full_Status In frame response 1 and Byte 2, Bit 5 of Get_Status In frame response. The LIN communication pin will not accept traffic during VBB Undervoltage, but will record the VBB undervoltage situation and can only be cleared with a Get_Full_Status frame. R+ 325 mV * 20 mV I LEDhigh (eq. 1) For ILEDhigh = 30.5 mA the resistor is: R+ 0.305 V + 10 W 0.0305 A When not being modulated for color setting purposes, or under abnormal or error conditions, the LEDs can be switched on and off independently by their bit in the control register. Additionally, bit will activate and deactivate all LEDs at the same time. When there are error conditions, the LEDs will not turn on. NOTE: The LED modulation current regulator switches between ILEDhigh and a reduced current, ILEDlow. The reduced current value is determined by a low reference voltage Vref2. All references to Max ON duty cycle in this datasheet run at 2040/2048 duty cycle to provide for internal analog compensation. LED Modulation Sources Each LED output has its own LED modulation controller. The NCV7430 blends the modulated LED currents in an RGB LED to create colors. The NCV7430 provides additional OTP registers for each channel to store color calibration factors. The calibration factors are used by the NCV7430 to create the modulation needed for an exact color setting. The calibration functionality can be enabled and disabled via the CAL_EN bit. If the CAL_EN bit is ‘0’, the LIN command (8 bit) is save into the modulation registers. When the CAL_EN is set to ‘1’, the received modulation values are first corrected, and then stored in the LED modulation registers. For the calibration a matrix calculation is used. The matrix has the following form: LED1Ȁ + ǒ(a 11 ) 1) @ LED1 ) (a 12 ) 0) @ LED2 ) (a 13 ) 0) @ LED3Ǔń32 LED Modulation Matrix LED2Ȁ + ǒ(a 21 ) 0) @ LED1 ) (a 22 ) 1) @ LED2 ) (a 23 ) 0) @ LED3Ǔń32 (eq. 2) LED3Ȁ + ǒ(a 31 ) 0) @ LED1 ) (a 32 ) 0) @ LED2 ) (a 33 ) 1) @ LED3Ǔń32 www.onsemi.com 9 NCV7430 Transitions from color to color, or changes in intensity will vary in a linear fashion through the color/intensity spectrum (optional logarithmic mode for intensity). The fading time can be set between 0 and 6.3 seconds via a 6 bit register giving a resolution of 0.1 second. The fading function can be enabled and disabled by programming the FADING ON/OFF bit in the control registers. The default state of this bit depends on the bit that is set in OTP memory. Intensity − Linear or logarithmic dimming Color − Linear dimming only The calibration factors have a value of eight bits and fraction the programmed LED modulation value between 0% and Max ON duty cycle. With high values chosen for the coefficients in one row, the calculation can cross the Max ON duty cycle boundary (clipping) for the color. As a rule: For proper design, the sum of the calibration values should stay under Max ON duty cycle to prevent color saturation. If one of the calculated LED1′, LED2′, or LED3′ values exceeds the upper practical boundaries of Max ON duty cycle, the modulator automatically adapts the modulation speed to the color that exceeded the Max ON duty cycle. This method guarantees that the color integrity is maintained. The calibration factors a11 to a33 reside in nine dedicated OTP registers: (0x04 to 0x08, and 0x0A to 0x0D).: LED modulation Calibration data a11 to a33. These registers can be programmed in OTP and are generally used for the compensation of LED colors which occur due to system design changes and lot−to−lot variation of LEDs. LED Update Modes Bits are used to enable the NCV7430 for operation in different update modes. The following modes are implemented: UPDATECOLOR: 00 immediate update 01 store and do not update 10 update to the already stored values 11 discard The UPDATECOLOR bits are included in the command Set_Color (Byte 5, Bits 6 and 7). LED Intensity Short Circuit and Open Circuit Detection The overall intensity of the LEDs is programmable with a four bit scaling factor that is applied over the LED modulation. The register containing this value is AMBLIGHTINTENSITY. The scaling is linear. The light output function is described with the following formula: NJ The NCV7430 provides protection features for each LED driver. The device monitors for LED Open Circuit (ANODE to LEDxC), LED Short Circuit (ANODE to LEDxC), Short LEDxC to GND and Open Circuit RSENSE (LEDxR to GND) as shown in Figure 7. Detection of these errors will set the appropriate error bits in the status register (), and proper action will be taken (reference Table 7). There is a minimum detection activation time of 8 msec for error detection (use of a 0.2% duty cycle is recommended). This is derived from a combination of color, intensity levels, and PWM frequency settings (122 Hz or 244 Hz). The system design should monitor error detection at high intensity settings to avoid missing short or open circuit conditions at low duty cycles. LEDxC shorts to ground do not require a minimum duty cycle. Additionally, error detection must be sequential (transitioning from a known good state to an error state). Mixing of errors (i.e. transitioning from a short condition to an open condition) could result in signal false errors in identity. Intensity Matrix LED1int LED1Ȁ LED2int + AMBLIGHTINTENSITY * LED2Ȁ (eq. 3) 16 LED3Ȁ LED3int Nj ǒ Ǔ NJ Nj If the intensity value is set to 15 the used value for the calculation is 16, resulting in a multiplication factor of 1 (no intensity reduction). Changing the intensity from one to another value can follow a linear or logarithmic transition based on the fading time as described in “Theatre dimming function”. LED Modulation Frequency The LED modulation frequency can be chosen to be 122 or 244 Hz. Theatre Dimming Function The NCV7430 has a fading function to give a theater dimming effect when changing color and/or intensity settings. The effect presents itself as a smooth transition between colors, or increases or decreases in intensity. www.onsemi.com 10 NCV7430 Table 7. ERROR CONDITIONS FOR EACH INDIVIDUAL LED ERR[2] ERR[1] ERR[0] Retry Option Action: No Error 0 0 0 No No Action Open circuit LEDxR Short from ANODE to LEDxC 0 1 1 Yes Thermal Sense Short from LEDxC to GND (Note 13) “Shorted LED cathode to GND” 0 1 0 Yes ANODE OFF (Note 12) LEDxC OFF Open circuit (LEDxC to ANODE) 1 0 1 No Thermal Sense Automatic retry below Thermal Warning Threshold LED & ANODE OFF (Note 12) Error Description: Thermal Shutdown 12. ANODE OFF is realized by internal circuitry that switches VBIAS to 0 V. The Anode can only be switched off when an external transistor is used. 13. A short from (LEDxC) to (LEDxR), or (ANODE) to (LEDxR) may damage the device. When the external ballast transistor is not used, the LED and/or Rsense may also be damaged. ANODE LED Open Circuit Detection Error Detection Manager LEDxC LED Short Circuit Detection Short Circuit Detection LEDxC to GND Open Circuit Detection RSENSE to GND LEDxR GND Figure 7. Short Circuit and Open Circuit Detection Thermal Warning and Thermal Shutdown Thermal Control Bit The NCV7430 has thermal warning and thermal shutdown protection features. When the junction temperature of the NCV7430 rises above the thermal warning level (T), the warning flag is set in the status register. When the junction temperature rises above T, the device will switch off the LEDs, and set the flag in the status register. and flags represent an event has happened and may not represent the current state of the IC. After the flag is set, the device can only enter normal operation again after it is cooled down below the T level. After a occurrence and the cooling down period, the NCV7430 will resume normal operation. When the thermal control bit is set, the NCV7430 will actively regulate the LED currents as programmed by the user when exceeding a thermal warning threshold. This function protects the device and the LEDs from overheating without interaction from the LIN master. When T is reached, the NCV7430 will decrease the LED currents by a step defined by the parameter TH_Ired_step. The reduction in current is represented by the status bit . If after tTH_timeout seconds the thermal warning condition is still present, the current is decreased further. If the thermal warning condition is removed within the tTH_timeout seconds, the NCV7430 keeps the reduced current setting for the next tTH_timeout www.onsemi.com 11 NCV7430 The currents can be set back to their normal operating values by writing the bit to ‘1’ in the control register where the bit was previously set. After this command the < TH_CONT_STATE > is reset to ‘0’. Note: During thermal control the device is still protected for over temperatures at the Thermal Shutdown threshold. period. The reduced current state is presented by the 4 bit register. Under normal conditions the Thermal Warning level has the value as specified by T. With the OTP programmable bit , the Thermal warning and Thermal Shutdown levels can be reduced by 20°C. T shutdown level T T warning level t T bit T < Ttw and* getfullstatus T bit * TSD and TW flags remain set until cleared with getfullstatus. T > Ttsd, LED’s turn OFF T < Ttw and* getfullstatus LED’s turn on Figure 8. Thermal Management Retry Mode LED currents will be regulated as described in “Thermal warning and thermal control”. NOTE: Care has to be taken not to overstress the system by switching on the LEDs repeatedly after detection of errors. The bit residing in OTP can program to act on all LEDs when an error occurs or to act only on the LED(s) that is (are) failing. NOTE: The NCV7430 utilizes a single timeout counter for the Retry Interval time. Additional errors occurring after the 1 st error detection will cause the timer to be reset. This results in an extended retry interval time for the initial detected error. This is highlighted in Figure 9. The device attempts to turn on 20 times (after a GetFullStatus request). A retry mode will be entered upon error detection (as per Table 12). Information on this event is stored in the status register (bit ). After entering the retry mode, the device will switch ON the LED(s) after tretryinterval. If the error(s) still exists, the device will switch OFF the LEDs. The retry actions are taken place Nnumberofretries times. After the last retry, the device will switch OFF the LEDs until a turn−on signal is reinitiated by the user via the LIN pin. This is done by resetting the internal retry counter by reading the Status Register via a GetFullStatus command. After reading, the and error flags are cleared. The error conditions “Shorted LED” and “Open circuit” do not switch OFF the LEDs. For these errors, the device relies on the (always active) thermal shutdown and thermal control. When the thermal shutdown temperature threshold is reached, the device will switch OFF the LEDs (reference below). When thermal control is activated, the www.onsemi.com 12 NCV7430 1 5 10 15 20 T shutdown level T warning level Getfullstatus request 1 5 1 10 5 15 20 T shutdown level T warning level Getfullstatus request Figure 9. Retry Counter Sleep Mode detection of a transition of LIN recessive state to dominant state followed by a dominant level for a time period >tLIN_Wake. Refer to Figure 6 for wake time and voltage threshold definitions to wake up via LIN bus transitions. As per the LIN protocol, a special master request frame is issued to force slave nodes to sleep mode. Reference Table 29 for details of the command structure. In sleep mode, LEDs are turned OFF and the VBIAS output is brought to 0V, turning OFF the optional bypass transistor. The internal circuitry of the NCV7430, including the band gap reference, internal oscillator and current sources are put in low power mode and the internal registers are reset. In Sleep mode the total battery current consumption is reduced to Ibat_sleep as specified in the DC parameter table. The NCV7430 wakes up from sleep after www.onsemi.com 13 NCV7430 OTP REGISTERS Table 8. OTP MEMORY STRUCTURE Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x00 OSC4 OSC3 OSC2 OSC1 OSC0 ZAP2 ZAP1 ZAP0 0x01 TSD3 TSD2 TSD1 TSD0 BG3 BG2 BG1 BG0 0x02 DEFAULT ERROFF TWPROG LOCKBT0 PPOL3 PPOPL2 PPOL1 PPOL0 0x03 LOCKBT1 CMDSOFF AD5 AD4 AD3 AD2 AD1 AD0 TWPROG2 LOW BAUD BALLAST GROUP_ID1 GROUP_ID0 0x04 LED modulation Calibration data a11 0x05 LED modulation Calibration data a12 0x06 LED modulation Calibration data a13 0x07 LED modulation Calibration data a21 0x08 LED modulation Calibration data a22 0x09 0 1 reserved 0x0A LED modulation Calibration data a23 0x0B LED modulation Calibration data a31 0x0C LED modulation Calibration data a32 0x0D LED modulation Calibration data a33 0x0E LOCKBT2 LED_MOD_FREQ 1 TH_CONT Table 9. OTP PROGRAMMING BIT DESCRIPTION Programming Bit GROUP_ID3 GROUP_ID2 Table 10. OTP OVERWRITE PROTECTION Lock Bit Description Protected Bytes LOCKBT0 (factory zapped before delivery) 0x00 − All bits 0x01− All bits 0x02 − bit 0 to bit 5 DEFAULT ‘1’ Enables the LEDs on power−up. ERROFF ‘1’ Turns off all LEDs during LEDxC short to ground. TWPROG, TWPROG2 (See table below) LOCKBT1 0x03 0x0E − GROUP_IDx bits LOCKBT1 ‘1’ Locks bits per Table 13. LOCKBT2 CMDSOFF ‘1’ Limits command recognition to Set_Color_Short and Set_Iintensity. AD0 − AD5 NCV7430 address programming bits. LOW BAUD Expected Low Baud Rate ‘0’ = 9600 BAUD ‘1’ = 10400 BAUD 0x04 to 0x0D 0x02 − DEFAULT, ERROFF, TWPROG, and TWPROG2 0x03 − CMDSOFF 0x0E − LED_MOD_FREQ and TH_CONT BALLAST This bit must be zapped (‘1’) when using an external ballast transistor. An unzapped bit with the use of a ballast transistor could result in LEDxC short to ground errors. LOCKBT2 ‘1’ Locks bits per Table 13. LED_MOD_FREQ ‘0’ LED modulation frequency − 122 Hz ‘1’ LED modulation frequency − 244 Hz TH_CONT ‘1’ Thermal Control Enabled. GROUP_ID0− GROUP_ID3 NCV7430 group programming bits. 16 possible groups. Parameters stored at address 0x00 and 0x01, and bit 0 to bit 4 of address 0x02 are pre−programmed in the OTP memory at the factory. They correspond to the calibration of the circuit. This does not correspond to LED calibration. Each OTP bit is set to ‘0’ prior to zapping. Zapping a bit will set it to ‘1’. Zapping of a bit already at ‘1’ will have no effect. Each OTP byte needs to be programmed separately (see command SetOTPparam). Once OTP programming is completed, bit and can be zapped to disable future zapping. After programming the OTP, the contents only become active after a power−on reset. The power−on reset copies the OTP information to the registers. Thermal Warning Temperature Select TWPROG2 TWPROG 0 1 Temperature 95°C 0 0 115°C 1 1 120°C 1 0 130°C www.onsemi.com 14 NCV7430 Table 11. REGISTERS AND FLAGS Register Mnemonic Length (bit) LED color value LED1 Led 1’ 8 LED color value LED2 Led 2’ 8 LED color value LED3 Led 3’ 8 LED modulation Calibration a11 Cal_a11 8 LED modulation Calibration a22 Cal_a22 LED modulation Calibration a33 Related Commands Comment Reset State Get_Color Set_Color Set_Color_Short Get_Actual_param Get_Color Set_Color Set_Color_Short Get_Actual_param Get_Color Set_Color Set_Color_Short Get_Actual_param Get_Actual_Param Set_Primary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF “00” 8−bit unsigned: 0x00 .. 0xFF “00” 8−bit unsigned: 0x00 .. 0xFF “00” 8−bit unsigned: 0x00 .. 0xFF From OTP or “FF” when all OTP values are “0” 8 Get_Actual_Params Set_Primary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF From OTP or “FF” when all OTP values are “0” Cal_a33 8 Get Actual Param Set_Primary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF From OTP or “FF” when all OTP values are “0” LED modulation Calibration a12 Cal_a12 8 Get Actual Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP LED modulation Calibration a13 Cal_a13 8 Get_ Actual _Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP LED modulation Calibration a21 Cal_a21 8 Get Actual_Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP LED modulation Calibration a23 Cal_a23 8 Get_ Actual _Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP LED modulation Calibration a31 Cal_a31 8 Get_ Actual _Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP LED modulation Calibration a32 Cal_a32 8 Get_ Actual _Param Set_Secondary_Cal_Param 8−bit unsigned: 0x00 .. 0xFF FROM OTP Calibration Enable CAL_EN 1 Get_LED_Control Set_LED_Control Get_Actual_Param “0”: Calibration is not used “1”: Calibration is used “1” Ambient light intensity AMBLIGHT INTENSITY 4 Set_Intensity 4 bit linear scaling for intensity “15” Fading Time Fading time[5:0] 6 Set_Color Get_Actual_Param 6−bit unsigned: 0 .. 6..3 seconds in resolution steps of 0.1 secs “00” Fading ON/OFF FADING ON/OFF 1 Set_Color Get_Actual_Param “0” : Fading off “1” : Fading on Fading Slope FADING SLOPE 1 Set_Color Get_Actual_Param “0” : Fading slope logarithmic “1” : Fading slope Linear “0” Thermal Control TH_CONT 1 Set_LED_Control Get_Actual_Param Get_LED_Control “0” : Automatic thermal control Disabled “1” : Automatic thermal control Enabled FROM OTP DEFAULT state after power−on DEFAULT 1 Set_OTP_Param “0” : Default power−up state: LEDs and Fading OFF “1” : Default power−up state: LEDs and Fading ON FROM OTP LED error detection selection ERROFF 1 Set_OTP_Param “0” : Only failing LED off when an error is detected “1” : All LEDs off when an error is detected FROM OTP CMDSOFF 1 Set_OTP_Param “0” : All LIN commands are validated and executed “1” : Only LIN command Set_Color_Short and Set_intensity are validated and executed, all other command are disabled for use. FROM OTP Commands OFF www.onsemi.com 15 If DEFAULT = 1: “1” If DEFAULT = 0: “0” NCV7430 Table 11. REGISTERS AND FLAGS Length (bit) Register Mnemonic Thermal Control Status TH_CONT _STATE[3:0] 4 Get_Full_Status TWPROG TWPROG 1 Set_OTP_Param TWPROG2 TWPROG2 1 Set_OTP_Param “0” “1” Works with TWPROG Thermal Warning Level Set per the Temperature Select Table. LEDs ON/OFF LEDs ON/OFF 1 Set_LED_Control Set_Color Get_LED_Control “0” : All LEDs OFF “1” : All LEDs ON if individual LEDx ENABLE is set to “1” If DEFAULT = 1: “1” If DEFAULT = 0: “0” LED1 ENABLE LED1 ENABLE 1 Set_LED_Control Get_LED_Control “0” : LED 1 OFF “1” : LED1 ON If DEFAULT = 1: “1” If DEFAULT = 0: “0” LED2 ENABLE LED2 ENABLE 1 Set_LED_Control Get_LED_Control “0” : LED 2 OFF “1” : LED 2 ON If DEFAULT = 1: “1” If DEFAULT = 0: “0” LED3 ENABLE LED3 ENABLE 1 Set_LED_Control Get_LED_Control “0” : LED 3 OFF “1” : LED 3 ON If DEFAULT = 1: “1” If DEFAULT = 0: “0” UPDATE COLOR[1:0] 2 Set_Color RETRYSTATE 1 Get_Full_Status Get_Status “00”: immediate update “01”: store and do not update “10”: update to the already stored values “11”: discard “0”: not in retry state “1”: device is retrying to recover from error LED modulation frequency LED_MOD_ FREQ 1 Set_LED_Control Get_Actual_Param Get_LED_Control “0” : 122 Hz “1” : 244 Hz ERROR LED 1 ERRLED1[2:0] 3 Get_Full_Status GetStatus Refer to Table 8 “x” ERROR LED 2 ERRLED2[2:0] 3 Get_Full_Status GetStatus Refer to Table 8 “x” ERROR LED 3 ERRLED3[2:0] 3 Get_Full_Status GetStatus Refer to Table 8 “x” Thermal warning TW 1 Get_Full_Status GetStatus Thermal warning detected “x” Thermal Shutdown TSD 1 Get_Full_Status GetStatus Thermal Shutdown detected “x” Tinfo[1:0] 2 Get_Full_Status 00: T < T 01: T T “x” VBB_Reset LIN Data Error 1 1 Get_Full_Status Get_Full_Status POR reset detected Checksum Error + Stopbit Error + Length Error “1” “x” 1 1 Get_Full_Status Get_Full_Status Parity Error + Synch field Error Difference in sent and monitored bit “x” “x” UPDATECOLOR mode RETRY state Tinfo VBB_reset LIN Data Error LIN Header Error LIN Header Error LIN Bit Error LIN Bit Error Related Commands www.onsemi.com 16 Comment 4 bits unsigned “0” : current reduced to 6.25% DC “15” : current not reduced (Max ON DC) “0” “1” Works with TWPROG2 Thermal Warning Level Set per the Temperature Select Table. Reset State “15” FROM OTP FROM OTP “0” “0” FROM OTP NCV7430 LIN CONTROLLER General Description VBB The LIN (local interconnect network) is a serial communications protocol that efficiently supports the control of distributed nodes in automotive applications. The physical interface implemented in the NCV7430 is compliant to the LIN rev. 2.0 & 2.1 specifications. It features a slave node, thus allowing for: • single−master / multiple−slave communication • self synchronization without quartz or ceramics resonator in the slave nodes • guaranteed latency times for signal transmission • single−signal−wire communication • transmission speed of 19.2 kbit/s, 10.4 kbit/s and 9.6 kbit/s • selectable length of Message Frame: 2, 4, and 8 bytes • configuration flexibility • data checksum (classic checksum) security and error detection • detection of defective nodes in the network It includes the analog physical layer and the digital protocol handler. The analog circuitry implements a low side driver with a pull−up resistor as a transmitter, and a resistive divider with a comparator as a receiver. The specification of the line driver/receiver follows the ISO 9141 standard with some enhancements regarding the EMI behavior. 30 kW RxD to control block LIN protocol handler LIN Filter TxD Slope Control LIN address from OTP Figure 10. Functional Description Analog Part The transmitter is a low−side driver with a pull−up resistor and slope control. The receiver mainly consists of a comparator with a threshold equal to VBB/2. Figure 5 shows the characteristics of the transmitted and received signal. See AC Parameters for timing values. Protocol Handler This block implements: • Bit synchronization • Bit timing • The MAC layer • The LLC layer • The supervisor Slave Operational Range for Proper Self Synchronization The LIN interface will synchronize properly in the following conditions: • Vbat: sufficiently high • Ground shift between master node and slave node < ±1 V It is highly recommended to use the same type of reverse battery voltage protection diode for the Master and the Slave nodes. Error Status Register The LIN interface implements a register containing an error status of the LIN communication. This register is as follows: Table 12. LIN ERROR REGISTER Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Not used Not used Not used Not used Not used Data error Flag Header error Flag Bit error Flag With: Data error flag: (= Checksum error + StopBit error + Length error) Header error flag: (= Parity error + SynchField error) Bit error flag: Difference in bit sent and bit monitored on the LIN bus A GetFullStatus frame will reset the LIN error status register. www.onsemi.com 17 NCV7430 Physical Address of the Circuit NOTE: For the Set_Color_Short and Set_Intensity commands the GROUP_ID bits are split. The lower two bits are used to assign the NCV7430 to one of four groups for the color setting, while the upper two bits are used to assign the device to one of four groups for the intensity setting. BAUD Rate Group ID 0010 Group ID 0001 Group ID 0000 The NCV7430 device automatically distinguishes between high and low baud rates. A high baud rate of 19200 transmitted by the master will be duplicated by the slave. There are two low baud rates in use between the US and Europe. They are 9600 and 10400. To eliminate possible confusion between these two closely related frequencies, the device is programmable via the OTP register to select between the two frequencies (reference Table 8). LIN Frames The LIN frames can be divided in writing and reading frames. A frame is composed of an 8−bit Identifier followed by 2, 4 or 8 data−bytes and a checksum byte. NOTE: The checksum conforms to LIN 1.3. This means that all identifiers are validated with classic checksum. Writing frames will be used to: • Program the OTP Memory; • Configure the LED parameters (Modulation value etc); • Control of the LED Outputs. Group 1 Group 0 Group ID 0101 Group ID 0100 Group ID 0011 Group ID 1000 Group ID 0111 Group ID 0110 Group 6 Group 5 Group 4 Group 3 Group 2 Send by Master Group 8 Group 7 Group ID 1101 Group ID 1100 Group ID 1011 Group ID 1010 Group ID 1001 Group 15 Group 14 Group 13 Group ID programmed in NCV7430 Group 12 Group 11 Group 10 Group 9 Group ID 1111 Group ID 1110 The circuit must be provided with a node address in order to discriminate this circuit from other ones on the LIN bus. This address is coded on 6 bits, yielding the theoretical possibility of 64 different devices on the same (logical) bus. However the maximum number of nodes in a LIN network is also limited by the physical properties of the bus line. Beside the node address a 4 bit “GROUP_ID” identifier is available. This “GROUP_ID” identifier is only evaluated when the Broad bit is recognized as ‘0’. The “GROUP_ID” identifier assigns the node to one of 16 groups. The node can only be assigned to one group. The LIN message will use 16 bit locations for the Groups. When the Node “GROUP_ID” identifier matches the bit in the message, the message will be evaluated. Refer to Figure 8. The message can address one or more Nodes at the same time by setting the appropriate Group bit(s). Figure 11. Resuming: The NCV7430 is individually addressable by its LIN node address and cluster addressable via the “Group” bits when ‘Broad’ is ‘0’. Whereas reading frames will be used to: • Get status information such as error flags; • Reading OTP for calibration by MCU; • Verify the right programming and configuration of the component. Writing Frames The LIN master sends commands and/or information to the slave nodes by means of a writing frame. According to the LIN specification, identifiers are to be used to determine a specific action. If a physical addressing is needed, then some bits of the data field can be dedicated to this, as illustrated in the example below. Identifier Byte ID 0 ID 1 ID 2 ID 3 ID 4 Data Byte 1 ID 5 ID 6 Data Byte 2 ID 7 phys. address command parameters (e.g. position) and are used for parity check over to , conforming to LIN2.1 specification. = ⊕ ⊕ ⊕ (even parity) and = NOT( ⊕ ⊕ ⊕ ) (odd parity). www.onsemi.com 18 NCV7430 Another possibility is to determine the specific action within the data field in order to use fewer identifiers. One can for example use the reserved identifier 0x3C and take advantage of the 8 byte data field to provide a physical address, a command and the needed parameters for the action, as illustrated in the example below. ID 0x3C Data Byte 1 00 Data Byte 2 Data Byte 3 command physical address Data Byte 4 Data Byte 5 Data Byte 6 Data Byte 7 Data Byte 8 1 AppCmd parameters NOTE: Bit 7 of Data byte 1 must be at ‘1’ since the LIN specification requires that contents from 0x00 to 0x7F must be reserved for broadcast messages (0x00 being for the “Sleep” message). See also LIN command Sleep. The NCV7430 is using both of above mentioned methods. LIN Commands: In the following paragraphs all LIN frame commands are described. The gray filled cells of the tables present the bytes sent by the master while the white cells present the bytes sent by the slave (NCV7430). Table 13. COMMAND SUMMARY Command Response Get_Full_Status Get_Full_Status In frame response 1 Get_Actual_Param1 Get_Actual_Param In frame response 1 Get_Actual_Param2 Get_Actual_Param In frame response 2 Get_OTP_Param 1 Get_OTP_Param In frame response 1 Get_OTP_Param 2 Get_OTP_Param In frame response 2 Get_Status READING FRAME Get_Status In frame response 1 Get_Color READING FRAME Get_Color In frame response 1 Get_LED_Control READING FRAME Get_LED In frame response 1 Set_LED_Control WRITING FRAME − Set_Color WRITING FRAME − Set_Color_Short − Set_Intensity − Set_Primary_Cal_Param − Set_Secondary_Cal_Param − Set_OTP_Param − Sleep − www.onsemi.com 19 NCV7430 Get_Full_Status Note: A Get_Full_Status command will clear flags , , , and . If the error condition persists, the value will be set again. Get _Full_Status conforms to a 0x3C command structure. This command is provided to the circuit by the LIN master to get a complete status of the circuit. Refer to Registers and Flags Table to see the meaning of the parameters sent to the LIN master. Table 14. Get_Full_Status Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 2 Data 2 1 3 Data 3 1 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF 8 Data 8 0xFF 9 Checksum Classic Checksum over data AppCMD =0x80 CMD[6:0] = 0x01 1 AD[5:0] Get_Full_Status In frame response 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 1 1 0 1 1 Data 1 1 1 2 Data 2 3 Data 3 1 1 1 1 1 LIN Data error LIN Header error LIN Bit error 4 Data 4 1 1 VBB Under Voltage VBB Reset TSD TW 5 Data 5 TH_CONT STATE 3 TH_CONT STATE 2 TH_CONT STATE 1 TH_CONT STATE 0 RETRY STATE ERR[2] LED1 ERR[1] LED1 ERR[0] LED1 6 Data 6 1 ERR[2] LED3 ERR[1] LED3 ERR[0] LED3 1 ERR[2] LED2 ERR[1] LED2 ERR[0] LED2 7 Data 7 LED3 ENABLE LED2 ENABLE LED1 ENABLE LEDs ON/OFF 8 Data 8 0xFF 9 Checksum Classic Checksum over data AD[5:0] 0xFF Tinfo[1:0] GROUP_ID3 GROUP_ID2 GROUP_ID1 GROUP_ID0 Where: Tinfo[1:0] gives the actual state of the temperature, while TW and TSD present the Latched status The Error states are as follows: Error Description: ERR[2] LEDx ERR[1] LEDx ERR[0] LEDx No Error 0 0 0 Open circuit − LEDxR, Short from ANODE to LEDxC 0 1 1 Open circuit − LEDxC to ANODE 1 0 1 Short from LEDxC to Ground 0 1 0 www.onsemi.com 20 NCV7430 The TH_CONT_STATE[3:0] read only bits represent the degree of current reduction when the thermal control bit is set . TH_CONT_STATE[3:0] Current in % of Nominal 15 Max ON 14 93.75 13 87.50 12 81.25 11 75.00 10 68.75 9 62.50 8 56.25 7 50.00 6 43.75 5 37.50 4 31.25 3 25.00 2 18.75 1 12.50 0 6.25 www.onsemi.com 21 NCV7430 Get_Actual_Param Reads the full set of the actual parameters of the NCV7430. For this command two messages are needed. This is a 0x3C command requiring an in frame slave responses. Table 15. Get_Actual_Param1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 2 Data 2 1 3 Data 3 1 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF 8 Data 8 0xFF 9 Checksum Classic Checksum over data AppCMD =0x80 CMD[6:0] = 0x02 1 AD[5:0] Get_Actual_Param In frame response 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 1 1 0 1 1 Data 1 1 1 2 Data 2 LED color value LED 1 [7:0] 3 Data 3 LED color value LED 2 [7:0] 4 Data 4 LED color value LED 3 [7:0] 5 Data 5 LED modulation Calibration data a11[7:0] 6 Data 6 LED modulation Calibration data a22[7:0] 7 Data 7 LED modulation Calibration data a33[7:0] 8 Data 8 9 Checksum FADING ON/OFF AD[5:0] FADING SLOPE Fading time [5:0] Classic Checksum over data www.onsemi.com 22 NCV7430 Table 16. Get_Actual_Param2 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 2 Data 2 1 3 Data 3 1 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF AppCMD =0x80 CMD[6:0] = 0x03 1 AD[5:0] 8 Data 8 0xFF 9 Checksum Classic Checksum over data Get_Actual_Param In frame response 2 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 1 1 0 1 1 Data 1 1 1 2 Data 2 LED modulation Calibration value a12[7:0] 3 Data 3 LED modulation Calibration value a13[7:0] 4 Data 4 LED modulation Calibration value a21[7:0] 5 Data 5 LED modulation Calibration value a23[7:0] 6 Data 6 LED modulation Calibration value a31[7:0] 7 Data 7 8 Data 8 GROUP_ID1 GROUP_ID0 9 Checksum AD[5:0] LED modulation Calibration value a32[7:0] CAL_EN LED_MOD_ FREQ 1 TH CONT GROUP_ID3 GROUP_ID2 Classic Checksum over data www.onsemi.com 23 NCV7430 Get_OTP_Param Reads the full set of OTP settings of the NCV7430. For this command two messages are needed. This is a 0x3C command requiring an in frame slave response. Table 17. Get_OTP_Param 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 2 Data 2 1 3 Data 3 1 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF 8 Data 8 0xFF 9 Checksum Classic Checksum over data AppCMD =0x80 CMD[6:0] = 0x04 1 AD[5:0] Get_OTP_Param In frame response 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 1 1 0 1 1 Data 1 1 1 2 Data 2 1 1 1 1 1 1 LOW BAUD DIAGALLOFF 3 Data 3 1 1 1 1 1 1 1 1 4 Data 4 DEFAULT ERROFF TWPROG 1 1 1 1 1 5 Data 5 LOCKBT1 CMDSOFF AD5 AD4 AD3 AD2 AD1 AD0 6 Data 6 LED modulation Calibration data a11[7:0] 7 Data 7 LED modulation Calibration data a12[7:0] 8 Data 8 LED modulation Calibration data a13[7:0] 9 Checksum Classic Checksum over data AD[5:0] NOTE: After programming bit all the LIN commands (except Set_Color_Short and Set_intensity) are disabled (The commands are not evaluated and interpreted by the NCV7430). www.onsemi.com 24 NCV7430 Table 18. Get_OTP_Param 2 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 2 Data 2 1 3 Data 3 1 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF AppCMD =0x80 CMD[6:0] = 0x05 1 AD[5:0] 8 Data 8 0xFF 9 Checksum Classic Checksum over data Get_OTP_Param In frame response 2 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 1 1 0 1 1 Data 1 1 1 2 Data 2 LED modulation Calibration data a21[7:0] 3 Data 3 LED modulation Calibration data a22[7:0] 4 Data 4 LED modulation Calibration data a23[7:0] 5 Data 5 LED modulation Calibration data a31[7:0] 6 Data 6 LED modulation Calibration data a32[7:0] 7 Data 7 8 Data 8 GROUP_ID1 GROUP_ ID0 9 Checksum AD[5:0] LED modulation Calibration data a33[7:0] LOCKBT2 LED_MOD_ FREQ 1 TH_CO NT GROUP_ID3 GROUP_ID2 Classic Checksum over data www.onsemi.com 25 NCV7430 Get_Status This command delivers a short overview of the device status. It will not attempt to reset the error bits. Resetting error bits requires execution of the Get_Full_Status command. Conform a two byte in frame command structure. Table 19. Get_Status READING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 0 0 0 0 0 1 Data 1 1 1 2 Data 2 8’hFF 3 Checksum Classic Checksum over data 0 0 1 ERRORLED2 ERRORLED1 LIN ERROR AD[5:0] Get_Status In frame response 1 0 Identifier 0 0 1 Data 1 1 1 2 Data 2 TSD TW 3 Checksum 0 1 0 AD[5:0] VBB Under Voltage RETRY STATE ERROR LED3 Classic Checksum over data Where: LIN ERROR = Or function of all LIN Errors Error LED1 = function ERRLED1[2:0] ≠ 0; refer to Table 8 Error LED2 = function ERRLED2[2:0] ≠ 0; refer to Table 8 Error LED3 = function ERRLED3[2:0] ≠ 0; refer to Table 8 RETRY STATE = NCV7430 is retrying to recover from errors VBB Undervoltage = “0” at power−on reset. Set to a “1” with VBB Undervoltage. Cleared with a GET_FULL_STATUS command. www.onsemi.com 26 NCV7430 Get_Color Gives the real modulation register values (after calibration). Conform an eight byte in frame command structure. Table 20. Get_Color READING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 0 0 0 0 0 1 Data 1 1 1 2 Data 2 8’hFF 3 Checksum Classic Checksum over data AD[5:0] Get_Color In frame response 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 1 0 0 1 0 0 1 0 1 Data 1 1 1 2 Data 2 3 Data 3 1 1 4 Data 4 5 Data 5 6 Data 6 7 Data 7 8 Data 8 9 Checksum AD[5:0] LED modulation value LED 1’ [7:0] (real LED modulation register) 1 1 LED modulation overflow LED1 LED modulation value LED 1’ [10:8] LED modulation value LED 2’ [7:0] (real LED modulation register) 1 1 1 1 LED modulation overflow LED2 LED modulation value LED 2’ [10:8] LED modulation value LED 3’ [7:0] (real LED modulation register) Intensity[3:0] FADING ON/OFF LED modulation overflow LED3 FADING SLOPE Fading time [5:0] Classic Checksum over data www.onsemi.com 27 LED modulation value LED 3’ [10:8] NCV7430 Get_LED_Control This command reads the control bits conform a two byte in frame command structure. Table 21. Get_LED_Control READING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 0 0 0 0 0 1 Data 1 1 1 2 Data 2 8’hFF 3 Checksum Classic Checksum over data AD[5:0] Get_LED In frame response 1 Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 0 1 0 0 0 0 1 Data 1 1 1 2 Data 2 CAL_EN LED_MOD_ FREQ LED2 ENABLE LED1 ENABLE 1 3 Checksum AD[5:0] LEDs ON/OFF TH CONT LED3 ENABLE Classic Checksum over data Set_LED_Control This command is the overall control command to switch the LEDs on and off. Table 22. Set_LED_Control WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 1 0 1 0 0 0 1 1 1 Data 1 Broad 1 2 Data 2 Group 7 selected Group 6 selected Group 5 selected Group 4 selected Group 3 selected Group 2 selected Group 1 selected Group 0 selected 3 Data 3 Group 15 selected Group 14 selected Group 13 selected Group 12 selected Group 11 selected Group 10 selected Group 9 selected Group 8 selected 4 Data 4 CAL_EN LED_MOD_ FREQ LEDs ON/OFF TH CONT LED3 ENABLE LED2 ENABLE LED1 ENABLE 1 5 Checksum AD[5:0] Classic Checksum over data Where: Broad: Broad = ‘0’ means group addressing. One or more groups can be selected by setting the corresponding ‘GroupX Selected’ bit to ‘1’. All nodes with GROUP_ID matching the selected groups will act. AD[5:0] bits are ignored. Broad = ‘1’ means single node addressing. The target node address is indicated by the AD[5:0] bits. Group selection bits are ignored. This command is executed immediately. www.onsemi.com 28 NCV7430 Set_Color When CAL_EN is set to ‘0’, the real value for the color setting is written into the LED modulation register. When CAL_EN is set to ‘1’ the received 8 bit values are first corrected by the matrix calculation and then applied to the LED modulation registers. Table 23. Set_Color WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 0 0 1 0 0 1 Data 1 Broad 1 2 Data 2 Group 7 selected Group 6 selected Group 5 selected Group 4 selected Group 3 selected Group 2 selected Group 1 selected Group 0 selected 3 Data 3 Group 15 selected Group 14 selected Group 13 selected Group 12 selected Group 11 selected Group 10 selected Group 9 selected Group 8 selected 4 Data 4 UPDATE COLOR[1] UPDATE COLOR[0] 5 Data 5 FADING ON/OFF FADING* SLOPE 6 Data 6 LED color value LED 1 [7:0] 7 Data 7 LED color value LED 2 [7:0] 8 Data 8 LED color value LED 3 [7:0] 9 Checksum Classic Checksum over data AD[5:0] Fading time[5:0] LEDs ON/OFF 1 Intensity[3:0] Where: Broad: Broad = ’0’ means group addressing. One or more groups can be selected by setting the corresponding ’GroupX Selected’ bit to ’1’. All nodes with GROUP_ID matching the selected groups will act. AD[5:0] bits are ignored. Broad = ’1’ means single node addressing. The target node address is indicated by the AD[5:0] bits. Group selection bits are ignored. The update of the LED colors is determined by UPDATECOLOR[1:0] 00 immediate update 01 store and do not update 10 update to the already stored values 11 discard www.onsemi.com 29 NCV7430 Set_Color_Short The Set_Color_Short command is used to set the LED colors directly for the four groups that are indicated. This command is short and does not contain all the parameters as used in the Set_Color command. Only four groups can be approached, so the NCV7430 needs to be programmed as member of one of these groups: (lowest two bits of GROUP_ID in OTP; GROUP_ID0 and GROUP_ID1; presenting 0 to 3 for color). NOTE: This command is always acting towards groups. Individual node addresses are not implemented. Table 24. Set_Color_Short WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 0 1 1 1 1 1 Data 1 LED color value LED 1 [7:0] 2 Data 2 LED color value LED 2 [7:0] 3 Data 3 LED color value LED 3 [7:0] 4 Data 4 C_GroupC selected C_GroupB selected C_GroupA selected 5 Checksum 1 1 1 1 C_GroupD selected Classic Checksum over data Where: Color Groups Corresponding GROUP_ID Range C_GroupA xx00 C_GroupB xx01 C_GroupC xx10 C_GroupD xx11 *Fading Scope = 0 = logarithmic = 1 = linear Choose either 0 or 1 when setting control for intensity Fading Slope must be set to ’1’ for color control (only Linear is allowed). Set_Intensity The Set_Intensity command is used to set the LED colors directly for the groups that are indicated. Only four groups can be approached, so the NCV7430 needs to be programmed as member of one of these groups: (higher two bits of GROUP_ID in OTP; GROUP_ID2 and GROUP_ID3; presenting group 0 to 3 for intensity). NOTE: This command is always acting towards groups. Individual node addresses are not implemented. Table 25. Set_Intensity WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 0 1 1 1 0 1 Data 1 I_GroupD selected I_GroupC selected I_GroupB selected I_GroupA selected 2 Data 2 1 1 3 Checksum Fading time[5:0] Classic Checksum over data Where: Intensity Groups Corresponding GROUP_ID Range I_GroupA 00xx I_GroupB 01xx I_GroupC 10xx I_GroupD 11xx www.onsemi.com 30 Intensity[3:0] NCV7430 Set_ Primary _Cal_Param Using a four byte command structure. These registers are updated as default from OTP after a power−on reset. Table 26. Set_Primary_Cal_ Param WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 0 0 1 0 1 1 Data 1 1 1 2 Data 2 LED modulation Calibration value a11[7:0] 3 Data 3 LED modulation Calibration value a22[7:0] 4 Data 4 LED modulation Calibration value a33[7:0] 5 Checksum Classic Checksum over data AD[5:0] Set_ Secondary_Cal _Param Using an eight byte command structure. These registers are updated as default from OTP after a power−on reset. Table 27. Set_ Secondary _Cal_Param WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 1 1 1 0 1 1 0 1 Data 1 1 1 2 Data 2 LED modulation Calibration value a12[7:0] 3 Data 3 LED modulation Calibration value a13[7:0] 4 Data 4 LED modulation Calibration value a21[7:0] 5 Data 5 LED modulation Calibration value a23[7:0] 6 Data 6 LED modulation Calibration value a31[7:0] 7 Data 7 LED modulation Calibration value a32[7:0] 8 Data 8 0xFF 9 Checksum Classic Checksum over data AD[5:0] www.onsemi.com 31 NCV7430 Set_OTP_Param This command is used for programming the individual bytes of the OTP memory. The OTP address is the pointer to the byte in OTP (refer to Table 8 OTP memory structure). Used is a four byte command structure. Table 28. Set_OTP_Param WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 1 1 1 0 0 1 1 1 1 Data 1 1 1 2 Data 2 3 Data 3 4 Data 4 OTP contents [7:0] 5 Checksum Classic Checksum over data AD[5:0] 0xFF 1 1 1 1 OTP address pointer[3:0] Sleep This command is provided to the circuit by the LIN master to put all the slave nodes connected to the LIN bus into sleep mode. See LIN 2.1 specification and Sleep Mode. The corresponding LIN frame is a master request command frame (identifier 0x3C) with data byte 1 containing 0x00 while the followings contain 0xFF. Table 29. SLEEP WRITING FRAME Structure Byte Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 Identifier 0 0 1 1 1 1 0 0 1 Data 1 0x00 2 Data 2 0xFF 3 Data 3 0xFF 4 Data 4 0xFF 5 Data 5 0xFF 6 Data 6 0xFF 7 Data 7 0xFF 8 Data 8 0xFF 9 Checksum Classic Checksum over data www.onsemi.com 32 NCV7430 APPLICATIONS INFORMATION High Current LEDs network comprised of a resistor in series with a schottky diode in parallel with another resistor as shown in Figure 13. Rredled sets the nominal LED current and the Schottky diode with the series resistor (R1) sets the temperature behavior. The NCV7430 uses a bandgap referenced circuit for creating the programming reference voltage on the LEDxR pins. The bandgap reference voltage targets to maintain a zero TC voltage. If the system design is able to correlate the red LED temperature to the NCV7430 IC temperature, there is a potential to create a compensation for these thermal effects. Starting with the zero temperature coefficient reference voltage on the LED1R pin, we can break up the voltage into two components by mandating a negative temperature coefficient associated with one component, and leave a positive temperature coefficient associated with the other component. This is done by adding a schottky diode in series with the programming resistor on the LED1R pin. The negative temperature coefficient of the schottky diode creates an overall positive temperature coefficient on the resistor in series. The system designer should consider the resulting positive voltage temperature coefficient with the discrete resistor temperature coefficient to obtain the desired temperature performance. Note, a schottky diode is required over p−n junction diodes due to the low voltage on the LED1R pin (325 mV [typ]). The NCV7430 is designed to drive RGB LEDs up to currents of 30 mA per channel. The system capability can be increased to drive higher current LEDs by configuring the device with an external PNP transistor as shown in Figure 12. In this setup, all the LED current is external to the device. Output current is limited by the base drive to the PNP (30 mA) and the beta of the PNP. Operation is controlled by the external feedback provided by R3 through R2 to the device pin LEDxR. VBB ANODE R1 LEDxC NJVMJD253T4G 10 ohm NCV7430 R2 LEDxR 10 ohm GND R3 1.2 ohm Figure 12. Using the NCV7430 with Higher Current LEDs VBB ANODE D1 D2 D3 LED1C Temperature Correction LED2C Light output from LEDs change with temperature. As temperature increases, light output goes down. The magnitude of change typically depends on the type of LEDs which are used. Red LEDs are typically manufactured using AlInGaP while green and blue LEDs are typically manufactured using AlInGaN. These processing differences result in the red LED temperature sensitivity being much more sensitive than the green or blue LEDs. As a result, the green and blue LEDs do not require any corrective adjustments while the red LEDs require the drive current to be increased as temperature goes up to keep a constant light output. Temperature correction can be implemented using the current programming pin, LED1R by using a programming LED3C LED3R LED2R LED1R D4 NCV7430 R1* GND Rredled* R3* 10 W R4* 10 W Figure 13. External Temperature Compensation *R3, R4 = 10 W for 30 mA LED current. R1, Rredled values dependent on application. R1, D4 set the LED current temperature coefficient. www.onsemi.com 33 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14 CASE 751AP ISSUE B 14 1 SCALE 1:1 NOTES 4&5 D D 0.10 C D 45 5 CHAMFER NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. H ALLOWABLE PROTRUSION SHALL BE 0.004 mm IN EXCESS OF MAXIMUM MATERIAL CONDITION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006 mm PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.010 mm PER SIDE. 5. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOT­ TOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTER­ SEATING L MOST EXTREMES OF THE PLASTIC BODY AT DATUM H. C PLANE 6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM H. DETAIL A 7. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP. 8. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. h NOTE 6 A 14 2X 8 0.10 C D E E1 NOTES 4&5 L2 0.20 C D 2X 1 7 B NOTE 6 14X b 0.25 TOP VIEW M C A-B D NOTES 3&7 NOTE 7 c 0.10 C e A1 C SIDE VIEW NOTE 8 DIM A A1 A2 b c D E E1 e h L L2 DETAIL A A2 A DATE 18 MAY 2015 END VIEW SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX --1.75 0.10 0.25 1.25 --0.31 0.51 0.10 0.25 8.65 BSC 6.00 BSC 3.90 BSC 1.27 BSC 0.25 0.41 0.40 1.27 0.25 BSC GENERIC MARKING DIAGRAM* 14X 0.76 14 XXXXXXXXXG AWLYWW 14X 1.52 1 7.00 1 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON30871E SOIC−14 XXXXX A WL Y WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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