NCV8518A

NCV8518A Low Dropout Linear Regulator with Watchdog, Wake Up, RESET, and ENABLE The NCV8518A device is a precision micropower voltage regulator. It has a fixed output voltage of 5.0 V and regulates within ±2%. It is suitable for use in all automotive environments and contains all the required functions to control a microprocessor. This device has low dropout voltage and low quiescent current. It includes a watchdog timer, adjustable reset, wake up and enable function. Also encompassed in this device are safety features such as thermal shutdown and short circuit protection. It is capable of handling up to 45 V transients. Features http://onsemi.com MARKING DIAGRAMS 8 8 1 SOIC-8 EXPOSED PAD CASE 751AC 1 16 SOIC-16 LEAD WIDE BODY EXPOSED PAD CASE 751R 1 1 A WL YY, Y WW G, or G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package 8518A AYWW G • • • • • • • • • • • • Output Voltage of 5.0 V ±2% Output Voltage Tolerance Output Current up to 250 mA Micropower Compatible Control Functions: - ENABLE - Watchdog - RESET - Wake Up NCV Prefix for Automotive and Other Applications Requiring Site and Change Control Low Dropout Voltage Low Quiescent Current of 100 mA Protection Features: - Thermal Shutdown - Short Circuit Low Sleep Mode Current less than 1.0 mA AEC Qualified PPAP Capable These are Pb-Free Devices NCV8518A AWLYYWWG 16 ORDERING INFORMATION Device NCV8518APDG Package SOIC-8* Shipping† 98 Units / Rail 2500 / Tape & Reel 47 Units / Rail NCV8518APDR2G SOIC-8* NCV8518APWG SOIC-16* Applications NCV8518APWR2G SOIC-16* 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb-Free. • Tire Pressure Monitor • Battery Powered Consumer Electronics © Semiconductor Components Industries, LLC, 2008 1 March, 2008 - Rev. 1 Publication Order Number: NCV8518A/D NCV8518A PIN CONNECTIONS SOIC-8 EP 8 SOIC-16 EP RESET WDI ENABLE VIN 1 NC NC GND NC Delay NC NC VOUT 16 Wake Up RESET NC WDI NC ENABLE NC VIN Wake Up GND Delay VOUT 1 PIN FUNCTION DESCRIPTION Pin SOIC-8 EP 4 5 7 2 6 8 3 SOIC-16 EP 8 9 13 3 11 15 5 1, 2, 4, 6, 7, 10, 12, 14 16 Symbol VOUT VIN WDI GND ENABLE RESET Delay NC Regulated output voltage. Input supply voltage. CMOS compatible Watchdog input. The watchdog function monitors the falling edge of the incoming signal. Ground connection. ENABLE control for the IC. Positive logic. CMOS compatible output RESET goes low whenever VOUT drops by more than 7.0% from nominal, or during the absence of a correct watchdog signal. Buffered reference voltage used to create timing current for RESET and Watchdog threshold frequency from RDelay. No Connection. Description 1 Wake Up Continuously generated signal that interrupts the microprocessor from sleep mode. http://onsemi.com 2 NCV8518A VIN VOUT Ilimit OSCH ENABLE Enable TSD FB Rail OSCL +- Reference VBG +UVLO WDI Buffer Watchdog + Wakeup Logic Iref OSCH OSCL Reset Driver RESET Delay + - Timing Circuit Wakeup Driver Wake Up Figure 1. Block Diagram http://onsemi.com 3 NCV8518A MAXIMUM RATINGS Rating Input Voltage Output Voltage RESET Voltage RESET Current (RESET may be incidentally shorted either to VOUT or to GND without damage) ESD Susceptibility (Human Body Model) Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay) Operating Junction Temperature Storage Temperature Range Moisture Sensitivity Level SOIC-16 EP (Case 751R) SOIC-8 EP (Case 751AC) Lead Temperature Soldering: Reflow Leaded Part 60-150 sec above 183°C, 30 sec max at peak Lead-Free Part 60-150 sec above 217°C, 40 sec max at peak Symbol VIN, ENABLE VOUT VRESET IRESET TJ TS MSL 2 2 °C °C Value -0.3 to 45 -0.3 to +7.0 0 V to VOUT Internally Limited 2.0 -0.3 to +7.0 -40 to150 -55 to +150 Unit V V V mA kV V °C °C - 240 peak 265 peak Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Parameter SO-8 Exposed Pad Package minimum-pad board (Note 1) Junction to case top (Y-JT, qJT) Junction to pin1 (Y-JL1, qJL1) Junction to board (Y-JB, qJB )3 Junction to ambient (RqJA, qJA) SO-16 Exposed Pad Package minimum-pad board (Note 3) Junction to case top (Y-JT, qJT) Junction to pin1 (Y-JL1, qJL1) Junction to board (Y-JB, qJB) (Note 4) Junction to ambient (RqJA, qJA) 30 70 15 150 1 sq. inch spreader board (Note 2) 16 65 17 55 °C/W °C/W °C/W °C/W 19 68 9 235 1 sq. inch spreader board (Note 2) 8 63 10 57 °C/W °C/W °C/W °C/W Board/Mounting Conditions Typical Value Unit Specific notes on thermal characterization conditions: All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical values are derived from an axisymmetric finite-element model where active die area, total die area, flag area, pad area, and board area are equated to the actual corresponding areas. 1. 1 oz copper, 6 x 9 mm, 0.062” thick FR-4. 2. 1 oz copper, 645 mm2 (1in2) spreader area (includes exposed pad). 3. 1 oz copper, 17.2 mm2 spreader area (minimum exposed pad, not including traces which are assumed). 4. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it best represents the primary heat flow path and is least sensitive to board and ambient properties. http://onsemi.com 4 NCV8518A ELECTRICAL CHARACTERISTICS (-40°C ≤ TJ ≤ 150°C; 6.0 V ≤ VIN ≤ 28 V, 100 mA ≤ IOUT ≤ 150 mA, C2 = 1.0 mF, RDelay = 60 k; unless otherwise specified.) Characteristic Output Output Voltage VOUT VDO Regload Regline Ilim TJmax IQ 100 150 1.0 4.9 -2% 5.00 5.10 +2% 750 30 V Symbol Min Typ Max Unit Dropout Voltage (VIN - VOUT, IOUT = 150 mA) (Note 5) Load Regulation (VIN = 13.5 V, 100 mA ≤ IOUT ≤ 150 mA) Line Regulation (6.0 V ≤ VIN ≤ 28 V, IOUT = 5.0 mA) Current Limit Thermal Shutdown (Guaranteed by Design) Quiescent Current (VIN = 13.5 V, IOUT = 100 mA, 150 mA, ENABLE = 2.0 V) (ENABLE = 0 V, TA = +125°C) RESET Threshold Voltage Output Low (RLOAD = 10 k to VOUT, VOUT = 1.0 V) Output High (RLOAD = 10 k to GND) Power On Reset Delay Time (VIN = 13.5 V, RDelay = 60 k, IOUT = 5.0 mA) (VIN = 13.5 V, RDelay = 120 k, IOUT = 5.0 mA) VIN = 13.5 V, RDelay = 500 k, IOUT = 5.0 mA) Watchdog Input Threshold Hysteresis Input Current (WDI = 6.0 V) Wake Up Rising Edge to WDI Falling Edge Delay Wake Up WDI ENABLE (Note 6) Input Threshold Logic Low Logic High Input Current (ENABLE = 2.0 V) 425 5.0 mV mV - 5.0 20 mV 255 150 400 180 210 mA °C mA - 4.50 - 4.65 0.2 4.75 0.4 V V tD VOUT - 0.4 2.0 - VOUT - 0.2 3.0 6.0 25 4.0 - V ms WDIhigh WDIhys - 30 25 5.0 50 100 0.1 - 70 2.0 - %VOUT mV mA ms Vth(EN) 2.0 3.0 0.8 10 V mA 5. Measured when the output voltage has dropped 2% from the nominal value. 6. If ENABLE is connected to VIN, a 20 kW resistor must be placed in series. http://onsemi.com 5 NCV8518A ELECTRICAL CHARACTERISTICS (continued) (-40°C ≤ TJ ≤ 150°C; 6.0 V ≤ VIN ≤ 28 V, 100 mA ≤ IOUT ≤ 150 mA, C2 = 1.0 mF, RDelay = 60 k; unless otherwise specified.) Characteristic Wake Up Output (VIN = 14 V, IOUT = 5.0 mA) Wake Up Period (RDELAY = 60 k) (RDELAY = 120 k) (RDELAY = 500 k) Wake Up Duty Cycle Nominal RESET HIGH to Wake Up Rising Delay Time (RDELAY = 60 k) 50% RESET Rising Edge to 50% Wake Up Edge (RDELAY = 120 k) (RDELAY = 500 k) Wake Up Response to Watchdog Input 50% WDI Falling Edge to 50% Wake Up Falling Edge Wake Up Response to RESET 50% RESET Falling Edge to 50% Wake Up Falling Edge (VOUT = 5.0 V→ 4.5 V) Output Low (RLOAD = 10 k) Output High (RLOAD = 10 k) Delay Output Voltage (RDELAY = 60 k, 120 k, 500 k) 0.48 V 18 9.0 12.5 25 104 0.1 16 5.0 ms 45 25 50 208 50 32 55 % ms ms Symbol Min Typ Max Unit - - 0.1 5.0 ms - VOUT - 0.5 0.2 VOUT - 0.25 0.4 - V V DEFINITION OF TERMS Dropout Voltage: The input-to-output voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at 14 V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminals with respect to ground. Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Quiescent Current: The part of the positive input current that does not contribute to the positive load current. The regulator ground lead current with no load. Current Limit: Peak current that can be delivered to the output. http://onsemi.com 6 NCV8518A TIMING DIAGRAMS VIN, ENABLE RESET Wake Up Duty Cycle = 50% Wake Up RESET High to Wake Up Delay Time WDI Wake Up Duty Cycle will be 50% when the WDI pulse occurs at the low state of the Wake Up Signal. VOUT POR Power Up Min WDI falling edge delay after Wake Up rising edge Microprocessor Sleep Mode Normal Operation with Varying Watchdog Signal Figure 2. Power Up, Sleep Mode and Normal Operation VIN, ENABLE RESET Wake Up RESET Delay Time WDI RESET High to Wake Up Delay Time VOUT POR Wake Up Period Figure 3. Error Condition: Watchdog Remains Low and a RESET is Issued RESET Wake Up Wake Up Response to Reset Wake Up Period WDI VIN, ENABLE RESET Threshold VOUT POR VOUT Decreasing Power Down POR Wake Up Response to WDI Figure 4. Power Down, Restart Sequence, and Wake Up Response to WDI http://onsemi.com 7 NCV8518A TYPICAL PERFORMANCE CHARACTERISTICS 5.1 5.01 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 5 mA Load 5.0 25°C 5.00 4.9 -50 0 50 100 TJ, TEMPERATURE (°C) 150 4.99 5 10 15 20 INPUT VOLTAGE (V) 25 30 Figure 5. Output Voltage vs. Temperature Figure 6. Output Voltage vs. Input Voltage 3.3 3.2 6.4 6.2 POR DELAY (ms) 3.1 60 kW Rdelay 3.0 2.9 2.8 2.7 -50 5.6 -50 POR DELAY (ms) 6.0 120 kW Rdelay 5.8 0 50 100 TJ, TEMPERATURE (°C) 150 0 50 100 TJ, TEMPERATURE (°C) 150 Figure 7. POR Delay vs. Temperature, 60 kW Rdelay Figure 8. POR Delay vs. Temperature, 120 kW Rdelay 10000 UNSTABLE REGION WAKEUP PERIOD (ms) 0.1 - 10 mF ESR (W) 100 100 mF 10 STABLE REGION, ALL CAP VALUES 27 1000 26 60 kW Rdelay 25 1 0.1 mF UNSTABLE 0.1 0 25 50 75 OUTPUT CURRENT (mA) 100 24 23 -50 0 50 100 TJ, TEMPERATURE (°C) 150 Figure 9. Stability Region of Capacitive ESR vs. Output Current Figure 10. Wakeup Period vs. Temperature http://onsemi.com 8 NCV8518A TYPICAL PERFORMANCE CHARACTERISTICS 250 30 25 POR DELAY (ms) 0 100 200 300 400 500 20 15 10 5 0 WAKEUP PERIOD (ms) 200 150 100 50 0 RDelay (kW) 0 100 200 300 400 500 RDelay (kW) Figure 11. Wakeup Period vs. RDelay Figure 12. POR Delay vs. RDelay 6 5 VOUT TRANSIENT (mV) OUTPUT VOLTAGE (V) 4 3 2 1 0 0 1 4 2 3 INPUT VOLTAGE (V) 5 6 60 4.7 mF, 0.32 ESR 50 40 22 mF, 0.20 ESR 30 20 10 0 0 50 100 150 200 SWITCHING CURRENT (mA) 250 100 mF, 0.12 ESR Figure 13. Output Voltage vs. Input Voltage, 5 mA Load 700 DROPOUT VOLTAGE (mV) 600 500 400 300 200 100 0 0 50 100 LOAD CURRENT (mA) 150 25°C 104 QUIESCENT CURRENT (mA) Figure 14. Load Transient Response 125°C 102 -40°C 100 25°C -40°C 98 125°C 96 0 50 100 LOAD CURRENT (mA) 150 Figure 15. Dropout Voltage vs. Output Current Figure 16. Quiescent Current vs. Output Current http://onsemi.com 9 NCV8518A OPERATING DESCRIPTION General RESET The NCV8518A is a precision micropower voltage regulator featuring low quiescent current (100 mA typical at 250 mA load) and low dropout voltage (450 mV typical at 150 mA). Integrated microprocessor control functions include Watchdog, Wakeup and RESET. An Enable input is provided for logic level control of the regulator state. The combination of low quiescent current and comprehensive microprocessor interface functions make the NCV8518A ideal for use in both battery operated and automotive applications. The NCV8518A is internally protected against short circuit and thermal runaway conditions. No external components are required to engage these protective mechanisms. The device continues to operate through 45 volt input transients, an important consideration in automotive environments. Wakeup and Watchdog To reduce battery drain, a microprocessor or microcontroller can transition to a low current consumption (“sleep”) mode when code execution is suspended or complete. The NCV8518A Wakeup signal is generated and output periodically to interrupt sleep mode. The nominal Wakeup output is a 5 volt square wave (generated from VOUT) with a duty cycle of 50%, at a frequency determined by external timing resistor RDELAY. In response to the rising edge of the Wakeup signal, the microprocessor will subsequently output a Watchdog pulse and check its inputs to decide if it should resume normal operation or remain in sleep mode. The NCV8518A responds to the falling edge of the Watchdog signal, which it expects at least once during each Wakeup period. When the correct Watchdog signal is received, the Wakeup output is forced low. Other Watchdog pulses received within the same cycle are ignored. The Watchdog circuitry continuously monitors the input Watchdog signal (WDI) from the microprocessor. The absence of a falling edge on the Watchdog input during one Wakeup cycle will cause a Reset pulse to be output at the end of the Wakeup cycle (see Figure 4). As output voltage falls, the RESET output will maintain its current state down to VOUT = 1 V. A Reset signal (active low) is asserted for any of four conditions: 1. During power up, RESET is held low until the output voltage is in regulation. 2. During operation, if the output voltage falls below the Reset threshold, RESET switches low, and will remain low until both the output voltage has recovered and the Reset delay timer cycle has completed following that recovery. 3. RESET will switch low if the regulator does not receive a Watchdog input signal within a Wakeup period. 4. Regardless of output voltage, RESET will switch low if the regulator input voltage VIN, falls below a level required to sustain the internal control circuits. The specific voltage is temperature dependent, and is approximately 4.75 V at 20°C. The Wakeup output is pulled low during a RESET regardless of the cause of the RESET. After the RESET returns high, the Wakeup cycle begins again (see Figure 4). The RESET Delay Time, Wakeup signal frequency and RESET high to Wakeup delay time are all set by one external resistor, RDelay, according to the following equations: Wakeup Period (seconds) = (4.17 RESET Delay Time (seconds) = (5.21 10-7) * RDELAY (W) 10-8) * RDELAY (W) RESET High to Wakeup Delay Time (seconds) = (2.08 10-7) * RDELAY (W) The voltage present at the Delay pin is a buffered bandgap voltage (~1.25 V) and can be used as a reference for an external tracking regulator. Enable This is a standard TTL and CMOS logic compatible input that can be used to turn the regulator on or off. Logic high enables the regulator; logic low disables it (also called shutdown). In the disabled/shutdown state, the pass transistor is off and total quiescent current is less than 1 mA. http://onsemi.com 10 NCV8518A VBAT VIN VOUT C2 1.0 mF WDI NCV8518A Delay RESET WAKE UP RDelay 120 k GND ENABLE OK Fault RESET I/O VDD I/O C1* 0.1 mF OFF *C1 required if regulator is located far from power supply filter. ON Figure 17. Application Circuit http://onsemi.com 11 Microprocessor NCV8518A PACKAGE DIMENSIONS SOIC-8 EP D SUFFIX CASE 751AC-01 ISSUE B 2X 0.10 C A-B D A 8 5 D EXPOSED PAD 5 DETAIL A F 8 2X 0.10 C D PIN ONE LOCATION 0.10 C 8X A A2 GAUGE PLANE 0.10 C SEATING PLANE b1 L q C SIDE VIEW A1 0.25 (L1) DETAIL A c1 SECTION A-A SOLDERING FOOTPRINT* 2.72 0.107 1.52 0.060 7.0 0.275 2.03 0.08 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 ÉÉ ÇÇ ÉÉ ÇÇ ÉÉ ÉÉ ÉÉÉ ÉÉÉ 1 E1 E G h 4 1 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS (ANGLES IN DEGREES). 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 MM TOTAL IN EXCESS OF THE “b” DIMENSION AT MAXIMUM MATERIAL CONDITION. 4. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H. MILLIMETERS MIN MAX 1.35 1.75 0.00 0.10 1.35 1.65 0.31 0.51 0.28 0.48 0.17 0.25 0.17 0.23 4.90 BSC 6.00 BSC 3.90 BSC 1.27 BSC 0.40 1.27 1.04 REF 2.24 3.20 1.55 2.51 0.25 0.50 0_ 8_ 2X 4 0.20 C 8X b 0.25 C A-B D e BOTTOM VIEW A A B TOP VIEW END VIEW c H (b) DIM A A1 A2 b b1 c c1 D E E1 e L L1 F G h q Exposed Pad NCV8518A PACKAGE DIMENSIONS SOIC-16 LEAD WIDE BODY, EXPOSED PAD PDW SUFFIX CASE 751R-02 -UISSUE B A M 16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751R-01 OBSOLETE, NEW STANDARD 751R-02. MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 3.31 3.51 0.25 0.32 0.10 0.25 4.58 4.78 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.130 0.138 0.010 0.012 0.004 0.009 0.180 0.188 0_ 7_ 0.395 0.415 0.010 0.029 P 0.25 (0.010) M W M 1 8 B -W- R x 45 _ PIN 1 I.D. G TOP SIDE 14 PL DETAIL E C -T0.10 (0.004) T D 16 PL 0.25 (0.010) H M F K TU S SEATING PLANE W S J DETAIL E EXPOSED PAD 1 8 DIM A B C D F G H J K L M P R L 16 9 SOLDERING FOOTPRINT* .350 .175 .050 Exposed Pad BACK SIDE C L .200 .07 4 .024 .145 SCALE 2:1 .18 8 C L .376 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT:  Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free  USA/Canada Europe, Middle East and Africa Technical Support:  Phone: 421 33 790 2910 Japan Customer Focus Center  Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 13 NCV8518A/D